JP2003204221A - Production method for container for surface mounted oscillator and crystal oscillator by the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a production method for a surface mounted container satisfactorily maintaining impact resistance and a crystal oscillator by the same. <P>SOLUTION: A container main body sheet is formed by laminating a frame wall sheet having a plurality of windows and having through holes on connecting parts on a bottom wall sheet, a plurality of container main bodies composed of bottom walls and frame walls are formed by providing the connecting parts with cut grooves, baking the frame wall sheet and dividing it along with the cut grooves provided on the connecting parts later, and the recessed container for surface mounted oscillator having end face electrodes formed from the through holes on the outer surface of the frame wall on the main body of the container is produced. In such a production method, conductive material is embedded in each of the through holes, the conductive material is equipped with a cut groove as well and baked and the container main body sheet is divided along with the cut grooves so that the plurality of main bodies of the container can be formed. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a container for a surface mount oscillator and a crystal oscillator according to the method, which is suitable for miniaturization while maintaining the shock resistance of the crystal oscillator. It relates to a manufacturing method.

[0002]

BACKGROUND OF THE INVENTION A crystal oscillator is used as a frequency and time reference source in many electronic devices. In particular, it is small and lightweight for surface mounting, and is incorporated in a portable device. One of such devices is a temperature-compensated crystal oscillator (referred to as a temperature-compensated oscillator) as a crystal oscillator used in a dynamic environment where temperature changes greatly.

(Example of Prior Art) FIG. 3 is a view of a temperature-compensated oscillator for surface mounting for explaining a conventional example. FIG. 3A is a sectional view and FIG. 3B is a cover and a second. It is a top view except a frame wall. The temperature-compensated oscillator is formed by fixing an IC chip 1 on which a temperature-compensating function and an oscillation circuit are integrated to the bottom surface of a concave container body 2, holding a crystal piece 3 on a stepped portion, and covering the cover 4. Then, the temperature compensation data for compensating the frequency temperature characteristic of the crystal oscillator is written in the temperature compensation function in the IC chip 1 from the end face electrode 5 provided on the side surface of the container body 2.

The container body 2 comprises a bottom wall 7 having a mounting electrode 6 and first and second side walls 8 (ab) forming a step,
The end face electrode 5 is provided on the side surface of the intermediate first side wall 8a.
Usually, as shown in FIG. 4 (a), through holes 10 are provided in the connecting portion of the first side wall sheet 8A having a plurality of windows 9, and the first side wall sheet 8A and the first side wall sheet 8A and the first side wall sheet 8A are provided on the bottom wall sheet (not shown). Two side wall sheets (not shown) are laminated to form a container body sheet. FIG. 4 (b) is a partially enlarged view indicated by a dotted frame (a) in FIG. 4 (a).

A conductive paste as a base circuit pattern (not shown) is applied by printing to the bottom wall sheet and the first and second frame wall sheets, including the inner surface of the through hole 10. Then, vertical and horizontal cut grooves 11 for dividing are provided from the surface of the connecting portion of the container body sheet, and after the container body sheet is integrally fired, the container body sheet is divided along the cut grooves 11 and the end face electrodes 5 are formed on the side surfaces. Obtain a plurality of container bodies 2 having. Usually, after firing, the underlying circuit pattern including the through holes 10 is Au plated.

[0006]

Problems to be Solved by the Invention (Problems of Prior Art)
However, in the temperature-compensated oscillator configured as described above, since the end face electrode 5 is formed by the through hole on the side surface of the container body 2 (first frame wall 8a), the thickness (width) of that portion is locally reduced. Therefore, due to the rapid miniaturization in recent years,
When the width of the frame wall is reduced, the strength of the first frame wall 8a is impaired, and the shock resistance of the temperature-compensated oscillator is deteriorated.

(Object of the Invention) It is an object of the present invention to provide a method of manufacturing a surface mount container having good impact resistance and a crystal oscillator using the same.

[0008]

According to the present invention, a conductive material is embedded in a through hole provided in a connecting portion of a frame wall sheet to provide a kerf, and after firing, the container body sheet is divided along the kerf. The basic solution means is to form a plurality of container bodies having the end face electrodes in the through holes in which the conductive material is embedded.

[0009]

In the present invention, since the conductive material is embedded in the through hole and divided, the thickness of the end face electrode 5 portion becomes substantially the same as the frame wall width, and the strength can be increased. An embodiment of the present invention will be described below by taking a temperature compensation oscillator as an example.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view of a temperature compensation oscillator according to an embodiment of the present invention, excluding a cover and a second frame wall. It should be noted that the same parts as those of the prior art example are given the same reference numerals, and the description thereof will be simplified or omitted. As described above, the temperature-compensated oscillator uses the IC chip 1 as the bottom wall 7 and the first and second frame walls 8 (ab).
The temperature compensation data for compensating the frequency temperature characteristic is fixed to the bottom surface of the container body 2 made of, the crystal piece 3 is held on the stepped portion and the cover 4 is covered, and the temperature compensation data for compensating the frequency temperature characteristic is obtained from the end surface electrode 5 provided on the side surface. It is configured by writing in the compensation function. And
Here, the end surface electrode 5 of the container main body 2 is embedded with the conductive material 12 and is formed substantially on the same plane as the side surface.

Specifically, the container body 2 is formed by stacking the bottom wall sheet and the first and second frame wall sheets to form a container body sheet, and then dividing the sheet separately after firing as described above. . Here, first, a base circuit pattern is formed and laminated on the bottom wall sheet, the first frame wall sheet 8A having the through holes 10 and the second frame wall sheet, and then, as shown in FIG. 2 (a), The conductive material 12 is embedded in the through hole. FIG. 2B is a partially enlarged view shown in FIG. The conductive material 12 is, for example, W (tungsten) that forms a base circuit pattern.

Next, the conductive material 1 is applied from above the second frame wall laminated sheet.
The cut groove 11 reaching 2 is provided, and the container body sheet is integrally fired. Finally, as shown in FIG. 2 (c), the underlying circuit pattern is plated with Au (not shown) to form the kerf 1
1. Divide into individual container bodies 2 along 1.

With this structure, since the end surface electrode 5 formed on the side surface of the container body 2 is flush with the side surface by embedding the conductive material 12, the strength at that portion is compensated.
The thickness of the frame wall 8a is kept constant to prevent local reduction in strength. Therefore, miniaturization is promoted and impact resistance is improved.

Further, the filling material 12 is embedded in the through hole 10 of the first frame wall sheet 8A, and the cut groove 11 reaching the filling material 12 is provided. Therefore, when dividing the container body sheet, it is possible to divide the sheet along the kerfs 11 without difficulty. In addition, when the filling material 12 does not have the kerf 11, it is separated from the inner wall of the through hole 10 at the time of division and is not divided.

[0015]

[Other Matters] In the above embodiment, the container body 2 is provided with a recess only on one main surface side of the bottom wall 7 to accommodate the IC chip 1 and the crystal piece 3 together. The present invention can be applied even when the IC chip 1 and the crystal piece are separately accommodated by providing a concave portion on the surface side. Further, in addition to the IC chip, other electronic components such as a capacitor may be housed if necessary. Further, although the end surface electrode is the writing terminal of the temperature compensation oscillator, it may be a crystal terminal for characteristic evaluation connected to the crystal piece of the crystal oscillator, for example, and can be applied when the end surface electrode is required.

[0016]

According to the present invention, a conductive material is embedded in a through hole provided in a connecting portion of a frame wall sheet to form a kerf, and after firing, the container body sheet is divided along the kerf to form a conductive material. Since a plurality of container bodies having the end face electrodes in the buried through holes are formed, it is possible to provide a method of manufacturing a surface mount container having good impact resistance and a crystal oscillator according to the method.

[Brief description of drawings]

FIG. 1 is a plan view excluding a cover and a second frame wall of a temperature-compensated oscillator for explaining an embodiment of the present invention.

FIG. 2 is a view for explaining an embodiment of the manufacturing method of the present invention,
FIG. 3A is a plan view of the first frame wall sheet, FIG. 2B is a partially enlarged view of the part shown in FIG. 2A, and FIG.
Is a plan view after division.

FIG. 3 is a diagram of a temperature-compensated oscillator for explaining a conventional example, in which FIG. 3A is a partially cutaway sectional view, FIG.
It is a top view except a frame wall.

FIG. 4 is a view for explaining the manufacturing method of the conventional example, and FIG.
Is a plan view of the first frame wall sheet, and FIG. 7B is a partially enlarged view of the portion shown in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 IC chip, 2 container main body, 3 crystal piece, 4 cover, 5 end surface electrodes, 6 mounting electrodes, 7 bottom wall, 8a 1st frame wall, 8b 2nd frame wall, 8A 1st frame wall sheet, 9 window,
10 through holes, 11 kerfs, 12 conductive material.

Claims (2)

[Claims] 1. A container wall sheet is formed by laminating a frame wall sheet having a plurality of windows and a through hole in a connecting portion on a bottom wall sheet, and forming a kerf in the connecting portion, followed by firing. A concave surface having a plurality of container main bodies composed of a bottom wall and a frame wall divided along a kerf provided in the connecting portion, and having an end face electrode formed by the through hole on the outer surface of the frame wall of the container main body In the method for manufacturing a container for a mounted oscillator, a conductive material is embedded in the through hole, a kerf is also provided in the conductive material and baked, and the container body sheet is divided along the kerf to form a plurality of container bodies. A method for manufacturing a container for a surface mount oscillator, wherein the container is formed. 2. A crystal oscillator for surface mounting, wherein a crystal blank and an IC chip are housed in the container body.