JP2003167002A - Probe - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe used for a conduction test of a semiconductor device suitable for use in a high frequency test capable of passing especially a high frequency signal. <P>SOLUTION: On this probe a projecting electrode 20 is pressed on the electrode of a semiconductor device 30. Since the projecting electrode is arranged on at least one part of the exposed portion of a core wire 14, it is not necessary to make the length of a portion electrically unprotected with a coat 18 long. Accordingly a higher frequency signal can be passed through this probe comparing to conventional probes. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe used for conducting a current test of a semiconductor device, and more particularly to a probe suitable for use in a high frequency test of a semiconductor device.

[0002]

2. Description of the Related Art As one of probes used for high frequency testing of semiconductor devices, there is a probe using a coaxial cable. This probe exposes one end of the core wire of the coaxial cable, bends the exposed portion at a predetermined angle like a probe for a general probe card, and bends the bent portion to the tip of a semiconductor device electrode. It is attached to a support plate or a holder in a cantilever shape so as to be used as a part.

[0003]

[Problems to be Solved] However, in the conventional probe, since one end of the core wire is bent, the exposed portion of the core wire (the portion that is not electrically protected by the outer cover) that acts as the transmission path of the test signal is Due to the large length dimension, there is a limit to the frequency of the signal that can be passed, and there is a limit to increasing the frequency of the test signal used.

An object of the present invention is to increase the frequency of a signal that can pass through.

[0005]

A probe according to the present invention comprises a coaxial cable in which at least a part of one end of a core wire is exposed, and a protruding electrode arranged in at least a part of the exposed part of the core wire. Including.

In the probe of the present invention, the protruding electrode is pressed against the electrode of the semiconductor device. This bump electrode is
Since it is disposed on at least a part of the exposed portion of the core wire, it is not necessary to increase the length dimension of the portion that is not electrically protected by the outer cover, and as a result, it is possible to pass a signal having a higher frequency than that of the conventional probe.

The protruding electrode may be attached to at least a part of the exposed portion of the core wire with a conductive adhesive, or may be a plate-like electrode attached to at least a portion of the exposed portion of the core wire. It may be arranged in the seat.

The probe may further include an elastic rubber disposed between the conductive outer cover of the coaxial cable and the core wire and opposite to the protruding electrode. By doing so, the stylus pressure acting between the protruding electrode and the electrode of the semiconductor device increases even though the probe is easily elastically deformed in an arc shape due to overdrive.

The probe further includes a pair of supports mounted on the outer circumference of the coaxial cable in a state of extending in parallel with the one end with the one end of the core wire and the protruding electrode interposed therebetween, and a tip of each support. A second protruding electrode attached to the portion, and both of the second protruding electrodes may be arranged on a support body corresponding to a state in which the protruding electrodes are in between. By doing so, not only the stylus pressure acting between the projecting electrode and the electrode of the semiconductor device becomes large when the probe elastically deforms in an arc shape, but also the second projecting electrode can be used as the ground electrode. it can.

The protruding electrode may have a conical shape or a pyramidal shape. By doing so, when the probe is elastically deformed in an arc shape due to overdrive and is displaced with respect to the electrode of the semiconductor device while the tip of the protruding electrode is in contact with the electrode of the semiconductor device, the tip of the protruding electrode is Surely give a rubbing effect to.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Referring to FIGS. 1-3, a probe 10 includes a coaxial cable 12. Coaxial cable 12
Is a generally semi-rigid cable that includes a conductive core wire 14, an electrical insulator 16 disposed around the core wire 14, and a conductive tubular jacket 18 disposed around the insulator 16. is there.

One end of the coaxial cable 12 has an insulator 16
The outer skin 18 is obliquely removed to expose a part of the outer peripheral surface of one end of the core wire 14. On the outer peripheral surface of the exposed portion of the core wire 14, a plate-shaped seat 22 having the protruding electrode 20 on one surface is adhered by a conductive adhesive 24 such as solder. In this case, one end of the core wire 14 also has the insulator 16
Alternatively, the outer skin 18 may be obliquely removed so as to be flush with the surface to be removed.

The protruding electrode 20 has a pyramid shape or a conical shape, and is integrally formed with the seat 22 by an appropriate technique such as electroforming. Projection electrode 20 and seat 2
2 is made of a conductive material. The seat 22 is attached to the core wire 14 so that the protruding electrode 20 is located at a position protruding from one end of the coaxial cable 12.

A jack 26 is attached to the other end of the coaxial cable 12. The jack 28 is connected to a plug 28 connected to the electric circuit of the tester.

The probe 10 is assembled in the coaxial cable 12 to a support plate or a holder assembled to the support plate. As a result, the probe 10 is attached to the support plate or the holder such that the region of the protruding electrode 20 side from the attachment portion to the support plate or the holder extends in a cantilever shape from the support plate or the holder.

During the energization test of the semiconductor device 30, the probe 10 presses the protruding electrode 20 against the electrode of the semiconductor device 30. The test signal is supplied to the electrodes of the semiconductor device 30 through the core wire 14, the seat 22 and the probe 20.

The probe 10 includes the protruding electrode 20 and the core wire 14
Since it is arranged on the outer peripheral surface of the exposed portion of the wire, it is not necessary to expose one end of the core wire 14 over a wide range and bend it, even though the probe 10 is a cantilever needle, and is electrically protected by the outer skin 18. It is not necessary to increase the length dimension of the non-shielded portion, and as a result, a higher frequency signal can be passed as compared with the conventional probe using the coaxial cable.

Further, since the protruding electrode 20 has a conical or pyramidal shape, the probe 10 is elastically deformed into an arc shape by overdrive, and the tip of the protruding electrode 20 is in contact with the electrode of the semiconductor device 30. Thirty
When it is displaced with respect to the electrode of FIG. As a result, the oxide film on the electrode surface of the semiconductor device 30 is scraped off.

Referring to FIGS. 4 and 5, the probe 40
Removes one end of the insulator 16 and the outer cover 18 to form one end of the coaxial cable 12 into a truncated cone shape, and further removes a part of one end of the insulator 16 to thereby remove one end of the core wire 14. A part of the outer peripheral surface of the part is exposed. Protruding electrode 20
The seat 22 having one side is attached to the outer peripheral surface of the exposed portion of the core wire 14 by a conductive adhesive 24 such as solder.

The probe 40, like the probe 10,
Used by being attached to a support plate or a holder. Further, the probe 40 can also obtain the same operational effect as that of the probe 10.

Referring to FIGS. 6-8, the probe 50
Removes one end of the insulator 16 to expose one end of the core wire 14, and removes one end of the outer cover 18 leaving a region of substantially the same width dimension as the diameter dimension of the core wire 14, Such elastic rubber 52 is arranged between the remaining outer skin 18 and the exposed core wire 14. The seat 22 having the protruding electrode 20 on one surface is made of elastic rubber 52 with respect to the core wire.
It is attached to the outer peripheral surface of the exposed portion of the core wire 14 by a conductive adhesive 24 such as solder so as to be located on the opposite side.

Like the probe 10, this probe 50 is also mounted on a support plate or a holder for use. Further, the probe 50 has the same effects as the probe 10, and since the probe 50 is easily elastically deformed into an arc shape due to overdrive, the pressing force applied between the protruding electrode 20 and the semiconductor device 30. That is, the needle pressure can be finely adjusted.

Referring to FIGS. 9 to 11, the probe 6
0 is a probe 10 shown in FIGS. 1 to 3 with a pair of strip-shaped supports 62, one end of the core wire 14 and the protruding electrode 20.
Coaxial cable 1 so that it extends parallel to one end
The plate-shaped second seat 66 having the second protruding electrode 64 on one surface is attached to the tip of each support body 62.

The two supports 62 are bonded to the outer skin 18 by a conductive adhesive 68 such as solder in a state where the protruding electrodes 20 are located between the second protruding electrodes 64.

Like the probe 10, this probe 60 is also used by being mounted on a support plate or a holder. Further, according to the probe 60, the same effect as that of the probe 10 can be obtained, and the stylus pressure acting between the protruding electrode 20 and the electrode of the semiconductor device 30 becomes large when the probe 60 is elastically deformed in an arc shape. Not only that, the second protruding electrode 64 can be used as a ground electrode.

The protruding electrodes 20 and 64 may have a shape other than a conical shape or a pyramidal shape, for example, a hemispherical shape, a hexagonal shape, a ring shape, or the like. Further, the protruding electrodes 20 and 64 may be directly attached to the core wire 14 and the support body 62 without using the seats 22 and 66, respectively. Wire the protruding electrode 20 to the core wire 1
4, instead of being mounted on the outer peripheral surface of the core wire 4, a groove, a step, a flat surface or the like is formed in the exposed portion of the core wire 14, and the protruding electrode 2 is formed at that portion.
0 or the material 22 may be attached.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of a probe according to the present invention.

FIG. 2 is an enlarged view of a needle tip side portion of the probe shown in FIG.

FIG. 3 is an enlarged view of the probe shown in FIG. 1 viewed from the needle tip side.

FIG. 4 is a front view of a needle tip side portion showing a second embodiment of the probe according to the present invention.

5 is a view of the probe shown in FIG. 4 viewed from the needle tip side.

FIG. 6 is a plan view of a needle tip side portion showing a third embodiment of the probe according to the present invention.

FIG. 7 is a front view of the needle tip side portion of the probe shown in FIG.

8 is a view of the probe shown in FIG. 6 viewed from the needle tip side.

FIG. 9 is a plan view of a needle tip side portion showing a fourth embodiment of the probe according to the present invention.

FIG. 10 is a front view of the needle tip side portion of the probe shown in FIG.

11 is a view of the probe shown in FIG. 10 viewed from the needle tip side.

[Explanation of symbols]

10, 40, 50, 60 probes 12 coaxial cable 14 core wire 16 Insulator 18 hull 20 protruding electrodes 22 seats 24,68 Conductive adhesive 26 plugs 28 Jack 30 Semiconductor devices 52 Elastic rubber 62 support 64 Second protruding electrode 66 Second Seat

Claims (6)

[Claims] 1. A probe comprising a coaxial cable in which at least a part of one end of a core wire is exposed, and a protruding electrode arranged in at least a part of the exposed part of the core wire. 2. The probe according to claim 1, wherein the protruding electrode is attached to at least a part of the exposed portion of the core wire with a conductive adhesive. 3. The probe according to claim 1, wherein the protruding electrode is arranged on a plate-shaped seat mounted on at least a part of the exposed portion of the core wire. 4. The probe according to claim 1, further comprising an elastic rubber disposed between the conductive outer cover of the coaxial cable and the core wire and opposite to the protruding electrode. 5. A pair of supports mounted on the outer periphery of the coaxial cable in a state of extending in parallel to the one end with one end of the core wire and the projecting electrode interposed therebetween, and a tip of each support. The second projecting electrode mounted on the substrate, the second projecting electrodes being arranged on a support body corresponding to a state in which the projecting electrodes are in between. The probe described in. 6. The probe according to claim 1, wherein the protruding electrode has a conical shape or a pyramidal shape.