JP2003171616A5 - - Google Patents

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Publication number
JP2003171616A5
JP2003171616A5 JP2001370441A JP2001370441A JP2003171616A5 JP 2003171616 A5 JP2003171616 A5 JP 2003171616A5 JP 2001370441 A JP2001370441 A JP 2001370441A JP 2001370441 A JP2001370441 A JP 2001370441A JP 2003171616 A5 JP2003171616 A5 JP 2003171616A5
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JP
Japan
Prior art keywords
atom
silica
component
composition
forming
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Application number
JP2001370441A
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English (en)
Japanese (ja)
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JP3702842B2 (ja
JP2003171616A (ja
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Priority to JP2001370441A priority Critical patent/JP3702842B2/ja
Priority claimed from JP2001370441A external-priority patent/JP3702842B2/ja
Publication of JP2003171616A publication Critical patent/JP2003171616A/ja
Publication of JP2003171616A5 publication Critical patent/JP2003171616A5/ja
Application granted granted Critical
Publication of JP3702842B2 publication Critical patent/JP3702842B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001370441A 2001-12-04 2001-12-04 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品 Expired - Fee Related JP3702842B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001370441A JP3702842B2 (ja) 2001-12-04 2001-12-04 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001370441A JP3702842B2 (ja) 2001-12-04 2001-12-04 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2004260262A Division JP2005042118A (ja) 2004-09-07 2004-09-07 シリカ系被膜形成用組成物、シリカ系被膜の製造方法及び電子部品
JP2004316467A Division JP2005105284A (ja) 2004-10-29 2004-10-29 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品
JP2004316470A Division JP2005072615A (ja) 2004-10-29 2004-10-29 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品

Publications (3)

Publication Number Publication Date
JP2003171616A JP2003171616A (ja) 2003-06-20
JP2003171616A5 true JP2003171616A5 (enrdf_load_stackoverflow) 2005-07-07
JP3702842B2 JP3702842B2 (ja) 2005-10-05

Family

ID=19179665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001370441A Expired - Fee Related JP3702842B2 (ja) 2001-12-04 2001-12-04 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品

Country Status (1)

Country Link
JP (1) JP3702842B2 (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7687590B2 (en) 2002-02-27 2010-03-30 Hitachi Chemical Company, Ltd. Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
US7682701B2 (en) 2002-02-27 2010-03-23 Hitachi Chemical Co., Ltd. Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
CN100491486C (zh) 2002-02-27 2009-05-27 日立化成工业株式会社 二氧化硅涂膜形成用组合物、二氧化硅涂膜及其制造方法、以及电子部件
JP2004277502A (ja) * 2003-03-13 2004-10-07 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法並びにシリカ系被膜を備える電子部品
JP2005314616A (ja) * 2004-04-30 2005-11-10 Shin Etsu Chem Co Ltd シリコーンコーティング組成物及び被覆物品
TW200605220A (en) * 2004-06-21 2006-02-01 Hitachi Chemical Co Ltd Organic siloxane film, semiconductor device using same, flat panel display and raw material liquid
US20060047034A1 (en) 2004-09-02 2006-03-02 Haruaki Sakurai Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film
JP4756128B2 (ja) 2004-10-20 2011-08-24 日揮触媒化成株式会社 半導体加工用保護膜形成用塗布液、その調製方法およびこれより得られる半導体加工用保護膜
JP2006213908A (ja) * 2004-12-21 2006-08-17 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜の形成方法、シリカ系被膜、及び、電子部品
WO2006068181A1 (ja) * 2004-12-21 2006-06-29 Hitachi Chemical Company, Ltd. 被膜、シリカ系被膜及びその形成方法、シリカ系被膜形成用組成物、並びに電子部品
JP2007254678A (ja) * 2006-03-24 2007-10-04 Tokyo Ohka Kogyo Co Ltd シリカ系被膜形成用組成物およびシリカ系被膜

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