JP2003174117A - Electronic component assembling method and electronic component - Google Patents

Abstract

To provide an electronic component assembling method and an electronic component capable of reducing the mounting cost including stabilization of product quality and improvement of production tact. After the circuit forming portion 113 is covered with a sealing material 114, the sealing material is removed until a bump 112 is exposed, so that the circuit forming portion is not damaged. Product quality can be stabilized. Further, a specially shaped package is not required as in the prior art, and a process of covering is not necessary. Therefore, it is possible to reduce the mounting cost including improvement of production tact.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component assembling method and an electronic component assembled by the assembling method.

[0002]

2. Description of the Related Art In recent years, the production volume of electronic parts has continued to increase,
Along with this, various types of package forms have been proposed. For example, CSP (chip sides package), C4 (Cont
rolledCollapse Chip Connection) and BGA (Ball Gri)
d Allay), QFP, etc. In particular, it is considered that CSP of electronic parts that realizes small size and light weight will be important. In a conventional semiconductor element such as an IC chip, gold bumps, solder bumps, etc. are formed on electrodes, mounted on a mounting board, and then fixed with a sealing material. As an example of this, referring to FIG. 22, the bumps 3 made of gold, for example, are formed on the electrodes of the semiconductor element 1 by stud bump bonding or the like. Then, the bumps 3 are bonded onto the substrate electrodes 4 on the mounting substrate 2 made of ceramic or resin material while applying ultrasonic vibration. After that, sealing is performed with a sealing material 5 such as an insulating resin including a bonding portion between the bump 3 and the substrate electrode 4 and a peripheral portion of the semiconductor element 1.

Further, since a semiconductor element such as a SAW (surface acoustic wave) filter must have no foreign matter on the circuit forming surface, the SAW filter 6 is bumped onto the cavity type ceramic substrate 7 as shown in FIG. 24 is conducted by a flip chip bonding method, or as shown in FIG.
The W filter 6 is fixed, and the gold wire 8 is used to conduct electricity by the wire bonding method. After that, both of them had a mode in which the metal plate 9 was covered with the glass material or the solder 10 on the upper part of the ceramic substrate 7 to seal the cavity.

[0004]

However, in the above-mentioned conventional method, when the bumps 3 are bonded on the substrate electrode 4 while applying ultrasonic vibration, the vicinity of the bonding portion between the bump 3 and the electrode of the semiconductor element 1 is considered. It is conceivable that stress concentrates on the surface of the semiconductor element 1 and damages the circuit formation surface of the semiconductor element 1.
Further, in the case of storing in the above-mentioned cavity, the shape of the package becomes special and a step of covering the lid is required. Therefore, in either case, it is difficult to stabilize the product quality, reduce the mounting cost, and improve the production tact. The present invention has been made to solve the above problems, and an electronic component assembling method capable of stabilizing the product quality and reducing the mounting cost including the improvement of the production tact, and the assembling method. An object is to provide an electronic component assembled by the method.

[0005]

According to a first aspect of the present invention, there is provided an electronic component assembling method, which covers a protruding electrode formed on a circuit forming surface of a semiconductor element having a circuit forming portion and covers the circuit forming surface with a sealing material. Is provided, the sealing material is removed until the protruding electrodes are exposed to the sealing material while the circuit forming portion is protected.

Further, after removing the encapsulating material, a conductive material that is electrically connected to the protruding electrode may be provided on the exposed surface of the protruding electrode exposed on the encapsulating material.

Before the sealing material is provided, a protective material may be provided to contact the circuit forming portion to cover and protect the circuit forming portion.

The electronic component assembling method according to the second aspect of the present invention is
After providing a protective material on the circuit formation surface on which the circuit formation portion of the semiconductor element is formed so as to contact the circuit formation portion to cover and protect the circuit formation portion, a sealing member for sealing the protection material may be provided. Characterize.

In the assembly method of the second aspect, it is possible to form the protruding electrodes on the circuit forming surface after providing the sealing member.

In the assembling methods of the first aspect and the second aspect, the semiconductor element may be mounted on a mounting board electrically connected to the protruding electrode.

In the assembly method of the first aspect, the circuit forming portion is formed in a grid pattern on a semiconductor wafer, and after the encapsulating material is removed, the circuit forming portion is cut into each circuit forming portion and electrically connected to the protruding electrodes. You may make it mount on the mounting board connected to.

In the assembling method according to the second aspect, the circuit forming portions are formed in a grid pattern on a semiconductor wafer, and after the protruding electrodes are formed on the circuit forming surface, the circuit forming portions are cut into each circuit forming portion and mounted. It may be mounted on a substrate.

An electronic component according to a third aspect of the present invention is characterized in that it is assembled by the electronic component assembling method according to the first and second aspects.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION An electronic component assembling method according to an embodiment of the present invention and an electronic component assembled by the assembling method will be described below with reference to the drawings. In each figure, the same components are designated by the same reference numerals. First Embodiment: A first embodiment of the electronic component assembling method will be described. First, as shown in FIG. 6, in this embodiment, the capillary 20 of the stud bump bonding apparatus is used.
No. 1 metal wire 202 such as a gold wire protruding through the first wire passage 201a is melted by electric discharge,
a is formed. The circuit forming surface 1 of the semiconductor element 111
The metal ball 202a is pressed against the electrode provided in the circuit forming portion 113 formed on the electrode 11a, and ultrasonic vibration is applied to bond the metal ball 202a to the electrode. After the joining, the capillary 201 is moved up, and the capillary 201 is laterally moved, moved down, and moved up to break the metal wire 202 connected to the metal ball 202a, and as shown in FIG. Bumps 112 corresponding to the protruding electrodes are formed on the electrodes. The material of the bump 112 is not limited to gold, but may be solder. The semiconductor element 111 includes a circuit formed on a substrate such as Si semiconductor, compound semiconductor, ceramic, resin, or glass.

In the next step, as shown in FIG. 8, the circuit forming surface 1 of the semiconductor element 111 on which the bumps 112 are formed is formed.
The encapsulant 1 made of an insulating resin in this embodiment is provided on the surface 11a.
14 is supplied, and the circuit forming surface 111a is sealed with a sealing material 114 so as to cover the bumps 112. Specifically, as shown in the figure, the sealing material 114 is supplied from the nozzle 116 of the coating machine 115, and the circuit forming surface 111a and the bumps 11 are formed.
2 and the entire thickness of the encapsulant 114 is bump 112.
Is greater than the height of, for example, twice the bump height,
Alternatively, the bump height + the set value can be set. The encapsulant 114 is a glass-based, acrylic-based, epoxy-based, or polyimide-based resin, and is thermosetting, thermoplastic, and photocurable. After the supply, the sealing material 114 is hardened.

By supplying the encapsulating material 114 by the coating method as described above, the circuit forming surface 111a can be protected, and after the application, the hardened encapsulating material 114 is polished to expose the exposed surface of the bump 112. Can be smoothed. Although the sealing material 114 is supplied by the coating method as described above in the present embodiment, it may be supplied by a printing method, spin coating, or a transfer method. In addition, in general, when supplying a sealing material having a high viscosity, the printing method is preferable because the construction time can be shortened. On the other hand, when a sealing material having a low viscosity is supplied, the spin coating method is preferable in order to stabilize the film thickness.

In the next step, as shown in FIG. 1, with the circuit forming surface 111a of the semiconductor element 111 protected by the encapsulant 114, the encapsulant 114 is exposed until the bumps 112 are exposed to the encapsulant 114. And the bump 112 is removed. In this embodiment, the sealing material 114 and the bumps 1 are formed by using the grinding tool 206 driven by the driving unit 205 as shown in the figure.
Grind 12 Depending on the material of the sealing material 114, the sealing material 1
The pressing force of the grinding tool 206 against 14, the number of revolutions, and the cutting depth are adjusted. The method for removing the encapsulating material 114 and the bumps 112 is not limited to the above grinding, but may be removed by polishing. According to the above grinding and polishing operation, the surface of the sealing material 114 after removal and the exposed surface 112a of the bump 112 can be made flush. Further, the periphery of the bump 112 can be surrounded by the sealing material 114,
When the electrodes on the mounting board and the bumps 112 are joined, the bumps 11
It is also possible to disperse the force acting on 2 to the sealing material 114. Further, according to the above grinding, the thickness of the completed electronic component can be made uniform. Further, in the case of the above-mentioned polishing, when the above-mentioned steps are performed on the wafer-shaped substrate, it is possible to collectively process, so that the cost can be reduced.

The bump 112 ground by the grinding tool 206 has the largest cross-sectional area of the bump 112, that is, the largest exposed surface 112a of the bump 112 exposed from the encapsulant 114. Height is preferred. Specifically, as shown in FIG. 10, in the shape of the bump 112, the bump 11 that generally has the maximum circumference is used.
It is preferable that the height of the second pedestal portion 112b is half the height h from the circuit forming surface 111a. In this way, as shown in FIG. 9, the electronic component 161 in which the circuit forming portion 113 of the semiconductor element 111 is covered with the encapsulant 114 in a state where a part of the bump 112 of the semiconductor element 111 is exposed.
Is formed. As an example of the electronic component 161, an LED
(Light emitting diode). In addition, as described above,
The method in which the sealing material 114 directly contacts the circuit forming portion 113 cannot be applied to the SAW filter.

As described above, according to the electronic component assembling method of the present embodiment and the electronic component assembled by the assembling method, the bump 112 is exposed while the circuit forming portion 113 is covered with the sealing material 114. Therefore, even when the bumps 112 are bonded to the electrodes on the mounting substrate while applying ultrasonic vibration, for example, the bumps 112 and the semiconductor element 1
The stress is not concentrated in the vicinity of the junction with the electrode 11 and the circuit forming portion 113 is not damaged.
Therefore, product quality can be stabilized.

The electronic component 161 manufactured as described above
As shown in FIG. 2, the board electrode 18 of the mounting board 180 is
1, the exposed surfaces of the bumps 112 are arranged so as to face each other via solder, a conductive paste, or a conductive sheet, and the substrate electrodes 181 and the bumps 112 are electrically and mechanically bonded to each other. The component-mounted board 101 is manufactured. As described above, according to the electronic component-mounted board 101, the board electrodes 181 and the bumps 112 are connected by solder or the like while the circuit forming portion 113 is protected by the sealing material 114. The product quality can be stabilized without damaging 113. Further, unlike the conventional case, a specially shaped package is not necessary and a step of covering the lid is not necessary. Therefore, it is possible to reduce the mounting cost including the improvement of the production tact.

As shown in FIGS. 6 to 9, in the above description, the operations of forming the bumps 112, supplying the sealing material 114, and exposing the bumps 112 are performed on one semiconductor element 111. As shown in FIGS. 11 and 12, each circuit forming portion 1 formed in a grid pattern on the semiconductor wafer 170.
The above operations may be performed for 13. Then, thereafter, the semiconductor wafer 170 corresponding to each circuit forming unit 113 is formed.
May be diced into individual electronic components 161. By performing processing in the wafer state in this manner, a plurality of electronic components 161 can be produced at one time, and handling becomes easier than in the case where processing is performed on individual semiconductor elements 111.

Second Embodiment: In the above-mentioned first embodiment,
As shown in FIG. 2, the bumps 11 exposed on the sealing material 114
2 of the exposed surface 112a and the substrate electrode 18 of the mounting substrate 180.
1 and 1 are connected via a conductive paste or the like. On the other hand, like the electronic component mounted substrate 102 shown in FIG. 3, after the bump 112 is exposed to the encapsulant 114 and before being mounted on the mounting substrate 180, a metal film 117 that contacts at least the exposed surface 112a is formed. To do. The metal film 117 corresponds to an example of a conductive material and is made of copper or gold, for example. The method of forming the metal film 117 is the same in the case of the wafer state described below.

When processing is performed in a wafer state, FIG.
As shown in FIG. 1, the sealing material 1 in which the exposed surface 112a is exposed
A metal film 117 is formed on all the surfaces 114a of 14 by sputtering, vapor deposition, or plating. After that, FIG.
As shown in, a patterning resist is applied so that the bumps 112 that require electrical connection are made conductive, and after patterning, unnecessary portions of the metal film 117 are removed by dry etching or wet etching. Next, electrodes are formed on the patterned metal film 117 by supplying solder by, for example, a printing method and reflowing. And
The semiconductor wafer 170 is diced so as to correspond to each circuit forming portion 113, and is cut into each electronic component.

In any of the method of manufacturing with individual semiconductor elements 111 and the method of manufacturing by separating from the wafer state, the manufactured electronic component 162 includes the solder on the metal film 117 and the substrate electrode 181. Are placed on the mounting substrate 180 so as to face each other, and the solder on the metal film 117 is melted by reflow to electrically connect the electronic component 162 and the mounting substrate 180, and the electronic component 162 is mounted on the mounting substrate 180.

Before forming the metal film 117, in order to improve the adhesion of the metal film 117 to the exposed surface 112a and the sealing material 114, argon plasma is applied to the surface of the exposed surface 112a and the sealing material 114, or It is preferable to perform the above-mentioned sputtering, vapor deposition, or plating after chemical polishing with ammonium sulfite or the like. According to the second embodiment having the steps described above, it is possible to obtain the same effect as in the case of the above-described first embodiment, and further, compared with the above-described first embodiment, the electrode on the polishing surface is provided. It is possible to realize a highly reliable structure in which the adhesiveness is improved and peeling is difficult with respect to mechanical external stress.

Third Embodiment: The above first and second embodiments are modes in which the circuit forming portion 113 is protected only by the sealing material 114. In the third embodiment,
A dedicated protective material is provided for the circuit forming portion 113, and the sealing material 114 is used to seal the protective material. This will be described in detail below with reference to FIGS. 4 and 15 to 17. In the following description, the case where the wafer is processed is taken as an example, but it goes without saying that the processing may be carried out for each individual semiconductor element 111.

As described in the first and second embodiments, after forming the bumps 112 on the circuit forming portion 113 of the semiconductor wafer 170, as shown in FIG. 15, a size that covers the entire circuit forming portion 113. In the present embodiment, the protective material 131 made of acrylic resin is added to the circuit forming portion 113.
The circuit forming portion 113 is protected by being placed on and closely contacted with. or,
Epoxy resin can be used in addition to acrylic resin.
After that, as in the case of the above-described first and second embodiments, the circuit of the semiconductor wafer 170 is covered so as to cover the bumps 112, and in the present embodiment, the protective material 131, as shown in FIG. The sealing material 114 is formed on the formation surface 111a.
Then, as shown in FIG. 17, the encapsulating material 114 is removed so that a part of the bump 112 is exposed from the encapsulating material 114. In addition, in this way, the sealing material 114 and the bumps 11 are formed.
Since the step of removing a part of 2 is included, there is a possibility that the protective material 131 interferes with the removing operation to cause damage to the circuit forming portion 113. In addition, as described above, the bump 112 may be removed up to the height of h / 2, so that the circuit forming surface 111a of the protective material 131 may be removed.
The height from is less than the above-mentioned h / 2.

In the next step, the semiconductor wafer 170 is diced into individual electronic components 163 corresponding to each circuit forming portion 113. Then, as shown in FIG. 4, the divided electronic component 163 is opposed to the mounting substrate 180, and the substrate electrode 181 and the bump 112 are electrically and mechanically connected via solder, a conductive paste, a conductive sheet, or the like. To join. This completes the electronic component-mounted board 103.

As described above, according to the third embodiment, it is possible to obtain the same effect as that of each of the above-described embodiments. Further, in the third embodiment, the sealing material 114 is provided so as to cover the protective material 131, so that the circuit forming portion 113 can be protected with higher reliability than in the first embodiment described above. . In the above description, the protective material 131 is
Although the size of the circuit forming portion 113 is entirely covered, the size of the circuit forming portion 113 may be partially covered.

Fourth Embodiment: In the above-described third embodiment,
After the protective material 131 was provided in contact with the circuit forming portion 113, the entire surface of the circuit forming surface 111a was sealed with the sealing material 114. On the other hand, in the fourth embodiment, after the protective material 131 is provided on the circuit forming portion 113, only the protective material 131 is covered with the sealing member 132. 5 and 1
This will be described in detail below with reference to FIGS. In the following description, the case where the processing is performed for each individual semiconductor element 111 is taken as an example, but it goes without saying that the processing may be performed in a wafer state and divided into individual electronic components by dicing.

As shown in FIGS. 18 and 19, the bumps 112 are formed on a part of the circuit forming surface 111a of the semiconductor element 111, and the protective material 131 is formed on the circuit forming portion 113 as in the third embodiment. To provide. Further, in the next step, the sealing member 132, which has a shape corresponding to the protective material 131 and accommodates the protective material 131, and which is made of a silicon-based glass member, surrounds the protective material 131. The protective material 131 is sealed by being provided and fixed on the formation surface 111a. Further, as the material of the sealing member 132, an epoxy-based material or an acrylic-based material can be used.
Further, although the protective material 131 and the sealing member 132 are illustrated as not in contact with each other, the protective material 131 and the sealing member 132 are in close contact with each other. In this way, the electronic component 164 is completed. Then, as shown in FIG. 20, the electronic component 164 is opposed to the mounting board 180, and the board electrode 1 of the mounting board 180 is mounted.
81 and the bumps 112 of the electronic component 164 are electrically and mechanically joined via solder, a conductive paste, a conductive sheet, or the like. This completes the electronic component mounted substrate 103 as shown in FIG.

In the above description, the bump 112 is formed on the circuit forming surface 111a of the semiconductor element 111.
As shown in FIG. 1, by forming the bumps 112 on the substrate electrodes 181 of the mounting substrate 180, the formation of the bumps 112 on the electronic component 164 side can be omitted. Also, the bump 11
2 regardless of the installation location, as shown in FIG.
In order to securely mount the mounting member 180 on the mounting board 180, the sealing member 132 may be mounted during mounting and after completion of mounting.
Must not interfere with the mounting substrate 180. Therefore, the height of the sealing member 132 from the circuit forming surface 111a is determined by the height of the circuit forming surface 111a and the mounting substrate 18 after the mounting is completed.
It must be smaller than the gap 169 of the substrate surface 180a of 0.

Regardless of where the bumps 112 are installed, either the forming operation of the bumps 112 or the attaching operation of the sealing member 132 may be performed first, but as described above, the height of the sealing member 132 is increased. Considering that the height of the bump 112 can be controlled relatively easily in the forming operation of the bump 112, it is better to form the bump 112 after the sealing member 132 is installed. preferable.

As described above, according to the present fourth embodiment, it is possible to obtain the same effects as those of the above-described embodiments. Further, according to the fourth embodiment, the bump 112 can be formed after the sealing member 132 is installed, so that the bump shape can be controlled more easily than in the above-described third embodiment. Further, since the protected portion and the bump 112 are separated, the stress due to heat is not concentrated on the protected portion, and the reliability of the component is improved.

In the fourth embodiment, the circuit forming section 1
Although 13 is covered with the protective material 131, the installation of the protective material 131 can be omitted. That is, the circuit forming portion 113 may be protected by only sealing the circuit forming portion 113 with the sealing member 132.

Further, in each of the above-described embodiments, the method of mounting the electronic component on the mounting substrate 180 has been described by taking the flip chip method as an example, but the electronic component is fixed to the mounting substrate 180 by die bonding and wire bonding is performed. Electrical connection may be achieved by the method.

[0037]

As described above in detail, according to the electronic component assembling method of the first aspect and the electronic component of the third aspect of the present invention,
After the circuit forming portion is covered with the sealing material, the sealing material is removed until the protruding electrodes are exposed on the sealing material, so that the protruding electrodes can be formed while applying, for example, ultrasonic vibration to the electrodes on the mounting substrate. Even in the case of joining, stress is not concentrated near the joining portion between the protruding electrode and the semiconductor element. Therefore, it is possible to stabilize the product quality without damaging the circuit forming portion. Further, unlike the conventional case, a specially shaped package is not required, and a step of covering the lid is not necessary. Therefore, it is possible to reduce the mounting cost including the improvement of the production tact.

By providing a protective material on the circuit forming portion before covering with the encapsulating material, damage to the circuit forming portion can be further prevented, and product quality can be stabilized.

Further, according to the electronic component assembling method of the second aspect of the present invention and the electronic component of the third aspect, mounting is performed by providing a protective material on the circuit forming portion and further covering the protective material with a sealing material. Even when the protruding electrode is bonded to the electrode on the substrate while applying ultrasonic vibration, for example, stress is not concentrated near the bonding portion between the protruding electrode and the semiconductor element. Therefore,
The product quality can be stabilized without damaging the circuit forming portion. Further, unlike the conventional case, a specially shaped package is not required, and a step of covering the lid is not necessary. Therefore, it is possible to reduce the mounting cost including the improvement of the production tact.

[Brief description of drawings]

FIG. 1 is a diagram showing a step in an electronic component assembling method according to a first embodiment of the present invention, showing a state in which a sealing material is removed.

FIG. 2 is a diagram showing a state in which the electronic component assembled by the electronic component assembling method according to the first embodiment of the present invention is mounted on a mounting board.

FIG. 3 is a diagram showing a state in which an electronic component assembled by an electronic component assembling method according to a second embodiment of the present invention is mounted on a mounting board.

FIG. 4 is a diagram showing a state in which an electronic component assembled by an electronic component assembling method according to a third embodiment of the present invention is mounted on a mounting board.

FIG. 5 is a diagram showing a state in which an electronic component assembled by an electronic component assembling method according to a fourth embodiment of the present invention is mounted on a mounting board.

FIG. 6 is a diagram showing a step in an electronic component assembling method according to each embodiment of the present invention, and is a diagram illustrating a state in which bumps are formed on a semiconductor element.

FIG. 7 is a diagram showing a state in which bumps are formed on a semiconductor element.

FIG. 8 is a diagram showing a step in an electronic component assembling method according to the first to third embodiments of the present invention, and is a diagram showing a state in which a bump is covered and a sealing material is supplied.

FIG. 9 is a diagram showing a step in an electronic component assembling method according to the first to third embodiments of the present invention, and is a diagram showing a state in which the sealing material is removed until a part of the bump is exposed.

FIG. 10 is a diagram for explaining the removal amount when the sealing material is removed from the height of the bump as shown in FIG.

FIG. 11 is a diagram showing a case where the electronic component assembling method according to the first to third embodiments of the present invention is performed on a wafer, and a state in which the sealing material is removed until a part of the bump is exposed. Is.

FIG. 12 is a diagram showing a state in which the wafer shown in FIG. 11 is cut into pieces.

FIG. 13 is a diagram showing a step in the electronic component assembling method according to the second embodiment of the present invention, showing a state in which a metal film is formed on the sealing material.

FIG. 14 is a diagram showing a state where a part of the metal film shown in FIG. 13 is removed by etching.

FIG. 15 is a diagram showing a step in the electronic component assembling method according to the third embodiment of the present invention, showing a state in which a protective material is installed in the circuit forming portion.

16 is a diagram showing a state in which a sealing material is supplied onto the wafer shown in FIG.

17 is a diagram showing a state in which the sealing material shown in FIG. 16 is removed.

FIG. 18 is a side view including a partial cross section of an electronic component assembled by the electronic component assembling method according to the fourth embodiment of the present invention.

FIG. 19 is a plan view of the electronic component shown in FIG.

FIG. 20 is a diagram showing a state where the electronic component shown in FIGS. 18 and 19 is mounted on a mounting board.

FIG. 21 is a diagram showing a state in which a modified example of the electronic component shown in FIGS. 18 and 19 is mounted on a mounting substrate having bumps formed thereon.

FIG. 22 is a diagram showing a board on which electronic components are mounted, which is assembled by flip-chip mounting in a conventional electronic component assembling method.

FIG. 23 is a diagram showing an electronic component-mounted board assembled by a conventional electronic component assembling method, showing an electronic component-mounted board when an electronic component is flip-chip mounted in a package.

FIG. 24 is a diagram showing an electronic component-mounted board assembled by a conventional electronic component assembling method, showing an electronic component-mounted board when an electronic component is wire-bonded and mounted in a package.

[Explanation of symbols]

111 ... Semiconductor element, 111a ... Circuit formation surface, 112 ...
Bumps, 112a ... exposed surface, 113 ... circuit forming part, 11
4 ... Sealing material, 117 ... Metal film, 131 ... Protective material, 132
... sealing member, 180 ... mounting substrate.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Kazuya Gokawa             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Kazuyuki Tomita             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5F061 AA01 BA07 CA10 CB13 FA06

Claims (9)

[Claims] 1. A semiconductor device (111) having a circuit forming portion (113) formed thereon, covering a protruding electrode (112) formed on a circuit forming surface (111a) of the semiconductor element (111).
After providing 14), the encapsulating material is removed until the protruding electrodes are exposed to the encapsulating material while the circuit forming portion is protected. 2. The conductive material (117), which is electrically connected to the protruding electrode, is provided on the exposed surface (112a) of the protruding electrode exposed on the sealing material after removing the sealing material. Electronic parts assembly method. 3. A protective material (13) for contacting and covering the circuit forming portion before providing the encapsulating material so as to cover and protect the circuit forming portion.
The electronic component assembling method according to claim 1 or 2, wherein 1) is provided. 4. A circuit forming portion (1) of a semiconductor element (111)
A protective member (131) is provided on the circuit forming surface (111a) on which the circuit forming portion (13a) is formed to come into contact with the circuit forming portion to cover and protect the circuit forming portion, and then a sealing member (132) for sealing the protective material. ) Is provided, an electronic component assembling method. 5. The method of assembling an electronic component according to claim 4, wherein after the sealing member is provided, a protruding electrode (112) is formed on the circuit formation surface. 6. The electronic component assembling method according to claim 1, wherein the semiconductor element is mounted on a mounting substrate (180) electrically connected to the protruding electrode. 7. The mounting substrate (wherein the circuit forming portion is formed in a grid pattern on a semiconductor wafer, is cut into each circuit forming portion after the encapsulating material is removed, and is electrically connected to the protruding electrode ( 180) The electronic component assembling method according to claim 1, which is mounted on. 8. The circuit forming portion is formed in a grid pattern on a semiconductor wafer, and after the protruding electrodes are formed on the circuit forming surface, the circuit forming portion is cut into each circuit forming portion and mounted on a mounting substrate. The electronic component assembling method according to claim 5. 9. An electronic component assembled by the electronic component assembling method according to any one of claims 1 to 8.