JP2003197758A5

JP2003197758A5 -

Info

Publication number: JP2003197758A5
Application number: JP2001397488A
Authority: JP
Filing date: 2001-12-27
Publication date: 2005-05-26
Anticipated expiration: 2021-12-27

Description

【０００９】
【課題を解決するための手段】
本発明に係るマイクロ波集積回路は上述した課題を解決するため、請求項１に記載した様に、コプレーナ構造で構成されたインタデジタル型キャパシタを備えたマイクロ波集積回路において、前記インタデジタル型キャパシタの対向するコプレーナ電極の外側の接地導体間に、前記コプレーナ電極を跨ぐ橋状接地導体を設置し、この橋状接地導体でコプレーナ電極を覆う様にしたことを特徴とする。 [0009]
[Means for Solving the Problems]
The microwave integrated circuit according to the present invention is a microwave integrated circuit including an interdigital capacitor configured in a coplanar structure as described in claim 1 in order to solve the above-mentioned problems. A bridge-like ground conductor straddling the coplanar electrode is disposed between the ground conductors outside the opposing coplanar electrodes , and the coplanar electrode is covered with the bridge-like ground conductor.

上述した課題を解決するため、本発明に係るマイクロ波集積回路は、請求項２に記載した様に、前記インタデジタル型キャパシタが有する前記橋状接地導体は対向するコプレーナ電極の外側の接地導体間を半筒状に形成することを特徴とする。 According to a second aspect of the present invention, there is provided a microwave integrated circuit according to the present invention, in which the bridge-like ground conductor of the interdigital capacitor is located between ground conductors on the outside of the opposing coplanar electrodes. Is formed into a semi-cylindrical shape .

図１および図２によれば、インタデジタル型キャパシタ１１は、コプレーナ電極１２，１３と、橋状接地導体１４とを誘電体基板１５の上面に備える。一方、誘電体基板１５の下面には下部接地導体１６を備える。誘電体基板１５の上面には、コプレーナ電極１２，１３が互いに対向して設けられる。また、コプレーナ構造で構成されたインタデジタル型キャパシタ１１のため、コプレーナ電極１２，１３が対向する外側には、接地導体１７が存在する。コプレーナ電極１２，１３の上方には、半楕円筒（半筒）状のシート部材で形成された橋状接地導体１４がコプレーナ電極１２，１３を覆う様に跨設され、両接地導体１７と電気的に接続される。即ち、橋状接地導体１４は接地導体１７，１７間をブリッジ結合しており、コプレーナ電極１２，１３に跨設される。 According to FIGS. 1 and 2, the interdigital capacitor 11 has coplanar electrodes 12 and 13 and a bridge-like ground conductor 14 on the top surface of the dielectric substrate 15. On the other hand, the lower ground conductor 16 is provided on the lower surface of the dielectric substrate 15. The coplanar electrodes 12 and 13 are provided on the top surface of the dielectric substrate 15 so as to face each other. Further, because of the interdigital capacitor 11 configured to have a coplanar structure, a ground conductor 17 exists on the outside where the coplanar electrodes 12 and 13 face each other. Above the coplanar electrodes 12 and 13, bridging the ground conductor 14 formed by a semi-elliptic cylinder (semi-cylindrical) shape of the sheet member is straddled to cover the coplanar electrodes 12 and 13, both the ground conductor 17 and the electrically Connected. That is, the bridge-like ground conductor 14 is bridge-connected between the ground conductors 17 and 17 and straddles the coplanar electrodes 12 and 13.

Claims

In a microwave integrated circuit provided with an interdigital capacitor configured in a coplanar structure, a bridge-like ground conductor straddling the coplanar electrode is disposed between ground conductors on the outside of the opposing coplanar electrodes of the interdigital capacitor, A microwave integrated circuit characterized in that a coplanar electrode is covered with this bridge-like ground conductor.

2. The microwave integrated circuit according to claim 1, wherein the bridge-like ground conductor of the interdigital capacitor forms a semicylindrical shape between the ground conductors outside the opposing coplanar electrodes.