JP2003198080A - Wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate the problem that electromagnetic waves generated from interconnection conductors for signals leak to the outside, making it difficult to obtain good isolation characteristics, and high-speed signals exceeding 60 GHz, for example, cannot be efficiently and correctly transmitted. <P>SOLUTION: A wiring board has such a structure that a ground conductor layer 4a is so disposed on an insulation base material 1 made by stacking a plurality of insulation layers 1a and 1b as to face interconnection conductors 3 for signals via the insulation layer 1b, first through conductors 5a connected to the ground conductor layer 4a are arranged in line on both sides of each interconnection conductor 3 for signals, and second through conductors 5b having a diameter larger than that of the first through conductors 5a are distributed in regions outside the first through conductors 5a. Part of the first and the second through conductors 5a and 5b is made of ferrite. In the wiring board, the leakage of an electromagnetic noise from the interconnection conductors 3 for signals can be effectively prevented even for very high-speed signals. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency wiring board for mounting high-frequency circuit elements such as high-frequency semiconductor elements and high-frequency circuits used in the high-frequency band.

[0002]

2. Description of the Related Art In wiring boards for mounting electronic parts such as semiconductor elements and optical semiconductor elements that operate at high speed,
In order to propagate a high-speed signal accurately and efficiently, it is important to enhance the isolation of the signal wiring conductor through which the high-speed signal propagates and to match the characteristic impedance.

As such a wiring board, for example, Japanese Unexamined Patent Application Publication 2000
In the -208885 publication, a ground conductor layer (ground layer) for increasing the isolation value of a signal wiring conductor (signal line) through which a signal propagates or for matching characteristic impedance is provided on two or more substrates. A wiring board having a large number of through conductors connected to the ground conductor layer on both sides of the signal wiring conductor and distributed at adjacent intervals of 0.5 to 5 times the diameter of the through conductor. The plurality of penetrating conductors are arranged in a row along the signal wiring conductor on both sides of the first penetrating conductor, and the plurality of penetrating conductors are distributed and arranged in a region outside the first penetrating conductor. A wiring board including a second through conductor having a diameter larger than that of the first through conductor is disclosed. According to this wiring board, a large gap extending in a direction perpendicular to the signal wiring conductor is not formed between a large number of through conductors, and a high-speed signal exceeding, for example, 10 GHz is propagated by the signal wiring conductor. Even if it does, it is possible to effectively prevent electromagnetic waves from leaking from the signal wiring conductor to the outside, and as a result, it is considered that the isolation of the signal wiring conductor and the matching of the characteristic impedance are good, and the frequency exceeds 10 GHz. It is possible to propagate such high-speed signals efficiently and accurately.

[0004]

However, in the above wiring board, a large number of through conductors connected to the ground conductor layer on both sides of the signal wiring conductor have different diameters.
It is made by arranging at intervals of 0.5 to 5 times adjacent to each other, and as a large number of through conductors, 1 is provided on both sides of the signal wiring conductor.
First through conductors arranged side by side in rows and second through conductors having a diameter larger than that of the first through conductors dispersedly arranged in an area outside the first through conductors are arranged. However, when an ultra-high frequency signal exceeding 60 GHz is propagated, the electromagnetic wave generated from the signal wiring conductor leaks to the outside through a large gap between the through conductors connected in the direction perpendicular to the signal wiring conductor. I put it out, and as a result,
There is a problem in that good isolation characteristics of the signal wiring conductor cannot be obtained, and it becomes difficult for the signal wiring conductor to efficiently and accurately propagate an ultrahigh-speed signal exceeding 60 GHz. It was

Further, in the wiring substrate used in the conventional semiconductor device, the electric insulating material such as alumina ceramics, which constitutes the insulating substrate, has a low shielding effect against electromagnetic wave noise, and the recent semiconductor element is high in speed and Low-voltage driving has come to be performed, and it is easily affected by harmonic noise that enters from the outside of the semiconductor device through the metallized wiring layer, and at the same time, harmonic noise included in a signal that propagates through the metallized wiring layer Since it is apt to be emitted to the outside of the semiconductor device, if a noise source is located near the outside of the semiconductor device, electromagnetic wave noise will be extremely high in the signal propagating through the metallized wiring layer formed on the insulating substrate. It easily enters and propagates to the semiconductor element as it is, causing the semiconductor element to malfunction. If there is likely an electronic device or the like sensitive to electromagnetic noise to the outside position near the body apparatus electromagnetic noise emitted from the semiconductor device is disadvantageously or worse adversely affect the electronic devices.

The present invention has been devised in view of the above problems, and an object thereof is to reduce the leakage of electromagnetic waves from a signal wiring conductor even when an ultrahigh frequency signal is propagated, so that isolation and characteristic impedance can be reduced. It is an object of the present invention to provide a wiring board that can ensure good matching and can efficiently and accurately propagate a high-speed signal exceeding 60 GHz, for example.

[0007]

A wiring board according to the present invention is a signal wiring conductor for propagating a high frequency signal to an insulating substrate formed by laminating a plurality of insulating layers, and the above-mentioned insulation for the signal wiring conductor. A plurality of through conductors connected to the ground conductor layer are provided on both sides of the signal wiring conductor, and the ground conductor layers are arranged adjacent to each other with a diameter of 0.5 to 5 times the diameter of the through conductor. A wiring board formed by being dispersed at intervals, wherein the plurality of through conductors are arranged in a row along both sides of the signal wiring conductor, one first through conductor being provided side by side. A second through conductor having a diameter larger than that of the first through conductor, the second through conductor having a diameter larger than that of the first through conductor, the second through conductors being dispersedly arranged in an area outside the first through conductor; It is a thing.

According to the high-frequency wiring board of the present invention, a signal wiring conductor for propagating a high-frequency signal to an insulating substrate formed by laminating a plurality of insulating layers, and the insulating layer for the signal wiring conductor. A large number of through conductors connected to the ground conductor layer are arranged on both sides of the signal wiring conductor at an interval of 0.5 to 5 times the diameter of the through conductor. A plurality of penetrating conductors, wherein the plurality of penetrating conductors are arranged in a row along the signal wiring conductor on both sides thereof, and the first penetrating conductors; A second through conductor having a diameter larger than that of the first through conductor, the second through conductor having a diameter larger than that of the first through conductor, and the plurality of through conductors being partly made of ferrite. First through conductor provided along the wiring conductor Since the diameter of the body is small, the distance between the first penetrating conductors adjacent to each other can be narrowed, whereby the shielding performance of the first penetrating conductors is high, and the isolation and characteristics of the signal wiring conductor are improved. The impedance matching can be made good. Also,
Since the diameter of the second through conductor is larger than that of the first through conductor, the inductance of the second through conductor is reduced and the connection reliability between the second through conductor and the ground conductor layer is high. A stable ground network can be formed by the second penetrating conductor and the ground conductor layer, and electromagnetic waves can be effectively prevented from leaking out from the signal wiring conductor. Further, since some of the through conductors are made of ferrite, electromagnetic wave noise from a signal propagating through the signal wiring conductor can be effectively absorbed and removed by the through conductors made of these ferrites. It is possible to provide a wiring board in which electronic components such as the above are operated normally and stably and in which electromagnetic noise is less likely to be emitted to the outside of the semiconductor device in which this wiring board is used.

Further, the wiring board of the present invention is characterized in that, in the above structure, a part of the penetrating conductor made of the ferrite is arranged in a column closest to the signal wiring conductor.

When the through conductors made of ferrite are arranged in the column closest to the signal wiring conductor in this manner, the through conductors are arranged closest to the signal wiring conductor which is the source of the harmonic noise, and therefore, the signal The harmonic noise from the wiring conductor can be efficiently absorbed and removed.

Further, in the wiring board of the present invention, in the above structure, the plurality of through conductors are arranged also on the outer peripheral portion of the insulating base, and a part of the through conductors made of the ferrite is formed on the outer peripheral portion. It is characterized in that it is arranged in the column closest to the section.

As described above, when a large number of through conductors are arranged also on the outer peripheral portion of the insulating base and the through conductors made of ferrite are arranged in the row closest to the outer peripheral portion of the insulating base,
It is possible to effectively prevent electromagnetic wave noise from an ultra-high frequency signal propagating through the signal wiring conductor from being absorbed and removed by the through conductor made of ferrite in the outer peripheral portion of the insulating substrate, and to emit the electromagnetic wave noise to the outside. It will be possible.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a top view showing an example of an embodiment of a wiring board of the present invention, FIG. 2 is a sectional view taken along line AA of FIG. 1, and FIG. 3 is a sectional view taken along line BB of FIG. It is a figure.

In these figures, 1 is an insulating substrate, 3 is a signal wiring conductor, 4a and 4b are ground conductor layers, and 5a.
5b is a through conductor.

In FIG. 1, the through conductors 5a and 5b are provided.
Should be indicated by a broken line because it is located below the ground conductor layer 4b, but is indicated by a thin solid line for convenience of drawing.

As shown in FIG. 2, the insulating substrate 1 includes an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, and a silicon nitride sintered body.
An inorganic insulating material such as glass ceramics, an organic insulating material such as polytetrafluoroethylene / epoxy / polyimide / glass epoxy, or an inorganic insulating powder such as ceramic powder is bonded with a thermosetting resin such as epoxy resin. And a plurality of insulating layers made of an electrically insulating material such as a composite insulating material. In this example, the plate-shaped insulating layer 1a and the frame-shaped insulating layer 1b are laminated and integrated. Then, in the central portion of the upper surface thereof, a concave portion 2 is formed as an electronic component mounting portion for accommodating an electronic component (not shown) such as a semiconductor element.

When the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder, a solvent, etc. are added to and mixed with a raw material powder of aluminum oxide, silicon oxide, calcium oxide, magnesium oxide or the like. A ceramic green sheet to be the insulating layers 1a and 1b is obtained by forming it into a sheet shape by adopting a conventionally known doctor blade method while forming it into a slurry shape, and thereafter, appropriate punching processing is performed on these ceramic green sheets. It is manufactured by stacking the layers on top of each other and finally firing the laminated body at a temperature of about 1600 ° C. in a reducing atmosphere.

A ground conductor layer 4a is provided on the upper surface of the insulating layer 1a over substantially the entire surface thereof, and electronic parts such as semiconductor elements are mounted on the exposed portions of the ground conductor layer 4a in the recesses 2. .

Further, on the upper surface of the insulating layer 1b, as shown in FIGS. 1 and 3, a ground conductor layer 4b is disposed between the adjacent signal wiring conductors 3 and 3, and the signal wiring conductor 3 is provided. Also, each electrode of an electronic component such as a semiconductor element is connected to the periphery of the recess 2 of the ground conductor layer 4b via a bonding wire or the like.

Signal wiring conductor 3 and ground conductor layer 4
a and 4b are tungsten, molybdenum and molybdenum-
It is made of metal powder metallization such as manganese, copper, silver, silver-palladium, or metal material such as copper, silver, nickel, chromium, titanium, gold, or alloys thereof. For example, in the case of metal powder metallization of tungsten, a metal paste obtained by adding and mixing an appropriate organic binder / solvent to tungsten powder is printed and applied in a predetermined pattern on a ceramic green sheet to be the insulating layers 1a and 1b. By firing this together with the laminated body of the ceramic green sheets, it is arranged on the upper surfaces of the insulating layers 1a and 1b.

The ground conductor layers 4a and 4b are, as shown in FIGS. 1 and 3, a large number of first through conductors 5a and first through conductors 5a provided so as to penetrate the insulating layer 1b.
It is electrically connected by the second penetrating conductor 5b having a larger diameter. The diameter of the first through conductor 5a is preferably as small as 0.03 to 0.15 mm, and the first through conductor 5a has a small diameter.
Along one side of the signal wiring conductor 3 on each side of the diameter
They are arranged side by side with an interval d1 of 0.5 to 5 times.

The first through conductor 5a is the signal wiring conductor 3
Has a function to electromagnetically shield both sides of the signal wiring conductor 3 to enhance the isolation of the signal wiring conductor 3 and to match the characteristic impedance of the signal wiring conductor 3, and since the diameter thereof is relatively small, the adjacent distance d1 is narrow. It can be densely arranged as a product, and a high shielding property against high frequency can be secured.

Further, when the diameter is 0.03 to 0.15 mm, the adjacent distance d1 can be densely arranged with a narrow distance of 0.015 to 0.75 mm, which is extremely excellent for a high frequency exceeding 10 GHz, for example. It is possible to secure the shielding property.

The first penetrating conductor 5a has an adjacent interval d1.
Is less than ½ (0.5 times) the diameter, cracks tend to easily occur in the insulating layer 1b between the adjacent first through conductors 5a. On the other hand, if the adjacent distance d1 exceeds 5 times the diameter, it tends to be difficult to satisfactorily shield both sides of the signal wiring conductor 3. Therefore, the adjacent distance d1 between the first through conductors 5a is specified within a range of 0.5 to 5 times the diameter of the first through conductors 5a.

The diameter of the first through conductor 5a is
If it is less than 0.03 mm, it tends to be difficult to satisfactorily form the first penetrating conductor 5a itself. On the other hand, when the diameter exceeds 0.15 mm, the adjacent spacing d1 between the first through conductors 5a is narrowed to secure a high shield property against a high frequency of, for example, 10 GHz and obtain good isolation and characteristic impedance matching. Tends to be difficult. Therefore, it is preferable to set the diameter of the first through conductor 5a in the range of 0.03 to 0.15 mm.

If the distance d1 between the first through conductors 5a is set to 1/4 or less of the wavelength of the high frequency signal propagated by the signal wiring conductor 3, it is preferably set to 1/8 or less. The isolation of the signal wiring conductor 3 can be made extremely high. Therefore, the first
It is desirable that the adjacent distance d1 between the through conductors 5a is set to 1/4 or less, and more preferably 1/8 or less of the wavelength of the high-frequency signal propagated by the signal wiring conductor 3.

Further, in the first penetrating conductor 5a, the distance d2 between the columns sandwiching the signal wiring conductor 3 is set to be equal to the signal wiring conductor 3.
When the wavelength of the high-frequency signal propagated by is set to ½ or less, the reflection loss of the high-frequency signal propagating through the signal wiring conductor 3 can be made small. Therefore, it is preferable that the distance d2 between the columns of the first penetrating conductors 5a sandwiching the signal wiring conductor 3 is not more than half the high frequency signal propagated by the signal wiring conductor 3.

On the other hand, the diameter of the second penetrating conductor 5b is larger than that of the first penetrating conductor 5a, and the second penetrating conductor 5b is located in an area outside the first penetrating conductor 5a with respect to the signal wiring conductor 3. They are provided with a distance d3 of 0.5 to 5 times the diameter of each other and approximately evenly distributed.

The second through conductor 5b is the ground conductor layer 4
The second through conductor 5b has a function of strengthening the ground by connecting a and 4b with a low inductance and has a diameter larger than that of the first through conductor 5a.
Has a small inductance and high connection reliability between the second through conductor 5b and the ground conductor layers 4a and 4b. Therefore, the second through conductor 5b and the ground conductor layers 4a and 4b are stable. A ground network can be formed.

When the diameter is 0.2 to 0.3 mm, the inductance of the second through conductor 5b can be reduced and the connection reliability with the ground conductor layers 4a and 4b can be improved. An extremely stable ground network can be formed by the second penetrating conductor 5b and the ground conductor layers 4a and 4b.

Therefore, according to such a wiring board of the present invention, it becomes easy to accurately transmit a high-speed signal exceeding, for example, 10 GHz with less loss by the signal wiring conductor 3.

When the distance d3 between adjacent second conductors 5b is less than 0.5 times the diameter, the second through conductor 5b tends to easily crack the insulating layer 1b. On the other hand, if it exceeds 5 times, the ground conductor layers 4a and 4b
It tends to be difficult to connect and with a low inductance to form a stable ground network. Therefore, the adjacent distance d3 between the second penetrating conductors 5b is equal to the second distance d2.
It is specified in the range of 0.5 to 5 times the diameter of the through conductor 5b.

The diameter of the second through conductor 5b is
If it is less than 0.2 mm, the inductance of the second through conductor 5b becomes large and the second through conductor 5b becomes large.
The connection reliability between the ground conductor layers 4a and 4b is low, and as a result, it tends to be difficult to form a stable ground network between the ground conductor layers 4a and 4b and the second penetrating conductor 5b. . On the other hand, its diameter is 0.
When it exceeds 3 mm, the difference in the amount of thermal expansion between the second through conductor 5b and the insulating layer 1b becomes large, and a gap is generated between the second through conductor 5b and the insulating layer 1b, or the insulating layer is formed. 1
Cracks tend to occur in b. Therefore, it is preferable to set the diameter of the second through conductor 5b in the range of 0.2 to 0.3 mm.

The first through conductors 5a and the second through conductors 5b are made of metal powder metallized with tungsten, molybdenum, molybdenum-manganese, copper, silver, silver-palladium or the like, or copper, silver, nickel, chromium. Titanium·
It is made of metal materials such as gold and alloys thereof. For example, in the case of being made of metal powder metallization of tungsten, in a region where the ground conductor layer 4b of the ceramic green sheet to be the insulating layer 1b is arranged, a through hole having a diameter after firing of 0.03 to 0.15 mm and the firing The through holes having a diameter of, for example, 0.2 to 0.3 mm are punched out in a predetermined arrangement, and a conductor paste containing tungsten powder as a main component is filled in the through holes by using a conventionally known screen printing method. Is fired together with a ceramic green sheet laminate serving as the insulating substrate 1.

In this case, the first through conductor 5a and the second through conductor 5a
When a proper amount of the same component as the insulating substrate 1 is contained in the conductor paste that will be the through conductor 5b according to the material characteristics of the insulating substrate 1 and the through conductors 5a and 5b, the first through conductor 5
It is possible to approximate the firing contraction rate and the thermal expansion coefficient of the a and the second through conductor 5b to the firing contraction rate and the thermal expansion coefficient of the insulating substrate 1, which results in the difference in the firing contraction rate and the thermal expansion coefficient between the two. The first through conductor 5a and the second through conductor 5
It is possible to effectively prevent a gap from being generated between the insulating layer 1b and the insulating layer 1b or a crack from being generated in the insulating substrate 1. Therefore, it is preferable that the conductor paste serving as the first penetrating conductor 5a and the second penetrating conductor 5b contains an appropriate amount of the substantially same component as that of the insulating substrate 1.

In the wiring board of the present invention, a part of the large number of first through conductors 5a and the second through conductors 5b having a diameter larger than that of the first through conductors 5a is made of ferrite. A large number of first through conductors 5a and second
Since some of the through conductors 5b of No. 1 are made of ferrite and have high magnetic permeability, they have high impedance for high frequency components such as harmonics, and electronic components such as semiconductor elements mounted at high speed. Even if an ultra-high frequency signal containing harmonic noise, for example, exceeding 60 GHz is driven and propagates through the signal wiring conductor 3, the electromagnetic wave noise generated from the signal wiring conductor 3 due to the signal is generated by these ferrites. Since the first penetrating conductor 5a and the second penetrating conductor 5b selectively absorb and remove the electromagnetic wave noise, the electromagnetic wave noise is not propagated to electronic components such as semiconductor elements or emitted to the outside of the wiring board. Therefore, an accurate signal is always propagated to the mounted electronic component such as a semiconductor element via the signal wiring conductor 3, and the electronic component driven at high speed can be normally and stably operated. At the same time, no electromagnetic noise is emitted to the outside of the semiconductor device using this wiring board.

A part of the first through conductor 5a made of ferrite and the second through conductor 5b having a diameter larger than that of the first through conductor 5a are preferably arranged at a position close to the signal wiring conductor 3. The first through conductor 5a and the second through conductor 5a made of these ferrites should be arranged closer to the signal wiring conductor 3 which is the source of the harmonic noise.
The through conductor 5b can efficiently absorb the harmonic noise due to the super high frequency signal. More preferably, in order to increase the isolation of the signal wiring conductor 3 through which a signal of an ultrahigh frequency exceeding 60 GHz propagates and to match the characteristic impedance, the signal wiring conductor 3
The first through conductor 5a made of a normal conductor is arranged in the first through conductor 5a in the first row closest to the first row conductor, and the second through conductor 5b made of ferrite is arranged in the second through conductor 5b. Is good.

When the first through conductor 5a and the second through conductor 5b are arranged on almost the entire surface of the insulating base 1 as shown in FIG. 1, the position closest to the outer peripheral portion of the insulating base 1, For example, the first through conductor 5a made of ferrite and the second through conductor 5b made of ferrite may be arranged in the first row from the outer peripheral side of the insulating substrate 1. As a result, electromagnetic wave noise from a super-high frequency signal propagating through the signal wiring conductor 3 can be effectively absorbed and removed by the penetrating conductors 5a and 5b made of ferrite in the outer peripheral portion of the insulating substrate 1, and can be removed outside the wiring board. It is possible to effectively prevent emission of electromagnetic noise.

Through conductor 5 made of such ferrite
Examples of the ferrite for forming a.5b include Mn-Zn-based ferrite, Ni-Zn-based ferrite, and M.
A g-Mn ferrite can be used. A first through conductor 5a and a second through conductor 5b made of these ferrites
To form the first through conductor 5 made of the above-mentioned conductor.
a and the second through conductor 5b, a ferrite paste obtained by adding and mixing an appropriate organic solvent / solvent to ferrite powder is punched to form through holes for forming the through conductors 5a and 5b. A part of them may be printed and filled by using a conventionally known screen printing method or the like, and then this may be baked.

When the first through conductors 5a and the second through conductors 5b made of ferrite are arranged on both sides along the signal wiring conductor 3, as described above, along the signal wiring conductor 3. The adjacent distance d1 between the through conductors 5a in the first through conductor 5a and the adjacent distance d3 between the through conductors 5b in the second through conductor 5b, which are provided as If set to 1/4 or less, and more preferably 1/8 or less,
The isolation of the signal wiring conductor 3 can be made extremely high. Therefore, even when the first through conductor 5a and the second through conductor 5b made of ferrite are arranged along the signal wiring conductor 3, the first through conductor 5a is also arranged.
The adjacent spacing d1 between the through conductors 5a and the adjacent spacing d3 between the through conductors 5b in the second through conductor 5b are
It is desirable that the wavelength of the high-frequency signal propagated by the signal wiring conductor 3 is set to 1/4 or less, more preferably 1/8 or less.

Further, if the distance d2 between the first penetrating conductors 5a facing each other with the signal wiring conductor 3 sandwiched therebetween is set to be half the wavelength of the high frequency signal propagated by the signal wiring conductor 3 or less, The reflection loss of the high frequency signal propagating through the wiring conductor 3 can be reduced. Therefore,
Even when the through conductors 5 made of ferrite are arranged in the first rows facing each other with the signal wiring conductor 3 interposed therebetween, the first
It is preferable that the distance d2 between the through conductors 5a is less than or equal to one half of the high frequency signal propagated by the signal wiring conductor 3.

Thus, according to the wiring board of the present invention as described above, an electronic component such as a semiconductor element is mounted on the bottom surface of the recess 2 of the insulating substrate 1, and each electrode of the electronic component is connected to the signal wiring conductor 3. Also, by connecting to the ground conductor layer 4b via a bonding wire or the like, the wiring board is provided with an electronic component that operates at a high speed exceeding 60 GHz.

The present invention is not limited to the above-described example of the embodiment, but various modifications can be made without departing from the scope of the present invention. For example, as shown in the enlarged cross-sectional view of the main part in FIG. 4, the ground conductor layers 14a and 14b are provided above and below the signal wiring conductor 13 with the insulating layer 11 interposed therebetween, and the ground conductor layers 14a and 14b are connected to each other. 13
Small-diameter first through conductors arranged in a row along the
15a and the second through conductors 15b having a larger diameter than the first through conductors 15a, which are dispersedly provided on the outside.
It can also be applied to wiring boards that are designed to be connected by.

In the example shown in FIGS. 1 to 3, the ground conductor layer 4 is provided between the signal wiring conductors 3 on the upper surface of the insulating substrate 1.
Although b is provided, even if this ground conductor layer 4b is not provided, the shielding performance of the first through conductor 5a is high, and a part of the first through conductor 5a made of ferrite and Since it is possible to effectively absorb and remove electromagnetic wave noise due to a super-high frequency signal by the second penetrating conductor 5b, it is possible to improve the isolation and characteristic impedance matching of the signal wiring conductor 3. Further, a stable ground network can be formed by the second penetrating conductor 5b and the ground conductor layer 4a.

In addition to the line conductor of the so-called coplanar line structure with ground as shown in FIGS. 1 and 3 and the line conductor of the strip line structure as shown in FIG. Various forms using a line conductor for high frequency may be used, such as a line conductor having a strip line structure or a line conductor having a microstrip line structure in which the same plane ground conductor layer as the coplanar line is provided only on one side.

[0047]

According to the high-frequency wiring board of the present invention, a signal wiring conductor for propagating a high-frequency signal to an insulating substrate formed by laminating a plurality of insulating layers, and the insulation for the signal wiring conductor. A plurality of through conductors connected to the ground conductor layer are provided on both sides of the signal wiring conductor, and adjacent ground conductor layers are arranged at an interval of 0.5 to 5 times the diameter of the through conductor. The plurality of through conductors are arranged in a row along the signal wiring conductor on both sides thereof, and the plurality of through conductors are arranged outside the first through conductor. The second through conductors having a diameter larger than that of the first through conductors, which are distributed in the region of the above, and the large number of the through conductors are partly composed of ferrite. The diameter of the first through conductor provided along the As a matter of fact, the interval between the first through conductors can be made narrower, which increases the shielding property of the first through conductors, thereby improving the isolation of the signal wiring conductor and the characteristic impedance matching. Can be one. Further, since the diameter of the second through conductor is larger than that of the first through conductor, the inductance of the second through conductor becomes small and the connection reliability between the second through conductor and the ground conductor layer becomes high. As a result, a stable ground network can be formed by the second penetrating conductor and the ground conductor layer, and electromagnetic waves can be effectively prevented from leaking from the signal wiring conductor to the outside. Further, since some of the through conductors are made of ferrite, electromagnetic wave noise from a signal propagating through the signal wiring conductor can be effectively absorbed and removed by the through conductors made of these ferrites. It is possible to provide a wiring board in which electronic components such as the above are operated normally and stably and in which electromagnetic noise is less likely to be emitted to the outside of the semiconductor device in which this wiring board is used.

Further, according to the wiring board of the present invention, when some through conductors made of ferrite are arranged in the column closest to the signal wiring conductor, these through conductors are sources of harmonic noise. Since the arrangement is closest to the signal wiring conductor, harmonic noise from the signal wiring conductor can be efficiently absorbed and removed.

Further, according to the wiring board of the present invention, a large number of through conductors are arranged also in the outer peripheral portion of the insulating base, and a part of the through conductors made of ferrite are arranged in the row closest to the outer peripheral portion. In this case, the through conductor made of ferrite effectively absorbs and removes the electromagnetic wave noise from the ultra high frequency signal propagating through the signal wiring conductor in the outer peripheral portion of the insulating substrate, and emits the electromagnetic wave noise to the outside. Can be prevented.

As described above, according to the present invention, the leakage of the electromagnetic wave from the signal wiring conductor is made small even when the ultra high frequency signal is propagated, and the isolation and the matching of the characteristic impedance are satisfactorily ensured, for example, 60 GHz. It is possible to provide a wiring board that can efficiently and accurately propagate an exceedingly high-speed signal.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of an embodiment of a wiring board of the present invention.

2 is a cross-sectional view taken along the line AA of the wiring board shown in FIG.

3 is a cross-sectional view taken along line BB of the wiring board shown in FIG.

FIG. 4 is an enlarged sectional view of an essential part showing another example of the embodiment of the wiring board of the present invention.

[Explanation of symbols]

1 ... Insulating substrate 1a, 1b, 11 ... Insulating layer 3, 13 ..... Signal wiring conductors 4a, 4b, 14a, 14b ... Ground conductor layer 5a, 15a ... First through conductor 5b, 15b ..... Second through conductor

Claims (3)

[Claims] 1. A signal wiring conductor for propagating a high-frequency signal to an insulating substrate formed by laminating a plurality of insulating layers, and a ground conductor layer facing the signal wiring conductor via the insulating layer. A large number of through conductors connected to the ground conductor layer are provided on both sides of the signal wiring conductor in a distributed manner at an interval of 0.5 to 5 times the diameter of the through conductor. In the wiring board, the plurality of penetrating conductors are provided in a region outside the first penetrating conductors, the first penetrating conductors being arranged side by side along the signal wiring conductor, one row on each side. A wiring board, comprising: second through conductors, which are arranged in a dispersed manner and have a diameter larger than that of the first through conductor, part of which is made of ferrite. 2. The wiring board according to claim 1, wherein a part of the penetrating conductors made of ferrite is arranged in a column closest to the signal wiring conductor. 3. The plurality of through conductors are also arranged on an outer peripheral portion of the insulating base, and some of the through conductors made of the ferrite are arranged in a row closest to the outer peripheral portion. The wiring board according to claim 1, wherein: