JP2003200259A - Apparatus for assembling main body in furnace, reflow furnace and separately setting simple-type gas exhausting and heat-radiating apparatus - Google Patents

Apparatus for assembling main body in furnace, reflow furnace and separately setting simple-type gas exhausting and heat-radiating apparatus

Info

Publication number
JP2003200259A
JP2003200259A JP2001398938A JP2001398938A JP2003200259A JP 2003200259 A JP2003200259 A JP 2003200259A JP 2001398938 A JP2001398938 A JP 2001398938A JP 2001398938 A JP2001398938 A JP 2001398938A JP 2003200259 A JP2003200259 A JP 2003200259A
Authority
JP
Japan
Prior art keywords
furnace
water
reflow furnace
main body
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001398938A
Other languages
Japanese (ja)
Inventor
Masakazu Sueyasu
正和 末安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YASUKAWA SANGYO KK
Original Assignee
YASUKAWA SANGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YASUKAWA SANGYO KK filed Critical YASUKAWA SANGYO KK
Priority to JP2001398938A priority Critical patent/JP2003200259A/en
Publication of JP2003200259A publication Critical patent/JP2003200259A/en
Pending legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for performing treatments of vaporized residual material in flux and exhaust gas in a reflow furnace. <P>SOLUTION: This apparatus is the one, in which the exhaust gas from reflow is sucked with an axial fan 3 and forcibly passed through a cooling path 4 in water at one time and cooled to about 100°C, and successively, exhausted into the water with a water cooling part outlet path 5 and cooled to 25°C by passing through the water. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】 【０００１】本発明は、リフロー炉に於いて、フラック
スの蒸発残留物及び排気の処理を行う装置。 【従来の技術】 【０００２】従来の排気放熱は、炉よりダクトを通して
屋外へ軸流ファンで排気放熱している。 【０００３】 【発明が解決しようとする課題】請求項１の発明で、リ
フロー炉を使用する実装ラインで、その工場でのレイア
ウトの変更、又 生産実装ラインの別工場への移設・外
国への移転で、排気放熱ダクトの設置工事が不要になり
設備コストが１／２になる。 【発明が解決する為の手段】請求項１の発明では、目的
を達成するために１５０℃位の排気を軸流ファンで強制
的に水中を通して、２５℃位になった排気になる。 【０００４】 【作用】請求項１の発明により、設備レイアウトが簡単
に出来る。 【０００５】 【発明の実施の形態】以下に本発明の実施の形態を図面
に基づいて説明する。本実施の形態は、図１の２ リフ
ロー炉排気ダクト、３ 吸気用軸流ファン、４１回目冷
却ホース、５ 水冷 冷却用ダクト、６ 冷却用水、７ 水
タンク、８ 装置フレームを主要な構成とする。 【０００６】吸気用軸流ファン ３で、リフロー炉から
吸われた１５０℃位のフラックス蒸気残留物排気を 水
タンク内に通された１回目冷却ホース ４に送り込み１
００℃位に冷却する。次にその排気は水中に取り付けら
れた、水冷冷却ダクト ５より水中に放出され、水で冷
やされて空気中へ出る。このときの温度は２５℃位にな
る。 【０００７】 【０００８】の動作で、リフロー炉のフラックス蒸気の
含まれた排気が 水及び周辺の空気に悪影響を及ばさな
いという分析結果が出ている。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for treating flux evaporation residues and exhaust gas in a reflow furnace. 2. Description of the Related Art Conventionally, exhaust heat is radiated from a furnace through a duct to the outside by an axial fan. [0003] According to the first aspect of the present invention, in a mounting line using a reflow furnace, a layout of the factory is changed, a production mounting line is relocated to another factory, or transferred to a foreign country. The relocation eliminates the need for installation work for exhaust heat radiation ducts and reduces equipment costs by half. According to the first aspect of the present invention, in order to achieve the object, the exhaust gas at about 150 ° C. is forcibly passed through water by an axial fan to obtain exhaust gas at about 25 ° C. According to the first aspect of the present invention, the equipment layout can be simplified. An embodiment of the present invention will be described below with reference to the drawings. In this embodiment, the main components are 2 reflow furnace exhaust duct, 3 intake axial flow fan, 41st cooling hose, 5 water cooling cooling duct, 6 cooling water, 7 water tank, and 8 device frame in FIG. . [0006] The axial-flow fan 3 for suction feeds the exhausted flux vapor residue at about 150 ° C sucked from the reflow furnace into the first cooling hose 4 passed through the water tank.
Cool to around 00 ° C. Next, the exhaust gas is discharged into the water from a water-cooled cooling duct 5 attached to the water, cooled by the water, and discharged into the air. The temperature at this time is about 25 ° C. According to the above operation, it has been analyzed that the exhaust gas containing the flux vapor of the reflow furnace does not adversely affect water and the surrounding air.

【図面の簡単な説明】 【図 １】 本体組込み装置の断面図である。 【図 ２】 別置き装置の断面図である。 【符号の説明】 １． 実装用リフロー炉 ２． リフロー炉排気ダクト ３． 吸気用軸流ファン ４． １回目冷却路 ５． 水冷却部出口路 ６． 冷却用水 ７． 水タンク ８． 装置フレーム[Brief description of the drawings] FIG. 1 is a sectional view of a main assembly device. FIG. 2 is a cross-sectional view of a separate device. [Explanation of symbols] 1. Reflow furnace for mounting 2. Reflow furnace exhaust duct 3. Axial fan for intake 4. 1st cooling path 5. Water cooling section exit path 6. Cooling water 7. water tank 8. Equipment frame

Claims (1)

【特許請求の範囲】 【請求項１】 リフロー炉の排気に於いて、屋外の外
気への排気放熱でなく、本体組込み装置及び別置きの簡
易型 排気・放熱装置。Claims: 1. An exhaust device for assembling a main body and a separate exhaust / radiator device separately from a reflow furnace, wherein the exhaust device does not radiate the exhaust gas to the outside air.
JP2001398938A 2001-12-28 2001-12-28 Apparatus for assembling main body in furnace, reflow furnace and separately setting simple-type gas exhausting and heat-radiating apparatus Pending JP2003200259A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001398938A JP2003200259A (en) 2001-12-28 2001-12-28 Apparatus for assembling main body in furnace, reflow furnace and separately setting simple-type gas exhausting and heat-radiating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001398938A JP2003200259A (en) 2001-12-28 2001-12-28 Apparatus for assembling main body in furnace, reflow furnace and separately setting simple-type gas exhausting and heat-radiating apparatus

Publications (1)

Publication Number Publication Date
JP2003200259A true JP2003200259A (en) 2003-07-15

Family

ID=27639677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001398938A Pending JP2003200259A (en) 2001-12-28 2001-12-28 Apparatus for assembling main body in furnace, reflow furnace and separately setting simple-type gas exhausting and heat-radiating apparatus

Country Status (1)

Country Link
JP (1) JP2003200259A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053158A (en) * 2005-08-16 2007-03-01 Yokota Technica:Kk Reflow soldering device and flux removing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053158A (en) * 2005-08-16 2007-03-01 Yokota Technica:Kk Reflow soldering device and flux removing device

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