JP2000049176A - Production of semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a production method of inexpensive semiconductor package being mounted on a small portable apparatus excellent in reliability and productivity. SOLUTION: A collective package is formed by a step for forming a circuit board by arranging a plurality of a wiring pattern for mounting an IC chip and an electrode pattern for forming external connection electrodes on the surface of a collective circuit board 1A, a step for mounting an IC chip 6 on the wiring pattern, a step for resin sealing an IC chip 5, and a step for fixing solder balls to be fixed with external protruding electrodes and a single complete semiconductor package is formed by a first holding step for securing the external protruding electrodes of the collective package to a first reference member 8b, a step for cutting the collective package thus held along a cut line 2, a second holding step for securing the IC mounting face to a second reference member 8c, a step for peeling off the first reference member 8b, and a step for cleaning the collective package while pasting to the second reference member 8c.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method of manufacturing a semiconductor package, and more particularly to a method of manufacturing a semiconductor package having a projection electrode for external connection.

[0002]

2. Description of the Related Art In recent years, with the miniaturization and high density of semiconductor packages, flip chip bonding has been developed in which bare chips are directly mounted face down on a substrate. With the advent of camera-integrated VTRs and mobile phones, portable devices equipped with a small package having substantially the same dimensions as a bare chip, that is, a so-called CSP (chip size / scale package) are appearing one after another. Recently, CSP development has progressed rapidly, and the market demand has been in full swing.

First, an outline of a conventional method for manufacturing a semiconductor package of a CSP mounted on a small portable device or the like will be described below.

First, in a circuit board forming step of forming a large number of circuit boards shown in FIG.
After forming a through hole (not shown), a copper plating layer is formed by electroless copper plating and electrolytic copper plating, a plating resist is further laminated, a pattern mask is formed by exposure and development, and an etching solution is used. By performing pattern etching, a plurality of IC connection electrodes 3 arranged in a plurality are formed on the upper surface side of the collective circuit board 1A, and external connection electrodes 4 as pad electrodes are formed on the lower surface side. Next, a solder resist process is performed to form a resist film on a predetermined portion, so that a large number of solders of the same shape are formed in a matrix so that the external connection electrodes 4 are exposed on the lower surface side of the collective circuit board 1A. An integrated circuit board 1 for forming an opening of a resist film, which is a surface that can be attached, and taking a large number of pieces.
A is completed. 2 is a cut line orthogonal to the X and Y directions.

In the IC mounting step shown in FIG. 7B, first, an IC wafer is flowed to a bump step to form solder bumps 5 on pad electrode surfaces of the IC wafer. The method of forming the solder bump 5 generally includes a stud bump method, a ball bump method, a plating bump method, etc. Among them, a window is formed with a resist at a pad electrode position, and the window is immersed in a solder bath. The plating bump method of forming solder bumps by plating can form bumps in a narrow arrangement between pad electrodes, and is an effective means for forming solder bumps for miniaturizing IC chips.

After the solder bumps 5 are formed, the thickness of the wafer is cut in the X and Y directions by a full-cut method with a device such as a dicing saw while the IC wafer is adhered with an adhesive tape or the like. After that, the IC chip 6 is divided into single pieces.

A flux is applied to a predetermined position of the wiring pattern of the IC chip 6 with the solder bumps or the wiring pattern of the above-mentioned collective circuit board 1A, and the IC chips 6 divided into a single unit are arranged in plurals one by one. After being mounted at a predetermined position on each circuit board 1 of the circuit board 1A, flip-chip mounting is performed through a solder reflow process.

In the sealing step shown in FIG. 7C, the resin is integrally sealed by side potting with the thermosetting sealing resin 7 straddling the plurality of adjacent IC chips 5. By doing so, the IC chip 6 is fixed face down on the individual circuit boards 1 of the collective circuit board 1A.

In the ball attaching step shown in FIG. 7D, a solder ball is arranged at the position of the external connection electrode 4 formed on the lower surface side of the circuit board 1 and reflowed to form the ball electrode 9. .

In the reference member attaching step shown in FIG. 8E, the ball electrodes of the collective circuit board 1A on which the IC chip 6 is mounted and the ball electrodes are formed are fixed on the reference member 8a with an adhesive or an adhesive tape. Paste by means.

FIG. 8 (f) shows a tying step in which a single piece is cut and divided by a cutting means such as a dicing saw along the above-described cut line 2 in the X and Y directions, and then a reference member is formed with a solution or the like. 8a.

At this time, as shown in FIG. 6 (a), cutting dust during dicing adheres to the surface of the collective substrate 1A on the side of the reference member 8a and the surface of the solder ball 9.

When the reference member attaching step shown in FIG. 8E is fixed to the IC mounting surface of the collective circuit board 1A and the reference member 8a, as shown in FIG. Adhere to the mounting surface and the surface of the collective substrate 1A on the reference member 8a side.

FIG. 8 (g) shows a single-piece cleaning step in which the cutting chips adhered to the surface of the flip chip BGA 20 separated from the reference member 8a on the reference member 8a side are put into a basket, washed and dropped. Through the above steps, a single PBGA package 20 is completed.

[0015]

However, the above-described method for manufacturing a semiconductor package has the following problems. In other words, when removing the cutting residue attached to the package surface on the reference member side, a large number of packages are simultaneously placed in a basket and washed, so that during cleaning and drying, the packages come into contact with each other, damaging the package surface, and improving the appearance and reliability. There was a problem with gender. In addition, if the number of pieces to be put in the basket at the same time is reduced in order to reduce the contact of the package, there is a problem that productivity is low and cost is increased.

When the IC mounting method is implemented by flip chip mounting, chip edges are chipped as shown in FIG. 9, causing a serious problem in reliability.

The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide a method of manufacturing an inexpensive semiconductor package which is excellent in reliability and productivity and is mounted on a small portable device or the like. It is.

[0018]

In order to achieve the above object, a method of manufacturing a semiconductor package according to the present invention comprises forming an external connection electrode on one of surfaces of a circuit board having first and second surfaces. In the method of manufacturing a semiconductor package having an IC chip mounted on the other surface, a bonding pattern for mounting the IC chip and an electrode pattern for forming an electrode for external connection are arranged on the collective circuit board surface by a plurality of pieces. Circuit board forming step, and an IC for electrically connecting the bonding pattern and the IC chip
Forming an assembly forming a package assembly by a chip mounting step, a sealing step of forming a sealing portion by resin sealing the IC chip, and an electrode forming step of forming a protruding electrode on the external connection electrode And a first holding step of fixing the first surface side of the package assembly to a first reference member; and cutting a circuit board of the held package assembly to form a single semiconductor package. A cutting step, a second holding step of fixing the second surface side of the package assembly to a second reference member, and peeling the first reference member from the first surface side of the package assembly Separating the package assembly, cleaning the first surface side of the package assembly, and separating the single semiconductor package from the second reference member.

Further, the package assembly is characterized in that the first surface is a protruding electrode surface and the second surface is an IC chip mounting surface.

The first holding step is characterized in that the protruding electrode is fixed to the reference member with an adhesive.

Further, the package assembly is characterized in that the first surface is an IC chip mounting surface and the second surface is a protruding electrode surface.

Further, the first holding step is characterized in that the sealing portion is fixed to the reference member with an adhesive.

Further, the adhesive is an ultraviolet reactive resin.

Further, the second holding step is characterized in that the sealing portion is fixed to the reference member with an adhesive.

In the second holding step, the protruding electrode is fixed to the reference member with an adhesive.

The adhesive is a heat-reactive resin.

Further, the IC chip mounting step is a flip chip mounting step.

Further, the electrode forming step is a step of forming a protruding electrode using a member to be cleaned.

Further, the projection electrode is a solder bump.

Further, the cutting step is performed by cutting with a dicing saw.

[0031]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a semiconductor package according to the present invention will be described below with reference to the drawings. FIG.
FIG. 3 to FIG. 3 are explanatory views showing a manufacturing process of a semiconductor package having a bump electrode according to an embodiment of the present invention. 4 and 5
Is another embodiment of the present invention. The same members as those in the prior art are denoted by the same reference numerals.

First, a circuit board forming step shown in FIG. 1A, an IC mounting step shown in FIG. 1B, a resin sealing step shown in FIG.
The ball attaching step shown in FIG.
(A) to (d), and the description is omitted.

The first reference member attaching step of FIG. 2 (e) and the dicing step of FIG. 2 (f) are the same as those shown in FIGS. 8 (e) and 8 (f) of the above-mentioned prior art. Is omitted.

In the second reference member attaching step shown in FIG. 2 (g), in a state where the integrated circuit board 1A is cut and divided on the first reference member, the IC chip mounting surface is moved to the second reference member. It is stuck on the reference member 8c with an adhesive.

In the first reference member peeling step shown in FIG. 3D, the adhesive used in the first reference member attaching step shown in FIG. 2E, for example, an ultraviolet release tape "D638" manufactured by Lintec Corporation. Of the first reference member 8b and the external part of the integrated circuit board 1A are separated from the second reference member and the product part.

In the cleaning step shown in FIG.
The cutting dust generated in the dicing step (f) and adhered to the lower surface side and the solder ball surface of the collective circuit board 1A is
While the PBGA package 10 is stuck to the second reference member, it is washed and dropped.

Thereafter, the PBGA package 10 is peeled off from the second reference member 8c. By the above process, a single PB
The GA package is completed.

FIGS. 4 and 5 show another embodiment of the present invention.

In the first reference member attaching step of FIG. 4A, the integrated circuit board 1 on which the IC chip 6 completed by the ball attaching step of FIG.
The IC mounting surface of A is attached to the first reference member 8b with an adhesive.

In the tying step shown in FIG. 4B, a single cutting is performed by a cutting means such as a dicing saw along the cut line 2 in the X and Y directions. At this time, unnecessary portions around the collective circuit board 1A are removed.

In the step of attaching the second reference member shown in FIG. 4C, the assembly circuit board 1A is mounted on the first reference member 8b.
The solder ball 9 is stuck on the second reference member 8c with an adhesive in a state of being cut and divided into single pieces.

In the first reference member peeling step shown in FIG. 5D, the first reference member 8b is formed in the same manner as in the step of FIG. 3D.
From the second reference member 8c and the product part.

In the cleaning step shown in FIG.
(B) generated in the dicing step,
The cutting dust adhering to the upper surface side and the sealing surface of A is washed and dropped while the PBGA package 10 is adhered to the second reference member.

Thereafter, the PBGA package 10 is peeled off from the second reference member 8c. By the above process, a single PB
The GA package is completed.

[0045]

As described above, according to the semiconductor package manufacturing method of the present invention, a plurality of IC chips are arranged on the circuit board by arranging a plurality of IC chips on the upper surface side of the collective circuit board.
Side-molding with a sealing resin, forming protruding electrodes on the external connection electrodes on the lower surface side, fixing the solder balls to the first reference member, cutting the collective circuit board into single pieces, By fixing to the second reference member, peeling the first reference member, cleaning the lower surface side, and peeling the second reference member to manufacture a single semiconductor package, the reliability of mounting on a small portable device and the like is improved. It is possible to provide a method for manufacturing a semiconductor package having excellent productivity.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a circuit board forming step, an IC mounting step, a resin sealing step, and a ball attaching step in a manufacturing process of a semiconductor package according to an embodiment of the present invention.

FIG. 2 is an explanatory view showing a first reference member attaching step, a dicing step, and a second reference member attaching step after the manufacturing step of FIG. 1;

FIG. 3 is an explanatory view showing a first reference member peeling step and a cleaning step after the manufacturing step of FIG. 2;

FIG. 4 is an explanatory view showing a first reference member attaching step, a dicing step, and a second reference member attaching step in a semiconductor package manufacturing step according to another embodiment of the present invention.

FIG. 5 is an explanatory view showing a first reference member peeling step and a cleaning step after the manufacturing step of FIG. 2;

FIG. 6 is an explanatory view showing adhesion of cutting dust after a dicing step, which is a problem in a BGA manufacturing process.

FIG. 7 is an explanatory view showing a circuit board forming step, an IC mounting step, a resin sealing step, and a ball attaching step in a conventional BGA manufacturing process.

FIG. 8 is an explanatory view showing a reference member attaching step, a dicing step, and a single-piece cleaning step after the manufacturing step of FIG. 7 in a conventional BGA manufacturing step.

FIG. 9 is an explanatory diagram showing an IC chip occurring in a conventional flip chip BGA manufacturing process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 1A Collective circuit board 2 Cut line 3 IC connection electrode 4 External connection electrode 5 Solder ball 6 IC chip 7 Sealing resin 8a Reference member 8b First reference member 8c Second reference member 9 Ball electrode (projection electrode) 10 PBGA package 11 Cutting dust 12 IC chip

Claims (13)

[Claims] An external connection electrode is formed on one surface of a circuit board having first and second surfaces, and an I / O electrode is formed on the other surface.
In a method of manufacturing a semiconductor package having a C chip mounted thereon, a circuit board is formed by arranging a plurality of bonding patterns for mounting the IC chip and electrode patterns for forming electrodes for external connection on a surface of a collective circuit board. An IC chip mounting step of electrically connecting the bonding pattern to the IC chip; a sealing step of sealing the IC chip with a resin to form a sealing portion; An assembly forming step of forming a package assembly by an electrode forming step of forming a package, a first holding step of fixing the first surface side of the package assembly to a first reference member, and a held package A cutting step of cutting the circuit board of the assembly to form a single semiconductor package;
A second holding step of fixing the first reference member to the reference member, a separating step of separating the first reference member from the first surface side of the package assembly, and cleaning the first surface side of the package assembly. And a separating step of removing the single semiconductor package from the second reference member. 2. The method of manufacturing a semiconductor package according to claim 1, wherein the first surface of the package assembly is a protruding electrode surface, and the second surface is an IC chip mounting surface. 3. The method according to claim 1, wherein in the first holding step, the protruding electrode is fixed to the reference member with an adhesive. 4. The package assembly according to claim 1, wherein the first surface is I-shaped.
2. The method according to claim 1, wherein the mounting surface is a C-chip mounting surface, and the second surface is a protruding electrode surface. 5. The method according to claim 1, wherein in the first holding step, the sealing portion is fixed to the reference member with an adhesive. 6. The method according to claim 3, wherein the adhesive is an ultraviolet-reactive resin. 7. The method for manufacturing a semiconductor package according to claim 1, wherein in the second holding step, the sealing portion is fixed to the reference member with an adhesive. 8. The method according to claim 1, wherein in the second holding step, the protruding electrode is fixed to the reference member with an adhesive. 9. The method according to claim 7, wherein the adhesive is a heat-reactive resin. 10. The IC chip mounting step is a flip chip mounting step.
The manufacturing method of the semiconductor package described in the above. 11. The method according to claim 1, wherein the step of forming an electrode is a step of forming a protruding electrode using a member to be cleaned.
11. The method for manufacturing a semiconductor package according to items 10 to 10. 12. The method according to claim 11, wherein the protruding electrodes are solder bumps. 13. The method of manufacturing a semiconductor package according to claim 1, wherein said cutting step is performed by cutting with a dicing saw.