JPH0332045Y2 - - Google Patents

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Publication number
JPH0332045Y2
JPH0332045Y2 JP1986043042U JP4304286U JPH0332045Y2 JP H0332045 Y2 JPH0332045 Y2 JP H0332045Y2 JP 1986043042 U JP1986043042 U JP 1986043042U JP 4304286 U JP4304286 U JP 4304286U JP H0332045 Y2 JPH0332045 Y2 JP H0332045Y2
Authority
JP
Japan
Prior art keywords
contact
metal layer
layer
imparting
conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986043042U
Other languages
Japanese (ja)
Other versions
JPS62157074U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986043042U priority Critical patent/JPH0332045Y2/ja
Publication of JPS62157074U publication Critical patent/JPS62157074U/ja
Application granted granted Critical
Publication of JPH0332045Y2 publication Critical patent/JPH0332045Y2/ja
Expired legal-status Critical Current

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  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
  • Measuring Leads Or Probes (AREA)

Description

【考案の詳細な説明】 〔考案の目的〕 (考案の利用分野) 本考案は電気コネクタ用多層接触子に関するも
のである。
[Detailed Description of the Invention] [Object of the Invention] (Field of Application of the Invention) The present invention relates to a multilayer contact for an electrical connector.

(従来技術とその問題点) 電気コネクタの接触子として例えば第1図に示
すように、絶縁板1の一面例えば接着により導電
性付与金属層2を設け、他面に例えば接着により
ばね性付与金属層3を設けて構成した多層接触
子、或いは第2図のように絶縁板1の一面に例え
ば接着により導電性付与金属層2を設け、絶縁板
1をばね性付与層として用いる多層接触子が提案
されている。これらの多層接触子は相手接触子と
の接触を導電性付与層により行い、また接触圧を
導電性付与層と別個のばね性付与層により得るよ
うにしている。従つて例えば燐青銅のような合金
金属により作られる従来の接触子のように導電性
がばね性を与える金属によつて影響され、またば
ね性が導電性金属によつて影響されることがな
い。このため導電性付与層とばね性付与層を形成
する材料の選定により所望の導電性とばね性をも
つた接触子を容易に作ることができる。また燐青
銅のような接触子用合金金属は一般に高価である
ため、これによつて作られる接触子は高価となる
が、これに比べて多層接触子は比較的安価に形成
できる利点がある。また更に例えば第3図aのよ
うに絶縁板材1の一面に所望極数の短冊状導電性
付与金属層2を所要の絶縁間隔をおいて設け、他
面の全面または導電性付与金属層2に対応してば
ね性付与金属層3を設けて、第3図b,cのよう
に折り曲げて保持絶縁物4により保持することに
より多極接触子を形成でき、また例えば絶縁板材
1の一面に導電性付与金属層2を形成してエツチ
ングにより金属層2を形成するが、メツキにより
金属層2を形成すれば金属層2の幅および相互の
絶縁間隔を要求に応じて小さく出来る。従つて小
型な多極コネクタを安価に構成できる利点があ
る。
(Prior art and its problems) As a contact of an electrical connector, for example, as shown in FIG. A multilayer contact configured by providing a layer 3, or a multilayer contact configured by providing a conductivity imparting metal layer 2 on one surface of an insulating plate 1, for example by adhesion, as shown in Fig. 2, and using the insulating plate 1 as a spring property imparting layer. Proposed. These multilayer contacts make contact with a mating contact through a conductivity-imparting layer, and obtain contact pressure through a conductivity-imparting layer and a separate springiness-imparting layer. Therefore, the conductivity is not affected by the metal providing the springiness, and the springiness is not influenced by the conductive metal, as is the case with conventional contacts made of alloy metals such as phosphor bronze. . Therefore, by selecting the materials for forming the conductivity imparting layer and the spring property imparting layer, a contact having desired conductivity and spring properties can be easily produced. In addition, since contact alloy metals such as phosphor bronze are generally expensive, contacts made using these metals are expensive, but multilayer contacts have the advantage that they can be formed relatively inexpensively. Furthermore, for example, as shown in FIG. 3a, a desired number of strip-shaped conductive metal layers 2 are provided on one side of the insulating plate material 1 at a required insulation interval, and the entire surface of the other side or the conductive metal layer 2 is A multi-pole contact can be formed by correspondingly providing a metal layer 3 with spring properties, bending it as shown in FIGS. 3b and 3c, and holding it with a holding insulator 4. The metal layer 2 is formed by forming the metal layer 2 and etching it. However, if the metal layer 2 is formed by plating, the width of the metal layer 2 and the mutual insulation interval can be made smaller as required. Therefore, there is an advantage that a small multi-pole connector can be constructed at low cost.

しかし、その反面この多層接触子により電流容
量の大きい接触子を得んとした場合には、以下の
ような難点を免れることができにくい。即ち一般
に材質を一定として電流容量の大きい接触子を得
る場合には、導電性付与金属層2の断面積を大に
することが要求され、例えば、接触子の幅が制限
されている場合には導電性付与金属層2の厚みを
大にしなければならない。しかし前記のように接
触子の全長において各層が接着されている場合に
は、導電性付与金属層2や絶縁層1がばね性付与
金属層3のばね力に影響を与えて所要の接触圧を
実現できなかつたりするのを避けることができな
い。
However, on the other hand, when trying to obtain a contact with a large current capacity using this multilayer contact, it is difficult to avoid the following difficulties. That is, in general, when obtaining a contact with a large current capacity while keeping the material constant, it is required to increase the cross-sectional area of the conductivity-imparting metal layer 2. For example, when the width of the contact is limited, The thickness of the conductivity-imparting metal layer 2 must be increased. However, when each layer is bonded along the entire length of the contact as described above, the conductivity imparting metal layer 2 and the insulating layer 1 influence the spring force of the spring property imparting metal layer 3 to maintain the required contact pressure. It is inevitable that we will not be able to realize it.

本考案は上記のような多層接触子の欠点の排除
を目的としてなされたもので、次に図面を用いて
その詳細を説明する。
The present invention was developed with the aim of eliminating the drawbacks of the multilayer contactor as described above, and will now be described in detail with reference to the drawings.

〔考案の構成〕[Structure of the idea]

(問題点を解決するための手段) 本考案の特徴とするところは、多層接触子の各
層間の一部に各層がばらばらにならないようにす
るため、接触部2aを除く部分に一体化部分を設
けて、導電性付与金属層2と絶縁層1およびばね
性付与金属層3とを重ね合わせた点にある。例え
ば第4図に示すように相手接触子によつて図中矢
印方向の力が接触部2aに加えられることから、
基部の一部において導電性付与金属層2と絶縁層
1およびばね性付与金属層3の接着による一体化
部5を作り、これを除く他部分を非一体化部6と
するものである。
(Means for Solving the Problems) The present invention is characterized by the fact that in order to prevent each layer from coming apart in a part between each layer of the multilayer contactor, an integrated part is provided in the part other than the contact part 2a. The point is that the conductivity imparting metal layer 2, the insulating layer 1, and the spring property imparting metal layer 3 are stacked on top of each other. For example, as shown in FIG. 4, since a force in the direction of the arrow in the figure is applied to the contact portion 2a by the mating contact,
An integrated part 5 is formed by adhering the conductivity-imparting metal layer 2, the insulating layer 1, and the spring property-imparting metal layer 3 in a part of the base, and the other part is a non-integrated part 6.

(効果) 以上のようにすればばね性付与金属層3は導電
性付与金属層2に加えられた力に対して、導電性
付与金属層2とほぼ独立に変形することができ、
自己のばね力を発揮できる。また導電性付与金属
層2とばね性を与える絶縁層1の2層接触子の場
合にも、同様に基部の一部を一体化することによ
つて同様な効果を得ることができ、前記した多層
接触子の欠点は一掃される。
(Effect) By doing as above, the spring property imparting metal layer 3 can deform almost independently from the conductivity imparting metal layer 2 in response to the force applied to the conductivity imparting metal layer 2,
You can exert your own spring power. Furthermore, in the case of a two-layer contactor consisting of a metal layer 2 imparting conductivity and an insulating layer 1 imparting spring properties, the same effect can be obtained by integrating a portion of the base, as described above. The disadvantages of multilayer contacts are eliminated.

(変形例) 以上本考案を説明したが、コネクタにおいては
第3図cのように接触子の基部を保持絶縁物4に
より保持されるため、この保持を利用して各層を
一体化することができる。
(Modified example) Although the present invention has been explained above, in the connector, the base of the contact is held by the holding insulator 4 as shown in Fig. 3c, so it is possible to integrate each layer using this holding. can.

また以上では3層を非接着としたが、絶縁層1
のばね性が殆ど問題にならないような場合には、
ばね性付与金属層3のみを非接着とすればよい。
In addition, in the above, the three layers are non-adhesive, but the insulating layer 1
In cases where the springiness of the material is of little concern,
Only the spring property imparting metal layer 3 may be made non-adhesive.

また各層間を非接着とした場合、導電性付与金
属層が薄かつたり金属が軟らかいと、相手接触子
が差込まれたとき導電性付与金属層3は下方に押
されて変形し易い。これを防ぐためには第5図a
のように先端部を一体化5したり、第5図bのよ
うに接触部2aを除く部分を一体化5したり、更
には第5図cのようにしてもよい。
Further, when the layers are not bonded, if the conductive metal layer 3 is thin or the metal is soft, the conductive metal layer 3 is likely to be pushed downward and deformed when a mating contact is inserted. To prevent this, see Figure 5a.
The tip portion may be integrated 5 as shown in FIG. 5, or the portion except the contact portion 2a may be integrated 5 as shown in FIG. 5b, or further, as shown in FIG. 5c.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は多層接触子の説明図、第
3図は多極接触子の説明図、第4図は本考案の一
実施例の説明図、第5図は本考案の他の実施例図
である。 1……絶縁層、2……導電性付与金属層、2a
……接触部、3……ばね性付与金属層、4……保
持絶縁物、5……一体化部、6……非一体化部。
Figures 1 and 2 are explanatory diagrams of a multilayer contact, Figure 3 is an explanatory diagram of a multipolar contact, Figure 4 is an explanatory diagram of one embodiment of the present invention, and Figure 5 is an explanatory diagram of another embodiment of the present invention. It is an example figure. 1... Insulating layer, 2... Conductivity imparting metal layer, 2a
...Contact part, 3... Spring property imparting metal layer, 4... Holding insulator, 5... Integrated part, 6... Non-integrated part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電性付与金属層とばね性付与金属層との間に
絶縁層を有し、これら各層が接着により一体化さ
れた多層接触子において、少なくとも接触部全体
を含む前記接触子の一部に、各層の非接着部分を
設けたことを特徴とする多層接触子。
In a multilayer contact in which an insulating layer is provided between a conductivity-imparting metal layer and a spring-imparting metal layer, and these layers are integrated by adhesive, each layer is applied to at least a part of the contact including the entire contact portion A multilayer contactor characterized by having a non-adhesive part.
JP1986043042U 1986-03-26 1986-03-26 Expired JPH0332045Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986043042U JPH0332045Y2 (en) 1986-03-26 1986-03-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986043042U JPH0332045Y2 (en) 1986-03-26 1986-03-26

Publications (2)

Publication Number Publication Date
JPS62157074U JPS62157074U (en) 1987-10-06
JPH0332045Y2 true JPH0332045Y2 (en) 1991-07-08

Family

ID=30859529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986043042U Expired JPH0332045Y2 (en) 1986-03-26 1986-03-26

Country Status (1)

Country Link
JP (1) JPH0332045Y2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635774U (en) * 1979-08-29 1981-04-07

Also Published As

Publication number Publication date
JPS62157074U (en) 1987-10-06

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