JP2003203856A5 - - Google Patents
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- Publication number
- JP2003203856A5 JP2003203856A5 JP2002229697A JP2002229697A JP2003203856A5 JP 2003203856 A5 JP2003203856 A5 JP 2003203856A5 JP 2002229697 A JP2002229697 A JP 2002229697A JP 2002229697 A JP2002229697 A JP 2002229697A JP 2003203856 A5 JP2003203856 A5 JP 2003203856A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002229697A JP2003203856A (ja) | 2001-10-23 | 2002-08-07 | 有機被膜の除去方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001325516 | 2001-10-23 | ||
| JP2001-325516 | 2001-10-23 | ||
| JP2002229697A JP2003203856A (ja) | 2001-10-23 | 2002-08-07 | 有機被膜の除去方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002061096 Division | 2001-10-23 | 2002-03-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003203856A JP2003203856A (ja) | 2003-07-18 |
| JP2003203856A5 true JP2003203856A5 (OSRAM) | 2005-07-07 |
Family
ID=27666411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002229697A Pending JP2003203856A (ja) | 2001-10-23 | 2002-08-07 | 有機被膜の除去方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003203856A (OSRAM) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050120914A (ko) * | 2004-06-21 | 2005-12-26 | 주식회사 동진쎄미켐 | 레지스트 제거용 조성물 |
| JP4883975B2 (ja) * | 2004-10-19 | 2012-02-22 | 株式会社レナテック | 基体表面上の付着物の除去方法、除去用処理液および除去装置 |
| JP2008192629A (ja) * | 2005-05-20 | 2008-08-21 | Toagosei Co Ltd | 基体表面上の有機被膜の除去方法及び除去装置 |
| JPWO2007004612A1 (ja) * | 2005-07-05 | 2009-01-29 | 東亞合成株式会社 | 剥離液中の有機物濃度を管理した基体の製造方法 |
| EP1903400A1 (en) * | 2006-09-20 | 2008-03-26 | Interuniversitair Microelektronica Centrum | A method to remove resist layers from a substrate |
| US20100183853A1 (en) * | 2007-06-12 | 2010-07-22 | Takashi Ihara | Stripping agent for resist film on/above conductive polymer, method for stripping resist film, and substrate having patterned conductive polymer |
| JP5466380B2 (ja) * | 2008-07-17 | 2014-04-09 | 大日本スクリーン製造株式会社 | 基板処理装置のスケジュール作成方法及びそのプログラム |
| JP2012109290A (ja) * | 2010-11-15 | 2012-06-07 | Kurita Water Ind Ltd | シリコンウェハ清浄化方法及びシリコンウェハ清浄化装置 |
| JP5701068B2 (ja) * | 2011-01-06 | 2015-04-15 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| TWI480937B (zh) | 2011-01-06 | 2015-04-11 | Screen Holdings Co Ltd | 基板處理方法及基板處理裝置 |
| US8871108B2 (en) * | 2013-01-22 | 2014-10-28 | Tel Fsi, Inc. | Process for removing carbon material from substrates |
| US11335550B2 (en) * | 2017-09-08 | 2022-05-17 | Acm Research (Shanghai) Inc. | Method and apparatus for cleaning semiconductor wafer |
| JP7752087B2 (ja) * | 2022-04-04 | 2025-10-09 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
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2002
- 2002-08-07 JP JP2002229697A patent/JP2003203856A/ja active Pending