JPH0699358A - Reproducing method for ultraabrasive grain grinding wheel - Google Patents

Abstract

PURPOSE:To markedly reduce a grinding cost by removing a sintered layer after use from surfaces of a base mount, and securing a new sintered layer to the base mount surface after work of the removal, so that the base mount can be reutilized. CONSTITUTION:In a super abrasive grain grinding wheel 1 of securing a sintered layer 3 of containing super abrasive grains 4 to surfaces of a disk-shaped base mount 2 by a connecting layer 55, the sintered layer 3 after use is removed from the surface of the base mount 2, and the new sintered layer is secured to the surf ace of the base mount 2 after work of the removal. Here by a diamond grinding wheel, the sintered layer 3 of the super abrasive grain grinding wheel 1 is removed to grind an interface worked of the base mount 2 with the sintered layer 3, and the new sintered layer 3 is formed in peripheral surfaces of the base mount 2 thus applied with grinding work. As a result, the base mount 2 can be reutilized to enable a grinding cost to reduce.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for reclaiming a superabrasive grindstone in which superabrasive grains such as diamond and cubic boron nitride (CBN) are fixed to a grinding surface.

[0002]

2. Description of the Related Art A superabrasive grindstone using diamond or CBN abrasive grains is required for high-speed grinding with a peripheral speed exceeding 80 m / s. As shown in FIG. 1, such a superabrasive grain grindstone has an abrasive grain layer 4 containing superabrasive grains and an abrasive grain layer 4 containing no abrasive grains on the peripheral surface of a disk-shaped base 2. And a bonding layer 5 made of the same material as those described above are integrally bonded. The abrasive grain layer 4 and the bonding layer 5 include a filler such as abrasive grains and ceramics,
It is formed by sintering bond materials such as resin, metal, and vitrified, and has a high hardness by itself, and has excellent high-speed grinding performance.

On the other hand, the base 2 is conventionally formed of steel, aluminum alloy, plastic, a composite material of plastic and metal powder, etc., and the base made of these materials can be formed at a relatively low cost. Therefore, the abrasive grain layer 4 was discarded at the end of its life and was not reused.

However, in recent years, the peripheral speed of the grindstone is 250 m /
To reach s, the base of the superabrasive grindstone has the ability to stably hold the abrasive grain layer and the bonding layer at the time of high-speed rotation, that is, the stress acting by the inertial force at the time of high-speed rotation. However, it is required to have characteristics such as sufficient strength, small deformation, and light weight. Therefore, in order to obtain the above characteristics, fiber reinforced plastics, silicon nitride, silicon carbide, etc., which are excellent in mechanical strength and thermal strength and have a low specific gravity, have recently been used as a base material.

However, since such fiber reinforced plastics and silicon nitride are very expensive, when used as a material for the base, the ratio of the cost of the base to the price of the grindstone is significantly higher than that of the conventional one. When the base is disposed of without being reused as described above, there is a problem that the processing cost becomes extremely high.

[0006] Therefore, the present invention is intended to solve the above-mentioned problems and to provide a recycling method capable of reusing a base a plurality of times.

[0007]

In order to solve the above problems, the present invention provides a superabrasive grindstone in which a sintered layer containing superabrasive particles is adhered to the surface of a disk-shaped base. A method was adopted in which the used sintered layer was removed from the surface of the base, and a new sintered layer was fixed to the surface of the base after processing.

As a method for removing the sintered layer after use, there are a method by grinding or cutting, a method of chemically dissolving, and a method of cutting with a laser or an electron beam.

[0009]

As described above, the base can be reused by removing the used sintered layer from the base.

When the above-mentioned sintered layer is removed by grinding, a diamond grindstone is preferably used as a grinding grindstone in terms of working efficiency and working accuracy.
It can also be used with a C grindstone.

In the case of cutting, ceramics, cemented carbide, cermet tool, etc. can be used in addition to the diamond tool.

Further, in the method of chemically dissolving, if a solution containing nitric acid, hydrochloric acid, aqua regia, etc. is used, the sintered layer having the superabrasive grains bonded thereto can be dissolved.

[0013]

EXAMPLE FIG. 1 shows a superabrasive grindstone of an example in which a grinding process was performed to reuse a base. In this superabrasive grindstone 1, a base 2 is made of carbon fiber reinforced plastic in a disk shape, and a sintered layer 3 composed of an abrasive layer 4 and a bonding layer 5 is fixed to the outer peripheral surface of the base 2. Has been done.

In the case of Experimental Examples 1 and 2, which will be described later, the abrasive grain layer 4 is formed by sintering CBN abrasive grains by sintering with a vitrified bond material, and the bonding layer 5 is formed with the abrasive grain layer 4. It is formed by sintering a vitrified bond material of the same material and a metallic ceramics as a filler.

On the other hand, in the case of Experimental Examples 3 and 4, the abrasive grain layer 4
Is formed by sintering and bonding CBN abrasive grains with a metal bond material, and the bonding layer 5 is formed by sintering and bonding the same metal bond material as the abrasive grain layer 4 but not containing CBN abrasive particles. ing.

The size of the superabrasive grindstone 1 is an outer diameter D = 344 m.
m, the base inner diameter d = 152 mm, the width L = 25 mm, and the thickness t of the sintered layer 3 is 5 mm.

<Example 1> Using a diamond grindstone,
The sintered layer 3 of the superabrasive grindstone 1 is removed, and the interface between the sintered layer 3 of the base 2 is ground, and a new sintered layer 3 is formed on the outer peripheral surface of the base 2 after the processing. did.

The diamond grindstone used for removing the sintered layer 3 had an outer diameter of 400 mm and a thickness of 26 mm, and had a diamond abrasive grain size of # 80 and a concentration of 100.

A cylindrical grinder is used for the grinding, and the grinding conditions are such that the peripheral speed of the diamond grindstone is 2700 m / m.
in, the rotation speed of the workpiece (superabrasive grindstone 1) is 20 rpm,
The cutting speed was 0.5 mm / min, and the
A 0.5% solution of SW2 species was used.

In the reclaiming process of this embodiment, the time required for removing the sintered layer 3 was about 12 minutes, and the outer peripheral surface of the base 2 after the process was good in terms of accuracy and quality. It was Further, the method of fixing the new sintered layer 3 to the processed base 2 made it possible to reuse the base 2 10 times. In this case, the machining performance and life in the grinding process at each reuse are
Almost the same as the new superabrasive stone was obtained.

Example 2 Using a diamond bite, the sintered layer 3 of the superabrasive grindstone 1 was removed by cutting.

A numerical control (NC) lathe was used for cutting, and the cutting conditions were a cutting speed of 16 mm / min, a depth of cut of 0.5 mm, and a feed of 0.8 mm / rev, and dry cutting was performed. The processed outer peripheral surface of the base had a good shape accuracy and surface roughness.

<Example 3> An aqueous solution containing 20 to 80% by volume of nitric acid was heated in a temperature range of 80 to 100 ° C, and the sintered layer 3 of the superabrasive grindstone 1 was dipped in the aqueous solution and sintered. The layers were chemically dissolved.

If the base 2 of the superabrasive grindstone is made of a composite material of a fiber reinforced plastic resistant to acid and an aluminum alloy, it is possible to boil an aqueous acid solution at 100 ° C. It can also increase speed.

Example 4 Using a carbon dioxide gas (CO ² ) laser, the sintered layer 3 after the use of the superabrasive grindstone 1 was cut and processed, and the sintered layer was removed.

A beam moving type continuous wave laser processing machine was used for processing, and the laser output was 1000 W. Oxygen gas was used as the assist gas.

In this laser processing, it is possible to perform cutting at a high speed and with an extremely small depth of cut, and because it is possible to perform processing with the heat-affected layer being suppressed to a minimum, thermal distortion of the base hardly occurs and the base The outer peripheral surface could be processed with high precision.

In each of the experimental examples described above, the base 2 from which the sintered layer after use has been removed has a slightly smaller shape, but if the bonding layer 5 is made thicker accordingly, the abrasive grain layer 4 becomes larger. It is possible to use the same grindstone size without doing so.

[0029]

As described above, according to the reproducing method of the present invention,
Since the sintered layer after use is removed from the grindstone and a new sintered layer is fixed after that, the base can be reused, and the grinding cost can be greatly reduced.

[Brief description of drawings]

FIG. 1 is a sectional view showing a superabrasive grindstone of an embodiment.

[Explanation of symbols]

 1 Cross-sectional view showing a superabrasive wheel 2 Base 3 Sintered layer 4 Abrasive layer 5 Bonding layer

Claims (5)

[Claims] 1. A superabrasive grindstone in which a sintered layer containing superabrasive grains is adhered to the surface of a disk-shaped base, and the used sintered layer is removed from the surface of the base, and the processing is performed. A method for reclaiming a superabrasive grindstone, characterized in that a new sintered layer is adhered to the surface of a later base. 2. The method for reclaiming a superabrasive grindstone according to claim 1, wherein the used sintered layer is removed by grinding. 3. The method for reclaiming a superabrasive grindstone according to claim 1, wherein the used sintered layer is removed by cutting. 4. The method of reclaiming a superabrasive grindstone according to claim 1, wherein the used sintered layer is chemically dissolved and removed. 5. The method for reclaiming a superabrasive grindstone according to claim 1, wherein the sintered layer after the use is removed by cutting with a laser or an electron beam.