JP2003164988A - Laser beam machining system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable laser beam machining with high accuracy by making an object to be machined on a stage flat regarding a laser beam machining system in which prescribed machining is executed by conveying a single object to be machined on the stage and irradiating a laser beam. <P>SOLUTION: The system is so constituted that when the object to be machined (paper) conveyed by a conveying means 13 is laid on the stage 12, at least a prescribed part of the outer periphery of the object to be machined is sucked and fixed by suction means 17 (16) via an outer suction hole 23 and the prescribed laser beam machining is executed by a laser beam irradiation means 15. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing system for carrying out a predetermined processing by transporting a single workpiece on a stage and irradiating it with laser light.

[0002]

2. Description of the Related Art In recent years, for example, when processing a workpiece on a stage with a laser, the workpiece is conveyed and fixed on the stage, and the workpiece is irradiated with laser light based on processing information. It is common to apply predetermined processing by For example, it is also practiced to form predetermined information on the paper by forming through holes in the paper with a laser or scraping off a predetermined depth. As described above, when the laser processing is performed on the stage, it is necessary to flatten the workpiece, particularly the flexible workpiece such as paper, on the stage.

Here, FIG. 12 shows an explanatory view of a stage portion in a conventional laser processing system. 12
12A is a schematic perspective view of a stage portion in the laser processing system, FIG. 12B is an explanatory view of one form of the stage surface, and FIG. 12C is an explanatory view of another form of the stage surface. In FIG. 12A, a laser processing system 101
For example, a suction unit 103 for fixing the workpiece is provided below the stage 102 for processing, and a laser irradiation unit 104 is disposed above. This stage 10
For example, a single-leaf sheet 105 as a workpiece is conveyed to the work piece 2, and when the sheet 105 is conveyed to a predetermined position on the stage 102, the suction means 103 fixes the sheet on the stage 102 in a suction state. In addition, stage 1
Although not shown in the figure, a conveying unit that conveys the sheet 105 onto the sheet 02 is, for example, driven by a belt conveying drive.

The stage 102 includes the suction means 10
In order to fix the sheet 105 by suction by means of 3, a hole for suction is formed on the surface thereof. For example, in FIG.
As shown in FIG. 12B, the surface of the stage 102 is formed with a predetermined number of planar circular holes 111 at regular intervals or irregularly, or as shown in FIG. 12C, the surface of the stage 102 has a honeycomb structure. In general, the honeycomb holes 112 are formed.

[0005]

However, when the flexible workpiece such as the sheet 105 is laser-processed on the stage 102, the circular hole 111 or the honeycomb hole 112 is formed on the entire surface of the stage 102. When sucking and fixing by the suction means 103 via the laser, there is a problem in that the corrugation of the circular hole 111 and the honeycomb hole 112 may cause the focus of the laser light to fluctuate and high-precision laser processing may not be performed. is there. On the other hand, if the suction force is weakened in order to prevent the corrugation of the workpiece, the suction fixation becomes unstable and the machining accuracy is degraded.

Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a laser processing system that flattens a workpiece on a stage and enables high-precision laser processing.

[0007]

In order to solve the above problems, according to the invention of claim 1, a laser processing system for irradiating a workpiece with a laser beam according to predetermined processing information to perform a predetermined processing. And a stage in which at least a predetermined number of outer suction holes for suction-fixing a predetermined portion around the workpiece is formed in order to place the workpiece and perform the laser processing. In order to fix the workpiece by suction during laser processing of the workpiece on the stage, at least suction means for sucking from the outer suction hole, and at least the workpiece with respect to the stage. And a laser irradiation means for irradiating the object to be processed positioned on the stage with a laser beam to perform a predetermined processing.

According to the second to fourth aspects of the present invention, the "the stage has a structure in which the workpiece is mounted at a predetermined height inside the outer suction hole", and is "formed on the stage. A predetermined inner suction hole is formed inside a predetermined number of outer suction holes, and the suction means makes the suction force of the inner suction hole different from that of the outer suction hole.
And a predetermined number of outer suction holes formed on the stage are formed at least at positions facing the outer periphery of the workpiece.

As described above, when the workpiece conveyed by the conveying means is placed on the stage, a predetermined portion of the outer periphery of the workpiece is sucked and fixed by the suction means through the outer suction holes. A predetermined laser processing is performed by the laser irradiation means. That is, since the outer peripheral portion of the workpiece is suction-fixed by the outer suction hole, the workpiece on the stage can be flattened without waviness in the inner portion, and high-precision laser processing is possible. Is possible.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to the drawings. In the present embodiment, the object to be processed is a sheet, and characters and figures are appropriately printed on the sheet, and the laser processing method can be applied to both penetration and surface cutting. This means that the work piece is not limited to a sheet and is not limited to a processing form, and any object can be used as long as it has an effect of preventing waviness on the stage in the present invention and performing reliable suction fixation. Of course, it may be.

FIG. 1 shows a block diagram of a first embodiment of a laser processing system according to the present invention. A laser processing system 11 shown in FIG. 1 shows a main part thereof, and includes a stage 12, belt transfer units 13 and 14 as a transfer unit, a laser irradiation unit 15, and first and second suction mechanisms as a suction unit. It has 16 and 17. The stage 12 has an opening 22 formed on a surface on which a sheet of paper to be processed is placed, and a predetermined number of rollers 21 which are rotatable members at least in the transport direction of the sheet of paper are provided in the opening 22. It is a thing. The upper portion of each roller 21 is arranged higher than the surface of the stage 12 (described in FIG. 2). The gap between the rollers 21 in the opening 22 serves as an inner suction hole for the inner portion of the sheet (the inner portion of the outer suction hole 23).

Further, on the stage 12, a predetermined number of outer suction holes 23 for suction-fixing a predetermined portion around the placed paper are formed. In FIG.
Seven pieces are formed on each of the opposite side portions in the sheet conveying direction, and two pieces are formed on the opposite side in the direction perpendicular to this direction. That is, as shown in FIG. 2 described later, the eighteen outer suction holes 23 suction and fix the periphery of the sheet.

The belt transport unit 13 is for transporting the paper to the stage 12, and the belt transport unit 14 is for discharging the laser-processed paper on the stage 12. Although each of the belt transport units 13 and 14 is illustrated as transporting the sheet of the work piece in a placed state, it may be configured in two stages to sandwich and transport the sheet. Good. A mechanism for discharging the sheet to the belt transport unit 14 is omitted, and the sheet can be discharged by rotating and driving a predetermined number of rotating members 21 on the side of the belt transport 14, for example.

The laser irradiation means 15 comprises a stage 12
This is for irradiating the sheet positioned above with a laser beam based on processing information transmitted from a control means (not shown) to perform a predetermined processing. The laser irradiation by the laser irradiation unit 15 is performed by scanning the paper within the laser irradiation range by a drive control unit (not shown).

The first suction mechanism 16 sucks and fixes the inside portion of the sheet on the processing position of the stage 12 during laser processing by sucking it from the gap portion (inner suction hole) between the rollers 21 to fix it. The purpose is to prevent misalignment of the sheet during laser processing. In this case, the suction force is appropriately adjusted according to the thickness, hardness, etc. of the sheet (workpiece) so that the sheet to be sucked does not undulate with each roller 21. Further, the suction mechanism 16 also plays a role of discharging smoke generated during laser processing.

The second suction mechanism 17 is for sucking and fixing the sheet through the outer suction hole 23, and in combination with the height of the upper portion of each roller 21, the inner area of the sheet (at least the laser beam). This is for flattening the processing area). These first and second suction mechanisms 16,
Reference numerals 17 are respectively controlled by suction drive control means (not shown), and are different so that the suction force by each outer suction hole 23 is larger than the suction force by the inner suction hole.

FIG. 2 is a block diagram of the stage shown in FIG. FIG. 2A is a plan view of the stage.
FIG. 2B is a sectional view taken along line AA of FIG. Figure 2
In (A) and (B), the inside of the stage 12 is a space region, and the opening 22 is formed on the upper surface (surface).
In the figure, as an example, eight rollers 21 are rotatably supported by shafts 21A so as to be rotatable in the paper conveying direction between the opposite side parts in the opening 22. Each roller 21
Is made of aluminum, for example, having an outer diameter of 6 mm and a length of 150 mm, and is subjected to a treatment for forming a black corrosion-resistant oxide film by anodizing the surface to prevent reflection of laser light. These rollers 21 may be rotated by a force that is simply applied, and rotation control may be performed by a driving unit (not shown).

The upper portion of each roller 21 is arranged, for example, 0.5 mm higher than the surface of the stage 12, and the area occupied by these rollers on the stage 12 is larger than the laser irradiation range of the laser irradiation means 15. It is what is done. These rollers 21 can be detachable one by one, for example, by providing a spring in the shaft 21A. In the figure, eight rollers 2 as an example
Although the case where 1 is arranged is shown, for example, when A4 size paper is used, the roller 21 having the above size is 7
21 pieces are arranged at a mm pitch.

Assuming that the paper 31 indicated by the chain double-dashed line is located on the stage 12, the outer circumference of the paper 31 is suctioned and fixed by the outer suction holes 23, and the paper is provided in the opening 22. The gap portion of the roller 21 serves as an inner suction hole to fix the inner region of the sheet 31 by suction. Further, a range 32 of laser irradiation by the laser irradiation means 15 on the stage 12 is shown by a chain line, and each roller 21 is provided such that the range occupied on the stage 12 is larger than the laser irradiation range 32. .

That is, as shown in FIG.
When the sheet 31 is placed on the stage 12 at the processing position by the rotation of the corresponding roller 21 (and / or the slip on the surface of the roller 21), the outer suction force 17A (for example, by the suction drive of the second suction mechanism 17) (for example, When the paper 31 is plain paper, the periphery of the paper 31 is suction-fixed at 1 KPa for each hole, and each roller 21 is driven by suction of the second suction mechanism 16.
The inner suction force of 16 A (for example, 0.
1 KPa) to suck and fix the sheet 31 flat on at least the laser irradiation range 32 on the surface of each roller 21.

Therefore, FIG. 3 shows an explanatory view of the processing state of the laser processing system in FIG. In FIG.
The sheet 31 is conveyed by the belt conveying unit 13, and the stage 1
2 is carried onto the corresponding roller 21.
The rotation (and / or surface slip) of the above allows the sheet 12 to be smoothly carried in onto the stage 12 without being caught by any of them, and to be transported to the processing position and mounted. At that time, the second suction mechanism 17 carries out suction driving, and the outer circumference of the sheet 31 is sucked and fixed by the outer suction force 17A through the outer suction holes 23, and the first suction mechanism 16 carries out suction driving. Laura 2
At least the laser irradiation range 32 of the paper 31 is flattened by sucking and fixing the inner region of the paper 31 with the inner suction force 16A through the inner suction hole of the gap portion 1.

Then, based on the predetermined processing information, the laser irradiation means 15 sequentially irradiates a predetermined position on the paper 31 with the laser beam 15A to perform the laser processing. After the laser processing, the first and second suction mechanisms 16,
The suctioned sheet 17 is released, and the processed sheet 31 is discharged to the belt conveying section 14 and conveyed to a stacker or the like.

As described above, when the carried-in paper 31 is placed on the stage 12, the paper 31 is taken out through the outer suction holes 23.
Since the outer peripheral portion of the sheet is suction-fixed and the inner area is suction-fixed by the inner suction hole portion, the sheet 31 on the stage 12 can be flattened without waviness in the inner area, and high precision is achieved. The laser processing can be performed. It should be noted that when the sheet 31 is carried onto the stage 12, the sheet 31 is smoothly positioned on the stage 12 without being caught by any of the corresponding rollers 21 and the like, so that the transport obstacle is prevented. The sheet 31 can be stably conveyed on the stage 12. Further, since the contact area between each roller 21 and the paper 31 is small, it is possible to reduce the damage given to the roller 21 at the time of the penetration processing by the laser, and to make each roller 21 detachable so that the roller 21 is damaged. The replacement of 21 can be facilitated.

Next, FIG. 4 shows a block diagram of another embodiment of the laser processing system according to the present invention. In the roller 21 provided on the stage 12 of the laser processing system 11 shown in FIGS. 1 to 3, the case where the rollers 21 are provided in one row in the inner area of the outer suction hole 23 in the sheet conveying direction is shown.
In the laser processing system 11 shown in (2), for example, two openings 22A and 22B are formed in the inner region of the outer suction hole 23 formed on the stage 12, and each roller 21A is arranged in two rows. The rollers 21A in this case differ only in length, and each roller 21A on the stage 12
Similar to the above, the range occupied by A as a whole is larger than the laser irradiation range 32.

That is, the gaps between the rollers 21A in the openings 22A and 22B in which the rollers 21A are provided serve as inner suction holes, and are arranged in two rows with respect to the sheet conveying direction. Also, similarly to the above, by suction-fixing by the first and second suction mechanisms 16 and 17, the sheet 31 on the stage 12 is flattened without causing waviness in the inner region of the outer suction hole 23. It is possible to perform high precision laser processing.

Next, FIG. 5 shows a configuration diagram of a second embodiment of the laser processing system according to the present invention, and FIG.
The block diagram of the stage is shown. In addition, FIG. 5 and FIG.
Although shown as a single embodiment, it may be mixed with the rotating member in the first embodiment. The laser processing system 11 shown in FIG.
As a rotating member in the inner region of the outer suction hole 23 on the upper side 2, a predetermined number of rolling members that are rotatable at least in the transport direction of the paper 31 that is the workpiece are provided in the holder 41A as shown in FIG. 6B. With the spherical roller 41 which is
A predetermined number of inner suction holes 42 are provided at predetermined positions in the area where the rollers 41 are provided (FIGS. 5 and 6 (A)), and other configurations are the same as those in FIGS. 1 and 4. And
The description is omitted. Note that FIG. 6B is B of FIG.
It is a -B sectional view.

That is, each spherical roller 41 is made of, for example, a stainless ball having an outer diameter of 6 mm, and its surface is treated with black to prevent reflection of laser light.
It is provided so as to have a height of, for example, 5 mm above the surface. As shown in FIG. 6 (B), each of the spherical rollers 41 is provided with a corresponding number of holders 41A on the upper part of the stage 12, and rotates in any direction so as not to be separated into the holders 41A. It is held freely.

Then, similarly to the above, the outer suction holes 23 suck and fix the periphery of the sheet 31 placed by the second suction mechanism 17 by the suction force 17A. In addition, the inner suction hole 42
Is for sucking and fixing the laser irradiation range 32 which is the inner area of the paper 31 by the suction force 16A by the first suction mechanism 16 and for discharging the smoke generated by the laser irradiation of the penetration processing. The arrangement is set appropriately. It should be noted that at least the range occupied by each spherical roller 41 on the stage 12 is set larger than the laser irradiation range 32 as in the above.

That is, as shown in FIG. 6B, when the corresponding spherical roller 41 rotates (and / or slips on the surface) with respect to the sheet 31 carried on the stage 12, the sheet 31 is transferred. Without being caught in any of them, it is smoothly conveyed to the processing position, and the first and second
After the sheet 31 is suctioned and fixed by the suction mechanisms 16 and 17 to flatten the laser irradiation range 32, laser light 15A is emitted from the laser irradiation means 15 according to the processing information, and laser processing is performed. . Although FIG. 5 and FIG. 6 show the case where the rolling member as the rotating member is the spherical roller 41, a rod-shaped rolling member which is rotatable in the sheet conveying direction may be used.

As described above, by forming a predetermined number of inner suction holes 42 on the stage 12 in addition to the outer suction holes 23, similarly to the above, the first and second suction mechanisms 1 are also provided.
The outer suction hole 2 is fixed by suctioning with 6, 7
Stage 1 without waviness in the inner area of 3
The sheet 31 on the second sheet can be flattened, and high-precision laser processing can be performed. By providing each spherical roller 41 (rolling member), the contact area between these and the paper 31 is small, and the damage given to the roller 41 (rolling member) at the time of laser penetration processing can be reduced. is there.

Next, FIG. 7 shows a block diagram of a third embodiment of the laser processing system according to the present invention, and FIG.
The block diagram of the stage is shown. The laser processing system 11 shown in FIG. 7 has an inner suction hole structure 51 in the inner region of the outer suction hole 23 on the stage 12, instead of the above-mentioned rotating member.
The upper surface thereof is, for example, 0.
The belt conveyors 13 and 14, the laser irradiation means 15, and the first and second suction mechanisms 16 and 17 are the same as those described above, and the description thereof will be omitted.
A side sectional view of the inner suction hole structure 51 is shown in FIG. 8B and 8C are plan views showing the planar shape of the suction holes in the inner suction hole structure 51.

The inner suction hole structure 51 shown in FIG.
Is a regular (or irregular) predetermined number of planar circular holes 51A formed on substantially the entire surface, and the inner suction hole structure 51 shown in FIG. 8C has a planar honeycomb structure on almost the entire surface. The honeycomb holes 51B are formed.

That is, the plane circular hole 5 is formed on the stage 12.
1A or an inner suction hole structure 51 in which honeycomb holes 51B are formed is provided, the inner region of the sheet 31 placed by the first suction mechanism 16 is fixed by suction, and the second suction is performed through the outer suction hole 23. By suction-fixing the outer peripheral portion by the mechanism 17, similarly to the above, the sheet 31 on the stage 12 is not wavy in the inner region of the outer suction hole 23.
Can be flattened, and high-precision laser processing can be performed.

Next, FIG. 9 shows a block diagram of a fourth embodiment of the stage in the laser processing system according to the present invention. The stage 12 shown in FIG. 9 has an outer suction hole 23 on its surface, which is driven by suction by a second suction mechanism 17 similar to the above.
And a pedestal frame 52, which is inside the outer suction hole 23 and is larger than the laser irradiation range (32), is provided at a height of, for example, 0.5 mm above the surface of the stage 12. The inside of the pedestal frame 52 serves as an inside suction hole, which is suction-driven by the first suction mechanism 16.

That is, the paper (31) is placed on the pedestal frame 52 which is provided higher than the surface of the stage 12, and the periphery of the paper (31) is surrounded by the outer suction holes 23 by the suction drive of the second suction mechanism 17. By sucking and fixing the sheet with the suction force of 17A, and by sucking and fixing the inner region of the sheet (31) with the suction force of 16A through the inner suction hole formed by the pedestal frame 52 by the suction drive of the first suction mechanism 16. Also, similarly to the above, the sheet (31) on the stage 12 can be flattened without causing waviness in the inner region of the outer suction hole 23, and high-precision laser processing can be performed. is there.

Next, FIG. 10 shows a block diagram of a fifth embodiment of the stage in the laser processing system according to the present invention. In the stage 12 shown in FIG. 10, the outer suction holes 23 similar to the above are provided on the surface thereof, and the pedestal plate 53 which is inside the outer suction holes 23 and is larger than the laser irradiation range (32) is the stage. It is provided at a height of, for example, 0.5 mm from the 12 surface. That is,
The stage 1 is configured only by the outer suction holes 23 sucked by the second suction mechanism 17 without performing the suction fixation by the inner suction holes described above.
The sheet (31) on the second sheet is fixed by suction, and the first suction mechanism 16 is omitted accordingly.

As described above, the sheet (31) is placed on the pedestal plate 53 provided higher than the surface of the stage 12,
The second suction mechanism 17 is used to drive the suction so that the outer suction holes 23 alone fix the suction. In this case, the suction force 17A is adjusted according to the hardness (weight) of the sheet (31) to be processed.

By sucking and fixing the sheet (31) to be processed only by the outer suction holes 23 in this manner, similarly to the above, the inside area of the outer suction holes 23 is not corrugated, and the stage 12 is placed on the stage 12. The paper (31) can be flattened and high-precision laser processing can be performed.

Next, FIG. 11 shows a block diagram of a sixth embodiment of the stage in the laser processing system according to the present invention. The present embodiment is the stage 1 shown in the first embodiment.
However, it is needless to say that it can be applied to the stage 12 shown in the above-described second to fifth embodiments.

The stage 12 in the laser processing system shown in FIG. 11A has an outer suction hole 2 for suction-fixing the outer periphery of the paper (31) placed on the stage 12.
7 is formed on each of the opposite side portions in the sheet conveying direction, and holes are not formed before and after facing each other in the direction perpendicular to this direction. That is, by adjusting the suction force 17A according to the hardness (weight) of the sheet (31) to be processed, even if only these 14 outer suction holes 23 are provided, the outer suction holes 23 can be formed in the same manner as above. Without waviness in the inner area, the paper (3
1) can be flattened and high-precision laser processing can be performed.

Further, in the stage 12 in the laser processing system shown in FIG. 11B, the outer suction holes 23 for sucking and fixing the outer periphery of the sheet (31) placed on the stage 12 are arranged in the sheet conveying direction. Four holes are formed in each of the front and rear sides facing each other in the vertical direction, and the holes are not formed in the side portions facing each other in the sheet conveying direction. That is, by adjusting the suction force 17A according to the hardness (weight) of the sheet (31) to be processed, even if only these eight outer suction holes 23 are provided, the outer suction holes 23 can be similarly processed as described above.
Stage 12 without waviness in the inner area of the stage
The upper sheet (31) can be flattened and high-precision laser processing can be performed.

Further, in the stage 12 in the laser processing system shown in FIG. 11B, the outer suction holes 23 for sucking and fixing the outer periphery of the paper (31) placed on the stage 12 have the paper (31). 4) are formed so as to oppose to the portions corresponding to the four corners of the circumference, and other side portions in the paper transport direction and holes in the front and rear sides in the vertical direction in this direction other than that are omitted. is there. That is, by adjusting the suction force 17A according to the hardness (weight) of the sheet of paper (31) to be processed, even if only these four outer suction holes 23 are provided, the outer suction holes 23 are similar to the above.
Stage 12 without waviness in the inner area of the stage
The upper sheet (31) can be flattened and high-precision laser processing can be performed.

By the way, in the above first to sixth embodiments,
The case where the rollers (21, 21A), the rollers 41, the pedestal frame 52, and the pedestal plate 53 are provided with their upper surfaces higher than the surface of the stage 12 by a predetermined amount when the paper (workpiece) is placed on the stage 12 is shown. However, depending on the hardness (weight) of the sheet (31) to be processed, the surface may be on the same surface as the stage, and by fixing by suction with the outer suction hole 23 and / or the inner suction hole, similar to the above, It is possible to prevent waviness from occurring in the laser irradiation range 32, and it is possible to perform highly accurate laser processing by flattening the paper (31) on the stage 12.

[0044]

As described above, according to the present invention, when the work carried by the carrying means is placed on the stage, a predetermined outer circumference of the work is provided via the outer suction holes. By sucking and fixing the portion with the suction means and causing the laser irradiation means to perform the predetermined laser processing, the workpiece on the stage can be flattened, and high-precision laser processing can be performed. It is possible.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a first embodiment of a laser processing system according to the present invention.

FIG. 2 is a configuration diagram of a stage in FIG.

FIG. 3 is an explanatory diagram of a processing state of the laser processing system in FIG. 1.

FIG. 4 is a configuration diagram of another embodiment of the laser processing system according to the present invention.

FIG. 5 is a configuration diagram of a second embodiment of a laser processing system according to the present invention.

6 is a block diagram of the stage of FIG.

FIG. 7 is a configuration diagram of a third embodiment of a laser processing system according to the present invention.

8 is a configuration diagram of the stage in FIG. 7. FIG.

FIG. 9 is a configuration diagram of a fourth embodiment of a stage in the laser processing system according to the present invention.

FIG. 10 is a configuration diagram of a fifth embodiment of a stage in a laser processing system according to the present invention.

FIG. 11 is a configuration diagram of a sixth embodiment of a stage in the laser processing system according to the present invention.

FIG. 12 is an explanatory diagram of a stage portion in a conventional laser processing system.

[Explanation of symbols]

11 Laser processing system 12 stages 13, 14 Belt conveyor 15 Laser irradiation means 16 First suction mechanism 17 Second suction mechanism 21 Laura 22 opening 23 Outside suction hole 31 sheets 32 Laser irradiation range 41 Roll 42 Inside suction hole 51 Inside suction hole structure 52 pedestal frame 53 base plate

Claims (4)

[Claims] 1. A laser processing system for performing predetermined processing by irradiating a work with a laser beam according to predetermined processing information, wherein the work is placed and the laser processing is performed. Therefore, a stage in which at least a predetermined number of outer suction holes for fixing a predetermined portion around the workpiece by suction is formed, and the workpiece is sucked during laser processing of the workpiece on the stage. In order to fix, at least suction means for sucking from the outer suction hole, at least a transport means for transporting the workpiece to the stage, and to the workpiece positioned on the stage A laser processing system for irradiating a laser beam to perform a predetermined process, and a laser processing system. 2. The laser processing system according to claim 1, wherein the stage has a structure for mounting the workpiece at a predetermined height inside the outer suction hole. system. 3. The laser processing system according to claim 1, wherein a predetermined inner suction hole is formed inside a predetermined number of outer suction holes formed in the stage, and the suction means comprises: A laser processing system comprising a first and a second suction mechanism for making suction forces of the inner suction hole and the outer suction hole different from each other. 4. The laser processing system according to claim 1, wherein a predetermined number of outer suction holes formed in the stage oppose at least the outer circumference of the workpiece. A laser processing system characterized by being formed at a position.