JP2003171480A - Fluorine resin substrate - Google Patents
Fluorine resin substrateInfo
- Publication number
- JP2003171480A JP2003171480A JP2001373100A JP2001373100A JP2003171480A JP 2003171480 A JP2003171480 A JP 2003171480A JP 2001373100 A JP2001373100 A JP 2001373100A JP 2001373100 A JP2001373100 A JP 2001373100A JP 2003171480 A JP2003171480 A JP 2003171480A
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- Japan
- Prior art keywords
- loss tangent
- dielectric loss
- fluorine resin
- substrate
- ghz
- Prior art date
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Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、高周波帯域用のプ
リント回路やアンテナ等に用いられるふっ素樹脂基板に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fluororesin substrate used for high frequency printed circuits, antennas and the like.
【０００２】[0002]
【従来の技術】ＧＨｚ帯域の高周波帯域の周波数の用途
としては、表１に示すものがあり、表１に掲げるもの以
外にも、ミリメートル波レーダを用いた自動車の衝突防
止システムなどでは、７０ＧＨｚ以上になると予想され
る。2. Description of the Related Art As applications of frequencies in the high frequency band of GHz band, there are those shown in Table 1. In addition to those listed in Table 1, automobile collision prevention systems using millimeter wave radar have a frequency of 70 GHz or more. Is expected to become.
【０００３】[0003]
【表１】 [Table 1]
【０００４】上記のような高周波帯域用のプリント回路
やアンテナに使用される基板にあっては、通信速度を速
くするため低誘電率であること、及び通信損失を低くす
るために低誘電正接であることが求められる。下記表２
は、従来の基板の誘電特性を示している。The substrate used for the printed circuit or antenna for the high frequency band as described above has a low dielectric constant in order to increase the communication speed, and a low dielectric loss tangent in order to reduce the communication loss. It is required to be. Table 2 below
Shows the dielectric properties of a conventional substrate.
【０００５】[0005]
【表２】 [Table 2]
【０００６】表２の３つの基板の中で、ＧＨｚ帯域での
使用に適している基板は「ガラス繊維クロス／ふっ素樹
脂基板」である。このガラス繊維クロス／ふっ素樹脂基
板は、１ＭＨｚの測定で低誘電率（２．２〜３．０）・
低誘電正接（０．０００１〜０．００１）を実現してい
る。Among the three substrates shown in Table 2, the one suitable for use in the GHz band is "glass fiber cloth / fluorine resin substrate". This glass fiber cloth / fluorine resin substrate has a low dielectric constant (2.2-3.0) at 1MHz measurement.
A low dielectric loss tangent (0.0001 to 0.001) is realized.
【０００７】[0007]
【発明が解決しようとする課題】しかし、ガラス繊維ク
ロス／ふっ素樹脂基板では、高周波数帯域、特にミリメ
ートル波帯域（３０ＧＨｚ〜３００ＧＨｚ）では、誘電
正接が増大し、通信損失が大きくなるという問題があ
る。すなわち、高周波帯域に用いる基板としては、誘電
率及び誘電正接が単に低いだけでなく、周波数が上昇し
ても誘電正接が高くならないものが求められる。しか
し、従来のガラス繊維クロス／ふっ素樹脂基板では、周
波数帯域が上昇すると誘電正接が高くなり、波形が劣化
し通信損失が増大するという欠点あった。しかも、ミリ
メートル波帯域における今後の用途の広がりに対応する
には、かかる欠点の克服は重要である。However, the glass fiber cloth / fluorine resin substrate has a problem that the dielectric loss tangent increases and the communication loss increases in the high frequency band, particularly in the millimeter wave band (30 GHz to 300 GHz). . That is, a substrate used in a high frequency band is required to have not only a low dielectric constant and a low dielectric loss tangent but also a high dielectric loss tangent even when the frequency is increased. However, the conventional glass fiber cloth / fluorine resin substrate has a drawback that the dielectric loss tangent increases as the frequency band rises, the waveform deteriorates, and the communication loss increases. Moreover, it is important to overcome such drawbacks in order to cope with future expansion of applications in the millimeter wave band.
【０００８】本発明はかかる問題に鑑みてなされたもの
であり、周波数帯域の上昇に対する誘電正接の上昇が抑
制されたふっ素樹脂基板を提供することを目的とする。The present invention has been made in view of the above problems, and an object of the present invention is to provide a fluororesin substrate in which an increase in dielectric loss tangent with respect to an increase in frequency band is suppressed.
【０００９】[0009]
【課題を解決するための手段】前記目的を達成するため
本発明は、次の技術的手段を採用した。すなわち、本発
明は、アラミド繊維シート材にふっ素樹脂が含浸されて
なるプリプレグを絶縁材として用いたことを特徴とする
ふっ素樹脂基板である。アラミド繊維シート材は誘電正
接がそれほど低くないが、誘電率及び誘電正接の低いふ
っ素樹脂を含浸させることで、高周波帯域用として十分
に低い誘電率及び誘電正接が得られる。しかも、ふっ素
樹脂をアラミド繊維に含浸させると、周波数帯域が上昇
しても誘電正接はさほど上昇しないことを本発明者らは
見いだした。これは、アラミドのポリマー分子は双極子
性が小さいことに加えて、曲がりにくい分子（剛直性分
子）で構成されており、分子が剛直であることから、Ｇ
Ｈｚ以上では分子の運動は電解の変化に追従できなくな
り、誘電正接の変化がさほど発生しないためであると考
えられる。In order to achieve the above object, the present invention adopts the following technical means. That is, the present invention is a fluororesin substrate characterized by using a prepreg obtained by impregnating an aramid fiber sheet material with a fluororesin as an insulating material. The aramid fiber sheet material has a not so low dielectric loss tangent, but by impregnating a fluorocarbon resin having a low dielectric constant and dielectric loss tangent, a sufficiently low dielectric constant and dielectric loss tangent for a high frequency band can be obtained. Moreover, the present inventors have found that when the aramid fiber is impregnated with the fluororesin, the dielectric loss tangent does not increase so much even if the frequency band increases. This is because the polymer molecule of aramid has a small dipole property and is composed of a molecule that is difficult to bend (rigid molecule), and the molecule is rigid.
It is considered that the movement of molecules cannot follow the change of electrolysis at Hz or higher, and the change of the dielectric loss tangent does not occur so much.
【００１０】なお、ふっ素樹脂としては、例えば、ポリ
テトラフルオロエチレン（ＰＴＦＥ）、テトラフルオロ
エチレン−パーフルオロアルキルビニルエーテル共重合
体（ＰＦＡ）、テトラフルオロエチレン−パーフルオロ
アルコキシエチレン共重合体（ＰＦＥ）、テトラフルオ
ロエチレン−ヘキサフルオロプロピレン共重合体（ＦＥ
Ｐ）、テトラフルオロエチレン−エチレン共重合体（Ｅ
ＴＦＥ）などを用いることができる。Examples of the fluorine resin include polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene-perfluoroalkoxyethylene copolymer (PFE), Tetrafluoroethylene-hexafluoropropylene copolymer (FE
P), tetrafluoroethylene-ethylene copolymer (E
TFE) or the like can be used.
【００１１】また、ふっ素樹脂の含有率としては、６０
重量％〜９５重量％であるのが好ましい。ふっ素樹脂が
９５重量％より多いと、ふっ素樹脂の含有率が多すぎて
基板の強度が十分でなくなり、ふっ素樹脂が６０重量％
より少ないと誘電率及び誘電正接が高くなるからであ
る。また、１ＧＨｚにおける誘電正接に対する７５ＧＨ
ｚにおける誘電正接の上昇比が１０以下であるのが好ま
しく、上昇比が１０以下であれば、高周波帯域用として
も十分に低い誘電正接となる。Further, the content of the fluorine resin is 60
It is preferable that it is from 95% by weight to 95% by weight. If the content of fluororesin is more than 95% by weight, the content of fluororesin is too high and the strength of the substrate becomes insufficient.
This is because if it is smaller, the dielectric constant and the dielectric loss tangent become higher. Also, 75 GHz with respect to the dielectric loss tangent at 1 GHz
The increase ratio of the dielectric loss tangent in z is preferably 10 or less, and when the increase ratio is 10 or less, the dielectric loss tangent is sufficiently low even for a high frequency band.
【００１２】[0012]
【発明の実施の形態】図１は、本発明の実施形態におけ
るふっ素樹脂基板１の基本構成を示す断面図である。基
板１は、絶縁層２と導電体層３とを備えており、絶縁層
２を構成する絶縁材としてアラミド繊維シート材にふっ
素樹脂を含浸させたプリプレグ４が用いられ、この絶縁
層２の上下両面に導電体層３として銅箔が形成されてい
る。なお、絶縁層２としてはプリプレグ４を２枚積層し
たものが図示されているが、積層数は何層でもよい。1 is a sectional view showing the basic structure of a fluororesin substrate 1 according to an embodiment of the present invention. The substrate 1 is provided with an insulating layer 2 and a conductor layer 3, and a prepreg 4 obtained by impregnating an aramid fiber sheet material with a fluororesin is used as an insulating material forming the insulating layer 2. Copper foil is formed as the conductor layer 3 on both surfaces. Although the insulating layer 2 is shown as a stack of two prepregs 4, the number of stacked layers may be any number.
【００１３】[0013]
【実施例】実施例として、アラミド繊維の不織布（アラ
ミド繊維ペーパー：デュポン帝人アドバンスドペーパ社
製ＴＨＥＲＭＯＵＮＴ＃８０坪量５６ｇ／ｍ２）に、Ｐ
ＴＦＥ（三井・デュポンフロロケミカル社製ＰＴＦＥデ
ィスパージョン３４Ｊ）を含浸したプリプレグの上下面
に銅箔（福田金属箔粉工業社製１８μｍ銅箔ＣＦＴ９Ｌ
Ｐ）を配し熱プレス成形（成型プレス条件は３８５℃、
５ＭＰａ、６０ｍｉｎ）することによって、アラミド繊
維ペーパー補強／ふっ素樹脂基板１を作成した。実施例
におけるふっ素樹脂の含浸率としては、９５重量％のも
の（実施例１）、８０重量％のもの（実施例２）、６０
重量％のもの（実施例３）の三種類の基板を作成した。EXAMPLE As an example, an aramid fiber non-woven fabric (aramid fiber paper: Dupont Teijin Advanced Paper Co. THERMOUNT # 80 basis weight 56 g / m 2 ) was coated with P
Copper foil (18 μm copper foil CFT9L manufactured by Fukuda Metal Foil & Powder Co., Ltd.) on the upper and lower surfaces of prepreg impregnated with TFE (PTFE dispersion 34J manufactured by Mitsui DuPont Fluorochemical Co., Ltd.)
P) and heat press molding (molding press conditions are 385 ° C,
The aramid fiber paper reinforcing / fluorine resin substrate 1 was prepared by applying 5 MPa and 60 min). The impregnation rate of the fluororesin in the examples is 95% by weight (Example 1), 80% by weight (Example 2), 60.
Three types of substrates with weight% (Example 3) were prepared.
【００１４】また、比較例として、ガラス繊維クロス
（有沢製作所社製＃１０８ガラスクロス坪量４８ｇ／ｍ
２）にＰＴＦＥ（三井・デュポンフロロケミカル社製Ｐ
ＴＦＥディスパージョン３４Ｊ）を含浸したプリプレグ
の上下面に銅箔（福田金属箔粉工業社製１８μｍ銅箔Ｃ
ＦＴ９ＬＰ）を配し熱プレス成形（成型プレス条件は実
施例と同様）することによって、ガラス繊維クロス補強
／ふっ素樹脂基板を作成した。比較例におけるふっ素樹
脂の含浸率としては、実施例と同様に、９５重量％のも
の（比較例１）、８０重量％のもの（比較例２）、６０
重量％のもの（比較例３）の三種類の基板を作成した。As a comparative example, glass fiber cloth (Arisawa Seisakusho # 108 glass cloth basis weight 48 g / m 2)
2 ) PTFE (Mitsui / Dupont Fluorochemicals P
Copper foil (18 μm copper foil C manufactured by Fukuda Metal Foil & Powder Co., Ltd.) on the upper and lower surfaces of the prepreg impregnated with TFE dispersion 34J)
FT9LP) was placed and subjected to hot press molding (molding press conditions were the same as in the example) to prepare a glass fiber cloth reinforced / fluorine resin substrate. The impregnation rate of the fluorine resin in the comparative example was 95% by weight (Comparative Example 1), 80% by weight (Comparative Example 2), and 60 as in the case of the Examples.
Three types of substrates with a weight percentage (Comparative Example 3) were prepared.
【００１５】なお、下記表３に示すように、実施例１の
基板はプリプレグ枚数が２枚であって銅箔を含む基板厚
さが１．１０ｍｍであり、実施例２の基板はプリプレグ
枚数が４枚であって銅箔を含む基板厚さが０．６１ｍｍ
であり、実施例３の基板はプリプレグ枚数が６枚であっ
て銅箔を含む基板厚さが０．５１ｍｍである。また、比
較例１の基板はプリプレグ枚数が３枚であって銅箔を含
む基板厚さが１．１２ｍｍであり、比較例２の基板はプ
リプレグ枚数が６枚であって銅箔を含む基板厚さが０．
６２ｍｍであり、比較例３の基板はプリプレグ枚数が９
枚であって銅箔を含む基板厚さが０．５０ｍｍである。As shown in Table 3 below, the substrate of Example 1 has two prepregs and the thickness of the substrate including the copper foil is 1.10 mm, and the substrate of Example 2 has prepreg numbers. The thickness of the board is 0.61mm including 4 sheets of copper foil
In the substrate of Example 3, the number of prepregs is 6 and the thickness of the substrate including the copper foil is 0.51 mm. In addition, the board of Comparative Example 1 has three prepregs and the board thickness including the copper foil is 1.12 mm, and the board of Comparative Example 2 has six prepregs and the board thickness including the copper foil. Is 0.
The substrate of Comparative Example 3 has a prepreg count of 9 mm.
The thickness of the substrate including the copper foil is 0.50 mm.
【００１６】[0016]
【表３】 [Table 3]
【００１７】実施例１〜３及び比較例１〜３の誘電特性
を測定した結果を表４及び図２に示す。測定方法は摂動
方であり、測定機器はアジレトテクノロジー社製ベクト
ルネットワークアナライザーＨＰ−８７２０を用いた。The results of measuring the dielectric properties of Examples 1 to 3 and Comparative Examples 1 to 3 are shown in Table 4 and FIG. The measuring method was a perturbation method, and the measuring instrument used was a vector network analyzer HP-8720 manufactured by Azilet Technology.
【００１８】[0018]
【表４】 [Table 4]
【００１９】表４に示すように、１ＧＨｚ程度の周波数
では、実施例１〜３及び比較例１〜３ともに低誘電率及
び低誘電正接を達成している。しかし、表４の誘電正接
の値をグラフ化した図２からも明らかなように、比較例
１〜３では、周波数帯域が上昇すると誘電正接が増大し
ており、特にミリメートル波帯域付近になると誘電正接
の顕著な増加が見られる。すなわち、比較例１では測定
周波数１ＧＨｚにおける誘電正接（０．０００１）に対
する測定周波数７５ＧＨｚにおける誘電正接（０．００
５）の上昇比が５０であり、比較例２では同上昇比が約
２１であり、比較例３では同上昇比が４０であり、比較
例１〜３では、いずれも上昇比が非常に大きい。したが
って、比較例１〜３の基板を高周波帯域用、特にミリメ
ートル波帯域用に用いると通信損失が増大するなどの弊
害が生じる。As shown in Table 4, at frequencies of about 1 GHz, Examples 1 to 3 and Comparative Examples 1 to 3 achieved low dielectric constant and low dielectric loss tangent. However, as is clear from FIG. 2 in which the values of the dielectric loss tangent in Table 4 are graphed, in Comparative Examples 1 to 3, the dielectric loss tangent increases as the frequency band rises, and in particular near the millimeter wave band, the dielectric loss tangent increases. There is a significant increase in tangent. That is, in Comparative Example 1, the dielectric loss tangent (0.0001) at the measurement frequency of 1 GHz and the dielectric loss tangent (0.00
The increase ratio of 5) is 50, the increase ratio of Comparative Example 2 is about 21, the increase ratio of Comparative Example 3 is 40, and the increase ratios of Comparative Examples 1 to 3 are very large. . Therefore, when the substrates of Comparative Examples 1 to 3 are used for the high frequency band, especially for the millimeter wave band, there arises an adverse effect such as an increase in communication loss.
【００２０】一方、実施例１〜３では、周波数帯域が上
昇しても、比較例１〜３に比べて誘電正接の増大は緩や
かである。すなわち、実施例１では前記上昇比が９．８
であり、実施例２では前記上昇比が４であり、実施例３
では前記上昇比が５であり、実施例では上昇比がいずれ
も１０以下であり比較例に比べて小さい。しかも、実施
例と比較例においてふっ素樹脂含浸率が同じもの（実施
例１と比較例１、実施例２と比較例２、実施例３と比較
例３）を比較すると、実施例におけるミリメートル波帯
域における誘電正接は比較例に比べて非常に小さい。し
たがって、実施例１〜３の基板を高周波帯域用に用いれ
ば通信損失を低く抑えることができ、特にミリメートル
波帯域用として非常に有益である。On the other hand, in Examples 1 to 3, even if the frequency band increased, the increase in the dielectric loss tangent was slower than in Comparative Examples 1 to 3. That is, in Example 1, the increase ratio is 9.8.
In Example 2, the increase ratio is 4, and in Example 3,
The rise ratio is 5 and in the examples, the rise ratios are all 10 or less, which is smaller than that of the comparative example. Moreover, when the examples and the comparative examples have the same fluorine resin impregnation rate (example 1 and comparative example 1, example 2 and comparative example 2, and example 3 and comparative example 3), the millimeter wave band in the example is compared. The dielectric loss tangent in is extremely smaller than that in the comparative example. Therefore, when the substrates of Examples 1 to 3 are used for the high frequency band, the communication loss can be suppressed to a low level, which is very useful especially for the millimeter wave band.
【００２１】また、実施例の場合、ＰＴＦＥとアラミド
繊維が均質に分散されているため、レーザ穴あけ加工
性、プラズマ表面処理製が優れるのに対し、比較例の場
合は、平織ガラスクロスを用いているためガラス分の多
い部分とＰＴＦＥ分の多い部分が混在するため、ガラス
分の多い部分はレーザ穴あけ加工性が悪く、ＰＴＦＥ分
の多い部分はプラズマ表面処理製が悪い。In the case of the example, since the PTFE and the aramid fiber are uniformly dispersed, the laser drilling processability and the plasma surface treatment are excellent, whereas in the case of the comparative example, the plain weave glass cloth is used. Since the glass-rich portion and the PTFE-rich portion coexist, the laser-drillability is poor in the glass-rich portion and the plasma surface treatment is poor in the PTFE-rich portion.
【００２２】[0022]
【発明の効果】本発明によれば、アラミド繊維シート材
にふっ素樹脂を含浸させることで、周波数帯域の上昇に
対する誘電正接の上昇が抑制されたふっ素樹脂基板を得
ることができる。また、ふっ素樹脂の含有率を６０重量
％〜９５重量％とすると、基板の強度を十分に確保でき
るとともに、高周波帯域に適した低誘電率及び低誘電正
接とすることができる。しかも、１ＧＨｚにおける誘電
正接に対する７５ＧＨｚにおける誘電正接の上昇比が１
０以下であれば、高周波帯域用としても十分に低い誘電
正接となる。According to the present invention, by impregnating the aramid fiber sheet material with the fluororesin, it is possible to obtain the fluororesin substrate in which the increase of the dielectric loss tangent with respect to the increase of the frequency band is suppressed. When the content of the fluorine resin is 60% by weight to 95% by weight, the strength of the substrate can be sufficiently secured, and the low dielectric constant and low dielectric loss tangent suitable for the high frequency band can be obtained. Moreover, the increase ratio of the dielectric loss tangent at 75 GHz to the dielectric loss tangent at 1 GHz is 1
If it is 0 or less, the dielectric loss tangent is sufficiently low even for a high frequency band.
【図１】本発明の基板の基本構成を示す断面図である。FIG. 1 is a sectional view showing a basic structure of a substrate of the present invention.
【図２】実施例と比較例の誘電正接を示すグラフであ
る。FIG. 2 is a graph showing dielectric loss tangents of Examples and Comparative Examples.
１ 基板 ２ 絶縁層（絶縁材） ３ 導電体層 ４ プリプレグ 1 substrate 2 Insulation layer (insulation material) 3 Conductor layer 4 prepreg
───────────────────────────────────────────────────── フロントページの続き (72)発明者 平本 雅信 兵庫県三田市下内神字打場541番地の１ 日本ピラー工業株式会社三田工場内 (72)発明者 市野 靖彦 兵庫県三田市下内神字打場541番地の１ 日本ピラー工業株式会社三田工場内 (72)発明者 谷井 利光 兵庫県三田市下内神字打場541番地の１ 日本ピラー工業株式会社三田工場内 (72)発明者 大西 格司 兵庫県三田市下内神字打場541番地の１ 日本ピラー工業株式会社三田工場内 Ｆターム(参考） 4F072 AA02 AA08 AB06 AD07 AG03 AH22 AL13 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Masanobu Hiramoto 1 of 541, Shimouchi Kamibata, Sanda City, Hyogo Prefecture Japan Pillar Industry Co., Ltd. Mita factory (72) Inventor Yasuhiko Ichino 1 of 541, Shimouchi Kamibata, Sanda City, Hyogo Prefecture Japan Pillar Industry Co., Ltd. Mita factory (72) Inventor Toshimitsu Tanii 1 of 541, Shimouchi Kamibata, Sanda City, Hyogo Prefecture Japan Pillar Industry Co., Ltd. Mita factory (72) Inventor Koji Onishi 1 of 541, Shimouchi Kamibata, Sanda City, Hyogo Prefecture Japan Pillar Industry Co., Ltd. Mita factory F-term (reference) 4F072 AA02 AA08 AB06 AD07 AG03 AH22 AL13
Claims (3)
されてなるプリプレグを絶縁材として用いたことを特徴
とするふっ素樹脂基板。1. A fluororesin substrate comprising a prepreg obtained by impregnating an aramid fiber sheet material with a fluororesin as an insulating material.
％であることを特徴とする請求項１記載のふっ素樹脂基
板。2. The fluororesin substrate according to claim 1, wherein the fluororesin content is 60% by weight to 95% by weight.
ＧＨｚにおける誘電正接の上昇比が１０以下であること
を特徴とする請求項１又は２記載のふっ素樹脂基板。3. 75 to the dielectric loss tangent at 1 GHz
3. The fluororesin substrate according to claim 1, wherein the increase ratio of the dielectric loss tangent at GHz is 10 or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001373100A JP3614396B2 (en) | 2001-12-06 | 2001-12-06 | Method of using fluororesin substrate for millimeter wave band communication and fluororesin substrate for millimeter wave band communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001373100A JP3614396B2 (en) | 2001-12-06 | 2001-12-06 | Method of using fluororesin substrate for millimeter wave band communication and fluororesin substrate for millimeter wave band communication |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003171480A true JP2003171480A (en) | 2003-06-20 |
| JP3614396B2 JP3614396B2 (en) | 2005-01-26 |
Family
ID=19181879
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001373100A Expired - Fee Related JP3614396B2 (en) | 2001-12-06 | 2001-12-06 | Method of using fluororesin substrate for millimeter wave band communication and fluororesin substrate for millimeter wave band communication |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3614396B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005332994A (en) * | 2004-05-20 | 2005-12-02 | Kyocera Corp | Method and apparatus for evaluating characteristic of radio wave absorber |
| JP2006059865A (en) * | 2004-08-17 | 2006-03-02 | Unitika Ltd | Substrate and its manufacturing method |
| JP2010199437A (en) * | 2009-02-26 | 2010-09-09 | Kuraray Co Ltd | Laminated board for printed wiring board |
| JP2012237015A (en) * | 2012-08-28 | 2012-12-06 | Japan Vilene Co Ltd | Composite sheet |
| US8431955B2 (en) | 2010-07-21 | 2013-04-30 | International Business Machines Corporation | Method and structure for balancing power and performance using fluorine and nitrogen doped substrates |
| JP2015008286A (en) * | 2013-05-31 | 2015-01-15 | 住友電気工業株式会社 | Printed wiring board for high frequency use |
| CN105393647A (en) * | 2013-05-31 | 2016-03-09 | 住友电气工业株式会社 | High-frequency printed circuit board and wiring material |
| US11745482B2 (en) | 2019-10-29 | 2023-09-05 | Resonac Corporation | Fluororesin substrate laminate |
-
2001
- 2001-12-06 JP JP2001373100A patent/JP3614396B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005332994A (en) * | 2004-05-20 | 2005-12-02 | Kyocera Corp | Method and apparatus for evaluating characteristic of radio wave absorber |
| JP2006059865A (en) * | 2004-08-17 | 2006-03-02 | Unitika Ltd | Substrate and its manufacturing method |
| JP2010199437A (en) * | 2009-02-26 | 2010-09-09 | Kuraray Co Ltd | Laminated board for printed wiring board |
| US8431955B2 (en) | 2010-07-21 | 2013-04-30 | International Business Machines Corporation | Method and structure for balancing power and performance using fluorine and nitrogen doped substrates |
| JP2012237015A (en) * | 2012-08-28 | 2012-12-06 | Japan Vilene Co Ltd | Composite sheet |
| JP2015008286A (en) * | 2013-05-31 | 2015-01-15 | 住友電気工業株式会社 | Printed wiring board for high frequency use |
| CN105393647A (en) * | 2013-05-31 | 2016-03-09 | 住友电气工业株式会社 | High-frequency printed circuit board and wiring material |
| US10383215B2 (en) | 2013-05-31 | 2019-08-13 | Sumitomo Electric Industries, Ltd. | Radio-frequency printed circuit board and wiring material |
| US11745482B2 (en) | 2019-10-29 | 2023-09-05 | Resonac Corporation | Fluororesin substrate laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3614396B2 (en) | 2005-01-26 |
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