JP2003195973A - Semiconductor device and method of manufacture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device superior in convenience in use being foldable in a small shape at carrying time, and expandable in a large shape at using time. <P>SOLUTION: This semiconductor device is provided with at least one element in element kinds including a recording element for recording data, an operational element for processing the data, a communication element for exchanging the data, an energy element for storing or generating energy, a sensor element for converting information into storable or communicable data by detecting the external information, and a display element for displaying the data. At least one of the provided elements has a bending part composed of a flexible material, and can be folded up thereby. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device used for a credit card, a bank cash card, electronic money, or the like, and having an IC memory, a processor, an interface with the outside, a sensor and the like as a basic configuration. .

[0002]

2. Description of the Related Art The basic structure of a conventional semiconductor device such as an IC card is such that a storage element dedicated to fixed information typified by a ROM or the like and a storage element typified by a RAM or the like in which information can be rewritten as necessary. It includes a part or all of an RF coil, an interface with the outside such as a connector, a processor that controls a storage element and an interface, processes data, and the like, and a power supply system such as a lithium-ion battery. A memory element or a processor is an inorganic semiconductor formed of Si or the like mounted on a resin substrate and wired by wire bonding or the like.

FIG. 11 shows the structure of a conventional semiconductor device using an IC card as an example. The basic configuration is such as a storage element (ROM or RAM) 4, an RF coil 5, an interface 17 with the outside, a processor 3 for controlling the storage element 4 or the interface 17 and various processing of stored data, a lithium ion battery, etc. An energy supply source 18. These components are arranged flat on both surfaces of the substrate 6.
The memory element 4 and the processor 3 are made of an inorganic semiconductor such as Si and are integrated into one chip as an IC chip 20.
And is wired by the wire bonding method using the wire 11.

In recent years, development has also been carried out in which elements other than the above-mentioned basic structure are mounted to achieve multi-functionality. For example, in the case of an IC card, a display, a keyboard, a sensor, etc. are installed (for example, Japanese Patent Publication No. 62-8838, 61-4374).
No. 9, JP-A 1-175691). Regarding the display function, in order to display the information stored in the IC card on the IC card, a display element using a reversible thermosensitive recording material (see, for example, JP-A-4-105996) or a liquid crystal display element (for example, actual An IC card having a display element such as Japanese Patent Publication No. 3-9078) has also been devised.

Regarding the sensor function, various types of sensors are mounted on one IC card to enhance convenience (see, for example, Japanese Patent Application Laid-Open No. 1-175691), and the card holder is the original owner of the card. There is a sensor for authenticating (see, for example, JP-A-64-38295). Further, Japanese Patent Application Laid-Open No. 8-31184 discloses a technique in which functions are stacked and mounted on an IC card and applied as a high-density memory.

With the display function, a plurality of displays are connected in series so that the respective screens are directed in substantially the same direction, and the two screens cooperate with each other to display a single large screen. The technology to use is also JP-A-10-2
It is disclosed in Japanese Patent Publication No. 88952. Further, Japanese Patent Publication No. 8-505954 discloses a technique for forming an electronic book by binding a sheet-like display capable of displaying an image like a book.

[0007]

Semiconductor devices are being manufactured year by year.
Although it is becoming more and more multifunctional, conventional semiconductor devices such as IC cards and mobile terminals can be used on both the front and back sides of the semiconductor device or the four-sided notebook PC. With the increasing number of functions, functions such as displays, keyboards, sensors, speakers, and solar cell scanners that cannot be used unless they are placed on the surface and functions that want to use the surface as much as possible have increased, and the four-sided model is becoming insufficient.

On the other hand, the ease of carrying the semiconductor device is becoming more important, and it is required that the size of the semiconductor device can be reduced at least when carrying it. At present, however, it is necessary to make a large use of the surface when using and to make the surface small when carrying. Is not compatible with.

Regarding the display function, the plurality of displays are connected in series so that the respective screens are oriented in substantially the same direction, and the two screens cooperate with each other to display one large screen. The technology to do is also JP-A-10-288
As disclosed in Japanese Patent No. 952, since a plurality of displays are connected by a hinge (hinge), there is an area that cannot be displayed on the hinge (hinge) and the boundary portion, and the area is displayed across the area. Information is hard to see.

Further, a technique for forming an electronic book by binding a sheet-like display capable of displaying an image like a book is disclosed in Japanese Patent Publication No. 8-505954, but it is limited to the display function. , Display and keyboard combination, sensor and display combination, scanner and display combination,
No semiconductor device has been realized in which a combination of functions, both of which must be visible to the user at the same time when used, can be switched by one device.

Although it is possible to reduce the thickness of the element by thinning the substrate of the Si element used for the semiconductor device, the element is easily broken. For example, IC cards are stored in card holders, wallets, etc. and carried around, but they are often subjected to external bending and twisting forces in pockets, bags, etc., so they are strongly demanded to be flexible and hard to break. To be

Further, there is a problem that the performance of the device is significantly deteriorated by a slight amount of contaminants. In addition, since it is necessary to bond the element to a resin substrate and wire the wire by wire bonding or the like, there is a problem that the element itself, the wiring, or the like is broken by a force such as bending or twisting, which significantly lowers reliability.

In the conventional semiconductor device, since a memory element and a processor using a Si semiconductor are used, a complicated process is required to manufacture the element itself, and a large-scale and expensive manufacturing apparatus is required. There is a problem.

Even if various functions can be mounted on one semiconductor device, the combination of functions required by each user is different. According to the conventional technology, it is difficult to precisely meet the specifications desired by each user, because each element requires different complicated processes.

[0015]

The present invention is directed to a recording element for recording data, an arithmetic element for processing data, a communication element for exchanging data, an energy element for storing or generating energy, and an external device. At least one element out of elements including a sensor element that detects information and stores or converts it into communicable data, and a display element that displays data is provided, and at least one of the provided elements is a flexible material. It is intended to provide a semiconductor device having a bent portion configured and being foldable by the bent portion.

Further, according to the present invention, a recording element for recording data, an arithmetic element for processing data, a communication element for exchanging data, an energy element for storing or generating energy, and external information are detected. At least one element of a group of elements including a sensor element for converting to data that can be stored or communicated and a display element for displaying data is provided, and at least one of the provided elements is made of a flexible material, It is intended to provide a semiconductor device characterized by being able to be rolled or unrolled by means of.

A display element for displaying information of one screen on one surface or over a plurality of surfaces in a folded state may be provided. A display element for displaying one screen of information over the entire surface in an expanded state may be provided. The flexible material may be an organic material. The present invention also provides a method for manufacturing a semiconductor device, which is characterized by being manufactured by a coating method, a printing method, and a film bonding method.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION As a method for mounting a large number of functions that cannot be used unless they are arranged on the surface of the device at the time of use or functions that want to use the surface to a large extent, for example, one foldable substrate is provided with a plurality of functional units. There is a method in which a functional part which is desired to be used is folded so as to be at the top at the time of use.

Further, by arranging two or more function parts desired to be used at the same time in the vertical direction or the horizontal direction, folding them, and expanding them at the time of use, two surfaces having necessary functions are simultaneously exposed to the user. Can be seen in.

For example, it is possible to select two or more surfaces and display one screen as the entire surface.
Many combinations can be realized depending on the folding method.

Further, even if the whole is not made of a flexible material, it is possible to realize a foldable semiconductor device by providing at least the bending portion with flexibility.

For example, a foldable semiconductor device can be realized even if a function-based unit in which elements are arranged on a sheet-shaped substrate is manufactured and the structures are connected to each other by flexible connecting portions. can do.

By forming each element with a flexible material, the element itself can be provided with flexibility, and the semiconductor device as a whole in which each element is arranged can be provided with flexibility. It is rolled and held in a rod (cylindrical) state so that it can be used in an open state or a rolled state as needed. As a result, it becomes possible to roll the product into small rolls for transportation and unfold it for use.

By forming each part constituting the semiconductor device with a material having high flexibility against bending and twisting, the semiconductor device as a whole can be made flexible and hard to break, and a foldable semiconductor device can be realized. .

In this respect, for example, organic materials generally have higher flexibility than inorganic semiconductor crystals and metals,
It does not easily break or break even when bent, and has great strength against repeated bending.

In recent years, as an organic material, a material having a conductivity close to that of a metal has been developed as a conductor, and a material having a characteristic close to that of amorphous silicon has been developed as a semiconductor material. It has become possible to fabricate semiconductor devices.

Further, as compared with the inorganic semiconductor material, the influence of the trace amount of impurities on the physical properties is small. Therefore, by configuring all the constituent elements of the semiconductor device or as many constituent elements as possible with an organic material, it is possible to provide a semiconductor device having high reliability against contamination, bending, and twisting.

The organic material can be formed into a film having an arbitrary shape by a printing method such as a screen printing method or an ink jet method by dissolving the organic material in a suitable solvent or gelling it to a liquid state.

Further, since almost all the elements are made of organic materials, a wide variety of elements can be manufactured by a consistent printing process, so that the manufacturing process is extremely simple and the cost is low. Since semiconductor devices can be manufactured at low cost with simple equipment in a consistent process, it is possible to handle a wide variety of products with different specifications according to the wishes of the user.

Further, a function-based unit in which elements are arranged on a sheet-like substrate is prepared in advance, and a unit having a function desired by the user is combined and connected from among these units, so that the user's demands can be obtained precisely. It is possible to respond.

There are the following methods of wiring between the units. First, the method of wiring through the through holes opened through the board of each unit, and secondly, by forming the terminals so that the units to be wired are aligned with each other in each unit, and stacking and adhering them. / How to crimp
Thirdly, each unit is physically connected, and signals are exchanged by a light emitting element and a light receiving element provided in each unit.

As a method of customizing a function according to a user's request, a semiconductor device having as many functions as can be provided is prepared in advance so that only the function desired by the user can be used. Alternatively, there is a method of disabling unnecessary functions.

It corresponds to the increase in functions that cannot be used unless it is placed on the surface of the device during use, or the functions that want to use the surface as much as possible. At least two can be folded at the time of carrying and used at the same time. By expanding the functional part of the device to be arranged vertically or horizontally, it has at least two functions that must be used at the same time, such as a combination of a display and a keyboard, a combination of a sensor and a display, and a combination of a scanner and a display. Convenience is greatly enhanced because the surface can be made visible to the user at the same time.

By folding or rolling, a semiconductor device with high portability and portability can be realized. Regarding the display function, for example, 2
It is also possible to select one or more faces and display one screen seamlessly as a whole of those faces, so depending on the folding method, you can switch the screen size according to the situation at the time of use to optimize the size. Can be used in

The material for forming each element is, for example,
It is desirable to use organic materials. Compared with inorganic semiconductor materials, organic materials generally have less influence on physical properties by a small amount of impurities and have high flexibility.

Therefore, a recording element for recording data, an arithmetic element for processing data, a communication element for exchanging data, an energy element for storing or generating energy, and external information can be detected and stored or communicated. By configuring all or as many constituent elements of the semiconductor element as a sensor element for converting the data into various data and a display element for displaying the recorded data with an organic material, contamination, bending, twisting, etc. On the other hand, the reliability can be improved.

Since a wide variety of elements can be produced by a consistent printing process, the manufacturing process is extremely simple and the cost is low, and it is also possible to meet the demands of users for various types and small-quantity production. As a result, for example, it is possible to produce and sell according to the specifications of the user's order.

EXAMPLES The present invention will be described below in detail with reference to the examples shown in the drawings, but the present invention is not limited to these examples.

Example 1 As shown in FIG. 1, a plurality of functional parts are formed on one flexible sheet substrate 8 which can be folded into six or three pieces. For example, as shown in FIG. 2, the display surfaces 12 and 13 and the input surface 14 (key input, touch panel, etc.) are vertically arranged. In this case, one display surface 12
Displays reference information such as a dictionary on the other display screen.
Input information and information being created can be displayed in 13. Also, instead of the display surface, it is possible to open the sensor surface such as a solar cell that absorbs light energy, and the display surface and the input surface so that the three surfaces are vertical or horizontal. is there.

The flexibility of the functional portion can be realized by forming the element forming the functional portion with, for example, an organic material. 3A to 3E of FIG. 3 show a specific example of the manufacturing process of the elements constituting the display element drive circuit, the memory and the processor.

First, as shown in FIG. 3A, the surface of the substrate 6 made of polyimide is subjected to a hydrophilic treatment. As a hydrophilic treatment method, for example, there is a method of irradiating with vacuum ultraviolet light (wavelengths 172 and 222 nm) in a water vapor atmosphere. Next, as shown in FIG. 3B, the source 23 and the drain 24 are applied onto the hydrophilized substrate 6 by an inkjet printing method using a solution of a conductive polymer according to a wiring pattern and dried. Forming an electrode pattern.

As the conductive polymer, polyethylenedioxyt
Using a 1.5 wt% aqueous solution (Baytron P) of a mixture of hiophene (PEDOT) and polystylenesulfonate (PSS), the thickness is about 500n.
Let m. Next, as shown in (c) of FIG.
A p-type organic semiconductor layer 25 having a thickness of about 50 nm is formed by a spin coating method using a xylene solution of luorene-Bithiophene copolymer.

On top of this, as shown in FIG. 3 (d), Poly-v
An insulating layer 22 of about 500 nm is formed by a spin coating method using an isopropanol solution of inylphenol (PVP).
As shown in FIG. 3E, the gate electrode 21 is formed on the insulating layer so as to be aligned with the channel portion using a conductive polymer.

As the conductive polymer, polyethylenedioxythiophene (PEDOT) is used as in the source and drain electrodes.
A 1.5 wt% aqueous solution (Baytron P made by Bayer) of a mixture of PEG and polystylene sulfonate (PSS) is used, and the thickness is about 500 nm.

In a transistor or the like for a display element drive circuit, when wiring is required from the drain electrode to the pixel of the display element formed by being stacked on the drive circuit, the drain electrode is connected to the insulating layer and the semiconductor layer. The drain electrode can be connected to each pixel of the display element by using a method of forming a through hole penetrating the substrate or a method of forming both the insulating layer and the semiconductor layer by an inkjet method.

As another method, as shown in FIG.
As shown in (e), there is a method of forming the gate electrode 21, the insulating layer 22, the source / drain electrodes 23 and 24, and the semiconductor layer 25 in this order in the reverse order of the manufacturing process of the device shown in FIG.

Polymer dispersed liquid crystal is used as the display element. However, the liquid crystal is not limited to liquid crystal, and for example, an electrophoretic element or organic electroluminescence (organic EL)
An element or the like is used.

The type of liquid crystal used in the polymer dispersed liquid crystal layer is not particularly limited. For example, nematic liquid crystal, smectic liquid crystal, cholesteric liquid crystal and the like can be preferably used. Examples of the polymer used in the polymer-dispersed liquid crystal layer in the present invention include polyvinyl butyral, polyester, polyurethane, acrylic, acryl silicon, vinyl chloride, vinyl acetate copolymer, silicon, polyvinyl alcohol, polyvinyl pyrrolidone, and cyanoethylated pullulan. Various polymer resins such as various cyanoethyl compounds and mixtures thereof can be used.

The method for forming the polymer dispersed liquid crystal layer of the present invention is not particularly limited. Any liquid crystal forming method known to those skilled in the art and commonly or commonly used by those skilled in the art can be used in the present invention. For example, methods such as an encapsulation method, a polymerization phase separation method, a thermal phase separation method, and a solvent evaporation phase separation method can be appropriately used.

In the case of a memory element such as ROM or RAM, it can be achieved by adding a capacitor made of a ferroelectric material to the drain side of the element manufactured by the method of FIG. 3, for example.
Examples of organic ferroelectric materials include vinylidene fluoride-3
A thin film can be formed by a spin coating method or an inkjet method using a fluoroethylene copolymer.

Also in the case of an optical image sensor, an array having an organic transistor structure can be manufactured. If the gate electrode of the transistor corresponding to each pixel is made of a material that generates electromotive force by light (including infrared rays), electromotive force is generated in the gate part depending on the intensity of light, so it depends on the generated gate voltage. The varying source-drain current is detected for each pixel and imaged. Examples of the material include porphyrins, phthalocyanines and their derivatives, polyphenylene vin.
A mixture of an ylene derivative and a fullerene derivative, a perylene derivative, etc. can be used.

The RF coil can be produced, for example, by screen printing using a conductive paste containing metal fine particles as a main component. In the method of this embodiment, a silver paste (silver powder having an average particle size of 10 μm, which is composed of a phenoxy resin and butyl carbitol) is used to screen-print a coil, and then dried at 150 ° C. for about 20 minutes. The number of windings is 20, the line width is about 300 μm, and the total length is about 250 cm.

The semiconductor device manufactured by the above method can be folded and stored in a pocket or a bag, or can be carried by hand. The folding direction, the order, and the number of times of folding are not particularly limited, but it is also possible to improve reliability by limiting the bending position at the time of folding and arranging as few elements as possible in that portion. You can fold the function part you want to use so that it is at the top.

Further, it is possible to improve the usability by folding two or more functional parts which are desired to be used at the same time so as to be aligned in the vertical direction or the horizontal direction. Many combinations can be realized depending on the folding method.

Further, this method is not limited to the method using an element made of an organic material as in Example 1 as a main component, but in an inorganic semiconductor device such as silicon, the processor is thinned by reducing the substrate other than the functional portion as much as possible. It is also possible to use a memory or memory arranged on a substrate.

(Example 2) Sheet-like information terminal shown in FIG.
Fifteen is foldable and has a display function on the entire surface, and can be displayed on the entire display surface or an arbitrary part of the area under the control of the processor. is there. Display drive element, memory element,
The processor and the communication element are formed on the lower layer of the display function element or on the back surface of the substrate on which the display function element is formed. Such a foldable information terminal can be realized by the method described in the first embodiment, for example.

ABCDEF on the entire surface as shown in FIG.
It can be displayed as G, but when folded along the broken line as shown in Fig. 5 (b), it is adjusted to ABCDEFG and the screen size in the same manner as in the case of full display on the surface after folding. Can be displayed.

The number of times of folding is not particularly limited, and it is possible to freely select and switch from one-nth size to full-screen display. In this case, since the display size is switched on a circuit basis, it is possible to realize a seamless display including the region that was bent when folded.

The folding method, that is, the display size can be arbitrarily selected according to the place of use and the purpose. At this time, for example, by installing a sensor that detects bending due to folding, the size of the opened sheet information terminal is automatically recognized, the display size area is determined, and information is displayed only in the opened portion. It can also be done.

(Embodiment 3) An example in which a foldable semiconductor device is realized by producing functional units in which elements are arranged on a sheet-like substrate and connecting them by flexible connecting portions. Is shown in FIGS. FIG. 6 shows that the functional units including the sensor 1a, the sensor 1b, the display element 2, the processor 3, the memory element 4, and the RF element 5 are arranged on a sheet-shaped substrate 8 in a zigzag manner, and the connecting portion is movable. The hinge 10 provided with is used.

FIG. 7 shows an example in which a hinge 10 in which the other unit is connected to one of two sides of a functional unit in which elements are arranged on a sheet-like substrate 8 and the connecting portion is provided with flexibility is used. . In this example, other units are connected to two sides, but it is also possible to connect other units to three or four sides.

FIG. 8 shows a hinge 10 in which functional units in which elements are arranged on a sheet-shaped substrate 8 are stacked in the thickness direction and all the units are connected by one side, and the connecting portion is provided with movability.
Is an example of using.

Each element can be manufactured, for example, by the method described in the first embodiment. As the wiring method between the upper and lower sheets, a method using a flexible printed wiring (FPC), a method of connecting the wiring through a through hole penetrating each sheet with a conductive adhesive sheet, a through penetrating each sheet A method of crimping the terminals of the wiring through the holes is used.

6 to 8 show an example of a structure in which the units are connected by a hinge. Particularly, FIGS. 6 and 7 are shown.
The above structure can be realized without using a hinge by forming the element and the wiring on the flexible substrate having the shape originally shown in FIGS. 6 and 7. In addition, this method is not limited to the method using an element made of an organic material as shown in Example 1 as a main component, but in an inorganic semiconductor device such as silicon, a processor or memory in which a substrate other than a functional part is removed as thin as possible It can also be used for those arranged on a sheet substrate.

(Embodiment 4) By constructing each element with a flexible material, it is possible to impart flexibility to the element itself, and these elements are arranged on a flexible sheet substrate. By forming the sheet in this manner, it is possible to give flexibility to the entire sheet on which the respective elements are arranged.

The flexible element can be manufactured by the method described in Example 1, for example. It can be temporarily fixed in the state of being rolled into a rod (cylindrical), and can be used in the opened state or used in the rolled state as needed. As a result, for example, it can be rolled up when carried (it can be stuck in a breast pocket like a pen, for example) and opened when used. 9 and 10 show an example thereof.

First, as shown in FIG. 9, a processor 3, a memory element 4, a sensor 1a,
Each element of the sensor 1b and the display element 2 is arranged in a plane and wiring is provided.

Next, the substrate on which each element is arranged and wiring is rolled as shown in FIG. 10, and the ends are detachably fixed by the stoppers 26. Among the respective elements, elements such as the display element 2 and the sensor 1a that need to be exposed on the outermost surface when rolled are carefully considered in advance when arranging them on the sheet substrate 8.

In this embodiment, only the display element 2 and the sensor 1a are finally exposed on the surface of the semiconductor device having a rounded shape,
The other processor 3, storage element 4, and sensor 2b are designed to be caught inside. The inner diameter and outer shape of the rod-shaped (cylindrical) semiconductor device can be set within a range in which the element and the wiring are not broken depending on the flexibility of the substrate after the element is formed.

[0070]

According to the present invention, since the constituent elements are flexible and can be folded, there is provided a convenient semiconductor device which can be folded when carried and unfolded when used. Further, since the constituent elements are flexible and can be rolled or unrolled, a semiconductor device which is easy to use and can be rolled and unrolled when used is provided.

[Brief description of drawings]

FIG. 1 is an explanatory diagram illustrating a method of using a first embodiment of the present invention.

FIG. 2 is an explanatory diagram showing the configuration of the first embodiment of the present invention.

FIG. 3 is a process drawing showing the manufacturing method of the first embodiment of the present invention.

FIG. 4 is a process drawing showing the manufacturing method of the first embodiment of the present invention.

FIG. 5 is an explanatory diagram showing the operation of the second embodiment of the present invention.

FIG. 6 is an explanatory diagram showing a configuration of a third embodiment of the present invention.

FIG. 7 is an explanatory diagram showing another configuration of the third embodiment of the present invention.

FIG. 8 is an explanatory diagram showing still another configuration of the third embodiment of the present invention.

FIG. 9 is an explanatory diagram showing a configuration of a fourth embodiment of the present invention.

FIG. 10 is an explanatory diagram showing the operation of the fourth embodiment of the present invention.

FIG. 11 is an explanatory diagram showing a configuration of a conventional example.

[Explanation of symbols]

1a ... Sensor 1b ... Sensor 2 ... Display element 2a ... Display layer 2b ... Drive circuit 3 ... Processor 4 ... Memory element 5 ... RF element 6 ... substrate 7 ... Protective film 8 ... Board 10 ... Hinge 11 ... wiring 12 ... Display surface 13 ... Display surface 14 ... Input surface 15 ... Sheet information terminal 20 ... IC chip 21 ... Gate electrode 22 ... Gate insulating film 23 ... Source electrode 24 ... Drain electrode 25 ... Semiconductor layer 26 ... Stoppers

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G09F 9/40 301 G06K 19/00 H H01L 21/288 K 29/786 H01L 29/28 51/00 29 / 78 618B (72) Inventor Shigeyasu Mori 22-22 Nagaike-cho, Abeno-ku, Osaka-shi, Osaka Prefecture, Sharp Corporation (72) Takao Konishi 22-22, Nagaike-cho, Abeno-ku, Osaka, Osaka Prefecture F Term (reference) 4M104 AA10 BB36 CC01 CC05 DD22 DD51 EE03 EE18 GG09 5B019 BA10 BC06 BC08 5B035 AA07 BA03 BA07 BB09 CA02 CA23 5C094 AA15 AA60 DA06 DA08 HA10 5F110 AHA30 BB01 CC05 CC07 DD01 GG01 FF01 EE01FF24EE41

Claims (6)

[Claims] 1. A recording element for recording data, an arithmetic element for processing data, a communication element for exchanging data, an energy element for storing or generating energy, and external information can be detected and stored or communicated. A sensor element for converting into various data, and at least one element out of elements including a display element for displaying data, and at least one of the provided elements has a bent portion made of a flexible material, A semiconductor device characterized by being foldable thereby. 2. A recording element for recording data, an arithmetic element for processing data, a communication element for exchanging data, an energy element for storing or generating energy, and external information can be detected and stored or communicated. A sensor element for converting into various data, and at least one element out of elements including a display element for displaying data, at least one of the provided elements is made of a flexible material, thereby being rolled, A semiconductor device which can be expanded. 3. The semiconductor device according to claim 1, further comprising a display element that displays information of one screen on one surface or over a plurality of surfaces in a folded state. 4. The semiconductor device according to claim 1, further comprising a display element for displaying information of one screen over the entire surface in an expanded state. 5. The semiconductor device according to claim 1, wherein the flexible material is an organic material. 6. A method of manufacturing a semiconductor device according to claim 1, wherein the method is a coating method, a printing method, and a film bonding method.