JP2003209017A - Stacked composite electronic component and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an internal electrode having a desired thickness without allowing interlayer separation, cracking or the like to occur. <P>SOLUTION: Coil electrodes 9 to 11 and capacitor electrodes 13 to 16 are both formed with conductive paste comprising Ag powder. The coil electrodes are formed with conductive paste comprising Ag powder whose average particle size is from 0.5 μm to 2.5 μm or/and specific surface area is from 1.6 m<SP>2</SP>/g to 2.6 m<SP>2</SP>/g, with a film thickness being from 5.0 μm to 9.5 μm. The capacitor electrodes are formed with conductive paste comprising Ag powder whose average particle size is from 3.0 μm to 5.5 μm or/and specific surface area is from 0.2 m<SP>2</SP>/g to 1.4 m<SP>2</SP>/g, with a film thickness being from 0.5 μm to 4.0 μm. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated composite electronic component and a method for manufacturing the same, and more particularly to a laminated composite LC component including two or more kinds of internal conductors containing the same metal species as a main component. The present invention relates to a laminated composite electronic component and a method for manufacturing the laminated composite electronic component.

[0002]

2. Description of the Related Art Conventionally, in a laminated inductance element or a laminated impedance element having a coil electrode as an inner conductor, it is required that the coil electrode of the laminated body has a low direct current resistance (R _DC ). 5.0-9.
It must be thickened up to about 5 μm, but such an electrode film thickness is much thicker than that of the capacitor electrode which is the internal conductor of the multilayer capacitor, and the thickness between the ferrite element body (magnetic material) and the coil electrode during firing is large. There was a big difference in the amount of shrinkage, and therefore there was a drawback that delamination was likely to occur at the interface between the ferrite element body and the coil electrode.

Therefore, in order to eliminate such drawbacks, a conductive paste containing an organometallic compound as a ferrite element component has been proposed (Japanese Patent Laid-Open No. 6-21562).
No. 1 gazette; hereinafter referred to as "first conventional technology").

In the first prior art, the ferrite paste component is contained in the conductive paste to improve the bonding strength between the coil electrode, which is an internal electrode, and the ferrite body, and thereby delaminate at the interface. The occurrence of is suppressed.

On the other hand, in a multilayer capacitor having a capacitor electrode as an internal conductor, it is desired to reduce the electrode film thickness to about 0.5 to 4.0 μm from the viewpoint of downsizing, large capacity, and cost reduction. However, when attempting to form such a thin film electrode, there is a drawback in that evaporation or diffusion of a metal component occurs during firing and a connection failure easily occurs between the capacitor electrode and the external electrode such as the input / output electrode or the ground electrode. there were.

From this point of view, there has been proposed a monolithic ceramic electronic component in which a connecting portion for electrically connecting a capacitor electrode and an external electrode is thicker than other portions (Japanese Patent Laid-Open No. 304042/1993). JP-A-11-972
No. 88 publication; hereinafter referred to as "second prior art").

Furthermore, even in a monolithic ceramic capacitor,
Similar to the laminated inductance element and laminated impedance element, delamination and cracks may occur due to the difference in shrinkage between the ceramic body and the capacitor electrode during firing.

From the viewpoint of avoiding such delamination and cracking, a conductive paste containing a metal alcoholate containing a metal such as Zr, Nb, Fe or Ta, a carboxylic acid and Pd or Au, A conductive paste containing a metal resinate, which is a compound with a metal such as Ag, Cu, or Ni, has been proposed (JP-A-7-176448).
Japanese Patent Laid-Open No. 8-298224, Japanese Patent Laid-Open No. 5-2224
58608; hereinafter referred to as "third prior art").

[0009]

By the way, in a laminated composite electronic component such as a laminated composite LC component having a coil portion and a capacitor portion, as described above, the film thickness of the coil electrode is 5.0 to 9. The thickness of the capacitor electrode should be as thin as about 0.5 to 4.0 μm, while the thickness of the capacitor electrode should be about 5 μm.

However, in the above-mentioned first to third prior arts, even if the individual problems occurring in the multilayer impedance element, the multilayer capacitor and the like can be solved, a composite in which these individual multilayer electronic parts are combined is combined. In complex electronic parts such as LC parts, it is not possible to solve all of the problems that may occur in the internal electrodes (coil electrodes and capacitor electrodes), ceramic element bodies, etc., and moreover, it is required in the coil part and the capacitor part. Since the applied film thickness is different, it is difficult to solve all the problems described above and obtain a desired film thickness.

The present invention has been made in view of the above circumstances, and is free from delamination, cracks, etc.
It is an object of the present invention to provide a laminated composite electronic component including an internal electrode having a desired film thickness and a method for manufacturing the same.

[0012]

[Means for Solving the Problems] The inventors of the present invention have conducted extensive studies in order to achieve the above-mentioned object. In order to prevent delamination, cracks, cracks, etc., from occurring even when the electrode film thickness is increased. It is desirable to form the internal electrode (internal conductor) using a conductive material containing a metal powder having a small average particle diameter Dave and / or a large specific surface area Sw.
In order to suppress evaporation and diffusion during firing even if the electrode film thickness becomes thin, the internal electrode is formed by using a conductive paste containing a metal powder having a large average particle diameter Dave and / or a small specific surface area Sw. We have found that it is desirable to form them.

The present invention has been made on the basis of such findings, and the laminated composite electronic component according to the present invention is composed of two or more kinds of laminated bodies in which internal conductors and sheet-like members are alternately laminated. In the multilayer composite electronic component, the inner conductor is formed by sintering a conductive paste containing the same kind of metal material, and is formed to have a different film thickness for each laminated body, and the inner conductor has a large film thickness. Is characterized by being formed of a conductive paste containing a metal material having a smaller average particle size and / or a metal material having a larger specific surface area than the inner conductor having a small film thickness.

Further, as a result of intensive studies on the composite LC component as the laminated composite electronic component, the present inventors have found that as a metal material for achieving the above-mentioned object, the capacitor electrode has an average particle diameter Dave of 3 0.0 μm to 5.5 μm
m, the ratio is the desirably a 0.2m ² /g~1.4m ² / g surface area, the coil electrode has an average particle diameter Dave 0.5
μm to 2.5 μm, specific surface area 1.6 m ^{2 /} g to 2.6
It has been found that m ² / g is desirable.

That is, in the laminated composite electronic component of the present invention, the laminated body has a first laminated body having a first inner conductor and a second inner body having a film thickness smaller than that of the first inner conductor. And a second laminated body having a conductor, wherein the first inner conductor has an average particle size of 0.5 μm to 2.5 μm or /
And a specific surface area of 1.6m ² /g~2.6m ² / g of metal material conductive paste containing is sintered, said second internal conductor has an average particle size of 3.0μm~5 .5μm or / and 0.2m ² /g~1.4m ² / g of metal material conductive paste containing is characterized by being sintered, and further, the first laminate coil portion The second laminated body constitutes a capacitor portion, the first inner conductor is a coil electrode, and the second inner electrode is a capacitor electrode.

Further, the laminated composite electronic component of the present invention is characterized in that the metallic material contains silver as a main component, whereby each laminated body has a desired conductivity. Obtainable.

Further, the laminated composite electronic component of the present invention is
The conductive paste is characterized by containing an organic vehicle, thereby obtaining a laminated composite electronic component having an internal conductor in which a metal material is uniformly dispersed by the conductive paste having a desired paste form. be able to.

Further, according to the method of manufacturing a laminated composite electronic component of the present invention, sheet-like members having an electrode pattern formed thereon are laminated using a conductive paste containing a metal material to form a laminate, and In the method for producing a laminated composite electronic component, in which a laminated composite electronic component is produced by stacking the above laminated bodies of at least one type on top of each other, a conductive paste containing the same type of metal material is used. The electrode patterns are formed by using the conductive paste so that each of the laminated bodies has a different film thickness. It is characterized in that a conductive paste containing a metal material having a small average particle size and / or a metal material having a large specific surface area is used.

According to the above manufacturing method, the conductive paste is used to form an electrode pattern so that each laminated body has a different film thickness, and a thick electrode pattern is a thin electrode pattern. Use a conductive paste containing a metal material with a smaller particle size than that of the above, or / and use a conductive paste containing a metal material with a large specific surface area. Compared with the conductive paste containing a metal material having a large particle diameter, or / and the conductive paste containing a metal material having a small specific surface area, delamination, cracks, cracks, etc. do not occur, It is possible to easily obtain a laminated composite electronic component having an internal electrode having a desired film thickness according to each laminated body.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of a laminated composite LC component (hereinafter referred to as "composite LC component") as a laminated composite electronic component according to the present invention.
The C component has a coil portion 1 and a capacitor portion 2, and an intermediate layer 3 made of a glass material or the like is interposed between the coil portion 1 and the capacitor portion 2. The coil unit 1, the capacitor unit 2, and the intermediate layer 3 constitute a component body 4, and input / output electrodes 5 and 6 are formed at both ends of the component body 4, and the two input / output electrodes 5 and 6 are formed. Ground electrodes 7 and 8 having a U-shaped cross section are formed in the substantially central portion of.

FIG. 2 is a sectional view taken along line XX of FIG.

The coil portion 1 is formed by laminating a magnetic material sheet having coil electrodes 9 to 11 as internal conductors formed on the surface thereof, and a lead portion 9a of the coil electrode 9 is electrically connected to one of the input / output electrodes 5. In addition to being connected, the lead-out portion 11a of the coil electrode 11 is electrically connected to the other input / output electrode 6, and the coil electrode 10 is formed in a substantially C shape.

The coil electrodes 9 to 11 are electrically connected in series through via holes (not shown) formed on the magnetic sheet to form a coil wound in a clockwise direction. .

The capacitor portion 2 is formed by laminating dielectric sheets having capacitor electrodes 13 to 16 as internal conductors formed on the surface thereof, and the lead-out portion 16a of the capacitor electrode 16 is connected to the one input / output electrode 5 described above. Electrically connected,
The lead-out portion 13a of the capacitor electrode 13 is electrically connected to the other input / output electrode 6. The lead-out portions of the capacitor electrodes 14 and 15 are electrically connected to the ground electrodes 7 and 8, respectively. Then, in the present embodiment, capacitance is formed between the capacitor electrodes 13 and 15 and the capacitor electrodes 14 and 16.

The coil electrodes 9 to 11 and the capacitor electrodes 13 to 16 are formed of a conductive paste containing Ag as a main component, and the coil electrodes 9 to 11 and the capacitor electrodes 13 to 16 are different films. Have a thickness. That is, the coil electrodes 9 to 11 have a DC resistance (R
_Since it is required that _DC ) be low, it is necessary to make the electrode film thickness thick. Therefore, in the present embodiment, the electrode film thickness of the coil electrodes 9 to 11 is set to 5.0 μm to 9.5 μm. There is. On the other hand, it is desirable that the capacitor electrodes 13 to 16 have a small electrode film thickness from the viewpoints of downsizing, large capacity, and cost reduction.
The electrode film thicknesses of 16 to 16 are formed to 0.5 μm to 4.0 μm.

The electrode film thicknesses of the coil electrodes 9 to 11 and the capacitor electrodes 13 to 16 are determined by the content of Ag powder as a solid content contained in the conductive paste, the viscosity of the conductive paste, and the screen printing. It is controlled by adjusting the printing conditions.

That is, in the present embodiment, the organic paste is contained in the conductive paste for the coil electrode and the capacitor electrode, whereby the viscosity of the conductive paste is adjusted to a desired paste state, and further, The electrode film thickness can be controlled by adjusting the content of Ag powder or appropriately changing the printing conditions of screen printing.

The organic vehicle is not particularly limited, and it is possible to use one obtained by dissolving ethyl cellulose in α-terpineol, or one obtained by dissolving butyral resin, acrylic resin, etc. in a predetermined organic solvent. .

In order to secure the above-mentioned electrode film thickness and to avoid the occurrence of defective connections, cracks, cracks, or delamination, the coil electrodes 9 to 9 are used in this embodiment.
11 is Ag having an average particle diameter Dave of 0.5 μm to 2.5 μm
The conductive paste containing powder is sintered, and the capacitor electrodes 13 to 16 have an average particle diameter Dave of 3.0 μm or more.
The conductive paste containing Ag powder of 5.5 μm is sintered. That is, the coil electrodes 9 to 11 contain Ag powder having an average particle diameter Dave of 0.5 μm to 2.5 μm, and the capacitor electrodes 13 to 16 contain Ag powder having an average particle diameter Dave of 3.0 μm to 5.5 μm. Is included.

Next, a method of manufacturing the above composite LC component will be described with reference to FIG.
Will be described with reference to.

First, a ferrite material such as a Ni—Zn—Cu ferrite material is prepared as a magnetic material to be the element body of the coil portion 1, and a ferrite material powder is kneaded with a binder, a plasticizer, a dispersant, a solvent and the like. After that, a magnetic sheet 12 having a predetermined film thickness is produced by using a doctor blade method or the like,
Further, a via hole is provided at a predetermined position of the magnetic material sheet 12 using a laser processing machine. Then, a predetermined electrode pattern is screen-printed on the magnetic material sheet 12 by using the above-mentioned conductive paste so that the coil electrodes 9 to 11 can be electrically connected in series through the via holes. Then, the magnetic material sheets 12 on which the coil electrodes 9 to 11 are formed are laminated, whereby a first laminated body is manufactured.

Next, BaT which is an element body of the capacitor section 2 is formed.
A dielectric material such as iO ₃ is prepared, and the dielectric material powder is kneaded with a binder, a plasticizer, a dispersant, a solvent, etc., and then a dielectric sheet 1 having a predetermined thickness is formed by using a doctor blade method or the like.
7 is produced. Then, a predetermined electrode pattern is screen-printed on the dielectric sheet 17 using the above-mentioned conductive paste to form the capacitor electrodes 13 to 16. Then, the dielectric sheets 17 on which the capacitor electrodes 13 to 16 are formed are laminated, whereby a second laminated body is manufactured.

Next, the first laminated body and the second laminated body are superposed on each other via the intermediate layer 3 formed of a glass material, and then they are pressure-bonded and fired at a predetermined temperature.
The laminated body of 1 becomes the coil portion 1, and the second laminated body becomes the capacitor portion 2. Then, at both ends and the center of the baked product, A
The composite LC component is manufactured by applying a conductive paste containing g, Ag—Pd, or the like as a main component and performing a baking process.

As with the magnetic sheet 12 and the dielectric sheet 17, the intermediate layer 3 is also formed by laminating an arbitrary number of sheet members having a predetermined film thickness.

As described above, in this embodiment, the coil electrodes 9 to 11 and the capacitor electrodes 13 to 16 having different electrode film thicknesses are used.
By selectively using Ag powders having different average particle diameters in and, it is possible to obtain a composite LC component having a desired film thickness without causing delamination, cracks, cracks, connection failures, and the like. Specifically, the coil electrodes 9 to 11 having a large electrode thickness of 5.0 μm to 9.5 μm have an average particle diameter Dave of 0.5 μm.
The capacitor electrodes 13 to 16 formed of a conductive paste containing Ag powder of m to 2.5 μm and having a thin electrode film thickness of 0.5 μm to 4.0 μm have an average particle diameter Dave of 3.0 μm.
By forming the conductive paste containing Ag powder of ˜5.5 μm, it is possible to obtain a composite LC component free from delamination, cracks, cracks, connection failure and the like.

Further, in the present invention, instead of the average particle diameter Dave or in addition to the average particle diameter Dave, Ag powder having a specific surface area Sw of the Ag powder within a predetermined range is used. The effect can be obtained. In particular,
The specific surface area Sw of Ag powder 1.6m ² /g~2.6m ²
/ G, delamination, cracks, cracks,
Alternatively, the electrode film thickness is 5.0 μm without connection failure.
It is possible to form coil electrodes 9 to 11 having a thickness of ˜9.5 μm, and the specific surface area Sw of Ag powder is 0.2 m ² / g to
By setting the thickness to 1.4 m ² / g, the capacitor electrodes 13 to 16 having an electrode film thickness of 0.5 μm to 4.0 μm can be formed without delamination, cracks, cracks, or connection failure.

The present invention is not limited to the above embodiment, and the number of laminated magnetic sheets 12 and dielectric sheets 17 in the coil portion 1 and the capacitor portion 2 can be set arbitrarily.

Although the composite LC component has been described in the present embodiment, the present invention can be applied to other laminated composite electronic components.

[0040]

EXAMPLES [First Example] The present inventors have found that the average particle diameter D
Various composite LC parts having different internal electrode film thicknesses were produced using conductive pastes having different aves, and the relationship between the electrode film thickness and the average particle diameter Dave was measured.

That is, the present inventors first of all, as the magnetic ceramic material, Fe ₂ O ₃ : 48.5 mol%, N
iO: 29.5 mol%, ZnO: 14.0 mol%, Cu
A Ni—Zn—Cu ferrite material containing O: 8.0 mol% was prepared.

As a dielectric ceramic raw material, Ba having a perovskite type crystal structure (general formula ABO ₃ ).
It was prepared which was added BaO-SiO ₂ based glass to TiO ₃ based material. Specifically, the BaTiO ₃ -based material is
A site component is BaO: 98.5 mol%, CaO:
1.5 mol%, B-site component was TiO ₂ : 81.0 mol%, ZrO ₂ : 19.0 mol%.

Further, as a raw material for the intermediate layer, Li ₂ O: 7
Mol%, BaO: 12 mol%, CaO: 4 mol%, Sr
O: 6 mol%, MgO: 2 mol%, SiO ₂ : 26 mol%, CuO: 15 mol%, TiO ₂ : 18 mol%, Bi
A crystallized glass material containing ₂ O ₃ : 10 mol% was prepared.

Then, polyvinyl butyral as a binder, dibutyl phthalate as a plasticizer, polycarboxylic acid ammonium salt as a dispersant, toluene and ethyl alcohol as a solvent are added to each of these materials and mixed,
Each raw material was made into a slurry. Next, a slurry-like raw material was prepared by a doctor blade method into a dielectric sheet, a magnetic sheet, and an intermediate layer sheet, each having a thickness of 40 μm.

On the other hand, the present inventors prepared an organic vehicle by dissolving ethyl cellulose in α-terpineol so that the ratio of α-terpineol to ethyl cellulose was 90% by weight: 10% by weight. Ag powder having a particle size was sufficiently kneaded with a three-roll mill to prepare a conductive paste for coil electrodes and a conductive paste for capacitor electrodes.

In this embodiment, the average particle diameter Dave is 0.5 μm.
m, 1.5 μm, 2.5 μm, 3.0 μm, 4.0 μ
m, 6.0 μm, and 7.0 μm Ag powder were used,
The Ag powder and the organic vehicle were kneaded to prepare a conductive paste.

The electrode film thickness of the coil electrode or the capacitor electrode, which is an internal electrode, can be adjusted by the viscosity of the conductive paste, the content of Ag which is a solid content in the conductive paste, and the electrode forming conditions. In this example, the content of Ag, which is a solid content, of the conductive paste was 60.0 w.
t% to 85.0 wt%, paste viscosity is 20 Pa · s or more
Various preparations were performed so that the range was 60 Pa · s.

Next, the present inventors used a laser beam machine to form via holes so that the coil electrodes could be electrically connected in series, and screened the electrode pattern using the conductive paste. It printed and formed the coil electrode.

Similarly, with respect to the dielectric sheet, an electrode pattern was screen-printed using the conductive paste to form a capacitor electrode.

Then, after that, a large number of magnetic sheets having coil electrodes and dielectric sheets having capacitor electrodes are laminated to make the coil portion and the capacitor portion each have a layer thickness of 500 μm. An intermediate layer having a thickness of 30 μm was interposed between the layers, and pressure-bonded to a thickness of 1 mm to produce a laminated body block.

Next, the laminated body block is set to a length of 2.5 m.
After cutting into m, width 1.5 mm, and thickness 1.0 mm, it was fired in air at 900 ° C. for 2 hours.

Furthermore, the present inventors separately prepared an Ag paste for external electrodes in which glass frit and an organic vehicle were added to Ag powder and dispersed, and the Ag paste was applied to both ends and substantially the center of the fired product. It was applied and baked at 800 ° C. for 30 minutes to form an input / output electrode and a ground electrode.

The coil portion has an initial magnetic permeability of 4 by itself.
00, it is possible to support the operating frequency of 1 KHz to 10 MHz, and the capacitor section alone has a relative permittivity of 70.
It has a property of 0 and a dielectric loss of 0.01%.

Then, the composite L produced in this way
For C part, each coil electrode and capacitor electrode,
The connectivity with external input / output electrodes and ground electrodes, cracks, cracks, and delamination were investigated.

That is, in the coil portion, the impedance | Z | or the DC resistance (R
_DC ) to check whether there is a disconnection defect between the coil electrode and the input / output electrode. Also, in the capacitor section, the capacitance between the input / output electrode and the ground electrode is measured, and the capacitor electrode and the input / output electrode are measured. Alternatively, the presence or absence of disconnection failure with the ground electrode was examined.

Also, cracks, cracks, and delamination were detected by an ultrasonic flaw detector (mi-scop manufactured by Hitachi Construction Machinery Finetech Co., Ltd.).
e) was used.

FIG. 4 shows the average particle diameter Dave in the coil portion.
It is a mapping diagram showing the relationship between the electrode thickness.

Ten pieces of each test piece were produced, and a test piece having a defect such as a crack, a crack, or a connection failure was judged as a "defective product" and indicated by an X mark, and these cracks and the like did not occur. The test piece was judged to be a "non-defective product" and is indicated by a circle. In the first example, no test piece had delamination in the coil portion.

As is apparent from FIG. 4, when the thickness of the coil electrode is 5.0 μm to 9.5 μm, in order to prevent defects such as cracks, cracks, and poor connection, the symbol "A" is used. So that the average particle size is 0.5 μm to 2.
It can be seen that a conductive paste containing 5 μm Ag powder may be used.

The thickness of the coil electrode is 5.0 μm-9.
In order to set the thickness to 5 μm, the content of Ag powder, which is a solid content, is 85.0 wt%, and the viscosity of the conductive paste is 40 to 60.
It was also found that a conductive paste adjusted to Pa · s should be used.

FIG. 5 shows the average particle diameter Dav in the condenser part.
It is a mapping diagram showing the relationship between e and the electrode film thickness.

Ten pieces of each test piece were prepared, and a test piece having a defect such as a connection failure or delamination was judged as a "defective product" and indicated by an X mark. Is judged to be a "good product" and is indicated by a circle. In the first embodiment, no test piece had cracks or cracks in the capacitor part.

As is clear from FIG. 5, when the thickness of the capacitor electrode is 0.5 μm to 4.0 μm, in order to prevent problems such as delamination and connection failure,
As shown by “B”, the average particle size is 3.0 μm to 5.5 μm.
It is understood that the conductive paste containing Ag powder of m should be used.

The thickness of the capacitor electrode is 0.5 μm
In order to set the thickness to 4.0 μm, the content of Ag powder which is a solid content is 70.0 wt%, and the viscosity of the conductive paste is 20 P.
It was also found that a conductive paste prepared to have a.s to 40 Pa.s should be used.

[0065] Second Embodiment The present inventors, the specific surface area Sw is 0.2m ² /g,0.6m ² /g,1.0m ² /
^{g, 1.4m 2 /g,1.6m 2 /g,2.2m 2} /
A conductive paste was prepared in the same manner as in the first example, so that Ag and 2.6 m ² / g of Ag powder were contained in a predetermined solid content.

Then, a composite LC component was manufactured by the same method and procedure as in the first embodiment, and the presence or absence of disconnection defects in the coil portion and the capacitor portion, cracks, cracks, and delamination were measured.

FIG. 6 is a mapping diagram showing the relationship between the specific surface area Sw in the coil portion and the electrode film thickness.

As is clear from FIG. 6, when the electrode film thickness of the coil electrode is 5.0 μm to 9.5 μm, in order to prevent defects such as cracks, cracks, and connection failures, "C" is set. Specific surface area is 1.6 m ² / g
It was confirmed that it is necessary to set the pressure to be about 2.6 m ² / g.

FIG. 7 shows the specific surface area Sw in the capacitor section.
It is a mapping diagram showing the relationship between the electrode thickness.

As is apparent from FIG. 7, when the electrode film thickness of the capacitor electrode is 0.5 to 4.0 μm, in order to prevent problems such as delamination and connection failure,
The specific surface area is 0.2 m ^{2 /} g to 1.4 as indicated by “D”.
It was confirmed that it was necessary to set m ² / g.

[0071]

As described above in detail, the laminated composite electronic component according to the present invention is a laminated composite electronic component composed of two or more kinds of laminated bodies in which the internal conductors and the sheet-shaped members are alternately laminated, The inner conductor is formed by sintering a conductive paste containing the same kind of metal material, and is formed with a different film thickness for each of the stacked bodies, and the thick inner conductor is a thin film inner conductor. Delamination, cracks, cracks, etc. occur because the conductive paste containing a metal material with a smaller average particle size than the conductor or / and the conductive paste containing a metal material with a larger specific surface area is sintered. It is possible to obtain a laminated composite electronic component having an internal conductor having a desired film thickness without causing delamination or the like.

In the laminated composite electronic component of the present invention, the laminated body includes a first laminated body (coil portion) having a first inner conductor (coil electrode) and the first inner conductor (coil). A second laminated body (capacitor portion) having a second inner conductor (capacitor electrode) having a smaller film thickness than that of the first inner conductor (coil electrode).
μm to 2.5 μm, or / and a specific surface area of 1.6 m ² /
The conductive paste containing a metal material of g to 2.6 m ² / g is sintered, and the second inner conductor (capacitor electrode) has an average particle diameter of 3.0 μm to 5.5 μm, or / and 0.2m ^{by 2 /g~1.4m 2} / g of the conductive paste containing a metal material is formed by sintering, it is possible to easily obtain the function and effect.

Further, since the conductive paste contains silver as a metallic material as a main component and an organic vehicle, it becomes possible to easily control the film thickness of the electrode.

Further, in the method for manufacturing a laminated composite electronic component according to the present invention, a sheet-like member having an electrode pattern formed thereon is laminated using a conductive paste containing a metal material to form a laminate, and In a method of manufacturing a laminated composite electronic component, in which two or more kinds of laminated bodies are stacked on each other and then subjected to a firing treatment to manufacture a laminated composite electronic component, a conductive paste containing the same kind of metal material is used. The electrode patterns are formed by using the conductive paste so that each of the laminated bodies has a different film thickness. Since it contains a metal material with a small average particle size and / or a metal material with a large specific surface area, delamination, cracks, cracks, etc. do not occur, and a desired film thickness is formed according to each laminate. The The high quality multilayer composite electronic component having excellent reliability with internal electrodes can be easily produced.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a composite LC component as a laminated composite electronic component according to the present invention.

FIG. 2 is a sectional view taken along line XX of FIG.

FIG. 3 is a schematic diagram for explaining a method for manufacturing the composite LC component.

FIG. 4 is a mapping diagram showing the relationship between the average particle diameter Dave of Ag powder in the coil portion and the electrode film thickness in the first embodiment.

FIG. 5 is a mapping diagram showing the relationship between the average particle diameter Dave of Ag powder and the electrode film thickness in the capacitor unit in the first embodiment.

FIG. 6 is a mapping diagram showing a relationship between a specific surface area Sw of Ag powder in a coil portion and an electrode film thickness in a second embodiment.

FIG. 7 is a mapping diagram showing the relationship between the specific surface area Sw of Ag powder and the electrode film thickness in the capacitor section in the second embodiment.

[Explanation of symbols]

1 Coil part (laminate) 2 Capacitor part (laminated body) 9-11 Coil electrode (inner conductor) 12 Magnetic sheet (sheet-shaped member) 13-16 Capacitor electrode (inner conductor) 17 Dielectric sheet (sheet-shaped member)

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Makoto Ishino             2-10-10 Tenjin, Nagaokakyo, Kyoto Stock             Murata Manufacturing Co., Ltd. F-term (reference) 5E070 AA05 CB03 CB13                 5E082 AA01 AB03 BB01 BB07 BC14                       BC39 EE04 EE23 EE35 FF05                       FG04 FG16 FG26 FG46 PP09                 5J024 AA10 CA03 DA04 DA29 DA35

Claims (11)

[Claims] 1. A laminated composite electronic component comprising two or more kinds of laminates in which inner conductors and sheet-shaped members are alternately laminated, wherein the inner conductor is a conductive paste containing the same kind of metal material. The conductive paste that is formed by sintering and has a different film thickness for each laminated body, and the thick inner conductor contains a metal material having a smaller average particle diameter than the thin inner conductor. A laminated composite electronic component characterized by being sintered. 2. A laminated composite electronic component comprising two or more kinds of laminates in which inner conductors and sheet-shaped members are alternately laminated, wherein the inner conductor is a conductive paste containing the same kind of metal material. The inner conductor having a large film thickness, which is formed by sintering and has a different film thickness for each laminated body, is a conductive paste containing a metal material having a larger specific surface area than the inner conductor having a thin film thickness. A laminated composite electronic component characterized by being sintered. 3. A laminated composite electronic component comprising two or more kinds of laminates in which inner conductors and sheet-shaped members are alternately laminated, wherein the inner conductor is a conductive paste containing the same kind of metal material. The inner conductor having a large film thickness, which is formed by sintering and has a different film thickness for each laminated body, is made of a metal material having a smaller average particle size and a larger specific surface area than an inner conductor having a thin film thickness. A laminated composite electronic component, characterized in that the contained conductive paste is sintered. 4. The laminated body comprises a first laminated body having a first inner conductor and a second laminated body having a second inner conductor having a thickness smaller than that of the first inner conductor. The first inner conductor has an average particle size of 0.5 μm to 2.5 μm.
The conductive paste containing a metal material of μm is sintered, and the second inner conductor has an average particle diameter of 3.0 μm to
The laminated composite electronic component according to claim 1 or 3, wherein a conductive paste containing a metal material of 5.5 µm is sintered. 5. The laminated body comprises a first laminated body having a first inner conductor and a second laminated body having a second inner conductor having a film thickness smaller than that of the first inner conductor. The first inner conductor has a specific surface area of 1.6 m ² / g to
A conductive paste containing a metal material of 2.6 m ² / g is sintered, and the second inner conductor has a specific surface area of 0.
The laminated composite electronic component according to claim 2 or 3, wherein a conductive paste containing ² m ² / g to 1.4 m ² / g of a metal material is sintered. 6. The first laminated body constitutes a coil portion,
The said 2nd laminated body comprises a capacitor | condenser part, The said 1st internal conductor is a coil electrode and the said 2nd internal electrode is a capacitor electrode, The claim 4 or claim 5 characterized by the above-mentioned. Multi-layer composite electronic component of. 7. The multilayer composite electronic component according to claim 1, wherein the metal material contains silver as a main component. 8. The laminated composite electronic component according to claim 1, wherein the conductive paste contains an organic vehicle. 9. A laminated body is formed by laminating sheet-like members on which an electrode pattern is formed by using a conductive paste containing a metal material, and at least two kinds of the laminated bodies are laminated on each other and then fired. In a method for manufacturing a laminated composite electronic component, which is subjected to a treatment to produce a laminated composite electronic component, a conductive paste containing the same kind of metal material is used, and each laminated body has a different film thickness. To form each electrode pattern using the conductive paste and to form the electrode pattern having a large film thickness, a conductive paste containing a metal material having a particle diameter smaller than that of the electrode pattern having a small film thickness is used. A method for manufacturing a laminated composite electronic component, which is characterized by being used. 10. A laminated body is formed by laminating sheet-like members on which an electrode pattern is formed using a conductive paste containing a metal material, and at least two kinds of the laminated bodies are superposed on each other and then fired. In a method for manufacturing a laminated composite electronic component, which is subjected to a treatment to produce a laminated composite electronic component, a conductive paste containing the same kind of metal material is used, and each laminated body has a different film thickness. To form each electrode pattern using the conductive paste and to form an electrode pattern having a large film thickness, a conductive paste containing a metal material having a larger specific surface area than an electrode pattern having a thin film thickness is used. A method for manufacturing a laminated composite electronic component, which is characterized by being used. 11. A laminated body is formed by laminating sheet-like members on which an electrode pattern is formed using a conductive paste containing a metal material, and at least two kinds of the laminated bodies are laminated on each other and then fired. In the method of manufacturing a laminated composite electronic component, which is subjected to a treatment to produce a laminated composite electronic component, a conductive paste containing the same kind of metal material is used, and each laminated body has a different film thickness. The conductive paste is used to form each electrode pattern, and when forming an electrode pattern having a large film thickness, a metal material having a smaller average particle size and a larger specific surface area than that of an electrode pattern having a small film thickness is contained. A method for producing a laminated composite electronic component, characterized by using the above-mentioned conductive paste.