JP2003177825A - Overshoot prevention type temperature controller - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature controller which quickly obtains a stable average temperature control state while suppressing the excessive temperature rising at the inlet side of air to be made in contact with a sample. <P>SOLUTION: This temperature controller for a thermostatic chamber is provided with a temperature rising control part 4 and a transition control part 5. The temperature rising control part 4 controls the heating quantity of a heater 12 by outputting a Pd<SB>1</SB>so that a blowoff port temperature t<SB>1</SB>becomes a set temperature ts as a temperature tc to be controlled in a temperature rising process, and the transition control part 5 controls the temperature tc to be controlled after the temperature rising so that the temperature tc becomes an average temperature ta of the blowoff port temperature t<SB>1</SB>and a suction port temperature t<SB>2</SB>detected by a suction temperature sensor 3 by changing the temperature tc little by little by generating a Pd<SB>2</SB>. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is designed such that a gas heated by a heater is introduced into an environment where a desired temperature environment is applied to an object to be treated from an inlet side and is discharged from an outlet side. The temperature control device for controlling the temperature of the gas in the temperature environment providing device is conveniently used as a temperature control technique for a thermostatic chamber in which a heat-generating sample is often placed.

[0002]

2. Description of the Related Art Generally, in a thermostatic chamber in which a heat-generating sample is placed, temperature sensors are provided at the outlet and the inlet of the air into the chamber, and the average temperature, which is the average of these temperatures, is used to determine the temperature distribution in the chamber. Is set as the central temperature, and this temperature is controlled as the control target temperature so that this temperature becomes the set temperature. However, in such a control device, due to the heat capacity of the sample,
For example, when the temperature rises, the rise in the inlet temperature is delayed and the temperature difference from the outlet temperature increases, and therefore the difference between the outlet temperature and the average temperature also increases, so at the time when the average temperature reaches the set temperature, After that, an overshoot phenomenon of the outlet temperature occurs in which the outlet temperature becomes considerably higher than the set temperature as compared with when the stable control state is entered. On the other hand, when a sample is tested in a heat generation state due to a heat generation load, there is a problem that the suction port temperature becomes higher than the set temperature, that is, the average temperature and the blowout port temperature, resulting in overshoot.

Recently, since the temperature of a sample such as a semiconductor to be tested is close to the limit temperature of the sample,
It is necessary to improve the accuracy of the temperature applied to the sample and sufficiently suppress the state in which the temperature of the sample near the blowout port or the suction port becomes higher than the set temperature when the temperature is raised or when the sample heats up. In this case, if the outlet temperature is set to the control temperature instead of the center temperature, overshoot of the outlet temperature at the time of temperature rise can be prevented, but as described above, the rise in temperature on the suction side is prevented when there is a heat load. Can not.

In order to solve such a problem of temperature control in a thermostatic chamber that handles exothermic samples, the outlet temperature is set to a control temperature until the inlet temperature becomes higher than the outlet temperature by 2 to 3 ° C. If, as a result of causing the exothermic sample to generate heat for the test, the inlet temperature becomes 2-3 ° C higher than the outlet temperature, the average temperature is set to the control temperature instead of the outlet temperature at that time,
A constant temperature for sample processing that prevents excessive rise of the outlet temperature during temperature rise and, after heat generation of the sample, controls the temperature of the center of the tank while preventing overshoot of the inlet temperature. A bath temperature control method has been proposed (see Japanese Patent Laid-Open No. 3-137707).

However, according to this control method, the target temperature control, which is the final control state, is not reached until the height relationship between the outlet temperature and the inlet temperature reverses due to the influence of the heat generation load, so that a stable center is achieved. There is a problem that it takes a long time to reach the temperature control state and control is disturbed at the time of switching. Also, the problem of testing the sample without heating it has not been solved.

On the other hand, when the temperature is lowered, the temperature when the temperature is reached is lower than when the temperature is raised, so that there is no problem in the limit temperature of the sample.
However, when the temperature is lowered by the average temperature control, the blowout temperature becomes considerably lower than the set temperature when the set temperature is reached, and then an undershoot that gradually approaches the set temperature occurs, depending on the amount and type of sample at the time of the test. Since the amount of undershoot is different, there is a problem that the reproducibility of the test in which the same temperature condition is applied to all the samples is lowered. In order to prevent this, if the temperature is lowered by blowout temperature control and the blowout temperature control is switched to the average temperature control by a normal method after the temperature is reached,
Control fluctuations occur due to temperature fluctuations during switching. However, a control device that can solve such a problem at the time of lowering the temperature has not heretofore been known.

[0007]

SUMMARY OF THE INVENTION Therefore, the present invention solves the above problems in the prior art and suppresses the temperature applied to the object to be processed from being excessively raised to a desired temperature or higher, and is stabilized quickly. It is an object to provide a temperature control device that reaches a temperature control state. It is another object of the present invention to provide a temperature control device having good temperature reproducibility at the time of testing without changing the test temperature even when the amount of the object to be processed at the time of testing is not constant.

[0008]

In order to solve the above problems, the present invention provides a gas heated by a heater to a temperature environment applying space for applying an environment of a predetermined temperature to an object to be processed from an inlet side. In a temperature control device for controlling the temperature of the gas in a temperature environment providing device which is put in and put out from an outlet side, an inlet side temperature detecting means for detecting a temperature at the inlet side, and an outlet for detecting a temperature at the outlet side Side temperature detection means, and the temperature of the inlet side detected by the inlet side temperature detection means in the temperature rising process of raising the gas to the predetermined temperature is set as the control target temperature so that the control target temperature becomes the predetermined temperature. A temperature raising control unit that controls the heating amount of the heater, and when the temperature on the inlet side reaches the predetermined temperature, the temperature to be controlled is the temperature on the inlet side and the outlet side detected by the outlet side temperature detecting means. The temperature of Characterized by having a a transition control unit for controlling the heating amount of the heater gradually changing the control target temperature so that the average temperature of the.

In addition to the above, the invention of claim 2 has a temperature lowering process of lowering the gas to another predetermined temperature lower than the predetermined temperature, and the inlet side temperature detecting means detects the temperature during the temperature lowering process. A temperature decrease control unit that controls the heating amount of the heater so that the temperature of the inlet side is the temperature to be controlled and the temperature of the control target is the other predetermined temperature, and the temperature of the inlet side reaches the other predetermined temperature. Then, the controlled object temperature is gradually changed so that the controlled object temperature becomes an average temperature of the inlet side temperature and the outlet side temperature detected by the outlet side temperature detecting means, and the heating amount of the heater is changed. It is characterized by having another transition control unit for controlling.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an example of the overall configuration of a temperature control device to which the present invention is applied and a thermostatic chamber which is an example of a temperature environment providing device equipped with this device. The temperature control device of the present example is applied to the test chamber 11, which is a temperature environment application space that provides an environment of, for example, 125 ° C. as the set temperature ts which is the target predetermined temperature to the IC 101 mounted on the burn-in board 100 as the object to be processed. It is a device for controlling the temperature of the air in the thermostatic chamber 1 in which normal air is introduced as the gas heated by the heater 12 from the outlet 13 on the inlet side and is discharged from the inlet 14 on the outlet side. It is composed of a blow-out temperature sensor 2 as a temperature detecting means, a suction temperature sensor 3 as an outlet side temperature detecting means, a temperature raising control section 4, a transition control section 5, and the like.

The constant-temperature bath 1 for burn-in test is, as a normal component, an air supply side duct 15 provided so as to be able to supply hot air that is heated air to the test chamber 11 as shown by an arrow, and a test. A suction side duct 16 provided so that hot air can be sucked from the chamber 11, and hot air is circulated and supplied so that hot air is sucked from the chamber 12 through the heater 12 and blown into the test chamber 11 through the air supply duct 15. Blower 1
7, its drive motor 17a, the heat insulation casing 18 which surrounds these, IC101 tested and heat | fever-generated under normal operating conditions.
Cooling fan 19 which sends cooling air to the test chamber 11 when necessary, the motor 19a thereof, an air supply port 20 for taking in the cooling air, and an exhaust port 21 for discharging excess air at that time. , Etc. Outlet 1
3 and the suction port 14 are perforated plates so that air flows in parallel in the test chamber 11.

The blowout temperature sensor 2 detects the temperature of the blowout port 13, but in this example, it is provided in the air supply side duct 15 near the blowout port 13. The blow-out temperature sensor 3 detects the temperature of the suction port 14, but is provided in the suction side duct 16 in the vicinity of the suction port 14 in this example.

The temperature raising control section 4 raises the temperature of the air, which is a gas, to a set temperature ts which is a predetermined temperature during the temperature raising process.
The outlet temperature t ₁ that is the inlet temperature detected by the outlet temperature sensor 2 is set as a control target temperature tc, and the heating amount of the heater 12 is controlled so that this temperature becomes the set temperature ts.

Therefore, t ₁ and ts are taken in and compared with each other. If t ₁ is smaller than ts, it is judged that there is a temperature rising process, and t ₁ is defined as tc. Corresponding to the heating output signal Pd ₁ during heating
When t ₁ becomes ts, it is determined that the temperature raising process is completed, and t ₁ is output. Pd ₁ and t ₁ are sent to the shift controller 5. The set temperature ts is supplied from a temperature setter 221 provided on the operation control panel 22 of the constant temperature bath 1. The temperature raising control unit 4 is also incorporated in the normal operation control panel 22 as a temperature controller as shown in the figure.

The transition control unit 5 controls the outlet temperature t₁To ts
When it reaches, the temperature tc to be controlled is t ₁And suction temperature sensor
Suction port temperature t, which is the temperature on the outlet side detected by 3₂Tonohira
The temperature of the heater 12 is gradually changed by gradually changing the temperature so that the temperature becomes equal to ta.
Heating output signal Pd after reaching the temperature so as to control the amount of heat₂To
generate. Therefore, the above Pd₁And t₁Take in
And ts and t₂Configured to take in
The calculation part 51, the output part 52 and the switching part 53.
I have it.

The calculation unit 51 calculates that the temperature has reached the temperature when t ₁ passed through the temperature raising control unit 4 and calculates the controlled temperature tc for gradually changing t ₁ to ta. Output part 52
Generates a heating output Pd ₂ after reaching the temperature corresponding to the difference between them by tc and ts. When there is no output of t ₁ from the temperature raising control unit 4 and only Pd ₁ is taken in, the switching unit 53 passes Pd ₁ as it is and transmits it, and the temperature raising control unit 4 generates t ₁ to output. When the portion 52 generates the above Pd ₂ , it emits Pd ₂ instead of Pd ₁ . Pd ₁ or Pd ₂ is sent to a heater to control its heating amount or heating output.

There are various methods for calculating tc in the calculation portion 51, but in this example, the simplest method is to shift from t ₁ to ta in proportion to the elapsed time. That is, the timer 51a is provided and t
_{When 1} reaches ts, the timer 51a is started,
Let T be the transition time from t ₁ to t ₁
For each control cycle from 1 to n in T, the time Ti up to an arbitrary control cycle i and t ₁ and t ₂ input at that control cycle are used to calculate the following formulas (1) and (2). The control target temperature ti at that time is calculated, and this ti
Is set as tc, and this is controlled to reach the set temperature ts.

Ti = t ₁ − (t ₁ −ta) Ti / T −−−−−− (1) where ta = (t ₁ + t ₂ ) / 2 −−−−− (2) The constant temperature bath and its temperature control device are operated as follows to exert their effects.

The burn-in board 100 having the IC 101 as a sample is mounted on a rack (not shown) in the test chamber 11, and the temperature setter 221 of the operation control panel 22 sets the set temperature ts for the burn-in test to, for example, 125.
Set the temperature to ℃ and press the start button (not shown) to activate the thermostatic chamber. As a result, normally, the cooling fan 19 is first operated as shown by the double-dashed line arrow in the figure, and outside air is taken in through the air supply port 20 and exhausted through the exhaust port 21 to replace the atmosphere in the test chamber 11. After that, the cooling fan is stopped, the air supply / exhaust ports are closed by a damper (not shown), and the blower 17 and the heater 12 are operated. As a result, the heated air is delivered from the blower 17, and sequentially,
It is again sucked into the blower 17 via the air supply side duct 15, the test chamber 11, the suction side duct 16 and the heater 12, and the air is circulated and heated and heated. The temperature of the circulating air is constantly detected by the outlet temperature sensor 2 and the inlet temperature sensor 3 as the outlet temperature t ₁ and the inlet temperature t ₂ , respectively.

In this temperature raising process, the circulating air is fed to the set temperature t.
s, but the temperature raising control unit 4 sets the above-mentioned t ₁ as the temperature to be controlled tc so that it becomes ts.
Control the heating amount of 2. Therefore, the temperature raising control unit 4 first takes in t ₁ and ts, compares them, and determines whether or not the temperature is being raised based on the magnitude thereof. If t ₁ <ts, it is determined that the temperature is being raised. Set ₁ to tc. And
A heating output signal Pd ₁ during temperature increase is generated as an output corresponding to the difference between t ₁ = tc and ts. This Pd ₁ is given to the heater 12 via the transfer control unit 5. At this stage, the only signal sent from the control unit 4 to the control unit 5 is Pd ₁ .

FIG. 2 shows a test chamber 11 when the temperature of the circulating air is controlled by the temperature control device of FIG. 1 to which the present invention is applied.
The state of temperature change of the circulating air inside is shown. Of these (a)
The case where there is no heat load is shown, and the case (b) shows the case where the sample generates heat as in the operation test of the IC 101.

In the temperature raising process, a large difference occurs between the temperatures t ₁ and t ₂ before and after the circulating air passing through these parts due to the heat capacity of the sample-related parts such as the burn-in board, the IC and the rack, Therefore, a difference also occurs between t ₁ and ta, and t ₁ reaches ts earlier, so that the temperature rise reaching time Tu can be shortened by setting t ₁ to tc. Also, during the temperature rise, t ₁ which becomes the highest becomes tc
With this setting, t ₁ is controlled to be ts, so that the temperature does not become abnormally high.

On the other hand, in the conventional apparatus, in which ta is set to tc even in the temperature rising process, when ta reaches ts as shown in FIGS. 3 (a) and 3 (b), t ₁
However, the present invention has been applied to the problem that the sample becomes much higher than ts by Δt ₁ and approaches the limit temperature when the sample is tested, and the safety of the sample during the test is lowered. The apparatus of FIG. 1 does not have such a problem.

Next, when the temperature in the tank rises due to the circulation of the heated air and t ₁ becomes ts, the temperature raising control unit 4 judges that the temperature raising process has ended, and outputs t ₁ to the transition control unit 5. To do. At this time, both Pd ₁ and t ₁ are sent to the transition control unit 5. However, the temperature raising control unit 4 may send only t ₁ instead of Pd ₁ .

The transition control unit 5 is t₁When you introduce
The calculation part 51₁Is always input₂When
Therefore, the controlled object temperature tc is calculated by the equations (1) and (2).
Calculated and output part 52 is pre-input with this tc
Heating output Pd after reaching the temperature corresponding to the difference with ts₂From
And the switching portion 53 is₂Incorporating
Pd that has been passed so far₁Instead of Pd₂Passed through
Let the heater 12 be Pd ₂To be controlled by
It

According to the equations (1) and (2), the t ₁ control is t
a for each control cycle of the transition time T until transition to control
a is calculated, and the difference between t ₁ and ta is calculated by the ratio (Ti / T) of the time Ti elapsed from reaching the temperature rise to T to an arbitrary control cycle i − (t ₁ −ta) Ti / T Since there is no abrupt change from t ₁ to ta, and therefore t ₁ does not overshoot from ts, the control ratio by ta increases with the passage of time, and ta control is performed smoothly. Can be moved to.

In order to make this transition control easy to understand,
In FIG. 2 (a), from the time To when the temperature rise is reached to the transition time T which is the transition completion time, t ₁ , t
₂ shows a state in which the difference between ta and ta is constant, which is indicated by a chain double-dashed line. According to this, for example, n
= 10, i is divided into 1 to 10 in 10 times, and T / 1
When t ₁ is corrected to the ta side every control cycle of 0,
If (t ₁ −ta) = x, i = 2 and T ₂ = 2T / 1
When 0 = T / 5, the correction amount of t ₁ is x / 5, and thus the increase of t ₁ is x / 5. When i = 5, the correction is x /
Therefore, the increase of t ₁ and the unachieved amount of ta are both x / 2. When the shift of i = 10 is completed, the correction of t ₁ becomes x, and therefore ti = tc = t ₁ − (t ₁ −t
a) = ta, ta becomes completely tc, and t ₁ is x
Will only rise. As described above, according to the transition control unit 5, the control state can be continuously and gradually changed without suddenly changing the control target temperature tc, and tc can be transitioned from t ₁ to ta while maintaining control stability. it can.

In this case, in reality, the temperature of the sample-related portion rises with the lapse of time, and t ₁ and t ₂ , and therefore t ₁ and ta approach each other, so that the solid line and the solid line in FIG. As indicated by the alternate long and short dash line, t ₁ only slightly increases from the set temperature ts by Δt ₁ , and finally the difference from ta becomes xn as shown in the figure to reach a stable continuous control state. At this time, the difference between t ₂ and ta is naturally xn. As described above, according to the present invention, it is possible to quickly reach the stable control state within a predetermined transition time T without suppressing the rise of t ₁ and causing overshoot.

Although the case where the sample does not generate heat and has a low temperature heat load when the temperature rises has been described above, when the IC is tested in an operating state, the sample generates heat and becomes a high temperature heat load when the temperature is kept. The state of temperature change at this time is shown in FIG.
It shows in (b). The start time of the IC operation test, that is, the heat generation time varies depending on the sample and the content of the test, but normally, when the circulating air that hits the sample first, that is, when the air at the outlet temperature t ₁ reaches the set temperature ts, or slightly before or after that. It's time. Assuming that the sample is put into an operating state when the temperature rises when t ₁ becomes ts, as shown in the figure, the temperature of t ₂ and ta is higher than that of the state (a) partially shown by the chain double-dashed line due to heat generation of the sample. Rise fast. Then, the sample-related portion changes from the low temperature heat load to the high temperature heat load in a short time.

As a result, at the beginning, ta approaches t ₁ earlier, and the correction of t ₁ corresponding to x in FIG. 1 in the equation (1) becomes smaller, so that the temperature at which t ₁ rises above tc. Δt ₁ becomes small, and when the sample is exposed to high temperature heat load, t
T ₂ and ta is higher than _1, t ₁ becomes lower than tc, turn t ₁ is corrected to the positive side. Also at this time, t ₁ is corrected in proportion to the elapsed time of the control cycle, so that the stability of the control is maintained without a sudden change. Then, since tc = ta is finally controlled, t ₂ does not become too high by controlling the center temperature of the sample. Therefore, even when the sample heats up, it is possible to achieve the final control state at an early stage by the predetermined time T while ensuring the stability of control.

When the sample heats up, Pd ₂ becomes a small value and the load on the heater 12 is controlled to be reduced. However, when the time elapses, only the load control of the heater is performed to set the temperature ts. Therefore, the cooling fan 19 is operated by a low output of Pd ₂ equal to or lower than a certain value, and a sufficiently small value of Pd is obtained while taking in the outside air to perform a cooling action.
The temperature is controlled by d ₂ .

In contrast to such a temperature control device to which the present invention is applied, in the conventional control device of the control system in which t ₁ remains tc even after reaching the temperature rise, as shown in FIG. When there is no heat generation load, stable control is possible without excessive temperature rise of t _{1 from} the temperature rise to after the temperature rise is reached. In addition, there is a problem that the suction port temperature t ₂ becomes too high due to heat generation. In the control of the present invention, the ta control is used, which is a smooth transition from the t ₁ control, and thus the problem that t ₂ becomes too high does not occur.

Among the conventional devices, t ₁
It was brought to tc, intended inlet temperature that was switched to ta control from 2 to 3 ° C. higher when t ₁ control than outlet temperature by heating load, to eliminate the excessive increase of t ₁ during heating reaches Although it can be done, it remains t even after the temperature is reached.
_{Since 1} control is maintained, t is the final center temperature control.
When the timing of shifting to the a control becomes late, and the influence of the heat generation load after reaching the temperature rise causes t ₁ and t ₂ to reverse and the temperature becomes 2 to 3 ° C., the control from the t ₁ control to the ta control suddenly occurs at that time. Since it is switched to, it is unavoidable that a sudden change in the temperature of the test chamber due to control disturbance occurs, and it is not possible to cope with a test without a heat load. The temperature control device adopting the present invention solves all of these problems.

FIG. 4 shows experimental results of temperature control by a thermostatic chamber equipped with a temperature control device to which the present invention is applied. It should be noted that in the figure, the illustration of the portion at 100 ° C. or lower in the temperature rising process is omitted.

In this experiment, ts is set to 125 ° C., the temperature tc to be controlled before and after the temperature rise is t ₁ and equation (1),
It was carried out by setting ti calculated in (2) and setting the transition time T to about 20 minutes. The control cycle is 3 seconds. According to this experiment, the rise Δt ₁ of t ₁ after reaching the temperature could be set to a sufficiently small value of about 1 ° C. without overshoot. It should be noted that even if Δt ₁ is about 2 to 3 ° C., there is no problem in practical use. Therefore, if Δt ₁ is allowed up to that level, the transition time T of about 20 minutes can be further shortened.

Although this experiment was carried out in the absence of a heat load due to the relationship of the experimental equipment, when there is a heat load, the transition time will be slightly changed depending on the amount of heat generated. It is expected that similar operation results will be obtained as shown in 2 (a) and (b).

Therefore, in the temperature control device to which the present invention is applied, in a device which is actually manufactured, a safe and stable control is performed while preventing an excessive rise of t ₁ during such a test operation or a practical operation. By confirming the transition time T at which the transition can be completed quickly, the temperature control of the constant temperature bath can be optimized.

FIG. 5 is a diagram showing, as a reference, an experimental result in the case where ta control is performed including the temperature rise as in the conventional apparatus. According to this experiment, it was confirmed that Δt ₁ has a large value of about 6 ° C. and t ₁ largely overshoots.

FIG. 6 shows another example of the temperature control device to which the present invention is applied. When the apparatus of this example has a temperature lowering process of lowering the air, which is a gas, to a low preset temperature ts ₁ as another predetermined temperature lower than the preset temperature ts which is the predetermined temperature, in the temperature lowering process, the inlet side temperature detection is performed. The outlet temperature t ₁ which is the temperature on the inlet side detected by the outlet temperature sensor 2 which is the means is set as the control target temperature tc, and the temperature decrease control unit 6 that controls the heating amount of the heater 12 so that tc becomes ts _1. I have it.

When the outlet temperature t ₁ reaches ts ₁ , the temperature tc to be controlled is the average temperature t ₁ of t ₁ and the inlet temperature t ₂ which is the outlet temperature detected by the inlet temperature sensor 3.
The temperature decrease transition control unit 7 is provided as another transition control unit that generates the heating output signal Pd ₃ after reaching the temperature decrease so as to control the heating amount of the heater 12 by gradually changing it to a. Therefore, it is configured to take in ts ₁ and t ₂ together with taking in the above Pd ₁ and t ₁ .
It comprises a calculation part 54, an output part 55 and a switching part 56.

In this example, the device of FIG. 1 and the device of FIG. 6 are described as different devices, but in reality, the temperature raising control unit 4 and the temperature lowering control unit 6 are integrated, The transfer control unit 5 and the temperature drop transfer control unit 7 are integrated, and these are formed as one control device using a microcomputer or the like.

In the apparatus of this example, the cooling fan 1 shown in FIG. 1 is also used.
In place of 9, a single damper 22 capable of adjusting the opening degrees of the air supply port 20 and the exhaust port 21 at the same time is provided, and the outside air is taken in from the air supply port 20 by the blower 17 and discharged from the exhaust port and 21. The inside of the test chamber 11 can be rapidly cooled. However, similar to the device of FIG. 1, the cooling fan 19 may perform the same operation.

The temperature control device of this embodiment also operates in the same manner as the device of FIG. 1 except for the difference between the temperature rising and the temperature falling. In this case, in the apparatus of this example, the temperature decrease control unit 6 determines that the temperature is being decreased if t ₁ is larger than ts ₁ . Also, equation (1)
Is ti = t ₁ + (ta−t ₁ ) Ti / T −−−−−− (1) ′.

The control state of the temperature of the circulating air at this time is as follows.
As for FIG. 2 of the apparatus of FIG. 1, it becomes like FIG. That is, even when the temperature is lowered, the time t is smoothly changed from the t ₁ control to the ta control. As a result, when the temperature is lowered with tc = ta, undershoot occurs when t ₁ reaches ts ₁ and t ₁ drops too much, but this can be prevented by the apparatus of this example. As a result, even if the amount of the sample put in the test chamber 11 changes and its heat capacity changes, the temperature of the sample can be always lowered in the same state. That is, the reproducibility of the test conditions can be improved. Also, since the undershoot value itself becomes small,
This can be cleared even when strict test conditions are specified.

In the above-described apparatus shown in FIGS. 1 and 6, a description will be given of the control after the temperature is raised from the temperature rise and the control after the temperature is lowered from the temperature drop, that is, when tc is shifted from t ₁ to ta. However, it is desirable to perform the control using the transition control unit for increasing or decreasing the temperature from the constant temperature control after reaching the set temperature.

That is, when the temperature is raised from the low set temperature ts ₁ to ts, tc = ta in a program operation or the like by a control device similar to the temperature raising control unit 4 and the transition control unit 5 in FIG.
= The temperature increase instruction from the constant temperature control state of ts ₁ exits, t
The time tc, which is a, is shifted to t ₁ over time T and switched to t ₁ control. After that, when the temperature rises and t ₁ reaches ts, the transition control unit 5 in FIG.
Switch from ₁ to ta. In addition, in such control,
Since it is a heating process, only the heater 12 is used. Therefore, the cooling fan 19 of FIG. 1 is stopped. In the device of FIG. 6, the damper 22 is in the closed position indicated by the solid line.

From the set temperature ts to the low set temperature ts₁Down to
When performing, the temperature drop control unit 6 and the temperature drop transition control of FIG.
By the control device similar to the part 7, ts₁To reach
Control temperature tc of from ta to t over time T₁Cut into
Change. At this time, since the temperature is falling, the set temperature
Since the difference between the temperature and the measured temperature is large, the heating output P
d₁Becomes 0, and the damper 22 is in the state of the chain double-dashed line in FIG.
That is, the intake port 20 and the exhaust port 21 reach the maximum opening,
The total amount of outside air sucked by the blower 12 from the air outlet 20 is exhausted
It is discharged from 21, and the inside of the test chamber 11 is rapidly cooled. By this
, T₁Is ts ₁The opening of the damper 22 becomes smaller
Heating output Pd₃Gradually increases from 0
, T₁Is ts₁When the control device of FIG. 6 is reached,
The control shifts to tc = ta control.

[0048]

As described above, according to the present invention, in the invention of claim 1, the temperature detecting means for the inlet side and the outlet side imparts a temperature environment of a target predetermined temperature environment to the object to be processed. In the temperature raising process of detecting the temperature of the inlet side and the outlet side of the gas heated by the heater to the space and raising the temperature of this gas to a predetermined temperature, the temperature rise control unit sets the detected temperature of the inlet side as the temperature to be controlled. Since it is configured to control the heating amount of the heater so that this temperature becomes a predetermined temperature,
The temperature at the outlet side, where the temperature rise is delayed due to the heat capacity of the object-related part, and the temperature at the inlet side, which rises faster than the central temperature, make it possible to reach the predetermined temperature quickly and to shift to stable temperature control quickly. Further, it is possible to prevent the inevitable overshoot of the inlet side temperature that occurs when the average temperature control is performed.

A transition control unit is provided, and when the temperature on the inlet side reaches a predetermined temperature, the temperature to be controlled is gradually changed so that the temperature to be controlled becomes an average temperature of the temperature on the inlet side and the temperature on the outlet side. Since the heating amount of the vessel is controlled, while preventing the overshoot of the inlet side temperature that occurs in the same manner as above when switching to the average temperature control at the same time when the temperature rise is reached,
It is possible to shift the control to the desired average temperature as the temperature applied to the object to be processed. Further, it is possible to prevent the occurrence of control disturbance such as a sudden change in the temperature of the temperature environment-applying space when shifting to the average temperature control.

In this case, the temperature raising control unit can quickly reach a predetermined temperature to complete the temperature raising quickly, and the transition control unit can gradually change the time by the trial operation or the practical operation of the temperature environment providing device. Since it is possible to set the shortest time within the range that can prevent the excessive rise of the inlet side temperature as described above, according to the present invention, the temperature control in the temperature environment providing device can be optimized.

According to the invention of claim 2, in addition to the above, when there is a temperature lowering process for lowering the gas to another predetermined temperature lower than the predetermined temperature, the temperature lowering control section and the other transition control having a predetermined configuration are provided. Since the temperature to be controlled is set to the temperature on the inlet side, the temperature does not drop below that temperature when it reaches another predetermined temperature. As a result, even if the amount of the object to be placed in the temperature environment application space changes and the heat capacity changes, the temperature of the object can be always lowered in the same state. That is, the temperature reproducibility as a test condition can be improved. Further, even when a strict test temperature condition is defined for the object to be processed, this can be cleared.

In this case, when the temperature on the inlet side reaches another predetermined temperature, another transition control unit smoothly controls the average temperature, which is a desired temperature to be applied to the object to be processed, without causing control disturbance. Can be moved to.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an example of the overall configuration of a constant temperature bath including a temperature control device to which the present invention is applied.

FIG. 2 is an explanatory diagram showing a transition state of temperature control in the temperature control device, where (a) is a case where there is no heat load and (b) is a diagram where there is a heat load.

3 (a) to 3 (e) are explanatory views of transition states of temperature control in a conventional constant temperature bath.

FIG. 4 is an explanatory diagram showing an experimental result by the temperature control device to which the present invention is applied.

FIG. 5 is an explanatory diagram showing an experimental result by a conventional temperature control device.

FIG. 6 is an explanatory diagram showing another example of the overall configuration of a constant temperature bath including a temperature control device to which the present invention is applied.

FIG. 7 is an explanatory diagram showing a transition state of temperature control in the temperature control device, where (a) is a case where there is no heat generation load and (b) is a case where there is a heat generation load.

[Explanation of symbols]

1 Constant Temperature Chamber (Temperature Environment Applying Device) 2 Blowout Temperature Sensor (Inlet Side Temperature Detection Means) 3 Suction Temperature Sensor (Outlet Side Temperature Detection Means) 4 Temperature Increase Control Unit 5 Transition Control Unit 6 Temperature Decrease Control Unit 7 Temperature Decrease Transition Control Unit ( Other transfer control part) 11 Test chamber (temperature environment application space) 12 Heater 13 Blowout port (inlet side) 14 Suction port (outlet side) 101 IC (object to be treated) t ₁ Blowout port temperature (inlet side temperature) t ₂ inlet temperature (outlet temperature) ta average temperature tc controlled temperature ts set temperature (predetermined temperature) ts ₁ low set temperature (other predetermined temperature)

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 3L054 BE02                 3L060 AA06 CC01 EE00                 5H323 AA29 BB05 CA02 CB25 EE01                       FF01 FF04 FF10 HH02 HH03                       KK05 MM06

Claims (2)

[Claims] 1. A temperature environment imparting device, wherein a gas heated by a heater is introduced from an inlet side into a temperature environment imparting space for imparting an environment of a desired predetermined temperature to an object to be treated and discharged from an outlet side. In a temperature control device for controlling the temperature of a gas, an inlet temperature detecting means for detecting the temperature of the inlet side, an outlet temperature detecting means for detecting the temperature of the outlet side, and raising the gas to the predetermined temperature. A temperature raising control unit that controls the heating amount of the heater so that the temperature of the inlet side detected by the inlet side temperature detecting means in the temperature raising process is the temperature to be controlled and the temperature to be controlled becomes the predetermined temperature, When the temperature on the inlet side reaches the predetermined temperature, the temperature to be controlled is set to be the average temperature of the temperature on the inlet side and the temperature on the outlet side detected by the outlet side temperature detecting means. gradually Temperature control apparatus characterized by by reduction; and a transition control unit for controlling the heating amount of the heater. 2. A temperature lowering process for lowering the gas to another predetermined temperature lower than the predetermined temperature, wherein the temperature on the inlet side detected by the inlet side temperature detecting means in the temperature lowering process is used as a control target temperature. A temperature drop control unit that controls the heating amount of the heater so that the temperature to be controlled becomes the other predetermined temperature,
When the temperature of the inlet side reaches the other predetermined temperature, the control target temperature is set to be an average temperature of the temperature of the inlet side and the temperature of the outlet side detected by the outlet side temperature detecting means. The temperature control device according to claim 1, further comprising another transition control unit that controls the heating amount of the heater by gradually changing the temperature.