JP2003209083A5 - - Google Patents
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- JP2003209083A5 JP2003209083A5 JP2002006558A JP2002006558A JP2003209083A5 JP 2003209083 A5 JP2003209083 A5 JP 2003209083A5 JP 2002006558 A JP2002006558 A JP 2002006558A JP 2002006558 A JP2002006558 A JP 2002006558A JP 2003209083 A5 JP2003209083 A5 JP 2003209083A5
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Description
【００４０】
上記ダイシングテープとしては特に限定されないが、公知の光硬化性粘着テープを用いることができ、例えば、Ａｄｗｉｌｌ（登録商標）Ｄ−シリーズや、日東電工社製のエレップホルダー（登録商標）ＵＥシリーズ等のテープが挙げられる。
上記ダイシングテープとしては特に限定されないが、公知の光硬化性粘着テープを用いることができ、例えば、Ａｄｗｉｌｌ（登録商標）Ｄ−シリーズや、日東電工社製のエレップホルダー（登録商標）ＵＥシリーズ等のテープが挙げられる。
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002006558A JP3787526B2 (ja) | 2002-01-15 | 2002-01-15 | Ｉｃチップの製造方法 |
| KR10-2003-7014522A KR20040105546A (ko) | 2002-01-15 | 2003-01-15 | Ｉｃ칩의 제조 방법 |
| EP03701719A EP1467402A4 (en) | 2002-01-15 | 2003-01-15 | METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT CHIP |
| TW092100744A TWI267168B (en) | 2002-01-15 | 2003-01-15 | Manufacturing method of IC chip |
| US10/475,257 US6939741B2 (en) | 2002-01-15 | 2003-01-15 | IC chip manufacturing method |
| CNB038002329A CN1322554C (zh) | 2002-01-15 | 2003-01-15 | Ic片的生产方法 |
| PCT/JP2003/000238 WO2003060972A1 (fr) | 2002-01-15 | 2003-01-15 | Procede de fabrication d'une puce de circuit integre |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002006558A JP3787526B2 (ja) | 2002-01-15 | 2002-01-15 | Ｉｃチップの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003209083A JP2003209083A (ja) | 2003-07-25 |
| JP2003209083A5 true JP2003209083A5 (ja) | 2004-12-24 |
| JP3787526B2 JP3787526B2 (ja) | 2006-06-21 |
Family
ID=27645293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002006558A Expired - Lifetime JP3787526B2 (ja) | 2002-01-15 | 2002-01-15 | Ｉｃチップの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3787526B2 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4462997B2 (ja) | 2003-09-26 | 2010-05-12 | 株式会社ディスコ | ウェーハの加工方法 |
| JP4647228B2 (ja) * | 2004-04-01 | 2011-03-09 | 株式会社ディスコ | ウェーハの加工方法 |
| JP2010042469A (ja) * | 2008-08-12 | 2010-02-25 | Tokyo Ohka Kogyo Co Ltd | サポートプレート |
| JP5706258B2 (ja) * | 2011-07-08 | 2015-04-22 | 株式会社東京精密 | ウェハの電気特性検査方法 |
-
2002
- 2002-01-15 JP JP2002006558A patent/JP3787526B2/ja not_active Expired - Lifetime
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