JP2003171438A - Epoxy resin composition, resin film, prepreg and laminated board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition comprising a curing agent and a phosphorus-containing epoxy resin obtained by reaction between an epoxy resin and a phosphorus compound, and capable of giving printed wiring boards of high electrical insulation, to provide a resin film and a prepreg each using the composition, and to provide a laminated board using the resin film and/or the prepreg. <P>SOLUTION: This epoxy resin composition comprises the curing agent and the phosphorus-containing epoxy resin obtained by reaction between the epoxy resin and the phosphorus compound; wherein the amount of a compound B of the formula(2) in the phosphorus compound is ≤100 mass ppm based on the total amount of the phosphorus-containing epoxy resin and the curing agent. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an epoxy resin composition used as a material for printed wiring boards and the like,
An epoxy resin composition using a phosphorus-containing epoxy resin obtained by reacting an epoxy resin with a phosphorus compound in order to impart flame retardancy, a resin film and a prepreg using the epoxy resin composition, and further the resin The present invention relates to a laminate using at least one of a film and a prepreg.

[0002]

2. Description of the Related Art Epoxy resin compositions have adhesiveness, heat resistance,
Since it has excellent moldability, it is widely used as a material for printed wiring boards and the like. Conventionally, in the case of making an epoxy resin composition flame-retardant, it has been widely used to use a halogen compound mainly containing bromine such as a Br-epoxy resin. However, halogen compounds mainly containing bromine may generate substances that have a harmful effect on the human body such as polybrominated dibenzodioxin when they are burned, and the flame retardance required without using halogen compounds. There is a need for a way to achieve sex.

Examples of flame retardants replacing halogen compounds include phosphorus compounds, organic silicon-containing compounds and organic nitrogen-containing compounds. Among them, the organic silicon-containing compound has a problem that it is difficult to uniformly mix it with other components at the time of preparing the epoxy resin composition, and further, the cost is high and it is not suitable for industrial production. Further, the organic nitrogen-containing compound has the same problems as the organic silicon-containing compound, and may generate a highly poisonous hydrogen cyanide at the time of burning.

Regarding the phosphorus compound, both addition type and reaction type of reacting with an epoxy resin are being studied. From the viewpoint of contamination and heat resistance deterioration due to elution of a material into an etching solution during processing of a printed wiring board, it has been recently widely observed that it is preferable to use a reactive phosphorus compound rather than an addition type phosphorus compound. For example, JP-A-1
JP-A No. 1-166035 discloses an epoxy resin containing a phosphorus-containing epoxy resin obtained by reacting 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide with an epoxy resin as a reactive phosphorus compound. It has been proposed to impart flame retardancy to the composition.

On the other hand, in the case of materials for printed wiring boards, the demand for high-density packaging is increasing more and more, and it is important to secure the insulation property in the case of a narrower circuit interval (plane direction and thickness direction) than before. It is becoming an issue.

However, in the method using a phosphorus-containing epoxy resin obtained by reacting a phosphorus compound with an epoxy resin, which is disclosed in the above publication, it is not sufficient to secure insulation in a field where high-density mounting is required. Improvement is required.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and its object is to provide a phosphorus-containing epoxy resin obtained by reacting an epoxy resin with a phosphorus compound, and to cure the epoxy resin. When used as a material for a printed wiring board having a narrow circuit spacing, an epoxy resin composition containing an agent and a printed wiring board having excellent insulation properties even when the circuit spacing is narrow can be obtained. It is to provide an epoxy resin composition that can be used. Moreover, it is an object of the present invention to provide a resin film and a prepreg using the epoxy resin composition, and further to provide a laminated board using at least one of the resin film and the prepreg.

[0008]

Means for Solving the Problems In order to solve the above-mentioned problems, the present inventors have used a compound A (9,10-dihydro-9-oxa-10-phosphah) represented by the following formula (1) as a phosphorus compound. When using phenanthrene-10-oxide),
As a result of various investigations, the inventors have found that the specific impurities present in the product of the compound A represented by the formula (1) are related to the deterioration of the insulating property in the case of a narrow circuit interval, and have reached the inventions described below. It is a thing.

The epoxy resin composition of the invention according to claim 1 is a phosphorus-containing epoxy resin obtained by reacting an epoxy resin with a phosphorus compound containing a compound A represented by the following formula (1) as a main component, and a curing agent. And containing the compound A
In the epoxy resin composition, wherein the content of the phosphorus element contained in the epoxy resin composition is 0.3% by mass or more based on the total amount of the phosphorus-containing epoxy resin and the curing agent, The amount of the compound B represented by the following formula (2) contained in the phosphorus compound is 100 mass ppm or less with respect to the total amount of the phosphorus-containing epoxy resin and the curing agent. Is.

[0010]

[Chemical 3]

[0011]

[Chemical 4]

In the epoxy resin composition of the present invention according to claim 1, the content of the phosphorus element contained in the compound A is 0.3% by mass based on the total amount of the phosphorus-containing epoxy resin and the curing agent.
The above is specified because this range is a range in which the compound A has a remarkable effect of imparting flame retardancy. 0.
Even if it is less than 3% by mass, the function of imparting flame retardancy is not absent, but in the present invention, it is an object of the present invention to solve the problems when the compound A is imparted with flame retardancy. Therefore, it is specified in the range where the function of imparting flame retardancy is prominent. Of course, it is not necessary to achieve all the flame retardancy required for the epoxy resin composition only by the action of the compound A, and it is possible to use other flame retardant components in combination in the present invention. The upper limit of the content of the elemental phosphorus is not particularly limited, but if it exceeds 8.0 mass%, the performance such as heat resistance tends to decrease, so it is 8.0 mass% or less. preferable. In addition, the phosphorus compound containing Compound A as a main component here means a material to be obtained as the compound A itself. For example, in the case where a material having a purity of 99% by mass or more is obtained, the compound is The content of A in the phosphorus compound is 99% by mass or more. As described above, the phosphorus compound containing the compound A as the main component in the present invention means a material (product) treated as the compound A, and its purity varies depending on the acquisition route. A compound A having a content rate of 50% by mass corresponds to the phosphorus compound containing the compound A as a main component in the present invention.

In the invention according to claim 1, the formula (2) contained in the phosphorus compound containing the compound A as a main component.
It is important that the amount of the compound B represented by is 100 mass ppm or less with respect to the total amount of the phosphorus-containing epoxy resin and the curing agent, and only when the mass is 100 mass ppm or less, the present invention It is possible to obtain a printed wiring board having excellent insulation even when the circuit spacing is narrow, which is the purpose of the above. In addition, regarding the amount of the phosphorus-containing epoxy resin for calculating the total amount in this case, the total amount of the phosphorus compound and the epoxy resin reacted to obtain the phosphorus-containing epoxy resin is the amount of the phosphorus-containing epoxy resin.

The epoxy resin composition of the invention according to claim 2 is characterized in that the epoxy resin used for obtaining the phosphorus-containing epoxy resin is a polyfunctional epoxy resin. Is. As described above, the use of the polyfunctional epoxy resin improves the heat resistance and the like, and is therefore desirable as a material for a printed wiring board.

The resin film of the invention according to claim 3 is a resin film obtained by heating the epoxy resin composition according to claim 1 or 2 to be semi-cured.

Since the resin film of the invention according to claim 3 uses the epoxy resin composition according to claim 1 or 2, a printed wiring board having excellent insulation even in the case of a narrow circuit interval. To obtain a resin film.

The prepreg of the invention according to claim 4 is a prepreg obtained by impregnating and drying a base material with the epoxy resin composition according to claim 1 or 2.

In the prepreg of the invention according to claim 4, since the epoxy resin composition according to claim 1 or 2 is used, a printed wiring board having an excellent insulating property is obtained even in the case of a narrow circuit interval. It becomes a prepreg that can be obtained.

The laminated plate of the invention according to claim 5 is the same as that of claim 3.
A laminated plate formed by laminating and using at least one of the resin film according to claim 4 and the prepreg according to claim 4.

In the laminated board of the invention according to claim 5, since at least one of the resin film according to claim 3 and the prepreg according to claim 4 is used, the insulating property is obtained even in the case of a narrow circuit interval. It is a laminated board from which a printed wiring board having excellent characteristics can be obtained.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION First, the epoxy resin composition of the present invention will be described.

In the epoxy resin composition of the present invention, a phosphorus-containing epoxy resin obtained by reacting an epoxy resin with a phosphorus compound containing the compound A represented by the formula (1) as a main component is used. The epoxy resin used in this reaction may be a curable epoxy resin, or may be a mixture of two or more kinds, and examples thereof include a bisphenol type epoxy resin, a novolac type epoxy resin, and a polyfunctional epoxy resin. The polyfunctional epoxy resin referred to here is one having three or more epoxy groups in one molecule, and the molecular structure of a volatile epoxy resin made from a condensate of phenols and aldehydes is also the molecular structure. Depending on the type, it is a kind of this multifunctional epoxy resin. When a polyfunctional epoxy resin is used, heat resistance and the like are improved, which is desirable as a material for a printed wiring board.

The compound A represented by the formula (1) is generally H
It is 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, referred to as CA. The phosphorus compound reacted with the epoxy resin contains at least 50 mass% of compound A as a main component. As described above, the phosphorus compound containing the compound A as a main component here means a material (product) treated as the compound A, and generally has a purity of 99% by mass or more. Is available. Therefore, it is practical to use the phosphorus compound containing 99 mass% or more of the compound A in the reaction with the epoxy resin.

The method of reacting the epoxy resin with the phosphorus compound containing Compound A as a main component can be carried out, for example, by the following method. 100 as reaction temperature
The reaction is carried out at ~ 200 ° C with stirring. The active hydrogen directly bonded to the phosphorus atom of the compound A reacts with the epoxy group of the epoxy resin. The end point of the reaction is confirmed by tracing the epoxy equivalent to a value of 97% or more of the theoretical epoxy equivalent, but it can be determined by a method other than tracing the epoxy equivalent. During this reaction, a catalyst is used if necessary.
Specifically, tertiary amines such as benzyldimethylamine, quaternary ammonium salts such as tetramethylammonium chloride, phosphines such as triphenylphosphine, and various catalysts such as imidazole can be used.

The epoxy resin composition of the present invention contains a curing agent together with the phosphorus-containing epoxy resin. As the curing agent, amine compounds, various phenol resins, acid anhydrides and other commonly used curing agents for epoxy resins can be used.

In the epoxy resin composition of the present invention,
A phosphorus compound other than the compound A represented by the formula (1) can be blended if necessary.

In the epoxy resin composition of the present invention, the content of the phosphorus element contained in the compound A represented by the formula (1) is 0.3% by mass or more based on the total amount of the phosphorus-containing epoxy resin and the curing agent. It is necessary to be. Regarding the amount of the phosphorus-containing epoxy resin for calculating this total amount, the total amount of the phosphorus compound and the epoxy resin reacted to obtain the phosphorus-containing epoxy resin is the amount of the phosphorus-containing epoxy resin (in the following. The same). An object of the present invention is to provide an epoxy resin composition capable of obtaining a printed wiring board having excellent insulating properties even when the circuit spacing is narrow, when the compound A is made to act to impart flame retardancy. Therefore, the range of the elemental phosphorus content of the compound A is specified. The upper limit of the content of the elemental phosphorus is not particularly limited, but if it exceeds 8.0 mass%, the performance such as heat resistance tends to be deteriorated, so it is preferably 8.0 mass% or less.

In the epoxy resin composition of the present invention, a curing accelerator such as a tertiary amine, a quaternary ammonium salt, a phosphine or an imidazole can be blended if necessary. If necessary, silica powder, powder of metal hydrate such as aluminum hydroxide, magnesium hydroxide, etc., inorganic filler of powder of viscous mineral such as talc, clay, etc. can be blended alone or in a mixture. .

In the epoxy resin composition of the present invention, the content of the compound B represented by the formula (2) in the phosphorus compound used is 100 mass ppm or less based on the total amount of the phosphorus-containing epoxy resin and the curing agent. Is important, and only when the content is 100 ppm by mass or less, it is possible to obtain a printed wiring board having excellent insulation even with a narrow circuit interval, which is an object of the present invention. The compound B represented by the formula (2) is a substance that is usually present in a phosphorus compound containing the compound A as a main component as an impurity of the compound A represented by the formula (1), and is treated as the compound A itself. It is a substance. Then, as a result of detailed investigation of the influence, the present inventors have introduced the compound B into the epoxy resin composition in order to obtain a printed wiring board having excellent insulation even in the case of a narrow circuit interval. To make the ratio extremely small, that is, 100 mass ppm based on the total amount of the phosphorus-containing epoxy resin and the curing agent.
We found that it was important to do the following:
The means for reducing the proportion of the compound B is not particularly limited, and for example, it can be performed by means such as removing the compound B from the phosphorus compound containing the compound A as a main component by a method such as a recrystallization method. .

Next, the resin film of the present invention will be described.

The resin film of the present invention is a resin film obtained by heating and semi-curing the epoxy resin composition described above. The term "semi-curing" as used herein means so-called B-stage formation, and means a state in which the epoxy resin composition is partially reacted by heating the epoxy resin composition. Similar to a prepreg described later, the resin film has a property of being once melted and then cured by heat and pressure during lamination molding. The method for forming the resin film is not particularly limited, and for example, using a roll coater or the like, the epoxy resin composition is applied to the surface of the PET film or the like with a predetermined thickness, and then heated at 100 to 180 ° C. to form a resin. It can be performed by a method of forming a film. The epoxy resin composition described above is used in the resin film of the present invention, so that the resin film can provide a printed wiring board having excellent insulation even when the circuit spacing is narrow.

Next, the prepreg of the present invention will be described.

The prepreg of the present invention is a prepreg obtained by impregnating and drying the epoxy resin composition described above into a substrate such as a sheet made of glass cloth or aramid fiber and then semi-curing it. Since the prepreg of the present invention uses the epoxy resin composition described above, it is a prepreg that can obtain a printed wiring board having excellent insulation even when the circuit spacing is narrow.

Next, the laminated plate of the present invention will be described.

The laminated plate of the present invention is a laminated plate formed by laminating and using at least one of the resin film and the prepreg manufactured by using the epoxy resin composition described above. In the laminated board of the present invention, since at least one of the resin film and the prepreg manufactured using the epoxy resin composition described above is used, a printed wiring board having excellent insulation even in the case of a narrow circuit interval. To obtain a laminated plate. The laminated plate of the present invention also includes a laminated plate with an inner layer circuit manufactured by integrating a copper foil, a prepreg (or a resin film), and a core material having an inner layer circuit formed therein.

[0036]

EXAMPLES The present invention will be specifically described below with reference to examples.

Preparation of Phosphorus-Containing Epoxy Resin: Solutions 1 to 3 of phosphorous-containing epoxy resin were prepared at the compounding ratio shown in Table 1. That is, a phosphorus compound containing phosphorus as a main component (a phosphorus compound standard product or a phosphorus compound high-purity product) was reacted with a polyfunctional epoxy resin (“EPPN-502H” manufactured by Nippon Kayaku Co., Ltd.). Specifically, a 300 ml three-necked flask was equipped with a stirrer and a cooling tube, and a predetermined amount of dimethylformamide (DMF) and methoxypropanol were weighed, and then a polyfunctional epoxy resin was added and heated in an oil bath. Then, when the temperature reached 80 ° C., the phosphorus compound was added, and when the temperature was further heated to 100 ° C., triphenylphosphine was added at a ratio of 0.2 mass% with respect to the total solid content, and mixed with the phosphorus compound. The functional epoxy resin was reacted. The progress of the reaction was confirmed by measuring the epoxy equivalent. Then, when a predetermined epoxy equivalent was reached, the reaction was terminated and cooled to obtain a phosphorus-containing epoxy resin solution. The epoxy equivalent is measured according to JIS
It carried out based on K7236-1995.

Details of the materials used at this stage are as follows.

Polyfunctional epoxy resin (“E” manufactured by Nippon Kayaku Co., Ltd.
PPN-502H ") is an epoxy resin having a structure represented by the following formula (3), and its epoxy equivalent was 169.

[0040]

[Chemical 5]

As the phosphorus compound standard product, a product manufactured by Sanko Chemical Co., Ltd. was used as it was without any purification treatment. It was confirmed by the analysis method described below that the content rate of the compound A in this phosphorus compound standard product was 99.6 mass% and the content rate of the compound B was 0.4 mass%.

As the phosphorus compound high-purity product, used is a phosphorus compound high-purity product obtained by subjecting the above-mentioned phosphorus compound standard product to purification by recrystallization using isopropyl alcohol, and having a compound A content of 100% by mass. did.

The content ratio of the compound A and the compound B in the phosphorus compound standard product or the phosphorus compound high-purity product was analyzed by quantitative analysis by liquid chromatography. That is, 0.1 g of a sample (phosphorus compound) was precisely weighed in an Erlenmeyer flask with a ground stopper, 20 ml of methanol was added, and the mixture was treated with an ultrasonic cleaner for 15 minutes to extract soluble matter, and the supernatant 5
μl was sampled with a microsyringe, and quantitative analysis (peak area method) was performed using a liquid chromatograph set under the following conditions. For the calibration curve, a compound A having a content rate of 100% by mass separately purified by recrystallization from isopropyl alcohol was used.

Liquid chromatograph conditions: CCPM liquid chromatograph manufactured by Tosoh Corporation, detection wavelength UV25
4 nm, column Shimadzu ZORBAX (inner diameter 4.6
mm, length 15 cm, number 1), and flow rate 1.2 ml / min.

Liquid chromatographic analysis was carried out on a standard product of Compound B obtained by separate purification, and from the obtained retention time results, the peak of the peak identified as Compound B in the phosphorus compound standard product was determined. It was confirmed that this was the peak of the compound represented by the formula (2).

Solution 1 of phosphorus-containing epoxy resin obtained above
3 to 3 are used as shown in Table 2 in Examples and Comparative Examples, and each material is blended and mixed at a blending ratio shown in Table 2 to mix the epoxy resin compositions (resin varnish) in Examples and Comparative Examples. Was prepared. The dispersion of silica, which is an inorganic filler, is 10 μm using a disperser (bead mill).
It was dispersed as follows. The degree of dispersion is JIS
It measured based on K5400.

Details of the materials used at this stage are as follows. Epoxy resin "850" shown in Table 2 was a trade name "Epiclone 850S" manufactured by Dainippon Ink and Chemicals, Inc., which is a bisphenol A type epoxy resin, and its epoxy equivalent was 190. As the curing agent, dicyandiamide manufactured by Nippon Carbide Co., Ltd. is used,
2-Ethyl-4-methylimidazole was used as the curing accelerator, and spherical silica powder having an average particle size of 1 μm was used as the silica.

Using the epoxy resin composition obtained above,
A resin film was produced by the following procedure. First, an epoxy resin composition (resin varnish) was applied to a PET film having a thickness of 40 μm with a film thickness of about 60 μm using a multi coater (“M400” manufactured by Hirano Techseed Co., Ltd.), and a transfer speed was 20 cm / min. The film was dried at a temperature of 100 ° C., and in order to protect the coated surface, a polyethylene film having a thickness of 20 μm was used as a cover film to prepare a resin film having a thickness shown in Table 2.

A printed wiring board for evaluation of insulation reliability was manufactured as follows.

The printed wiring board for insulation reliability evaluation is a wiring board having four conductor layers. A resin film is placed on both sides of a core material that has conductor layers on both sides, copper foil is placed on the outside of the core material, then laminated molding is performed and integrated to produce a board having four conductor layers. It was processed into a wiring board having four conductor layers.

The core material is a copper-clad laminate R1 manufactured by Matsushita Electric Works, Ltd.
766T (substrate thickness 0.8 mm, copper foil thickness 18 μm) was used. The conductor pattern of the core material was a solid copper pattern on the entire surface. Then, in order to improve the adhesion to the resin film, blackening treatment (black oxide treatment) was applied to the solid pattern of copper on the entire surface. Next, resin films were attached to both sides of the core material. This attachment was performed by laminating using a vacuum laminator manufactured by Meiki Seisakusho.
Further, a copper foil was attached to the resin film in the same manner to form an outer conductor layer.

Since the resin film is in a semi-cured state, 1
It was heat-treated at 70 ° C. for 120 minutes to be completely cured. Next, a comb-shaped pattern having a pitch of 150 μm was formed on the outer conductor layer to produce a printed wiring board for insulation reliability evaluation.

An insulation reliability test was performed on the produced printed wiring board for insulation reliability evaluation. The test is 130
DC 20V was applied in an atmosphere of ° C / 85% relative humidity. The insulation reliability was evaluated by evaluating the insulation of the portion formed of the resin film. The test time is 150
It was up to time. The judgment was made by n = 3, in which the resistance value of 50% or less compared to the initial insulation resistance value was x, and the resistance value of 90% or more was maintained as o. The results are shown in Table 2.

[0054]

[Table 1]

[0055]

[Table 2]

The phosphorus content (% by mass) shown in Table 2 is the proportion of the phosphorus element contained in the compound A to the total amount of the phosphorus-containing epoxy resin and the curing agent in the epoxy resin composition. The calculation formula for 1 is shown below. The phosphorus content (mass%) was calculated in the same manner for the other examples and comparative examples.

Phosphorus content (mass%) for Example 1 {142.9 × 0.70 × [6 / (194 + 6)] × (31/216)} × 100 / (142.
9 × 0.70 + 30 + 7.6) = 0.313 Also, the content ratio of compound B shown in Table 2 (mass ppm)
Is the ratio of the amount of the compound B contained in the phosphorus compound used to obtain the phosphorus-containing epoxy resin to the total amount of the phosphorus-containing epoxy resin and the curing agent in the epoxy resin composition. The calculation formula is shown below. It should be noted that Compound B was similarly applied to other Examples and Comparative Examples.
The content ratio (mass ppm) of was calculated.

Content ratio of compound B (mass ppm) for Example 1 {142.9 × 0.70 × [6 / (194 + 6)] × 0.004} × 1000000 / (14
2.9 × 0.70 + 30 + 7.6) = 87.2 From the results of Table 2, it was confirmed that the printed wiring boards having excellent insulation reliability were obtained in the examples of the present invention.

[0059]

EFFECTS OF THE INVENTION In the epoxy resin composition of the invention according to claim 1 and claim 2, the formula (2) contained in the phosphorus compound containing compound A as a main component, which is used for obtaining the phosphorus-containing epoxy resin, is used. Is 100 mass ppm with respect to the total amount of the phosphorus-containing epoxy resin and the curing agent.
The following is an epoxy resin composition using a phosphorus-containing epoxy resin obtained by reacting an epoxy resin and a phosphorus compound, and a printed wiring having excellent insulation even in the case of a narrow circuit interval. The epoxy resin composition has an extremely high electric insulating property that a plate can be obtained.

In the resin film of the invention according to claim 3,
Even if an epoxy resin composition using a phosphorus-containing epoxy resin obtained by reacting an epoxy resin and a phosphorus compound is used, the epoxy resin composition according to claim 1 or 2 is used as the epoxy resin composition. Since the resin film is used, it is possible to obtain a printed wiring board having excellent insulation even when the circuit spacing is narrow, and the resin film has extremely high electric insulation.

In the prepreg of the invention according to claim 4, even if an epoxy resin composition using a phosphorus-containing epoxy resin obtained by reacting an epoxy resin and a phosphorus compound is used, Since the epoxy resin composition according to claim 1 or 2 is used, a printed wiring board having excellent insulation can be obtained even when the circuit spacing is narrow, which is extremely high electrical insulation. It becomes a prepreg.

In the laminated board of the invention according to claim 5, a resin film or a prepreg using an epoxy resin composition containing a phosphorus-containing epoxy resin obtained by reacting an epoxy resin with a phosphorus compound, The resin film described above or the prepreg described in claim 4 is used. Therefore, the laminated board of the invention according to claim 5 is a laminated board having extremely high electrical insulation, that is, a laminated board capable of obtaining a printed wiring board having excellent insulation even in the case of a narrow circuit interval.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) // C08L 63:00 C08L 63:00 Z (72) Inventor Hiroaki Fujiwara 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita In-house (72) Inventor Matsumoto Takakage 1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works In-company F-term (reference) 4F071 AA42 AE02 AH13 BB02 BB03 BC01 4F072 AB06 AB09 AD23 AG03 AL13 4J036 AA01 CC02 DA01 JA08

Claims (5)

[Claims] 1. A compound containing a phosphorus-containing epoxy resin obtained by reacting an epoxy resin with a phosphorus compound containing a compound A represented by the following formula (1) as a main component, and a curing agent. The phosphorus compound used for obtaining the phosphorus-containing epoxy resin in an epoxy resin composition in which the content of the phosphorus element is 0.3% by mass or more based on the total amount of the phosphorus-containing epoxy resin and the curing agent. The amount of the compound B represented by the following formula (2) contained in the epoxy resin composition is 100 mass ppm or less based on the total amount of the phosphorus-containing epoxy resin and the curing agent. [Chemical 1] [Chemical 2] 2. The epoxy resin composition according to claim 1, wherein the epoxy resin used to obtain the phosphorus-containing epoxy resin is a polyfunctional epoxy resin. 3. A resin film obtained by heating and semi-curing the epoxy resin composition according to claim 1. 4. A prepreg obtained by impregnating and drying a base material with the epoxy resin composition according to claim 1. 5. A laminated plate obtained by laminating and molding using at least one of the resin film according to claim 3 and the prepreg according to claim 4.