JP2003167532A - Display device and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve reliability by preventing oxidization and electrolytic corrosion of a signal wiring layer due to exposure on the cut-off edge of a substrate. <P>SOLUTION: A connection part IJ1 is arranged for connecting an end part of the signal wiring layer GLL led out of a display area to a common wiring layer (short-circuit line layer) inside of a cut-off line CTL of a substrate, and this connection part IJ1 is placed under a configuration member such as a driver GDR. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device,
In particular, the present invention relates to an active matrix type display device using a thin film transistor or the like used as a display device for image information or character information such as a mobile phone or a personal digital assistant as a switching element for pixel selection, or a simple matrix type display device not using a switching element.

[0002]

2. Description of the Related Art With the spread of portable information terminals such as mobile phones and portable information terminals, it is required to improve the durability performance of display devices for displaying image information and character information. FIG. 21 is a schematic explanatory view of a schematic structure example of a display device mounted on a mobile phone which is one of portable information terminals. The display device of FIG. 21 is an image of a liquid crystal display device which is widely used at present, but a display device of another type, for example, an organic E
An active matrix type display device such as an L display device has a similar drive structure arrangement.

In FIG. 21, in this display device, a liquid crystal layer is sandwiched in a display area AR between a first substrate SUB1 and a second substrate SUB2. Display area A of the first substrate SUB1
In R, a unit pixel is formed at the intersection of the scanning signal line GL and the image signal line DL. Each pixel is provided with a thin film transistor as a switching element (active element). In the color display, a color filter layer, a counter electrode, and the like are formed on the inner surface of the second substrate SUB2.

The first substrate SUB1 is the second substrate SUB2.
It is slightly larger in size, and various terminal pads (hereinafter, also simply referred to as pads) for receiving a signal from an external signal source (host computer or the like) are formed on the protruding side when the second substrate SUB2 is bonded. In the display device of FIG. 21, a pixel signal drive circuit chip (hereinafter, also referred to as a drain driver) DDR is mounted on one side (the lower side of the drawing) of the first substrate SUB1 and the other side (the left side of the drawing). Is a scanning signal drive circuit chip (hereinafter also referred to as a gate driver)
It is equipped with GDR.

The output side of the gate driver GDR is connected to the scanning signal line GL of the display area AR, and the input side is connected to the pad PAD1 provided on the left side edge of the first substrate SUB1. The output side of the drain driver DDR is a display area AR
Connected to the image signal wiring DL of the first substrate SU on the input side.
It is connected to a pad PAD3 provided on the lower edge of B1.

Pad PAD1 on the gate driver GDR side
The pad PAD2 of the first flexible printed circuit board FPC1 connected to the external signal source is connected to this via an anisotropic conductive film or the like. Similarly, the pad P on the drain driver side
The pad PAD4 of the second flexible printed circuit board FPC2 connected to the external signal source is connected to AD3 by an anisotropic conductive film or the like. The pad PAD1 on the gate driver GDR side is formed on the lower edge of the first substrate SUB1.
There is also one in which the first flexible printed circuit board FPC1 is not provided and the functions thereof are combined into the second flexible printed circuit board FPC2.

FIG. 22 is a schematic explanatory view of another schematic structural example of a display device mounted on a mobile phone which is one of portable information terminals. In this display device, the gate driver G
Both the DR and the drain driver DDR are mounted on the first flexible printed circuit board FPC1 and the second flexible printed circuit board FPC2. Other configurations are similar to those in FIG. In addition to the configurations shown in FIGS. 21 and 22, only the drain driver DDR is provided on the first substrate SUB1.
There are those mounted on the first substrate SUB1 or only the gate driver GDR mounted on the first substrate SUB1.

In any of the above display devices, the wiring P that is drawn from the display area to the pad PAD1 on the gate driver GDR side or the pad P on the drain driver side is provided.
In AD3, the end portion of the wiring drawn out from the display area AR is exposed at the cut end of the first substrate SUB1. In addition to the flexible printed circuit board, the same applies to, for example, a tape carrier package connected to a signal source.

FIG. 23 is a plan view of an essential part for schematically explaining a structural example of a pixel formed in a display area of a display device. Here, a pixel structure of a partially transmissive display device in which an opening is formed in a part of a reflective electrode and which can be used as both a reflective type and a transmissive type will be described. In the figure, reference numeral DLL is an image signal wiring layer forming an image signal wiring, GLL is a scanning signal wiring layer forming a scanning signal wiring, ITO1 is a transparent conductive film (here, a pixel electrode), REL is a reflective electrode layer, and SI. Indicates a semiconductor layer. The reference numerals in the following description are
In the case of using the material of the same layer even if it has a separate function, "L" which means a layer is added and shown. For example, the metal layer for forming the gate line GL is GLL.

[0010]

FIG. 24 is a plan view of an essential part on the gate driver side for schematically explaining a structural example of a terminal portion of a display device, and FIG. 25 is a sectional view taken along the line AA ′ of FIG. FIG. 26 is a sectional view taken along the line BB ′ of FIG.
7 is a sectional view taken along the line CC 'of FIG. Figure 24
Is the mother board of the first substrate SUB1 to the first substrate SU.
The pre-stage of cutting B1 along the cutting line CTL is shown. Since the same applies to the drain driver side, only the gate driver side will be described here.

Reference numeral CGL1 is a common first wiring layer, CG
L2 is a common second wiring layer (here, formed of a transparent conductive film), GLL is a scanning signal wiring layer (here, the first scanning signal wiring layer, aluminum as a material), PAS is an insulating protective film, and ITO1 is transparent. Conductive film (here, second scanning signal wiring layer), DLL is image signal wiring layer, AP2 is second
It is an insulating film opening.

The structure of the terminal portion in the conventional display device is as follows.
As shown in FIGS. 24 to 27, the wiring of the laminated structure of the insulating protection film PAS / transparent conductive film ITO1 / scanning signal wiring layer GLL is drawn from the end of the cutting line CTL of the first substrate. Therefore, the scan signal wiring layer GLL made of aluminum is formed on the cut end of the first substrate by the transparent conductive film IT.
Exposed in contact with O1.

Therefore, when placed in a high-humidity environment, oxidation occurs from the exposed end portion toward the inside to expand the volume. As a result, the signal wiring may be broken. This is a cause of impairing the reliability improvement of the display device and is one of the problems to be solved. An object of the present invention is to solve the above problems and provide a display device having improved reliability.

[0014]

In order to achieve the above object, the present invention has a structure in which the wiring end face on a substrate made of a metal material is not exposed at the cut surface of the substrate. The features of typical means of the present invention are as follows.

Means (1), a substrate, a first scanning signal wiring layer formed on the substrate, and a second scanning signal wiring layer electrically connected to the first scanning signal wiring layer. In the display device, the first scanning signal wiring layer is formed of metal, both ends of which are located inside the end portion of the substrate, and the both ends are formed of other constituent layers or members. The second scanning signal wiring layer is covered with a transparent conductive film, and at least one end of the second scanning signal wiring layer extends to the end of the substrate.

In the means (2) and the means (1), an oxide film of a constituent material of the first scanning signal wiring layer is provided on at least a part of the surface of the first scanning signal wiring layer. To do.

The means (3), the means (1) or (2) is characterized in that it has a switching element connected to the first scanning signal wiring layer.

In any one of the means (4) and the means (1) to (3), the second scanning signal wiring layer is located above the first scanning signal wiring layer. .

In any one of the means (5) and the means (1) to (4), at least one end of the first scanning signal wiring layer is cut by using another constituent layer as a mask. And

In any of the means (6) and the means (1) to (5), there is provided a drive circuit mounted on the substrate,
At least one end of the first scanning signal wiring layer is positioned to overlap with the drive circuit, and the one end is covered with a member that fixes or protects the drive circuit. .

In any of the means (7) and the means (1) to (5), a flexible substrate for supplying a drive signal to the first scanning signal wiring layer is provided on the substrate, and the first substrate is provided.
At least one end of the scanning signal wiring layer is located at a position overlapping the flexible substrate, and the one end is covered with a member that fixes or protects the flexible substrate.

In any one of the means (8) and the means (1) to (7), there is provided a counter substrate which is superposed on the substrate, and a liquid crystal layer sandwiched between the substrate and the counter substrate. It is characterized by having.

In any one of the means (9) and the means (1) to (7), there is provided a counter substrate which is superposed on the substrate, and a sealing material which bonds the substrate and the counter substrate together. One scanning signal wiring layer is characterized in that at least one end is covered with the sealing material.

Means (10), a substrate, a counter substrate, a sealing material for bonding the substrate and the counter substrate, a first scanning signal wiring layer formed on the substrate, and the first
A scanning signal wiring layer and a second scanning signal wiring layer electrically connected to the scanning signal wiring layer, wherein the first scanning signal wiring layer is made of metal, and both ends thereof are end portions of the substrate. It is characterized in that it is located inside, and at least one end thereof is covered with the sealing material, and the second scanning signal wiring layer is formed of a transparent conductive film.

In the means (11) and the means (10), at least one end of the second scanning signal wiring layer extends to the end of the substrate.

With each of the above-mentioned configurations, disconnection of the signal wiring is avoided even when used in a high humidity environment, and reliability is improved. Further, as a method of manufacturing the above display device,
The following means were included.

Means (12), a step of forming a plurality of first scanning signal wiring layers formed of metal on the substrate and connected to each other by a common line, and electrically connecting to the first scanning signal wiring layers. And forming a second scanning signal wiring layer formed of a transparent conductive film and connected to each other by a common line,
Before the step of cutting the substrate and separating the second scanning signal wiring layer from the common line, and the step of cutting the substrate, the first line is provided on the side closer to the display area than the cutting line of the substrate. And separating the scanning signal wiring layer from the common line by etching.

It is needless to say that the present invention is not limited to the above-mentioned constitution and the constitution of the embodiments to be described later, and various modifications can be made without departing from the technical idea of the present invention.

[0029]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will now be described in detail with reference to the drawings of the embodiments.

FIG. 1 is a schematic diagram for explaining an embodiment of the main configuration of the display device of the present invention. Reference numeral SUB1 in the drawing is a first substrate. Here, the substrate material (mother substrate) outside the cutting line CTL has the short-circuit line layer SHL. The display area AR of the display device is sealed with a sealing material SL. The scanning signal wiring layer GLL is made of aluminum material AL
And extends outside the seal SL. A driver (gate driver) GDR is mounted on the left side of the display area AR of the first substrate SUB1 in the figure. Driver GD
The outline of R is shown by a dotted line.

In the embodiment having the configuration on the left side of FIG. 1, the scanning signal wiring layer GLL extends outside the sealing material, and the driver GDR
Short-circuit line layer SH formed of transparent conductive film ITO1 on the lower surface of
It is connected to L. The structure of this connection portion IJ1 will be described later. The scanning signal wiring layer GLL made of aluminum is covered with an anisotropic conductive film or an adhesive layer that connects the bumps of the driver GDR to the terminals of the transparent conductive film ITO. Therefore,
The scanning signal wiring layer GLL made of an aluminum material is shielded from the external atmosphere. With this configuration, disconnection of the signal wiring is avoided even in use in a high humidity environment, and reliability is improved.

The configuration on the right side of FIG. 1 is another embodiment of the present invention, and shows a case where the scanning signal line layer GLL extends to the substrate end opposite to the driver mounting side. The scanning signal wiring layer GLL made of an aluminum material has a transparent conductive film IT in the region of the sealing material.
Connected with O. The structure of this connection portion IJ2 will be described later. The transparent conductive film ITO extends outside the sealing material SL and is connected to the short-circuit line layer SHL formed of an aluminum material. Only the transparent conductive film ITO is exposed at the edge of the cutting line CTL, and the scanning signal wiring layer GLL made of an aluminum material is covered with the sealing material SL. Therefore, the scanning signal wiring layer GLL made of an aluminum material is shielded from the external atmosphere. With this configuration, disconnection of the signal wiring is avoided even in use in a high humidity environment, and reliability is improved.

FIG. 2 is a schematic diagram for explaining another embodiment of the main configuration of the display device of the present invention. This embodiment also applies the present invention to a display device in which the driver GDR is mounted on the first substrate SUB1. Scan signal wiring layer G
LL is made of an aluminum material. A short-circuit line layer SHL similar to that of FIG. 1 is provided outside the cutting line CTL on the left side of FIG.
Are formed. This short-circuit line layer SHL is a transparent conductive film I.
It is made of TO.

On the left side of FIG. 2, the scanning signal wiring layer GLL shown on the upper side is connected to the transparent conductive film ITO extending from the short-circuit line layer SHL in the region of the seal material SL. This connection part IJ
The configuration of 3 will be described later. Further, on the left side of FIG. 2, the scanning signal wiring layer GLL shown on the lower side is connected to the transparent conductive film ITO extending from the short circuit line layer SHL on the display area AR side of the seal material SL. The structure of this connection portion IJ4 will be described later.

The right side of FIG. 2 shows another embodiment of the present invention.
The case where the scanning signal line layer GLL extends to the substrate end opposite to the driver mounting side is shown. The scanning signal wiring layer GLL shown on the upper side is connected to the transparent conductive film ITO extending from the short-circuit line layer SHL in the region of the seal material SL. This connection part IJ5
The configuration of will be described later. In addition, on the right side of FIG. 2, the scan signal wiring layer GLL shown on the lower side is closer to the display area A than the seal material SL.
It is connected to the transparent conductive film ITO extending from the short-circuit line layer SHL on the R side. The structure of this connection portion IJ6 will be described later.

With the configurations shown in FIG. 2, the scan signal wiring layer GLL made of an aluminum material is shielded from the external atmosphere. With this configuration, disconnection of the signal wiring is avoided even in use in a high humidity environment, and reliability is improved.

FIG. 3 is a schematic view for explaining another embodiment of the main configuration of the display device of the present invention. In this embodiment, the present invention is applied to a display device having a driver GDR mounted on a flexible printed circuit board FPC1. The scanning signal wiring layer DLL is formed of an aluminum material. A short-circuit line layer SHL similar to that of FIG. 1 is formed outside the cutting line CTL on the left side of FIG. This short circuit line layer SHL
Is formed of a transparent conductive film ITO.

The scanning signal wiring layer GLL shown on the left side of FIG.
Is connected to the transparent conductive film ITO extending from the short-circuit line layer SHL in the terminal area of the flexible printed circuit board FPC1 indicated by the broken line outside the sealing material SL. The structure of this connecting portion IJ7 will be described later. In addition, the right side of FIG. 3 is another embodiment of the present invention, in which the scanning signal wiring layer DLL is a sealing material S.
Transparent conductive film ITO extending from the short-circuit line layer SHL in the region L
Connected with. The transparent conductive film ITO is connected to the short circuit line layer SHL made of an aluminum material. The structure of the connecting portion IJ8 will be described later.

With the above-described configurations of FIG. 3, the scanning signal wiring layer GLL made of an aluminum material is shielded from the external atmosphere. With this configuration, disconnection of the signal wiring is avoided even in use in a high humidity environment, and reliability is improved.

FIG. 4 is a schematic diagram for explaining another embodiment of the main configuration of the display device of the present invention. This embodiment also applies the present invention to a display device formed by mounting the driver GDR on the flexible printed circuit board FPC1. The scanning signal wiring layer GLL is made of an aluminum material. A transparent conductive film I is provided outside the cutting line CTL on the left side of FIG.
The short-circuit line layer SHL formed of TO is formed.

On the left side of FIG. 4, the scanning signal wiring layer GLL shown on the upper side is connected to the transparent conductive film ITO extending from the short-circuit line layer SHL in the region of the seal material SL. This connection part IJ
The configuration of 9 will be described later. Further, on the left side of FIG. 4, the scanning signal wiring layer GLL shown on the lower side is connected to the transparent conductive film ITO extending from the short-circuit line layer SHL on the display area AR side of the seal material SL. The structure of this connection portion IJ10 will be described later.

The right side of FIG. 4 shows another embodiment of the present invention.
The case where the scanning signal line layer GLL extends to the substrate end opposite to the driver mounting side is shown. The scanning signal wiring layer GLL shown on the upper side is connected to the transparent conductive film ITO extending from the short-circuit line layer SHL in the region of the seal material SL. This connection part IJ1
The configuration of 1 will be described later. Further, the scanning signal wiring layer GLL shown on the lower side on the right side of FIG. 4 is connected to the transparent conductive film ITO extending from the short-circuit line layer SHL on the display area AR side of the seal material SL. The structure of this connection portion IJ12 will be described later.

With the above-described configurations of FIG. 4, the scanning signal wiring layer GLL made of an aluminum material is shielded from the external atmosphere. With this configuration, disconnection of the signal wiring is avoided even in use in a high humidity environment, and reliability is improved. Note that the connection portions IJ1 to IJ12 in FIGS. 1 to 4 have the same configuration and correspond to the configuration in the vicinity of the opening (insulating protective film opening) formed in the insulating protective film described below.

FIG. 5 is a plan view of relevant parts for schematically explaining an embodiment of the detailed structure of the display device of the present invention. 6 is a sectional view taken along the line AA ′ in FIG. 5, FIG. 7 is a sectional view taken along the line BB ′ in FIG. 5, and FIG. 8 is a sectional view taken along the line CC ′ in FIG.
FIG. 9 is a sectional view taken along line D-D 'of FIG. 5 to 9, the above-mentioned FIG. 1 to FIG.
The same reference numerals as in FIG. 2 correspond to the same functional parts. CGL1 is a common first wiring layer, CGL2 is a common second wiring layer, AP1 is a first insulating film opening, AP2 is a second insulating film opening, and PAS is insulation protection. The membrane is shown.

FIG. 5 shows the wiring terminal portion (scanning signal wiring portion) in a state where the manufacturing process of the first substrate SUB1 is completed.
As shown in FIG. 5, the cutting line CTL of the first substrate SUB1
The short circuit line formed by the common first wiring layer CGL1 and the common second wiring layer CGL2 that commonly connects the scanning signal wiring layer GLL to the outside cut off from the final contour of the first substrate SUB1 of the display device (see FIGS. 4 corresponds to the reference symbol SHL). The common first wiring layer CGL1 formed of the same material as the scanning signal wiring layer GLL and the common second wiring layer CGL2 formed of the transparent conductive film ITO1 are electrically connected.

Wiring (corresponding to the second scanning signal wiring layer) made of the transparent conductive film ITO1 is arranged from the short-circuit line portion to the terminal portion (right side of the cutting line CTL). Wiring made of metal (scan signal wiring layer indicated by GLL in the drawing) is arranged in parallel with the transparent conductive film ITO1. The scanning signal wiring layer GLL made of this metal is interrupted in the first insulating protective film opening AP1 of the insulating protective film PAS as shown in FIGS. 6 and 9. Further, the image signal wiring layer DLL made of the same material as the material forming the image signal wiring DL is the transparent conductive film IT.
As shown in FIGS. 7 and 8, the image signal wiring layer DLL formed by stacking aluminum and chromium is formed on the O1 and the second insulating protective film opening portion AP of the insulating protective film PAS is formed.
Part of 2 is cut off. The image signal wiring layer DLL is also formed on the scanning signal wiring layer GLL, whereby the first scanning signal wiring layer GLL and the second scanning signal wiring layer ITO1 are electrically connected and the resistance is reduced. ing.

FIG. 10 is a plan view for schematically explaining the constitution of the terminal portion during the process of forming the thin film transistor on the first substrate. 11 is a sectional view taken along the line AA 'in FIG. 10, and FIG. 12 is a sectional view taken along the line DD' in FIG. First substrate SUB for forming a thin film transistor
During the manufacturing process of No. 1, as shown in FIG. 10, the scanning signal wiring layer GLL passes through the first insulating protective film opening AP1 and is a short circuit line between the common first wiring layer CGL1 and the common second wiring layer CGL2. Connected to the laminated wiring. Transparent conductive film I
TO1 is also the common first wiring layer CGL1 and the common second wiring layer CG
It is connected to the laminated wiring of L2.

13 and 14 are cross-sectional views when the first substrate SUB1 is cut and the driver GDR is mounted in FIG. 1, and FIG. 13 is a cross-sectional view taken along the line BB ′, FIG.
FIG. 6 is a sectional view taken along the line DD ′. First substrate SUB1
The cutting line CTL of is located at a position crossing the first insulating protective film opening AP1. As shown in FIG. 13, the transparent conductive film ITO1 connected to the scanning signal wiring layer GLL is connected to a so-called COG mounted driver or a peripheral member such as a terminal of a flexible printed board or a terminal of a tape carrier package. Since the driver GDR is mounted by COG in FIG. 13, the anisotropic conductive film ASL is applied to the terminal surface, and the peripheral member (driver GDR in FIG. 13) is bonded. Reference numeral DB in FIG. 13 is a bump of the driver GDR, and CB is a conductive bead mixed in the anisotropic conductive film ASL.

Further, as shown in FIG. 14, the exposed end portion of the scanning signal wiring layer GLL in the first insulating protective film opening AP1 is covered with the anisotropic conductive film ASL. Therefore, the end of the metal wiring such as aluminum material is not exposed at the cut end of the substrate. In particular, by arranging the end portion of the metal wiring in the bonding region of the peripheral member (here, the driver GDR) that is arranged and bonded on the upper layer of the anisotropic conductive film ASL, more effective coating can be obtained.

For example, in the case of COG mounting of the driver, the exposed end can be doubly covered with the anisotropic conductive film ASL and the driver by locating the end of the metal wiring under the driver. Therefore, the end of the metal wiring is not exposed to the external environment, and the transparent conductive film ITO1
It is possible to prevent a battery reaction between the metal forming the scanning signal wiring layer GLL and the transparent conductive film ITO1 forming the second scanning signal wiring layer by being shielded from the external environment at the same time as the upper film made of.

When a low resistance aluminum-based material is used for the scan signal wiring layer GLL, hillock generation of aluminum becomes a problem. Therefore, the surface of aluminum is anodized and covered with an anodized film AOL. For the anodization process, the scanning signal wiring layer GLL must once be connected to the common first wiring layer CGL1. Therefore, conventionally, the end of the aluminum wiring is exposed to the cutting line CTL, it is difficult to protect it from the external environment, and so-called electrolytic corrosion is likely to occur. On the other hand, in the present embodiment, such a situation can be avoided and the reliability can be improved.

FIG. 15 is a cross-sectional view of an essential part for schematically explaining an example of the display cell structure of the display device according to the present invention. This display device is a liquid crystal display device. This figure corresponds to a cross-sectional view taken along the line FF ′ of FIG. The scanning signal wiring layer GLL exposed in the first insulating film opening AP1 (see FIGS. 10 to 12) of the terminal portion is removed at the same time when the reflective electrode REL is processed, and the common first wiring layer CGL1 ((FIG. 12) and a first alignment film ORI1 is applied to cover the reflective electrode REL.

A color filter CF partitioned by a black matrix BM is formed on the inner surface of the first substrate SUB2, and an overcoat layer OC covers the color filter CF. A transparent conductive film I, which is a counter electrode, is formed on the overcoat layer OC.
TO2 is formed, and the second alignment film ORI2 is further applied. The second substrate SUB2 is bonded to the first substrate SUB1 via the liquid crystal layer LC. The gap (cell gap) between both substrates is regulated by the spacer beads SB. Next, an embodiment of a method for manufacturing the display device of the present invention will be described.

FIGS. 16, 17 and 18 are process drawings for explaining one embodiment of the method for manufacturing the display device of the present invention.
6, and FIGS. 17 and 18 show the rows “A-1 to A-7” as shown in FIG.
5 is a cross-sectional view sequentially showing the manufacturing process in the pixel along the line FF ', and the "B-1 to B-7" columns show the manufacturing process of the terminal portion along the line DD' in FIG. Sectional view showing "C-1 to C-
Column 7 "is a cross-sectional view showing the manufacturing process of the terminal portion along the line BB 'in FIG. 5 in order. Hereinafter, (1),
(2) will be described.

(1), (A-1) and (B- in FIG. 16)
1), (C-1) ... An aluminum film having a thickness of 300 nm is formed on the first substrate SUB1 by a sputtering method. Next, a resist mask (not shown) is formed by using the photolithography method. After etching this with a mixed solution of phosphoric acid, hydrochloric acid, and nitric acid, the resist mask is removed to obtain the patterns of the scanning signal wiring layer GLL and the common first wiring layer CGL1. This makes it possible to take measures against static electricity and also perform anodic oxidation described later.

(2), (A-2) and (B- in FIG. 16)
2), (C-2) ... The terminal portion of the above pattern of the aluminum scanning signal wiring layer GLL was covered with a resist, the tartaric acid aqueous solution was adjusted to around PH7 with ammonia water, and ethylene glycol solution was added. The aluminum wiring layer is immersed in a solution, and a voltage of 125 V is applied between the pattern of the aluminum wiring layer (scanning signal wiring layer GLL) on the first substrate SUB1 and a platinum electrode (not shown) separately prepared. An anodic oxide film AOL having a thickness of 175 nm is formed on the surface of the. Then, the resist is removed.

(3), (A-3) and (B- in FIG. 16)
3), (C-3) ... A transparent electrode film ITO1 having a thickness of 100 nm is formed on the first substrate SUB1 by a sputtering method. A resist mask is formed on this by a photolithography method, etching is performed with a mixed solution of hydrochloric acid and nitric acid, and then the resist mask is removed to form a transparent electrode film ITO1.
Then, the pixel electrode (see the central portion of (A-3)), the pad of the terminal (see the central portion of the drawing of (C-3)) and the common second wiring layer CGL2 ((B-3) and (C-3)). (The leftmost part of the figure)
To form. As shown in (B-3), in the terminal portion, the leader line of the scanning signal wiring layer GLL to the common first wiring layer CGL1 is not covered with the transparent electrode film ITO1.

(4), (A-4) in FIG. 17 ... Silicon nitride is formed to a thickness of 220 nm by chemical vapor deposition (hereinafter referred to as CVD). Then, amorphous silicon is formed to a thickness of 200 nm, and further amorphous silicon containing 1% of phosphorus (P) is formed to a thickness of 40 nm. A resist mask is formed on this using a photolithography method,
After etching with a fluorine-based gas by a dry etching method, the resist mask is removed to form patterns of the gate insulating layer GI and the semiconductor layer SI. Note that (B-
There is no change in 4) and (C-4).

(5), (A-5) and (B- in FIG. 17)
5), (C-5) ...- Chromium (C
r) is deposited to a thickness of 30 nm, and aluminum is deposited to a thickness of 200 nm thereon. A resist mask is formed by photolithography, and the aluminum film is etched with a mixed solution of phosphoric acid, hydrochloric acid, and nitric acid. next,
After etching the chromium film with a cerium secondary ammonium nitrate solution, the resist mask is removed by stripping,
Image signal wiring layer DLL, source electrode SD1 (DLL),
The drain electrode SD2 (DLL) is formed.

In the terminal portion, since the aluminum layer forming the scanning signal wiring layer GLL and the transparent conductive film ITO1 are natural oxide films formed at the interface, it is difficult to electrically connect them.
The terminal pads made of the scanning signal wiring layer GLL and the transparent conductive film ITO1 are connected by a laminated pattern of aluminum / chromium having chromium as a lower layer capable of contacting both. This aluminum / chromium laminated film is the image signal wiring layer DL.
It is formed at the same time when L is formed.

(6), (A-6) and (B- in FIG.
6), (C-6) ... Silicon nitride is deposited to a thickness of 300 nm by the CVD method. A resist mask is formed using a photolithography method, dry etching is performed with a fluorine-based gas, and then the resist mask is peeled and removed to form an insulating protective film PAS. At this time, in the display region, a contact hole for connecting the reflective electrode REL formed in the next step and the source electrode SD1 (DLL) (see (A-5) in FIG. 17) is formed.

In the terminal portion, the scan signal wiring layer GLL is divided into a pattern made of aluminum and a pattern made of the transparent conductive film ITO1, and the same common wiring layer (CGL).
1, CGL2). A first insulating protective film opening portion AP1 of the insulating protective film PAS is provided at a position where the pattern made of aluminum is located to expose the pattern. The pattern made of the transparent conductive film ITO1 is not exposed. At this time, if the first insulating protective film opening AP1 is arranged so as to cross the cutting line CTL of the substrate, it is possible to reduce the possibility of cracks in the insulating protective film PAS when the substrate is cut.

(7), (A-7) and (B- in FIG.
7), (C-7) ... 3% chromium by sputtering method
Form a film with a thickness of 0 nm,
The film is formed to a thickness of nm. A resist mask is formed by photolithography, and the aluminum film is etched with a mixed solution of phosphoric acid, hydrochloric acid, and nitric acid. Next, the chrome film is etched using a cerium diammonium nitrate solution, and then etched again with a mixed solution of phosphoric acid, hydrochloric acid, and nitric acid, and the resist mask is peeled off to form the reflective electrode REL.

In the second aluminum etching process, the portion exposed in the first insulating protective film opening AP1 of the aluminum lead wire pattern of the terminal portion is removed ((B
-7)). As a result, it is separated from the common first wiring layer CGL1.

(8) After that, the substrate is cut at the cutting line CTL to be separated from the common second wiring layer CGL2. As described above, the measure against static electricity can be taken by connecting the common second wiring layer CGL2 with the transparent conductive film ITO1 until just before the cutting of the substrate. In particular, when there is a switching element, the effect is great because it is easily damaged by static electricity.

According to this manufacturing method, the end portion of the wiring layer connected to the display region has the anisotropic conductive film ASL and the driver GDR,
Alternatively, since it is doubly covered with the flexible printed circuit board or the tape carrier package, the reliability in a high temperature and high humidity environment can be improved.

The uppermost layer of the image signal wiring layer DLL is a refractory metal such as chromium or molybdenum, or a single layer of refractory metal or its alloy, and the reflective electrode REL.
Is a single layer of aluminum or aluminum alloy, or aluminum or aluminum alloy in the upper layer,
By forming a laminated film in which aluminum and a refractory metal capable of batch etching are arranged in the lower layer, the reflective electrode RE
It is possible to simultaneously remove the aluminum pattern of the scanning signal wiring layer GLL in the first insulating protective film opening AP1 during the etching process of L aluminum or aluminum alloy. Therefore, there is also an advantage that it is not necessary to increase the number of steps.

In this embodiment, the insulating protective film PAS under the reflective electrode REL is made of silicon nitride, but the effect of the present invention does not change even if the laminated structure of silicon nitride and an organic film or a single organic film layer is used.

FIG. 19 is a plan view of a main portion for explaining the structure of the terminal portion and the opposite side of the scanning signal wiring layer for explaining another embodiment of the display device of the present invention, and FIG. 20 is GG 'of FIG. It is sectional drawing which followed the line. As described above with reference to FIGS. 1 to 4, the scanning signal wiring layer GLL is connected to a short-circuit line (common wiring layer) (not shown) beyond the cutting line CTL of the substrate. The scan signal wiring layer GLL made of aluminum is cut and separated in the third insulating protective film opening AP3. Therefore, the end portion of the first scanning signal wiring layer GLL is located not inside the end portion of the substrate but inside (closer to the display area AR) than the end portion of the substrate.

In this embodiment, the third insulating protective film opening AP3 is located in the area of the sealing material SL for bonding with the second substrate SUB2, and the third insulating protective film opening AP3 is formed by this sealing material SL. cover. As a result, the end of the scanning signal wiring layer GLL connected to the display area is isolated from the circumflex environment, like the driver, flexible printed circuit board, or tape carrier package covered in the above-described embodiment, and the reliability is improved. can do. Also in this case, the short-circuit line layer SHL may be connected to the outside of the cutting line CTL, and the wiring is not limited to the metal layer and may be laminated with the transparent conductive film ITO.

Although each of the above-described embodiments has been described with respect to the scanning signal wiring layer, the reliability of the display device can be improved by adopting the above-mentioned configuration also for the image signal wiring layer or other similar wiring layers. It can be greatly improved. It goes without saying that the present invention can be applied to a liquid crystal display device, an organic EL display device, a display device having a similar wiring structure, and the like.

[0072]

As described above with reference to the various embodiments, according to the present invention, the terminal portion of the scanning signal wiring layer or the terminal portion of the image signal wiring layer, and the wiring layer to be cut together with other substrates Since the end of the wiring layer connected to the display area such as is covered with a component such as a driver, a flexible printed circuit board, a tape carrier package, or a sealing material that constitutes the display device, high humidity or high temperature and high humidity It is possible to provide a highly reliable display device by avoiding the occurrence of oxidation or electrolytic corrosion at the end of the wiring layer when used in an external environment.

[0073]

[Brief description of drawings]

FIG. 1 is a schematic diagram illustrating an example of a configuration of a main part of a display device of the present invention.

FIG. 2 is a schematic diagram illustrating another embodiment of the main configuration of the display device of the present invention.

FIG. 3 is a schematic diagram illustrating another embodiment of the main configuration of the display device of the present invention.

FIG. 4 is a schematic diagram illustrating another embodiment of the main configuration of the display device of the present invention.

FIG. 5 is a main part plan view schematically explaining an embodiment of the detailed configuration of the display device of the present invention.

FIG. 6 is a cross-sectional view taken along the line A-A ′ of FIG.

7 is a cross-sectional view taken along the line B-B ′ of FIG.

8 is a cross-sectional view taken along the line C-C 'of FIG.

9 is a cross-sectional view taken along the line D-D ′ of FIG.

FIG. 10 is a plan view schematically illustrating the configuration of the terminal portion during the process of forming the thin film transistor on the first substrate.

11 is a cross-sectional view taken along the line A-A ′ of FIG.

12 is a cross-sectional view taken along the line D-D ′ of FIG.

13 is a cross-sectional view taken along the line BB ′ of FIG. 10 when the first substrate is cut and the driver is mounted.

FIG. 14 is a cross-sectional view taken along the line DD ′ of FIG. 10 when the first substrate is cut and the driver is mounted.

FIG. 15 is a main-portion cross-sectional view for schematically explaining an example of the display cell structure of the display device according to the present invention.

FIG. 16 is a process chart for explaining an example of the method for manufacturing the display device of the present invention.

FIG. 17 is a process diagram that follows FIG. 16 and illustrates one embodiment of the method for manufacturing the display device of the present invention.

FIG. 18 is a process diagram that illustrates one example of the method for manufacturing the display device of the present invention, following FIG.

FIG. 19 is a plan view of relevant parts for explaining the configuration of the terminal side and the side opposite to the terminal part of the scanning signal wiring layer for explaining another embodiment of the display device of the present invention.

FIG. 20 is a cross-sectional view taken along the line G-G ′ of FIG. 19.

FIG. 21 is a schematic explanatory view of a schematic structural example of a display device mounted on a mobile phone which is one of portable information terminals.

FIG. 22 is a schematic explanatory diagram of another schematic structural example of a display device mounted on a mobile phone which is one of portable information terminals.

FIG. 23 is a main-portion plan view schematically illustrating a structural example of a pixel formed in a display region of a display device.

FIG. 24 is a main-portion plan view of the gate driver side, which schematically illustrates a structural example of a terminal portion of a display device.

25 is a cross-sectional view taken along the line A-A ′ of FIG.

FIG. 26 is a cross-sectional view taken along the line B-B ′ of FIG. 24.

FIG. 27 is a cross-sectional view taken along the line C-C ′ of FIG. 24.

[Explanation of symbols]

SUB1 ... First substrate, SUB2 ... Second substrate, CTL ... Cutting line, SHL ... Short circuit layer, AR ... Display area, SL ... Seal material, G
LL ... Scan signal wiring layer layer, GDR ... Driver (gate driver), DDR ... Driver (drain driver), ITO1, ITO2 ... Transparent conductive film, IJ1 to IJ12 ...・ Connecting part, AOL ...
・ Anodic oxide film, PAS ... Insulation protection film, REL ...
..Reflecting electrodes, ORI1,2 ... Alignment film, SB ...
..Spacer beads, CB ... Conductive beads, DB
... Driver bumps, ASL, ... anisotropic conductive film,
AP1, AP2 ... ・ Insulation protective film opening, SL ...
・ Seal material, CGL1 ... Common first wiring layer, CGL
2 ... Common second wiring layer.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G09F 9/00 G09F 9/00 348L 9/35 9/35 (72) Inventor Toru Sasaki Hayano, Mobara-shi, Chiba 3300 Address Hitachi, Ltd. Display Group (72) Inventor Tomonori Nishino 3300 Hayano, Mobara, Chiba Prefecture Hitachi Display Group (72) Inventor Hiroko Hayada 3300 Hayano, Mobara City, Chiba Hitachi Display Group, Ltd. Inner F-term (reference) 2H092 HA06 HA12 HA19 JA46 JB22 KA05 KB04 MA17 NA15 NA29 NA30 PA01 5C094 AA32 AA38 AA43 AA48 BA03 BA43 CA19 DA07 DA09 DA14 DB02 EA04 EA05 EC02 FA01 FA02 HFB14 H12H15A14 HAH

Claims (12)

[Claims] 1. A display having a substrate, a first scanning signal wiring layer formed on the substrate, and a second scanning signal wiring layer electrically connected to the first scanning signal wiring layer. In the device, the first scanning signal wiring layer is formed of a metal, both ends thereof are located inside the end portion of the substrate, and the both ends are covered with another constituent layer or member. The second scanning signal wiring layer is formed of a transparent conductive film, and at least one end of the second scanning signal wiring layer extends to the end of the substrate. 2. The display device according to claim 1, wherein an oxide film of a constituent material of the first scanning signal wiring layer is provided on at least a part of the surface of the first scanning signal wiring layer. . 3. The display device according to claim 1, further comprising a switching element connected to the first scanning signal wiring layer. 4. The display device according to claim 1, wherein the second scanning signal wiring layer is located above the first scanning signal wiring layer. 5. The display device according to claim 1, wherein at least one end of the first scanning signal wiring layer is cut by using another constituent layer as a mask. 6. A drive circuit mounted on the substrate, wherein at least one end of the first scanning signal wiring layer is positioned to overlap the drive circuit, and the one end is The display device according to claim 1, wherein the display device is covered with a member that fixes or protects the drive circuit. 7. A flexible substrate for supplying a drive signal to the first scanning signal wiring layer is provided on the substrate, and at least one end of the first scanning signal wiring layer overlaps the flexible substrate. 6. The display device according to claim 1, wherein the one end is covered with a member that fixes or protects the flexible substrate. 8. A liquid crystal layer sandwiched between the substrate and the counter substrate, the counter substrate being overlaid on the substrate, and the liquid crystal layer sandwiched between the substrate and the counter substrate. Display device. 9. A counter substrate laminated on the substrate, and a sealing material for bonding the substrate and the counter substrate together, wherein at least one end of the first scanning signal wiring layer is the seal. It is covered with a material.
8. The display device according to any one of 7 to 7. 10. A substrate, a counter substrate, a sealing material for bonding the substrate and the counter substrate, a first scanning signal wiring layer formed on the substrate, and the first scanning signal wiring layer. And a second scanning signal wiring layer electrically connected to the first scanning signal wiring layer, wherein the first scanning signal wiring layer is made of metal, and both ends of the first scanning signal wiring layer are located inside the end portion of the substrate. The display device is characterized in that at least one end thereof is covered with the sealing material, and the second scanning signal wiring layer is formed of a transparent conductive film. 11. The display device according to claim 10, wherein at least one end of the second scanning signal wiring layer extends to an end of the substrate. 12. A step of forming a plurality of first scanning signal wiring layers formed of metal and connected to each other by a common line on a substrate, and electrically connecting to the first scanning signal wiring layers. A second layer formed of a transparent conductive film and connected to each other through a common line
Forming a scanning signal wiring layer, cutting the substrate, separating the second scanning signal wiring layer from the common line, and cutting line of the substrate before the step of cutting the substrate. And a step of separating the first scanning signal wiring layer from the common line by etching on the side closer to the display area.