JP2003175470A - Grinding wheel, and method of working hole using the same - Google Patents

Grinding wheel, and method of working hole using the same

Info

Publication number
JP2003175470A
JP2003175470A JP2001377855A JP2001377855A JP2003175470A JP 2003175470 A JP2003175470 A JP 2003175470A JP 2001377855 A JP2001377855 A JP 2001377855A JP 2001377855 A JP2001377855 A JP 2001377855A JP 2003175470 A JP2003175470 A JP 2003175470A
Authority
JP
Japan
Prior art keywords
grinding wheel
hole
abrasive grain
glass
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001377855A
Other languages
Japanese (ja)
Inventor
Shigeru Emori
滋 江森
Naoki Shamoto
尚樹 社本
Kuniharu Himeno
邦治 姫野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP2001377855A priority Critical patent/JP2003175470A/en
Publication of JP2003175470A publication Critical patent/JP2003175470A/en
Withdrawn legal-status Critical Current

Links

Abstract

<P>PROBLEM TO BE SOLVED: To uniformly and smoothly work an inner face of a working hole in glass and a ceramic, without damaging the inner face. <P>SOLUTION: In this grinding wheel 10, there are provided a base 11 and an abrasive grain member 12, and the abrasive grain member 12 has a tapered shape. In this hole working method, a tapered angle of the abrasive grain member 12 is made 84.3-89.9°. A glass material or a ceramic material is fixed to a honing machine, the grinding wheel 10 is set to the honing machine, the wheel 10 is presses in the glass material or the ceramic material, while rotated, to be moved vertically with respect to the glass material or the ceramic material, and prescribed hole working is conducted thereby. A rotating speed of the grinding wheel 10 is made 500-5000 rpm. A speed of a reciprocating motion of the wheel 10 is made 1.0 mm/min-50 mm/min. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、ガラス材またはセ
ラミックス材に穴加工を行なうための研削砥石およびこ
れを用いた穴加工方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grinding wheel for making holes in a glass material or a ceramic material and a hole making method using the grinding stone.

【0002】[0002]

【従来の技術】従来、ガラス材またはセラミックス材に
細径の穴を開ける際には、ホーニングマシンなどが用い
られている。ガラス材またはセラミックス材(以下、
「被加工材」と記す。)の穴加工では、まず、図示略の
ホーニングマシンに被加工材を固定し、ホーニングマシ
ンに図2に示すような、円柱状の基体1と、基体1と中
心軸を同じくして設けられ、基体1よりも直径の大きい
円柱状の砥粒体2とから構成されている自転可能な研削
砥石3をセットする。次に、研削砥石3を回転させなが
ら、被加工材に押し込んで、被加工材に対して垂直方向
に往復移動させることにより、所定の穴加工を行なう。
2. Description of the Related Art Conventionally, a honing machine or the like has been used for making a small-diameter hole in a glass material or a ceramic material. Glass material or ceramic material (hereinafter,
Described as "workpiece". 1), the workpiece is first fixed to a honing machine (not shown), and the honing machine is provided with a cylindrical base 1 and a base 1 having the same central axis as shown in FIG. A rotatable grinding wheel 3 composed of a cylindrical abrasive grain 2 having a diameter larger than that of the base 1 is set. Next, while the grinding wheel 3 is being rotated, the grinding stone 3 is pushed into the work material and reciprocally moved in the vertical direction with respect to the work material, thereby performing a predetermined hole drilling.

【0003】[0003]

【発明が解決しようとする課題】上記研削砥石3を用い
た穴加工では、被加工材にある程度の長さの加工穴を開
けると、加工穴の内面にクラックなどの深い傷ができる
ことがあった。ガラス材やセラミックス材にできた傷
は、その強度を著しく低下させるなど、品質上著しい問
題となる。この傷の発生要因の1つとしては、ガラス材
やセラミックス材を研削した際にできるガラスの粉やセ
ラミックスの粉が挙げられる。このガラスの粉やセラミ
ックスの粉が、砥粒体2の側面と、被加工材の加工穴の
内面との間に挟まり、被加工材の加工穴の内面に深い傷
を付ける。このように、砥粒体2の側面と、被加工材の
加工穴の内面との間にガラスの粉やセラミックスの粉が
挟まる理由は、次のようなことである。研削砥石3によ
って被加工材に開けられた加工穴の内径は、研削砥石3
の砥粒体2の外径とほぼ等しいため、加工穴を砥粒体2
が塞いだ状態となり、削れた粉が加工穴からスムーズに
排出され難いからである。
In the drilling using the grinding wheel 3, when a drilled hole having a certain length is drilled in the workpiece, deep scratches such as cracks may be formed on the inner surface of the drilled hole. . The scratches formed on the glass material or the ceramic material cause a serious problem in terms of quality, for example, the strength thereof is significantly reduced. One of the causes of the scratches is glass powder or ceramic powder produced when a glass material or a ceramic material is ground. The glass powder or the ceramic powder is sandwiched between the side surface of the abrasive grain 2 and the inner surface of the processed hole of the workpiece, and deep scratches the inner surface of the processed hole of the workpiece. The reason why the glass powder or the ceramic powder is sandwiched between the side surface of the abrasive grain 2 and the inner surface of the processed hole of the workpiece is as follows. The inner diameter of the processing hole formed in the workpiece by the grinding wheel 3 is
Since the outer diameter of the abrasive grain 2 is almost equal to that of the
This is because it is difficult to discharge the scraped powder from the processed hole smoothly.

【0004】本発明は、前記事情に鑑みてなされたもの
で、ガラスやセラミックスの加工穴の内面を傷付けるこ
となく、均一かつ平滑に加工することができる研削砥石
およびこれを用いた穴加工方法を提供することを課題と
する。
The present invention has been made in view of the above circumstances, and provides a grinding wheel that can be machined uniformly and smoothly without damaging the inner surface of a machined hole of glass or ceramics, and a hole machining method using the same. The challenge is to provide.

【0005】[0005]

【課題を解決するための手段】前記課題は、基体と、砥
粒体とを備えた研削砥石であって、前記砥粒体がテーパ
状である研削砥石によって解決できる。前記砥粒体のテ
ーパ角度が84.3〜89.9度であることが好まし
い。また、前記課題は、上記研削砥石を回転させなが
ら、被加工材に押し込んで、該被加工材に対して垂直方
向に移動させることにより、所定の穴加工を行なう穴加
工方法によって解決できる。前記研削砥石の回転速度を
500〜5000rpmとすることが好ましい。前記研
削砥石の往復運動の速度を1.0mm/min〜50m
m/minとすることが好ましい。
The above problems can be solved by a grinding wheel provided with a substrate and an abrasive grain, wherein the abrasive grain has a tapered shape. The taper angle of the abrasive grains is preferably 84.3 to 89.9 degrees. Further, the above-mentioned problem can be solved by a hole drilling method in which a predetermined hole is drilled by pushing the work into a work material while rotating the grinding wheel and moving it in a direction perpendicular to the work material. The rotation speed of the grinding wheel is preferably 500 to 5000 rpm. The reciprocating speed of the grinding wheel is 1.0 mm / min to 50 m
It is preferably m / min.

【0006】[0006]

【発明の実施の形態】以下、本発明を詳しく説明する。
図1は、本発明の研削砥石の一例を示す正面図である。
この例の研削砥石10は、円柱状の基体11と、基体1
1の一端に、これと中心軸を同じくして設けられ、基体
11との接合部から研削砥石10の先端に向かって次第
に拡径しているテーパ状の砥粒体12とから概略構成さ
れている。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention is described in detail below.
FIG. 1 is a front view showing an example of the grinding wheel of the present invention.
The grinding wheel 10 of this example includes a cylindrical base 11 and a base 1.
1 is provided with one end having the same central axis as that of the base 1 and has a tapered abrasive grain body 12 whose diameter gradually increases from the joint with the base body 11 toward the tip of the grinding wheel 10. There is.

【0007】基体11の直径および長さは、ガラス材や
セラミックス材に、研削砥石10を用いて加工される加
工穴の大きさに応じて適宜設定される。また、砥粒体1
2は、その上面12aの直径が基体11の直径よりも大
きくなっており、底面12bの直径が上面12aの直径
よりも大きくなっている。砥粒体12の大きさも基体1
1と同様に、上記の加工穴の大きさに応じて適宜設定さ
れる。
The diameter and length of the base body 11 are appropriately set in accordance with the size of a hole machined in the glass or ceramic material by using the grinding wheel 10. Also, the abrasive grain 1
In No. 2, the diameter of the upper surface 12a is larger than the diameter of the base body 11, and the diameter of the bottom surface 12b is larger than the diameter of the upper surface 12a. The size of the abrasive 12 is also the base 1
Similar to No. 1, it is appropriately set according to the size of the processed hole.

【0008】また、砥粒体12のテーパ角度(図1に示
す砥粒体12の底面12bと斜辺12cとのなす角度
d)が、84.3〜89.9度であることが好ましく、
より好ましくは、87.2〜89.5度である。砥粒体
12のテーパ角度が上記範囲内であれば、ガラス材やセ
ラミックス材を研削して、穴加工する際にできるガラス
の粉やセラミックスの粉が、砥粒体12の上面12a側
からスムーズに、加工穴の外に排出される。したがっ
て、ガラスの粉やセラミックスの粉が、砥粒体12の側
面と、ガラス材やセラミックス材の加工穴の内面との間
に挟まり、加工穴の内面に深い傷を付けることがなく、
加工穴の内面を均一かつ平滑に研削することができる。
砥粒体12のテーパ角度が84.3度未満では、加工穴
の内面を平滑に研削することができない。砥粒体12の
テーパ角度が89.9度を超えると、ガラスの粉やセラ
ミックスの粉が加工穴の外にスムーズに排出され難くな
り、結果として、加工穴の内面に深い傷が付く。
The taper angle of the abrasive 12 (angle d between the bottom surface 12b of the abrasive 12 shown in FIG. 1 and the hypotenuse 12c) is preferably 84.3 to 89.9 degrees.
More preferably, it is 87.2 to 89.5 degrees. If the taper angle of the abrasive 12 is within the above range, the glass powder or the ceramic powder, which is formed when grinding the glass material or the ceramic material and drilling holes, is smooth from the upper surface 12a side of the abrasive body 12. Then, it is discharged out of the processed hole. Therefore, the glass powder or the ceramic powder is not caught between the side surface of the abrasive grain body 12 and the inner surface of the processed hole of the glass material or the ceramic material, and the inner surface of the processed hole is not deeply scratched,
The inner surface of the processed hole can be uniformly and smoothly ground.
If the taper angle of the abrasive 12 is less than 84.3 degrees, the inner surface of the processed hole cannot be ground smoothly. If the taper angle of the abrasive 12 exceeds 89.9 degrees, it becomes difficult for glass powder or ceramic powder to be smoothly discharged out of the processed hole, resulting in deep scratches on the inner surface of the processed hole.

【0009】基体11は、鉄、ステンレスなどで形成さ
れている。砥粒体12は、ダイヤモンド、CBNなどの
砥粒を基体11にメタルボンドで固着し、一体に形成さ
れている。
The base 11 is made of iron, stainless steel or the like. The abrasive grains 12 are integrally formed by fixing abrasive grains such as diamond and CBN to the base 11 by metal bonding.

【0010】次に、本発明の穴加工方法を、図1を用い
て説明する。本発明の穴加工方法は、図示略のホーニン
グマシンに被加工材のガラス材またはセラミックス材を
固定し、ホーニングマシンに研削砥石10をセットし、
研削砥石10を回転させながら、被加工材に押し込ん
で、被加工材に対して垂直方向に移動させることによ
り、所定の穴加工を行なう。この際、研削砥石10が回
転する速度を500〜5000rpmとすることが好ま
しい。回転速度が500rpm未満では、ガラス材やセ
ラミックス材に形成した加工穴の内面を平滑に研磨する
ことができない。回転速度が5000rpmを超える
と、加工穴の内面に傷が付きやすくなる。また、研削砥
石10の加工速度を1.0mm/min〜50mm/m
inとすることが好ましい。加工速度が1.0mm/m
in未満では、加工穴の内面を均一かつ平滑に研磨する
ことができない上に、加工速度が遅くて生産性にあわな
い。加工速度が50mm/minを超えると、加工穴の
内面を均一かつ平滑に研磨することができない上に、加
工穴の内面に傷が付きやすくなる。
Next, the hole drilling method of the present invention will be described with reference to FIG. According to the hole drilling method of the present invention, a glass material or a ceramic material, which is a workpiece, is fixed to a honing machine (not shown), and the grinding wheel 10 is set on the honing machine.
While the grinding wheel 10 is being rotated, the grinding wheel 10 is pushed into the workpiece and moved in the vertical direction with respect to the workpiece, so that a predetermined hole is drilled. At this time, the rotation speed of the grinding wheel 10 is preferably set to 500 to 5000 rpm. If the rotation speed is less than 500 rpm, the inner surface of the processed hole formed in the glass material or the ceramic material cannot be polished smoothly. If the rotation speed exceeds 5000 rpm, the inner surface of the processed hole is likely to be scratched. Further, the processing speed of the grinding wheel 10 is 1.0 mm / min to 50 mm / m.
It is preferably in. Processing speed is 1.0 mm / m
If it is less than in, the inner surface of the processed hole cannot be uniformly and smoothly polished, and the processing speed is slow, which is not suitable for productivity. If the machining speed exceeds 50 mm / min, the inner surface of the machined hole cannot be polished uniformly and smoothly, and the inner surface of the machined hole is easily scratched.

【0011】本発明の穴加工方法によれば、加工された
穴の内面の中心線平均粗さRaの標準偏差を、5μm以
下とすることができる。また、加工穴の内面に深い傷を
付けることがなく、加工穴の内面を均一かつ平滑に研削
することができる。
According to the hole machining method of the present invention, the standard deviation of the center line average roughness Ra of the inner surface of the machined hole can be 5 μm or less. Further, the inner surface of the machined hole can be uniformly and smoothly ground without making deep scratches on the inner surface of the machined hole.

【0012】また、本発明の穴加工方法にあっては、研
削砥石10を用いてガラス材やセラミックス材に穴加工
を施す前処理として、ガラス材やセラミックス材に研削
砥石10を挿入するための下穴を形成してもよい。
Further, in the hole boring method of the present invention, as a pretreatment for boring a glass material or a ceramic material using the grinding wheel 10, the grinding wheel 10 is inserted into the glass material or the ceramic material. A pilot hole may be formed.

【0013】以下、具体的な実施例を示して、本発明の
効果を明らかにする。まず、純粋石英からなる円柱状の
ガラス材を用意した。次に、ホーニングマシンに、この
ガラス材を固定した。次に、ホーニングマシンに、砥粒
体のテーパ角度85度が研削砥石をセットし、研削砥石
10を回転速度2000rpmで回転させながら、ガラ
ス材に速度20mm/minで垂直に押し込んで所定の
穴加工を行なった。このような一連の穴加工を、ガラス
材100本について行なった。その結果、加工された穴
の内面の中心線平均粗さRaの標準偏差は、従来の研削
砥石で加工した場合20μmであったのが5μmとなっ
た。また、加工穴の内面には大きな傷は発生しなかっ
た。
Hereinafter, the effects of the present invention will be clarified by showing concrete examples. First, a cylindrical glass material made of pure quartz was prepared. Next, this glass material was fixed to a honing machine. Next, a grinding wheel with a taper angle of 85 degrees was set on the honing machine, and while the grinding wheel 10 was rotating at a rotation speed of 2000 rpm, the glass material was vertically pushed at a speed of 20 mm / min to form a predetermined hole. Was done. Such a series of hole processing was performed on 100 glass materials. As a result, the standard deviation of the center line average roughness Ra of the inner surface of the processed hole was 5 μm, which was 20 μm when processed by the conventional grinding wheel. Further, no large scratch was generated on the inner surface of the processed hole.

【0014】[0014]

【発明の効果】以上説明したように、本発明の研削砥石
は、基体と、砥粒体とを備えた研削砥石であって、前記
砥粒体がテーパ状であるから、ガラスやセラミックスの
穴の内面を傷付けることなく、均一かつ平滑に加工する
ことができる。前記砥粒体のテーパ角度が84.3〜8
9.9度であれば、ガラス材やセラミックス材を研削し
て、穴加工する際にできるガラスの粉やセラミックスの
粉が、砥粒体の上面側からスムーズに、穴の外に排出さ
れる。したがって、ガラスの粉やセラミックスの粉が、
砥粒体の側面と、ガラス材やセラミックス材の穴の内面
との間に挟まり、穴の内面に深い傷を付けることがな
く、穴の内面を均一かつ平滑に研削することができる。
As described above, the grinding wheel of the present invention is a grinding wheel provided with a substrate and an abrasive grain, and since the abrasive grain is tapered, it has a hole of glass or ceramics. It can be processed uniformly and smoothly without damaging the inner surface. The taper angle of the abrasive grains is 84.3 to 8
If it is 9.9 degrees, the glass powder or the ceramic powder, which is produced when the glass material or the ceramic material is ground and the hole is processed, is smoothly discharged from the upper surface side of the abrasive grain to the outside of the hole. . Therefore, glass powder and ceramic powder
It is sandwiched between the side surface of the abrasive grain and the inner surface of the hole of the glass material or the ceramic material, and the inner surface of the hole can be ground uniformly and smoothly without making deep scratches on the inner surface of the hole.

【0015】また、本発明の穴加工方法は、上記研削砥
石を回転させながら、被加工材に押し込んで、該被加工
材に対して垂直方向に移動させることにより、所定の穴
加工を行なうから、加工穴の内面に深い傷を付けること
がなく、加工穴の内面を均一かつ平滑に研削することが
できる。前記研削砥石の往復運動の速度を1.0mm/
min〜50mm/minとすれば、加工穴の内面を均
一かつ平滑にすることができる。
Further, according to the hole drilling method of the present invention, a predetermined hole is drilled by pushing the grinding grindstone into the work material and moving it in a direction perpendicular to the work material while rotating the grinding wheel. The inner surface of the machined hole can be uniformly and smoothly ground without making deep scratches on the inner surface of the machined hole. The reciprocating speed of the grinding wheel is 1.0 mm /
If it is set to min to 50 mm / min, the inner surface of the processed hole can be made uniform and smooth.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の研削砥石の一例を示す正面図であ
る。
FIG. 1 is a front view showing an example of a grinding wheel of the present invention.

【図2】 従来の研削砥石を示す正面図である。FIG. 2 is a front view showing a conventional grinding wheel.

【符号の説明】[Explanation of symbols]

10・・・研削砥石、11・・・基体、12・・・砥粒体 10 ... Grinding wheel, 11 ... Base, 12 ... Abrasive body

フロントページの続き (72)発明者 姫野 邦治 千葉県佐倉市六崎1440番地 株式会社フジ クラ佐倉事業所内 Fターム(参考) 3C063 AA02 AB02 BA02 BA21 BB02 BC02 EE16 EE21 FF23 FF30 4G015 FA09 FC00 Continued front page    (72) Inventor Kuniharu Himeno             Fuji Co., Ltd. 1440 Rokuzaki, Sakura City, Chiba Prefecture             Kura Sakura Office F term (reference) 3C063 AA02 AB02 BA02 BA21 BB02                       BC02 EE16 EE21 FF23 FF30                 4G015 FA09 FC00

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 基体と、砥粒体とを備えた研削砥石であ
って、前記砥粒体がテーパ状であることを特徴とする研
削砥石。
1. A grinding wheel provided with a base and an abrasive grain, wherein the abrasive grain has a tapered shape.
【請求項2】 前記砥粒体のテーパ角度が84.3〜8
9.9度であることを特徴とする請求項1記載の研削砥
石。
2. The taper angle of the abrasive grains is 84.3-8.
The grinding wheel according to claim 1, which is 9.9 degrees.
【請求項3】 請求項1または2記載の研削砥石を回転
させながら、被加工材に押し込んで、該被加工材に対し
て垂直方向に移動させることにより、所定の穴加工を行
なうことを特徴とする穴加工方法。
3. A predetermined hole is drilled by rotating the grinding wheel according to claim 1 or 2 and pushing it into a workpiece and moving it in a direction perpendicular to the workpiece. Hole drilling method.
【請求項4】 前記研削砥石の回転速度を500〜50
00rpmとすることを特徴とする請求項3記載の穴加
工方法。
4. The rotation speed of the grinding wheel is 500 to 50.
The hole drilling method according to claim 3, wherein the speed is set to 00 rpm.
【請求項5】 前記研削砥石の往復運動の速度を1.0
mm/min〜50mm/minとすることを特徴とす
る請求項3または4記載の穴加工方法。
5. The reciprocating speed of the grinding wheel is 1.0
mm / min-50 mm / min, The hole drilling method of Claim 3 or 4 characterized by the above-mentioned.
JP2001377855A 2001-12-11 2001-12-11 Grinding wheel, and method of working hole using the same Withdrawn JP2003175470A (en)

Priority Applications (1)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publications (1)

Publication Number Publication Date
JP2003175470A true JP2003175470A (en) 2003-06-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006205327A (en) * 2005-01-31 2006-08-10 Omi Kogyo Co Ltd Cemented carbide blade grinding tool and method of manufacturing cemented carbide tool

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006205327A (en) * 2005-01-31 2006-08-10 Omi Kogyo Co Ltd Cemented carbide blade grinding tool and method of manufacturing cemented carbide tool

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