JP2003170469A - Mold for injection molding - Google Patents

Mold for injection molding

Info

Publication number
JP2003170469A
JP2003170469A JP2001373045A JP2001373045A JP2003170469A JP 2003170469 A JP2003170469 A JP 2003170469A JP 2001373045 A JP2001373045 A JP 2001373045A JP 2001373045 A JP2001373045 A JP 2001373045A JP 2003170469 A JP2003170469 A JP 2003170469A
Authority
JP
Japan
Prior art keywords
mold
positioning
space
pin
injection molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001373045A
Other languages
Japanese (ja)
Inventor
Norihito Yokoyama
典人 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Hitachi High Tech Instruments Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Sanyo High Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Sanyo High Technology Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2001373045A priority Critical patent/JP2003170469A/en
Publication of JP2003170469A publication Critical patent/JP2003170469A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14163—Positioning or centering articles in the mould using springs being part of the positioning means

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold for injection molding which has a good appearance and the positioning hole 6a of a name plate 6 is filled with resin, and which molds an integral molding having good quality without deviation of a functional component such as a switch. <P>SOLUTION: The mold 100 for injection molding comprises a movable pin 8 energized to protrude into the positioning hole 6a perforated at the name plate 6 at a first mold 1 or a second mold 2, and a spring 9 for energizing the pin 8. The mold is opened, the plate 6 is mounted at the pin 8 projected from the cavity 4 surface, the mold is closed, the molten resin is injected, and the molten resin is filled in the hole 6a of the plate 6 while the pin 8 is pushed and sunk to the cavity 4 surface by the injecting pressure, and hence the integral molding 5 in which the hole 6a of the plate is blocked with the resin is molded. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【発明の属する技術分野】本発明は、表面に表示や商標
などを印刷した銘板などを樹脂成形体に一体成形するた
めに、金型に銘板を位置決めするための機構を備えた射
出成形金型に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an injection molding die provided with a mechanism for positioning a nameplate on a metal mold for integrally molding a nameplate or the like on the surface of which a display, a trademark or the like is printed. Regarding

【従来の技術】従来、射出成形前に軟質フィルムや薄い
アルミなどで作られた家電製品や電子機器で使用する文
字板、表示パネルあるいは銘板（以下銘板という）をあ
らかじめキャビティ面に密接させ、押し込んでおくこと
により、その銘板を成形品の表面に一体成形することが
行われている。そのために、銘板を成形品の所定位置に
一体成形するためには、銘板をキャビティ面の所定位置
に確実に位置決めさせる機構が必要となる。従来の銘板
を一体成形する射出成形機１００の位置決め機構の一実
施例を図８及び９の断面図において説明すると、射出成
形金型１００は、第１金型１０１、第２金型１０２、固
定ピン１０３から構成されている。第１金型１０１と第
２金型１０２は対峙して、型空間（キャビティ）１０４
を形成している。第１金型１０１には、成形品１０５及
び銘板１０６の外観形状を有するキャビティ１０４が形
成され、図８において上下方向に貫通する段付き穴１０
７が、銘板１０６の位置決めに必要な数（少なくとも２
箇所以上）形成されている。この段付き穴１０７は、後
述する固定ピン１０３が嵌挿できる形状に穿設され、前
記銘板１０６に空けられた位置決め用穴１０６ａに対峙
し、挿通可能な位置に穿設されている。固定ピン１０３
は、（図において）上端部に円柱状の頭部１０３ａを有
する有頭ピンで、前記第１金型に穿設された段付き穴１
０７に嵌挿され、頭部１０３ａが前記段付き穴１０７の
段部１０７ａと固定板１０９の（図において）下面１０
９ａとの間で挟着されている。固定ピン１０３の先端１
０３ｂは、銘板１０６を係合させるに十分に足り得る高
さでキャビティ１０４面から突出している。第２金型１
０２は、成形品の裏面（コアー側）を形成し、射出成形
後、成形品を型から突き出す突出し部（不図示）を内蔵
している。また、第２金型には、射出成形機（不図示）
から供給された溶融樹脂をキャビティ１０４内に射出す
るゲート部（不図示）が形成されている。以上の構成を
有する従来の射出成形金型１００の成形工程を説明する
と、まず、第１金型１０１と第２金型１０２を開放した
状態で、銘板１０６の位置決め用穴１０６ａを固定ピン
１０３の先端１０３ｂに挿入して、キャビティ１０４面
に銘板１０６をセットする。次に、図８に示すように第
１金型１０１と第２金型１０２を閉じ、ゲート部（不図
示）から溶融樹脂をキャビティ１０４内に射出する。キ
ャビティ１０４内に射出された溶融樹脂は、銘板１０６
と一体化して固化すると、第１金型１０１と第２金型１
０２が離れ、図９に示すように、銘板１０６の一体成形
品１０５が完成し、突出し部（不図示）により一体成形
品１０５が外部に突き出され、一連の成形工程が終了す
る。2. Description of the Related Art Prior to injection molding, a dial, display panel or nameplate (hereinafter referred to as a nameplate) used in home appliances and electronic devices made of soft film, thin aluminum, etc. has been pressed in close contact with the cavity surface in advance. Therefore, the nameplate is integrally molded on the surface of the molded product. Therefore, in order to integrally form the nameplate at a predetermined position of the molded product, a mechanism for reliably positioning the nameplate at a predetermined position on the cavity surface is required. An embodiment of a positioning mechanism of an injection molding machine 100 for integrally molding a conventional nameplate will be described with reference to the sectional views of FIGS. 8 and 9. The injection molding die 100 includes a first die 101, a second die 102, and a fixed die. It is composed of pins 103. The first mold 101 and the second mold 102 face each other, and a mold space (cavity) 104 is formed.
Is formed. A cavity 104 having the external shape of a molded product 105 and a name plate 106 is formed in the first mold 101, and a stepped hole 10 penetrating vertically in FIG.
7 is the number required to position the nameplate 106 (at least 2
More than one place) are formed. The stepped hole 107 is formed in a shape into which a fixing pin 103, which will be described later, can be inserted, faces the positioning hole 106a formed in the nameplate 106, and is formed in a position where it can be inserted. Fixed pin 103
Is a headed pin having a cylindrical head portion 103a at the upper end (in the figure), and is a stepped hole 1 formed in the first mold.
07, the head 103a has a stepped portion 107a of the stepped hole 107 and the lower surface 10 of the fixing plate 109 (in the drawing).
It is sandwiched between 9a and 9a. Tip 1 of the fixing pin 103
03b protrudes from the surface of the cavity 104 at a height sufficient to engage the name plate 106. Second mold 1
No. 02 has a built-in protrusion (not shown) that forms the back surface (core side) of the molded product and, after injection molding, projects the molded product from the mold. The second mold has an injection molding machine (not shown).
A gate portion (not shown) for injecting the molten resin supplied from the inside of the cavity 104 is formed. A description will be given of a molding process of the conventional injection molding die 100 having the above-described configuration. First, with the first die 101 and the second die 102 open, the positioning hole 106a of the nameplate 106 is fixed to the fixing pin 103. The nameplate 106 is set on the surface of the cavity 104 by inserting it into the tip 103b. Next, as shown in FIG. 8, the first mold 101 and the second mold 102 are closed, and molten resin is injected into the cavity 104 from the gate portion (not shown). The molten resin injected into the cavity 104 is the name plate 106.
When integrated with and solidified, the first mold 101 and the second mold 1
02 is separated, and as shown in FIG. 9, the integrally molded product 105 of the nameplate 106 is completed, and the integrally molded product 105 is projected to the outside by the projecting portion (not shown), and a series of molding steps is completed.

【発明が解決しようとする課題】射出成形金型の位置決
め機構は、一般的に前述のような構造になっているが、
前述したような位置決め機構であれば、銘板１０６の一
体成形品１０５において、銘板１０６の位置決めピン挿
入用穴１０８が空いたままで外観上非常に見栄えの悪い
製品に仕上がってしまう。そのため、固定ピン１０３
（位置決め用ピン）を用いないで銘板の外形で位置決め
する方法も採用されているが樹脂冷却時の熱収縮などに
より位置ズレを起こすなどの問題が発生し、スイッチな
どの機能部品の操作表示などのように寸法精度を要求さ
れる部品においては問題があった。本発明は、このよう
な問題を解決するためになされたもので、銘板１０６の
位置決め穴１０８が空いたままにならない外観上見栄え
の良い、また、操作表示の寸法精度の高い一体成形品を
成形することができる射出成形金型を提供することを課
題とする。The positioning mechanism of the injection molding die generally has the structure as described above.
In the case of the positioning mechanism as described above, in the integrally molded product 105 of the nameplate 106, the positioning pin insertion hole 108 of the nameplate 106 is left open, and the product looks very unsightly. Therefore, the fixing pin 103
The method of positioning with the outer shape of the nameplate without using (positioning pins) is also adopted, but problems such as positional deviation due to heat shrinkage during resin cooling occur, and operation display of functional parts such as switches However, there is a problem in the parts that require the dimensional accuracy. The present invention has been made in order to solve such a problem, and forms an integrally molded product which has a good appearance and does not leave the positioning hole 108 of the nameplate 106 vacant and which has a high dimensional accuracy of the operation display. An object of the present invention is to provide an injection molding die that can be manufactured.

【課題を解決するための手段】本発明による射出成形金
型は、第１金型と第２金型が対峙することにより囲まれ
た空間において、金型のどちらか一方に密接させて薄板
を装填し、空間内に溶融樹脂を射出し、薄板を表面に一
体化した樹脂成形体を成形する射出成形金型において、
前記薄板を、第１金型または第２金型のどちらか一方に
位置決めする位置決め手段と、位置決め手段を付勢し、
空間内に突出させる付勢手段とを有し、空間内に射出す
る溶融樹脂の射出圧力により付勢手段の付勢力に対向
し、位置決め手段を空間内から退出させることを特徴と
するものである。本発明の他の形態は、第１金型と第２
金型が対峙することにより囲まれた空間において、金型
のどちらか一方に密接するように薄板を装填し、空間内
に溶融樹脂を射出し、飾り薄板を表面に一体化した樹脂
成形体を成形する射出成形金型において、位置決め穴を
有する薄板と、第１金型または第２金型のどちらか一方
に、前記位置決め穴に対峙して配設され、空間内に突出
するように付勢され、位置決め穴を挿入する位置決めピ
ンと、位置決めピンを付勢するスプリングとを備え、空
間内に射出する溶融樹脂の射出圧力によりスプリングの
付勢力に対向し、位置決めピンを前記位置決め穴から退
出させることを特徴とするものである。In the injection molding die according to the present invention, a thin plate is brought into close contact with either one of the dies in a space surrounded by the first and second dies facing each other. In an injection mold for loading, injecting molten resin into the space, and molding a resin molded body in which a thin plate is integrated on the surface,
Positioning means for positioning the thin plate in one of the first mold and the second mold, and urging the positioning means,
A biasing means for projecting into the space, and the positioning means is moved out of the space by facing the biasing force of the biasing means by the injection pressure of the molten resin injected into the space. . Another aspect of the present invention is a first mold and a second mold.
In the space surrounded by the molds facing each other, a thin plate is loaded so as to be in close contact with one of the molds, a molten resin is injected into the space, and a resin molded body in which a decorative thin plate is integrated on the surface is formed. In an injection-molding die for molding, a thin plate having a positioning hole and one of a first die and a second die are disposed so as to face the positioning hole, and are biased to project into a space. A positioning pin for inserting the positioning hole and a spring for urging the positioning pin, facing the urging force of the spring by the injection pressure of the molten resin injected into the space, and retreating the positioning pin from the positioning hole. It is characterized by.

【発明の実施の形態】図１乃至図５は本発明の射出成形
金型の一実施の形態の要部構成を示す断面図であり、射
出成形の成形工程を追って順次説明したものである。図
６及び図７は本発明の射出成形金型の位置決め機構の要
部構成を示す拡大断面図であり、位置決めピンの出没動
作を説明するものである。本発明の銘板を一体成形する
射出成形機２００の一実施例を図１において説明する
と、射出成形金型２００は、第１金型１、第２金型２、
位置決め部３から構成されている。第１金型１と第２金
型２は対峙して、型空間（キャビティ）４を形成してい
る。図１に示すように、第１金型１には、成形品５及び
銘板６の外観形状を模るキャビティ４が形成され、（図
において）上下方向に貫通する段付き穴７が銘板６が位
置決められる数（少なくとも２箇所）形成されている。
この段付き穴７は、前記銘板６に空けられた位置決め用
穴６ａに対峙させた位置に穿設され、（図において）下
から小内径部７ａ、中内径部７ｂ、大内径部７ｃと３段
階に順次（図において）上に行くほどほど大きく開口し
ている。小内径部７ａと中内径部７ｂ及び中内径部７ｂ
と大内径部７ｃのそれぞれの接合部は（図において）水
平なフランジ面７ｄ、７ｅを有している。図６に示すよ
うに位置決め部３は、可動ピン８と、可動ピン８を（図
において）下方に付勢するスプリング９と、スプリング
９を収納するとともに可動ピン８の移動の（図におい
て）上限を規制するブッシュ１０から構成されている。
可動ピン８は、ピン部８ａと（図において）上部に円柱
状の頭部８ｂを有する有頭ピンで、ピン部８ａは、前記
段付き穴７の小内径部７ａに、（図において）上下方向
に摺動自在に挿通されている。可動ピン８の頭部８ｂ
は、前記段付き穴７の中内径部７ｂに収納され、ブッシ
ュ１０の（図において）下面１０ａと（図において）水
平のフランジ面７ｄで形成する空間を（図において）上
下に移動する。ブッシュ１０は、中心部にスプリング９
を収納する凹部を形成する円柱体で、前記段付き穴７の
大内径部７ｃに嵌合され、前記段付き穴７の（図におい
て）水平のフランジ面７ｅと固定板１１の（図におい
て）下面１１ａとの間で挟着されている。また、スプリ
ング９は（図において）上端がブッシュの凹部１０ａの
（図において）上底面１０ｂに当接され、（図におい
て）下端が前記可動ピン８の頭部８ｂの（図において）
上面８ｃとの間で張設され、可動ピン８を（図におい
て）下方に付勢している。可動ピン８は、頭部８ｂが前
記中内径部７ｂの空間を（図において）上下方向に移動
し、常にスプリング９により、前記段付き穴７のフラン
ジ面７ｄに当接し、（図において）ピン部８ａの先端が
キャビティ４面から突出している。この突き出している
部分の長さは、銘板６の位置決め用穴６ａがピン部８ａ
に係合するに足る十分な長さを有する。また、可動ピン
８の先端が、射出圧力に押されて上方にスプリング９が
縮退したときは、可動ピン８の先端８ｄがキャビティ４
面に面一になるまで後退する。可動ピン８のピン部８ａ
の先端面８ｄは、キャビティ４面に連続する一体成形品
５の外形を模るように形成されている。第２金型２は、
成形品５の裏面を形成するコアーを形成し、射出成形
後、一体成形品５を突き出す突出し部（不図示）を内蔵
している。また、第２金型には、射出成形機（不図示）
から供給された溶融樹脂をキャビティ４内に射出するゲ
ート部（不図示）が形成されている。次に、本発明の射
出成形金型の動作を説明すると、 （ａ）図１において、まず、第１金型１と第２金型２を
開放する。 （ｂ）図１及び図２において、第１金型１と第２金型２
を開放した状態で、銘板６の位置決め用穴６ａを第１金
型１の可動ピン８に挿入して、（図１において、矢印方
向に挿入する。）キャビティ４内に銘板６を装着する。 （ｃ）図３において、第１金型１と第２金型２を閉じ、
ゲート部（不図示）から溶融樹脂をキャビティ４内に射
出する。 （ｄ）図４において、溶融樹脂の射出圧力が可動ピン８
のピン部８ａの先端を加圧し、射出圧力が前記スプリン
グ９の付勢力に打ち勝つと、可動ピン８が第１金型１内
を後退し、可動ピン８の先端８ｄがキャビティ４に面一
になるまで後退し、銘板６の位置決め穴に溶融樹脂が充
填される。 （ｅ）図５において、キャビティ４内の溶融樹脂が銘板
６及び位置決め用穴６ａと一体化して固化すると、第１
金型１と第２金型２が離れ、可動ピン８は、スプリング
９の付勢力により元の位置に突出する。そして、一体成
形品が、突出し部（不図示）により突き出され、一体成
形品５が型外に取り出され、以上の一連の射出成形工程
が終了する。前述した実施例においては、第１金型１に
位置決め機構を設けたが、突出し部やゲート部などを配
慮すれば第２金型２に設けることも可能である。また、
銘板６の位置決め用穴６ａに樹脂が充填されるため、位
置決め用穴が空洞とはならず、外観上見栄えのよい一体
成形品を形成することができる。また、一体成形品５
は、銘板６の位置決め用穴６ａに樹脂が充填されている
ため、銘板の外形のみならず銘板表面も樹脂体と一体化
しており、一体成形品を使用するときに樹脂体に無理な
変形を加えたとしても、銘板が樹脂体から外れることが
ない。また、銘板６が位置決め用穴６ａ内の樹脂により
位置決めされているため、スイッチなどの機能部品の表
示が正確に表示される。1 to 5 are cross-sectional views showing a main part configuration of an embodiment of an injection molding die of the present invention, which will be sequentially described by following a molding step of injection molding. 6 and 7 are enlarged cross-sectional views showing the configuration of the main part of the positioning mechanism of the injection molding die of the present invention, which illustrates the retracting operation of the positioning pin. An embodiment of an injection molding machine 200 for integrally molding a nameplate of the present invention will be described with reference to FIG. 1. The injection molding die 200 includes a first die 1, a second die 2,
The positioning unit 3 is included. The first mold 1 and the second mold 2 face each other to form a mold space (cavity) 4. As shown in FIG. 1, the first mold 1 is provided with a cavity 4 imitating the external shape of the molded product 5 and the name plate 6, and a stepped hole 7 penetrating in the vertical direction (in the drawing) is formed on the name plate 6. The number of positioning (at least two) is formed.
The stepped hole 7 is formed at a position facing the positioning hole 6a formed in the name plate 6, and the small inner diameter portion 7a, the middle inner diameter portion 7b, and the large inner diameter portion 7c are arranged from the bottom (in the figure). The opening becomes larger as it goes up step by step (in the figure). Small inner diameter portion 7a, middle inner diameter portion 7b, and middle inner diameter portion 7b
And the large inner diameter portion 7c each have a horizontal flange surface 7d, 7e (in the drawing). As shown in FIG. 6, the positioning portion 3 includes a movable pin 8, a spring 9 that biases the movable pin 8 downward (in the drawing), an upper limit of the movement of the movable pin 8 (in the drawing) while housing the spring 9. It is composed of a bush 10 that regulates the.
The movable pin 8 is a headed pin having a pin portion 8a and a cylindrical head portion 8b at the upper portion (in the figure), and the pin portion 8a is vertically (in the figure) in the small inner diameter portion 7a of the stepped hole 7. It is inserted slidably in the direction. Head 8b of movable pin 8
Is housed in the inner diameter portion 7b of the stepped hole 7 and moves up and down (in the drawing) in the space formed by the lower surface 10a (in the drawing) of the bush 10 and the horizontal flange surface 7d (in the drawing). The bush 10 has a spring 9 at the center.
Is a columnar body that forms a concave portion for accommodating therein, and is fitted into the large inner diameter portion 7c of the stepped hole 7, and has a horizontal flange surface 7e (in the figure) of the stepped hole 7 and a fixed plate 11 (in the figure) It is sandwiched between the lower surface 11a. Further, the spring 9 has its upper end (in the drawing) abutted on the upper bottom surface 10b (in the drawing) of the recess 10a of the bush, and (in the drawing) the lower end of the head 8b of the movable pin 8 (in the drawing).
It is stretched between the upper surface 8c and the movable pin 8 and urges it downward (in the figure). In the movable pin 8, the head 8b moves vertically (in the figure) in the space of the inner diameter portion 7b, and the spring 9 constantly abuts the flange surface 7d of the stepped hole 7 (in the figure). The tip of the portion 8a projects from the surface of the cavity 4. As for the length of this protruding portion, the positioning hole 6a of the nameplate 6 has a pin portion 8a.
Long enough to engage with. Further, when the tip of the movable pin 8 is pushed by the injection pressure and the spring 9 is retracted upward, the tip 8d of the movable pin 8 is moved to the cavity 4.
Retreat until flush with the surface. Pin portion 8a of the movable pin 8
8d is formed to imitate the outer shape of the integrally molded product 5 continuous with the surface of the cavity 4. The second mold 2 is
A core that forms the back surface of the molded product 5 is formed, and after the injection molding, a protruding portion (not shown) that projects the integrally molded product 5 is incorporated. The second mold has an injection molding machine (not shown).
A gate portion (not shown) for injecting the molten resin supplied from the inside of the cavity 4 is formed. Next, the operation of the injection mold of the present invention will be described. (A) In FIG. 1, first, the first mold 1 and the second mold 2 are opened. (B) In FIGS. 1 and 2, a first mold 1 and a second mold 2
With the open state, the positioning hole 6a of the nameplate 6 is inserted into the movable pin 8 of the first mold 1 (inserted in the direction of the arrow in FIG. 1), and the nameplate 6 is mounted in the cavity 4. (C) In FIG. 3, the first mold 1 and the second mold 2 are closed,
Molten resin is injected into the cavity 4 from a gate portion (not shown). (D) In FIG. 4, the injection pressure of the molten resin is the movable pin 8
When the injection pressure overcomes the biasing force of the spring 9, the movable pin 8 retracts in the first mold 1, and the distal end 8d of the movable pin 8 is flush with the cavity 4. Then, the positioning hole of the nameplate 6 is filled with the molten resin. (E) In FIG. 5, when the molten resin in the cavity 4 is integrated with the nameplate 6 and the positioning hole 6a and solidified, the first
The mold 1 and the second mold 2 are separated from each other, and the movable pin 8 is projected to the original position by the biasing force of the spring 9. Then, the integrally molded product is projected by the projecting portion (not shown), the integrally molded product 5 is taken out of the mold, and the above series of injection molding steps are completed. In the above-described embodiment, the positioning mechanism is provided in the first mold 1, but it is also possible to provide it in the second mold 2 in consideration of the protruding portion, the gate portion and the like. Also,
Since the positioning hole 6a of the nameplate 6 is filled with the resin, the positioning hole does not become a cavity, and an integrally molded product having a good appearance can be formed. In addition, the integrally molded product 5
Since the positioning hole 6a of the name plate 6 is filled with resin, not only the outer shape of the name plate but also the name plate surface is integrated with the resin body, and when the integrally molded product is used, the resin body is not deformed excessively. Even if added, the nameplate does not come off from the resin body. Further, since the name plate 6 is positioned by the resin in the positioning hole 6a, the display of the functional parts such as the switch is accurately displayed.

【発明の効果】本発明の上述したような構成であるか
ら、前記一体成形品において銘板の位置決め用穴が樹脂
で充填されることにより、銘板面に穴の空かない外観上
見栄えの良い一体成形品が得られる。また、使用時に一
体成形品に無理な変形が加わっても、銘板が外れない安
定した品質の一体成形品が得られる。また、樹脂が位置
決め用穴に充填し終わるまで銘板を確実に保持している
ため、スイッチなどの機能部品の操作表示の位置ずれが
生じない精度の良い一体成形品を成形することができ
る。EFFECTS OF THE INVENTION With the above-mentioned structure of the present invention, by integrally filling the positioning holes of the nameplate in the integrally molded product with resin, the nameplate surface has no holes and is integrally molded with a good appearance. Goods are obtained. Further, even if the integrally molded product is deformed unduly during use, the integrally molded product of stable quality in which the nameplate does not come off can be obtained. In addition, since the nameplate is securely held until the resin is completely filled in the positioning hole, it is possible to form a highly accurate integrated molded product that does not cause displacement of the operation display of the functional parts such as the switch.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明による射出成形金型の一実施形態におけ
る金型を開放した状態を示す断面図である。FIG. 1 is a sectional view showing a state in which a mold is opened in an embodiment of an injection molding mold according to the present invention.

【図２】同じく、金型を開放し銘板を装填した状態を示
す断面図である。FIG. 2 is a sectional view showing a state in which the mold is opened and a nameplate is loaded in the same manner.

【図３】同じく、金型を閉じ溶融樹脂を充填する直前の
状態を示す断面図である。FIG. 3 is a sectional view showing a state immediately before the mold is closed and a molten resin is filled.

【図４】 同じく、溶融樹脂の充填が完了した状態を示
す断面図である。FIG. 4 is likewise a sectional view showing a state in which the filling of the molten resin is completed.

【図５】同じく、溶融樹脂が固化し、金型を開放した状
態を示す断面図である。FIG. 5 is a sectional view showing a state where the molten resin is solidified and the mold is opened.

【図６】本発明による射出成形金型の一実施形態におけ
る位置決め機構の可動ピン８が突出し、銘板６を装着し
た状態を示す断面図である。FIG. 6 is a cross-sectional view showing a state in which a movable plate 8 of a positioning mechanism in an embodiment of an injection molding die according to the present invention is projected and a name plate 6 is attached.

【図７】同じく、射出圧力により可動ピンが後退し、位
置決め用穴６ａに樹脂が充填された状態を示す断面図で
ある。FIG. 7 is a sectional view showing a state in which the movable pin retracts due to injection pressure and the positioning hole 6a is filled with resin.

【図８】従来の射出成形金型の一実施形態における金型
を閉じた状態を示す断面図である。FIG. 8 is a cross-sectional view showing a state in which a mold is closed in an embodiment of a conventional injection molding mold.

【図９】同じく、金型を開放した状態を示す断面図であ
る。FIG. 9 is likewise a sectional view showing a state in which the mold is opened.

【符号の説明】[Explanation of symbols]

１ 第１金型 ２ 第２金型 ４ 空間 ６ 薄板 ５ 一体成形品（樹脂成形体） ２００ 射出成形金型 ８ 可動ピン（位置決め手段） ９ スプリング（付勢手段） ６ａ 位置決め用穴（位置決め穴） ８ 可動ピン（位置決めピン） ９ スプリング（スプリング） 1 first mold 2 second mold 4 space 6 thin plates 5 Integrated molding (resin molding) 200 injection mold 8 Movable pins (positioning means) 9 Spring (biasing means) 6a Positioning hole (positioning hole) 8 Movable pins (positioning pins) 9 Spring (Spring)

───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F202 AD08 AD09 AR07 CA11 CB01 CB12 CB19 CQ01 CQ07 4F206 AD08 AD09 AR075 JA07 JB12 JB19 JQ81    ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 4F202 AD08 AD09 AR07 CA11 CB01                       CB12 CB19 CQ01 CQ07                 4F206 AD08 AD09 AR075 JA07                       JB12 JB19 JQ81

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】第１金型と第２金型が対峙することにより
囲まれた空間において、前記金型のどちらか一方に密接
させて薄板を装填し、前記空間内に溶融樹脂を射出し、
前記薄板を表面に一体化した樹脂成形体を成形する射出
成形金型において、 前記薄板を、第１金型または第２金型のどちらか一方に
位置決めする位置決め手段と、前記位置決め手段を付勢
し、前記空間内に突出させる付勢手段とを有し、前記空
間内に射出する溶融樹脂の射出圧力により前記付勢手段
の付勢力に対向し、前記位置決め手段を前記空間内から
退出させることを特徴とする射出成形金型。1. In a space surrounded by a first mold and a second mold facing each other, a thin plate is loaded in close contact with one of the molds and a molten resin is injected into the space. ,
In an injection-molding die for molding a resin molded body in which the thin plate is integrated on the surface, a positioning means for positioning the thin plate in either the first mold or the second mold, and urging the positioning means. Urging means for projecting into the space, and opposes the urging force of the urging means by the injection pressure of the molten resin injected into the space, and withdrawing the positioning means from the space. An injection molding die characterized by. 【請求項２】第１金型と第２金型が対峙することにより
囲まれた空間において、前記金型のどちらか一方に密接
させて薄板を装填し、前記空間内に溶融樹脂を射出し、
前記薄板を表面に一体化した樹脂成形体を成形する射出
成形金型において、 位置決め穴を有する薄板と、第１金型または第２金型の
どちらか一方に、前記位置決め穴に対峙して配設され、
前記空間内に突出するように付勢され、前記位置決め穴
を挿入する位置決めピンと、前記位置決めピンを付勢す
るスプリングとを備え、前記空間内に射出する溶融樹脂
の射出圧力により前記スプリングの付勢力に対向し、前
記位置決めピンを前記位置決め穴から退出させることを
特徴とする射出成形金型。2. In a space surrounded by a first mold and a second mold facing each other, a thin plate is loaded in close contact with either one of the molds, and a molten resin is injected into the space. ,
In an injection molding die for molding a resin molded body in which the thin plate is integrated on the surface, a thin plate having a positioning hole and one of a first mold and a second mold are arranged facing the positioning hole. Was set up,
A positioning pin that is biased to project into the space and that inserts the positioning hole, and a spring that biases the positioning pin are provided, and the biasing force of the spring is generated by the injection pressure of the molten resin injected into the space. And the positioning pin is made to retreat from the positioning hole.
JP2001373045A 2001-12-06 2001-12-06 Mold for injection molding Pending JP2003170469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001373045A JP2003170469A (en) 2001-12-06 2001-12-06 Mold for injection molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001373045A JP2003170469A (en) 2001-12-06 2001-12-06 Mold for injection molding

Publications (1)

Publication Number Publication Date
JP2003170469A true JP2003170469A (en) 2003-06-17

Family

ID=19181829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001373045A Pending JP2003170469A (en) 2001-12-06 2001-12-06 Mold for injection molding

Country Status (1)

Country Link
JP (1) JP2003170469A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100875570B1 (en) 2007-06-13 2008-12-23 이든텍 주식회사 Horizontal injection mold with movable shaft
JP2009028936A (en) * 2007-07-25 2009-02-12 Toyota Motor Corp Resin injection molding method and resin injection molding mold
CN102862271A (en) * 2012-09-27 2013-01-09 广州市中新塑料有限公司 Surface decorating and forming die and design method thereof
JP2014240185A (en) * 2013-05-15 2014-12-25 東芝機械株式会社 Molding production device, method for producing molding, and molding
US9636856B2 (en) 2013-05-15 2017-05-02 Toshiba Kikai Kabushiki Kaisha Molding system and method of manufacturing molded article
KR20210073926A (en) * 2019-12-11 2021-06-21 주식회사 프라코 Insert Injection Mold For Manufacturing Injection Product Having Air Bag Door And Manufacturing System Of Injection Product
KR102677857B1 (en) * 2023-03-30 2024-06-25 도림공업(주) Injection molding system of airbag box

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100875570B1 (en) 2007-06-13 2008-12-23 이든텍 주식회사 Horizontal injection mold with movable shaft
JP2009028936A (en) * 2007-07-25 2009-02-12 Toyota Motor Corp Resin injection molding method and resin injection molding mold
CN102862271A (en) * 2012-09-27 2013-01-09 广州市中新塑料有限公司 Surface decorating and forming die and design method thereof
JP2014240185A (en) * 2013-05-15 2014-12-25 東芝機械株式会社 Molding production device, method for producing molding, and molding
US9636856B2 (en) 2013-05-15 2017-05-02 Toshiba Kikai Kabushiki Kaisha Molding system and method of manufacturing molded article
US10093048B2 (en) 2013-05-15 2018-10-09 Toshiba Kikai Kabushiki Kaisha Molding system and method of manufacturing molded article
KR20210073926A (en) * 2019-12-11 2021-06-21 주식회사 프라코 Insert Injection Mold For Manufacturing Injection Product Having Air Bag Door And Manufacturing System Of Injection Product
KR102437280B1 (en) * 2019-12-11 2022-08-29 주식회사 프라코 Insert Injection Mold For Manufacturing Injection Product Having Air Bag Door And Manufacturing System Of Injection Product
KR102677857B1 (en) * 2023-03-30 2024-06-25 도림공업(주) Injection molding system of airbag box

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