JP2003173989A5 - - Google Patents

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Publication number
JP2003173989A5
JP2003173989A5 JP2001370759A JP2001370759A JP2003173989A5 JP 2003173989 A5 JP2003173989 A5 JP 2003173989A5 JP 2001370759 A JP2001370759 A JP 2001370759A JP 2001370759 A JP2001370759 A JP 2001370759A JP 2003173989 A5 JP2003173989 A5 JP 2003173989A5
Authority
JP
Japan
Prior art keywords
tape
registered trademark
series
adwill
particularly limited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001370759A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003173989A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001370759A priority Critical patent/JP2003173989A/ja
Priority claimed from JP2001370759A external-priority patent/JP2003173989A/ja
Priority to PCT/JP2002/005407 priority patent/WO2003014242A1/ja
Priority to EP02730861A priority patent/EP1413615A4/en
Priority to TW091111919A priority patent/TWI299353B/zh
Priority to US10/485,462 priority patent/US20040248382A1/en
Priority to CNB028151534A priority patent/CN100336880C/zh
Priority to KR1020047001671A priority patent/KR100878971B1/ko
Publication of JP2003173989A publication Critical patent/JP2003173989A/ja
Priority to NO20040276A priority patent/NO20040276L/no
Publication of JP2003173989A5 publication Critical patent/JP2003173989A5/ja
Withdrawn legal-status Critical Current

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JP2001370759A 2001-08-03 2001-12-04 Ｉｃチップの製造方法 Withdrawn JP2003173989A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2001370759A JP2003173989A (ja) 2001-12-04 2001-12-04 Ｉｃチップの製造方法
KR1020047001671A KR100878971B1 (ko) 2001-08-03 2002-06-03 양면 점착 테이프 및 이를 이용한 ｉｃ 칩의 제조 방법
US10/485,462 US20040248382A1 (en) 2001-08-03 2002-06-03 Pressure sensitive adhesive double coated tape and method for producing ic chip using it
EP02730861A EP1413615A4 (en) 2001-08-03 2002-06-03 DOUBLE ADHESIVE COATED STRIP AND INTEGRATED CIRCUIT CHIP PRODUCTION METHOD USING THE STRIP
TW091111919A TWI299353B (en) 2001-08-03 2002-06-03 Pressure sensitive adhesive double coated tape and method for producing ic chip using it
PCT/JP2002/005407 WO2003014242A1 (fr) 2001-08-03 2002-06-03 Bande recouverte d'un double adhesif et procede de fabrication de puce pour circuit integre utilisant cette bande
CNB028151534A CN100336880C (zh) 2001-08-03 2002-06-03 两面胶以及使用它的ic芯片的制造方法
NO20040276A NO20040276L (no) 2001-08-03 2004-01-21 Dobbeltsidig trykkfolsom adhesivtap og fremgangsmate for tilvirkning av IC-brikke som bruker denne

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001370759A JP2003173989A (ja) 2001-12-04 2001-12-04 Ｉｃチップの製造方法

Publications (2)

Publication Number Publication Date
JP2003173989A JP2003173989A (ja) 2003-06-20
JP2003173989A5 true JP2003173989A5 (enrdf_load_stackoverflow) 2004-12-24

Family

ID=19179930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001370759A Withdrawn JP2003173989A (ja) 2001-08-03 2001-12-04 Ｉｃチップの製造方法

Country Status (1)

Country Link
JP (1) JP2003173989A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4381860B2 (ja) * 2004-03-24 2009-12-09 日東電工株式会社 補強半導体ウエハに固定された補強板の分離方法およびその装置
JP4528668B2 (ja) * 2005-05-17 2010-08-18 Ｏｋｉセミコンダクタ株式会社 半導体装置の製造方法
SG11201402832QA (en) 2011-12-14 2014-10-30 Mitsui Chemicals Tohcello Inc Adhesive resin composition, laminate, and self-stripping method
WO2014192631A1 (ja) 2013-05-31 2014-12-04 三井化学東セロ株式会社 電子部材の剥離方法および積層体
CN109545652A (zh) * 2017-09-21 2019-03-29 达迈科技股份有限公司 用于柔性显示器的透明聚酰亚胺复合膜及其制造方法

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