JP2003198057A5 - - Google Patents

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Publication number
JP2003198057A5
JP2003198057A5 JP2001396900A JP2001396900A JP2003198057A5 JP 2003198057 A5 JP2003198057 A5 JP 2003198057A5 JP 2001396900 A JP2001396900 A JP 2001396900A JP 2001396900 A JP2001396900 A JP 2001396900A JP 2003198057 A5 JP2003198057 A5 JP 2003198057A5
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JP
Japan
Prior art keywords
waveguide
face
ridge
substrate
laser device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001396900A
Other languages
English (en)
Japanese (ja)
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JP2003198057A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001396900A priority Critical patent/JP2003198057A/ja
Priority claimed from JP2001396900A external-priority patent/JP2003198057A/ja
Publication of JP2003198057A publication Critical patent/JP2003198057A/ja
Publication of JP2003198057A5 publication Critical patent/JP2003198057A5/ja
Pending legal-status Critical Current

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JP2001396900A 2001-12-27 2001-12-27 半導体レーザ素子及びその製造方法 Pending JP2003198057A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001396900A JP2003198057A (ja) 2001-12-27 2001-12-27 半導体レーザ素子及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001396900A JP2003198057A (ja) 2001-12-27 2001-12-27 半導体レーザ素子及びその製造方法

Publications (2)

Publication Number Publication Date
JP2003198057A JP2003198057A (ja) 2003-07-11
JP2003198057A5 true JP2003198057A5 (enrdf_load_stackoverflow) 2005-08-04

Family

ID=27602846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001396900A Pending JP2003198057A (ja) 2001-12-27 2001-12-27 半導体レーザ素子及びその製造方法

Country Status (1)

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JP (1) JP2003198057A (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4305554B2 (ja) 2007-02-28 2009-07-29 ソニー株式会社 半導体レーザの製造方法
US8530255B2 (en) 2007-02-28 2013-09-10 Sony Corporation Method of manufacturing semiconductor laser, semiconductor laser, optical pickup, optical disk device, method of manufacturing semiconductor device, semiconductor device, and method of growing nitride type group III-V compound semiconductor layer
JP2009105184A (ja) 2007-10-23 2009-05-14 Sharp Corp 窒化物系半導体レーザ素子とその製造方法
EP2216860A1 (en) * 2007-11-02 2010-08-11 Panasonic Corporation Semiconductor laser device
JP2009283512A (ja) * 2008-05-19 2009-12-03 Panasonic Corp 窒化物半導体レーザ
JP2009302138A (ja) * 2008-06-10 2009-12-24 Opnext Japan Inc 半導体レーザ素子、及び半導体レーザ素子の製造方法
JP5281842B2 (ja) * 2008-07-29 2013-09-04 パナソニック株式会社 半導体レーザ装置
JP5153524B2 (ja) * 2008-09-01 2013-02-27 シャープ株式会社 窒化物半導体発光素子およびその製造方法
JP5093033B2 (ja) * 2008-09-30 2012-12-05 ソニー株式会社 半導体レーザの製造方法、半導体レーザ、光ピックアップおよび光ディスク装置
JP5906445B2 (ja) 2008-12-10 2016-04-20 パナソニックIpマネジメント株式会社 半導体レーザ装置及びその製造方法
JP2011124253A (ja) 2009-12-08 2011-06-23 Sony Corp 半導体レーザの製造方法、半導体レーザ、光ディスク装置、半導体装置の製造方法および半導体装置
DE112021004159T5 (de) * 2020-08-04 2023-06-22 Panasonic Holdings Corporation Halbleiter-Lichtemissionsvorrichtung

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