JP2003187713A - Partition for plasma display panel and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem caused by sandblasting in forming the partition of the AC-type plasma display panel that pattern outer periphery is easily susceptible to side etching, the cutting of paste tends to advance, a resist rises to the surface from the paste during sandblasting, and that a resist pattern is peeled-off from such a part and a desired partition pattern not being obtained. <P>SOLUTION: When a partition material on a back face substrate 1 is sandblasted using a resist pattern 2 as a mask, a wider resist pattern 22 for an outer peripheral partition surrounding the outermost pattern of all the resist patterns 21 for the internal partition susceptible to the side etching is provided to improve the adhesion of the outermost peripheral resist pattern to the paste and to prevent the peeling-off of the resist at sandblasting. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a barrier rib for a plasma display panel and a method of manufacturing the barrier rib, and more particularly to a barrier rib structure capable of preventing peeling of a resist pattern which tends to occur when the barrier rib material is selectively removed by sandblasting and a structure thereof. The present invention relates to a manufacturing method.

[0002]

2. Description of the Related Art In a barrier rib for a plasma display panel formed by a sandblast method according to the present invention, by preventing the resist pattern from peeling off during sandblasting, it is possible to obtain a good barrier rib pattern even with a fine line pattern due to high definition. Being able is one of the important factors.

As a typical partition wall structure of an AC type plasma display panel, there are a stripe structure shown in FIG. 1B and a double beam structure shown in FIG. 5B. Usually, when the partition wall pattern is formed by sandblasting, the rear substrate 8 is used as a mask as shown in FIGS.
A resist pattern 82 is formed on the partition wall material layer 91 deposited on the surface 1.

[0004]

However, when sandblasting is performed, the peripheral portion of the pattern is easily subjected to side etching, so that the cutting of the paste is likely to proceed, and the resist floats from the paste during the sandblasting. There is a problem that the resist pattern is peeled off and a desired partition wall pattern cannot be obtained.
Therefore, it is conceivable to reduce the injection pressure of the blast and reduce the damage to the resist as much as possible, but due to the processing time and poor productivity, sufficient improvement cannot be expected under the sandblast conditions.

In the stripe-shaped resist pattern 82, both ends of the pattern are particularly likely to be peeled off, and in order to improve this, Japanese Patent Laid-Open No. 6-314542 discloses that the width of the partition wall at both ends of the partition pattern is widened. ing.
However, although this method can prevent the resist peeling at both ends, the resist peeling at the pattern portions at the left and right ends has not been solved and is not sufficient.

Further, Japanese Unexamined Patent Publication No. 2000-156151 discloses that resist peeling at the time of sandblasting is prevented by extending the end portion of the resist pattern to a region where the partition wall material layer is not formed. . However, in this method, the partition pattern is formed up to the end of the partition material layer. Usually, this partition wall material layer is formed by a slit coater or a roll coater, but since there is a region where the film thickness is not uniform at the end, this part is not generally used as a partition wall pattern. Therefore, although this method can prevent resist peeling at the time of sandblasting, since the end of the finished partition pattern has an uneven height, a gap is created between the front substrate and the panel, and this gap causes a discharge space. This will cause problems with the panel characteristics such as crosstalk at.

One of the main objects of the present invention is to improve the adhesiveness with the paste of the outermost peripheral resist pattern, which is susceptible to side etching, in the partition walls for plasma display panels formed by the sandblasting method, and to improve the resist during sandblasting. It is an object of the present invention to provide a partition wall capable of preventing peeling and a manufacturing method thereof.

[0008]

A barrier rib for a plasma display panel according to the present invention is a barrier rib on a substrate for partitioning a surface of the substrate in at least one direction to form a discharge space in a space on the substrate. The partition wall is a continuous structure, and has a partition wall frame surrounding the internal partition wall corresponding to the inside of the substrate in the periphery of the substrate, and the partition wall frame is wider than the internal partition wall. Characteristically, the internal barrier ribs have a stripe shape or a grid shape, or the discharge space is provided between the substrate and the counter substrate by contacting the barrier rib with a counter substrate arranged to face the substrate. It has the application form of being confined to.

According to the method of manufacturing a barrier rib for a plasma display panel of the present invention, a barrier rib material is deposited on a surface of a substrate, a mask pattern covering the barrier rib material is formed, and the barrier rib material is used as a mask. And a step of forming barrier ribs, and a method for manufacturing a barrier rib for a plasma display panel, comprising: the mask pattern having a continuous structure; and an internal pattern that partitions the surface of the substrate in at least one direction, A frame pattern surrounding the internal pattern around the substrate, wherein the frame pattern is wider than the internal pattern, and the internal pattern is stripe-shaped or cross-shaped.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The basic form of the present invention is, in a rear substrate of a plasma display panel, a barrier rib having an inner barrier rib and a peripheral barrier rib having a peripheral frame pattern wider than the inner barrier rib on an outer peripheral portion of the substrate, and a barrier rib for forming a barrier rib. There is provided a method of manufacturing a partition wall in which the mask pattern is configured to have an internal mask pattern and an outer peripheral frame mask pattern having a wider width than the internal mask pattern on the outer peripheral portion of the substrate, and the partition wall forming mask pattern is used as a mask for sandblasting.

A first embodiment of the present invention will be described as a structure of a partition wall with reference to FIGS.

FIG. 1 is a pattern plan view of a resist pattern used when forming a partition wall on a rear substrate.
2 is a perspective view of a plasma display panel, FIG.
4 is a manufacturing step sectional view showing the method of manufacturing the partition wall in the order of manufacturing steps.

Normally, the resist pattern used for forming the partition wall has a stripe structure having a constant width, but in the present embodiment, as shown in FIG. 1A, the address electrode 3 and the dielectric layer 4 are formed. On the rear substrate 1 (see FIG. 1B), the resist pattern 2 is composed of a stripe-shaped resist pattern 21 for inner partition walls and a resist pattern 22 for outer peripheral partition walls on the outer periphery of the rear substrate 1. At this time, the width of the outer peripheral partition wall resist pattern 22 is wider than that of the inner partition wall resist pattern 21.
1 and the outer peripheral partition wall resist pattern 22 are designed to be connected to each other.

This structure is adopted when the partition wall material is sandblasted using the resist pattern 2 as a mask.
Adhesion with the paste of the outer peripheral side wall pattern 22 which is susceptible to side etching is improved, and it serves to prevent resist peeling during sandblasting. Therefore,
A good partition pattern can be obtained even with a fine line pattern due to high definition.

FIG. 2 is a perspective view of a typical structure of an AC type plasma display panel. An address electrode 3 for selecting a discharge cell and a dielectric layer 4 covering the address electrode 3 are formed on the rear substrate 1, and a partition wall that divides a discharge space into unit light emitting cells is formed on the dielectric layer 4. The (rib) 16 is formed in a stripe shape. Inside the discharge space thus formed, phosphor layers 6 of red (R), green (G) and blue (B) are regularly formed in order to emit visible light and colorize it. . On the front substrate 31, a band-shaped transparent electrode 32 for discharging and a bus electrode 33 for low wiring resistance are formed on the transparent electrode 32, and the dielectric layer 3 is formed on the bus electrode 33.
4, the protective layer 35 covers in order. Each phosphor layer 6 is excited and emits light by the ultraviolet rays generated by the discharge between the pair of transparent electrodes 32.

Next, a method of manufacturing the partition walls of the rear substrate will be described with reference to the manufacturing process sectional views of FIGS.

As a method of forming partition walls for a plasma display panel, a screen printing method, an additive method, a photosensitive paste method, a sandblast method and the like have been conventionally known. Among them, the sandblast method has a high aspect ratio,
In addition, it is drawing attention as a high-definition partition forming method.

First, a rear substrate 1 having an address electrode 3 for selecting a discharge cell and a dielectric layer 4 covering the address electrode 3 is formed.
The glass paste for partition walls is coated on the upper surface by a slit die coater method or a roll coater method at 100 to 160 ° C.
The partition wall material layer 11 having a thickness of 100 to 150 μm is formed by drying at about a temperature (FIG. 3A). After that, a dry film resist (DFR) 12 is attached on the partition wall material layer 11 (FIG. 3B), and, for example, ultraviolet rays 14 are irradiated through a glass mask 13 having a negative pattern of the partition wall (FIG. 3C). Then, development (photolithography method) is performed to form a resist pattern 2 (FIG. 4A). After that, unnecessary portions of the partition wall material layer 11 are removed by sandblasting using the abrasive 15 to form the partition wall 16 (FIG. 4B), and finally the DFR 12 is peeled off (FIG. 4B).
(C)).

FIG. 1 is a plan view of the resist pattern 2 of the present embodiment having a stripe structure. Usually, the resist pattern 21 for the inner partition wall has a constant width, but the resist pattern 21 for the inner partition wall has a peripheral portion. A wide outer peripheral partition wall resist pattern 22 is provided. In the resist pattern 2 of the present embodiment, the outermost resist pattern 2 on the back substrate, which is easily subjected to side etching during sandblasting, is used as the resist pattern 22 for a wide outer peripheral partition wall, so that the adhesiveness between the outermost resist pattern 2 and the paste is improved. And to prevent resist peeling during the sandblasting process.

In the resist pattern 2 of this embodiment, as an example, the pitch of the internal partition resist pattern 21 is set to 3
00 μm, the width of the internal partition resist pattern 21 is 10
The outer peripheral partition wall resist pattern 22 has a width of 3 μm.
It is set to 100 to 500 μm. Further, even if the width of the resist pattern 21 for the inner partition walls is made finer, by setting the width of the resist pattern 22 for the outer partition walls to 300 to 500 μm, resist peeling at the time of sandblasting can be prevented and good partition walls can be obtained. You can get the pattern.

Next, a second embodiment according to the present invention will be described as a partition structure with reference to FIG. In this embodiment, A
It shows a case where the present invention is applied to a double girder structure among typical barrier rib structures of a C-type plasma display panel.
FIG. 5A is a pattern plan view of a resist pattern used when forming partition walls on the back substrate.
(B) is a perspective view showing a state in which a partition wall is formed on the rear substrate.

In order to prevent the adjacent erroneous lighting between the upper and lower cells, the double-sided barrier ribs are formed on the rear substrate side of the transparent electrode pair on the front substrate side corresponding to the non-discharge gap, and also in the direction perpendicular to the address electrodes. This is a structure provided with partition walls (see FIG. 2).

Similar to the first embodiment, the address electrode 4
3 and the rear substrate 1 on which the dielectric layer 44 is formed (see FIG.
In (b)), the resist pattern 42 is composed of a cross-shaped resist pattern 61 for inner partition walls and a resist pattern 62 for outer partition walls on the outer periphery of the back substrate 1. At this time, the width of the outer peripheral partition resist pattern 62 is wider than that of the inner partition resist pattern 61, and the inner partition resist pattern 61 and the outer partition resist pattern 62 are designed to be connected to each other.

Here again, the resist pattern 42 of the present embodiment improves the adhesiveness with the paste of the outer peripheral side wall pattern 62 which is susceptible to side etching when the partition wall material 51 is sandblasted using the resist pattern 42 as a mask. , Plays the role of preventing resist peeling during sandblasting. Therefore, it is possible to obtain a good partition wall pattern even with a fine line pattern due to high definition.

[0025]

As described above, according to the barrier ribs for a plasma display panel of the present invention and the method of manufacturing the barrier ribs, the inner barrier ribs that are susceptible to side etching when the barrier rib material on the back substrate is sandblasted using the resist pattern as a mask. A wide outer peripheral side wall pattern surrounding the outermost pattern of the resist pattern for use is provided to improve the adhesion between the outermost peripheral resist pattern and the paste.
It is possible to prevent peeling of the resist during sandblasting.

[Brief description of drawings]

FIG. 1 is a plan view and a perspective view of a partition wall of a resist pattern for forming a partition wall according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a typical structure of an AC type plasma display panel.

FIG. 3 is a cross-sectional view showing the method of manufacturing the partition wall of the first embodiment of the present invention in the order of manufacturing steps.

FIG. 4 is a cross-sectional view showing the manufacturing process following FIG.

FIG. 5 is a plan view of a resist pattern for forming barrier ribs and a perspective view of the barrier ribs according to the second embodiment of the present invention.

FIG. 6 is a plan view of a conventional resist pattern for forming partition walls.

[Explanation of symbols]

1, 81 Back substrate 2, 42, 82 resist pattern 3,43 Address electrode 4, 34, 44 Dielectric layer 6 Phosphor layer 11, 51, 91 Partition material layer 12 Dry film resist 13 glass mask 14 UV 15 Abrasive 16,56 bulkhead 21, 61 Internal partition resist pattern 22, 62 Peripheral partition wall resist pattern 31 Front substrate 32 transparent electrode 33 bus electrodes 35 Protective layer

Claims (6)

[Claims] 1. A partition on a substrate for partitioning a surface of the substrate in at least one direction to form a discharge space in a space on the substrate, wherein the partition is a continuous structure. A partition for a plasma display panel, comprising a partition frame surrounding an internal partition corresponding to the inside of the substrate around the substrate, wherein the partition frame is wider than the internal partition. 2. The partition for a plasma display panel according to claim 1, wherein the internal partition has a stripe shape or a grid shape. 3. The plasma display according to claim 1, wherein the discharge space is confined between the substrate and the counter substrate when a counter substrate arranged to face the substrate contacts the partition wall. Partition wall for panels. 4. A step of depositing a partition material on a surface of a substrate, a step of forming a mask pattern covering the partition material, a step of removing the partition material using the mask pattern as a mask to form a partition. A method of manufacturing a partition for a plasma display panel, comprising: a mask pattern having a continuous structure; and an internal pattern that partitions the surface of the substrate in at least one direction, and surrounds the internal pattern in the periphery of the substrate. And a frame pattern, wherein the frame pattern has a width wider than that of the internal pattern. 5. The method of manufacturing a partition for a plasma display panel according to claim 4, wherein the internal pattern has a stripe shape. 6. The method of manufacturing a partition for a plasma display panel according to claim 4, wherein the internal pattern has a cross pattern.