JP2003163557A - Manufacturing method of surface-mounted piezoelectric vibrator - Google Patents

Manufacturing method of surface-mounted piezoelectric vibrator

Info

Publication number
JP2003163557A
JP2003163557A JP2001362593A JP2001362593A JP2003163557A JP 2003163557 A JP2003163557 A JP 2003163557A JP 2001362593 A JP2001362593 A JP 2001362593A JP 2001362593 A JP2001362593 A JP 2001362593A JP 2003163557 A JP2003163557 A JP 2003163557A
Authority
JP
Japan
Prior art keywords
piezoelectric vibrator
lead
resin
electrode
type cylindrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001362593A
Other languages
Japanese (ja)
Inventor
Shunei Oi
俊英 大井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyota KK
Original Assignee
Miyota KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miyota KK filed Critical Miyota KK
Priority to JP2001362593A priority Critical patent/JP2003163557A/en
Publication of JP2003163557A publication Critical patent/JP2003163557A/en
Pending legal-status Critical Current

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Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To avoid exposing a surface of a cylindrical sealing pipe of a lead type cylindrical piezoelectric vibrator from a top and bottom surfaces, and poor printing and a defect by a short upon mounting in a surface-mounted piezoelectric vibrator, in which a portion of a lead frame becomes an electrode of the surface-mounted piezoelectric vibrator and a bottom surface of the electrode is not covered with resins, and to provide a thin, downsized, and inexpensive surface-mounted type piezoelectric vibrator. <P>SOLUTION: In a manufacturing method of the surface-mounted piezoelectric vibrator, a lead of a lead type cylindrical piezoelectric vibrator 1 having two leads at one end is fixed to a lead frame, the lead frame is insertion-molded by a resin 8, a portion of the frame becomes an electrode of the vibrator by cutting and forming, and the bottom surface of the electrode is not covered with the resin 8. An insertion-mold has no push pin of the lead type cylindrical piezoelectric vibrator 1, an upper mold 21 shifts to an upper direction during insertion-molding of a resin, a lower mold 22 shifts to a lower direction, and the lead type cylindrical piezoelectric vibrator 1 is resin-molded. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は表面実装型圧電振動
子の製造方法に関するものである。 【0002】 【従来の技術】電子部品の表面実装化が進み、電子部品
の一つである圧電振動子も表面実装に対応するものが増
えている。圧電振動子の表面実装型構造は、表面実装に
対応するケースに直接圧電素子を組込む構造と、リード
タイプ筒型圧電振動子をリードフレームに固定して樹脂
でインサートモールドしカットアンドフォーミングする
構造とに大別される。本発明は後者の構造に関するもの
である。 【0003】図1は従来技術による代表的な表面実装型
圧電振動子の正面図、図2は上面図であり、樹脂内部に
インサート成形されているリードタイプ筒型圧電振動子
とリードフレームを点線で表示している。図6はリード
タイプ筒型圧電振動子の分解斜視図である。リードタイ
プ筒型圧電振動子は、2本のリードを有する気密端子に
振動片を固定し、筒型封止管で封止する一般的な振動子
である。表面実装型圧電振動子は、リードタイプ筒型圧
電振動子1のリード2、3をリードフレームの表面実装
型圧電振動子の電極となる端子部4、5に抵抗溶接また
はレーザー溶接等により固定する工程、電極4、5と端
子6、7を残して樹脂8によりインサート成形する工
程、リードフレームから電極4、5及び端子6、7を切
り離す工程、電極4、5及び端子6、7を曲げ加工し、
樹脂8の下部に電極4、5及び端子6、7の一端を配置
する工程により製造される。表面実装型圧電振動子の上
面には型番や製造年月等が印刷される。 【0004】携帯電話を代表とするモバイル製品は小型
化、薄型化、低廉価化の要求が強く、0.1mm、0.
1gの小型化、薄型化、軽量化を達成するために表面実
装型圧電振動子も色々な構造が考案されている。図3は
本発明に係わる表面実装型圧電振動子の正面図、図4は
下面図であり、樹脂内部にインサート成形されているリ
ードタイプ筒型圧電振動子を点線で表示している。表面
実装型圧電振動子10の電極となるリードフレームの端
子部14、15及び端子部16は樹脂17の下面に配置
され、電極となる端子部14、15及び端子部16の上
面が樹脂17に固定されている構造である。リードタイ
プ筒型圧電振動子11のリード12、13は電極14、
15に接続固定するために図のように成形されている。
図1の構造と比較すると電極5、(4)及び端子7
(6)の厚さ分は薄型化がされている。また、インサー
ト成形後の電極、端子の曲げ加工工程が省け低廉価化も
可能な構造である。 【0005】 【発明が解決しようとする課題】薄型化、低廉価化が可
能な前述の表面実装型圧電振動子であるが、より薄型化
を進めるには、表面実装型圧電振動子の上下方向の樹脂
の肉厚を薄くすることにより薄型化が可能である。しか
し、インサート成形金型に設置された押さえピンにより
リードタイプ筒型圧電振動子を押さえる方法では、成形
金型とリードタイプ筒型圧電振動子の隙間が狭くなると
押さえピン周辺部の樹脂の回り込みが悪くなる。これに
より樹脂内部にインサート成形されているリードタイプ
筒型圧電振動子の筒型封止管の表面が表面実装型圧電振
動子の上、下面に露出してしまい、上面では印刷不良、
下面では回路基板実装時に基板引き回しとのショート不
良になってしまう問題がある。 【0006】本発明の目的は、表面実装型圧電振動子に
おいて、厚さ寸法がリードタイプ筒型圧電振動子の筒型
封止管の径寸法に近い寸法にしながら、表面実装型圧電
振動子の上面、下面よりリードタイプ筒型圧電振動子の
筒型封止管表面を露出させず、印刷不良や実装時のショ
ート不良を無くし、薄型且つ小型で低廉価の表面実装型
圧電振動子を提供することにある。 【0007】 【課題を解決するための手段】一端に2本のリードを有
するリードタイプ筒型圧電振動子のリードをリードフレ
ームに固定し、前記リードフレームを樹脂によりインサ
ート成形しカットアンドフォーミングする表面実装型圧
電振動子であって、前記リードフレームの一部が表面実
装型圧電振動子の電極となり、該電極の下面は樹脂によ
り被覆されていない表面実装型圧電振動子の製造方法に
おいて、インサート成形金型にはリードタイプ筒型圧電
振動子の押さえピンがなく、樹脂のインサート成形中に
成形金型の上金型が上方向へ、下金型が下方向へ移動し
リードタイプ筒型圧電振動子を樹脂モールドする表面実
装型圧電振動子の製造方法とする。 【0008】 【発明の実施の形態】図5は本発明の一実施形態である
表面実装型圧電振動子のインサート成形時の断面図であ
り、成形用の上金型21、上金型可動部21a、上金型
可動部用バネ25、下金型22と下金型可動部22a、
下金型可動部用バネ26、樹脂内部にインサート成形さ
れるリードタイプ筒型圧電振動子1を表示している。成
形スタート時、成形用上金型可動部21aと下金型可動
部22aでリードタイプ筒型圧電振動子1を押さえてお
き樹脂8を金型内に圧力をかけ充填する。リードタイプ
筒型圧電振動子1と上金型21、下金型22の隙間に樹
脂8が入り固まり出してリードタイプ筒型圧電振動子1
の位置決めが出来る状態になる。その後樹脂8の充填圧
力を上げると、上金型可動部用バネ25と下金型可動部
用バネ26が縮み、上金型可動部21aと下金型可動部
22aが可動し、設定された樹脂厚分移動し樹脂8の充
填が終了し目的の樹脂厚でインサート成形が終了する。
本実施形態の説明では上金型可動部21aと下金型可動
部22aの可動をバネにより説明したが、機械的駆動に
より可動させても良い。 【0009】 【発明の効果】本発明によると、リードタイプ筒型圧電
振動子の表面が表面実装型圧電振動子の上、下面に露出
することなく、印刷不良や基板とのショート不良のない
表面実装型圧電振動子が得られる。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a surface mount type piezoelectric vibrator. 2. Description of the Related Art The surface mounting of electronic components has been advanced, and the number of piezoelectric vibrators, which are one of the electronic components, which are compatible with surface mounting is increasing. The surface mount type structure of the piezoelectric vibrator has a structure in which the piezoelectric element is directly incorporated in a case corresponding to the surface mounting, and a structure in which the lead type cylindrical piezoelectric vibrator is fixed to the lead frame, insert molded with resin, and cut and formed. It is roughly divided into. The present invention relates to the latter structure. FIG. 1 is a front view of a typical surface-mount type piezoelectric vibrator according to the prior art, and FIG. 2 is a top view, in which a lead type cylindrical piezoelectric vibrator insert-molded inside a resin and a lead frame are indicated by dotted lines. Displayed with. FIG. 6 is an exploded perspective view of a lead type cylindrical piezoelectric vibrator. The lead type cylindrical piezoelectric vibrator is a general vibrator in which a vibrating piece is fixed to an airtight terminal having two leads and sealed with a cylindrical sealing tube. The surface mount type piezoelectric vibrator fixes the leads 2 and 3 of the lead type cylindrical piezoelectric vibrator 1 to terminal portions 4 and 5 serving as electrodes of the surface mount type piezoelectric vibrator of the lead frame by resistance welding or laser welding or the like. Process, a process of insert molding with the resin 8 while leaving the electrodes 4, 5 and the terminals 6, 7, a process of separating the electrodes 4, 5 and the terminals 6, 7 from the lead frame, and bending the electrodes 4, 5, and the terminals 6, 7 And
It is manufactured by a process in which the electrodes 4 and 5 and the terminals 6 and 7 are arranged below the resin 8. The model number, manufacturing date, etc. are printed on the upper surface of the surface mount type piezoelectric vibrator. [0004] Mobile products such as mobile phones are strongly required to be small, thin, and inexpensive.
Various structures have been devised for the surface mount type piezoelectric vibrator in order to achieve a reduction in size, thickness and weight of 1 g. FIG. 3 is a front view of the surface mount type piezoelectric vibrator according to the present invention, and FIG. 4 is a bottom view, in which the lead type cylindrical piezoelectric vibrator insert-molded inside the resin is indicated by a dotted line. The terminal portions 14 and 15 and the terminal portion 16 of the lead frame serving as electrodes of the surface-mount type piezoelectric vibrator 10 are arranged on the lower surface of the resin 17. The structure is fixed. The leads 12 and 13 of the lead type cylindrical piezoelectric vibrator 11 are electrodes 14,
It is formed as shown in the figure for connection and fixing to the connector 15.
Compared to the structure of FIG. 1, the electrodes 5, (4) and the terminal 7
The thickness of (6) is reduced in thickness. In addition, it is possible to reduce the cost by eliminating the bending process of electrodes and terminals after insert molding. The above-described surface-mount type piezoelectric vibrator, which can be made thinner and inexpensive, requires the vertical direction of the surface-mount type piezoelectric vibrator to be made thinner. The thickness of the resin can be reduced by reducing the thickness of the resin. However, in the method of holding down the lead-type cylindrical piezoelectric vibrator by the holding pin installed in the insert molding die, when the gap between the molding die and the lead-type cylindrical piezoelectric vibrator becomes narrow, the resin around the holding pin goes around. become worse. As a result, the surface of the cylindrical sealing tube of the lead type cylindrical piezoelectric vibrator which is insert-molded inside the resin is exposed on the upper and lower surfaces of the surface mount type piezoelectric vibrator, and printing is poor on the upper surface,
On the lower surface, there is a problem that a short circuit failure occurs when the circuit board is mounted on the circuit board. An object of the present invention is to provide a surface mount type piezoelectric vibrator in which the thickness dimension is close to the diameter of the cylindrical sealing tube of the lead type cylindrical piezoelectric vibrator, Provided is a thin, small, and inexpensive surface mount type piezoelectric vibrator that does not expose the surface of the cylindrical sealing tube of the lead type cylindrical piezoelectric vibrator from the upper surface and the lower surface, eliminates printing defects and short circuit defects at the time of mounting. It is in. A lead-type cylindrical piezoelectric vibrator having two leads at one end is fixed to a lead frame, and the lead frame is insert-molded with resin and cut and formed. In a method of manufacturing a surface-mount type piezoelectric vibrator, wherein a part of the lead frame is an electrode of the surface-mount type piezoelectric vibrator, and a lower surface of the electrode is not covered with resin, insert molding is performed. The die does not have a pin for the lead type cylindrical piezoelectric vibrator, and the upper die moves upward and the lower die moves downward during insert molding of the resin. A method for manufacturing a surface-mount type piezoelectric vibrator in which the element is resin-molded. FIG. 5 is a cross-sectional view of a surface mount type piezoelectric vibrator according to an embodiment of the present invention at the time of insert molding, and shows a molding upper mold 21 and an upper mold movable section. 21a, upper mold movable portion spring 25, lower mold 22 and lower mold movable portion 22a,
The lower mold movable portion spring 26 and the lead type cylindrical piezoelectric vibrator 1 that is insert-molded inside the resin are shown. At the start of molding, the lead-type cylindrical piezoelectric vibrator 1 is held down by the upper mold movable portion 21a and the lower mold movable portion 22a, and the resin 8 is filled into the mold by applying pressure. The resin 8 enters the gap between the lead-type cylindrical piezoelectric vibrator 1 and the upper mold 21 and the lower mold 22 and solidifies to form the lead-type cylindrical piezoelectric vibrator 1.
Can be positioned. After that, when the filling pressure of the resin 8 is increased, the spring 25 for the upper mold movable section and the spring 26 for the lower mold movable section contract, and the upper mold movable section 21a and the lower mold movable section 22a are moved and set. After moving by the resin thickness, the filling of the resin 8 is completed, and the insert molding is completed with the target resin thickness.
In the description of the present embodiment, the movement of the upper mold movable section 21a and the lower mold movable section 22a has been described by a spring, but may be moved by mechanical driving. According to the present invention, the surface of the lead-type cylindrical piezoelectric vibrator is not exposed to the upper and lower surfaces of the surface-mount type piezoelectric vibrator, and the surface is free from printing defects and short-circuit defects with the substrate. A mounted piezoelectric vibrator is obtained.

【図面の簡単な説明】 【図1】従来技術による代表的な表面実装型圧電振動子
の正面図 【図2】従来技術による代表的な表面実装型圧電振動子
の上面図 【図3】本発明に係わる表面実装型圧電振動子の正面図 【図4】本発明に係わる表面実装型圧電振動子の下面図 【図5】本発明の一実施形態である表面実装型圧電振動
子のインサート成形金型の正面断面図 【図6】リードタイプ筒型圧電振動子の分解斜視図 【符号の説明】 1 リードタイプ筒型圧電振動子 2 リード 3 リード 4 電極 5 電極 6 端子 7 端子 8 樹脂 10 表面実装型圧電振動子 11 リードタイプ筒型圧電振動子 14 電極 15 電極 16 端子部 17 樹脂 21 成形用上金型 21a 成形用上金型可動部 22 成形用下金型 22a 成形用下金型可動部 25 上金型可動部用バネ 26 下金型可動部用バネ
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view of a typical surface-mount type piezoelectric vibrator according to the prior art. FIG. 2 is a top view of a typical surface-mount type piezoelectric vibrator according to the prior art. FIG. 4 is a front view of the surface-mount type piezoelectric vibrator according to the present invention. FIG. 4 is a bottom view of the surface-mount type piezoelectric vibrator according to the present invention. FIG. 5 is insert molding of the surface-mount type piezoelectric vibrator according to one embodiment of the present invention. Front sectional view of mold [Fig. 6] Exploded perspective view of lead type cylindrical piezoelectric vibrator [Description of symbols] 1 Lead type cylindrical piezoelectric vibrator 2 Lead 3 Lead 4 Electrode 5 Electrode 6 Terminal 7 Terminal 8 Resin 10 Surface Mounting type piezoelectric vibrator 11 Lead type cylindrical piezoelectric vibrator 14 Electrode 15 Electrode 16 Terminal part 17 Resin 21 Upper mold 21a for molding Upper movable mold for molding 22 Lower mold for molding 22a Lower movable mold for molding 25 Upper mold movable part spring 26 Lower metal Mold movable part spring

Claims (1)

【特許請求の範囲】 【請求項1】 一端に2本のリードを有するリードタイ
プ筒型圧電振動子のリードをリードフレームに固定し、
前記リードフレームを樹脂によりインサート成形しカッ
トアンドフォーミングする表面実装型圧電振動子であっ
て、前記リードフレームの一部が表面実装型圧電振動子
の電極となり、該電極の下面は樹脂により被覆されてい
ない表面実装型圧電振動子の製造方法において、インサ
ート成形金型にはリードタイプ筒型圧電振動子の押さえ
ピンがなく、樹脂のインサート成形中に成形金型の上金
型が上方向へ、下金型が下方向へ移動しリードタイプ筒
型圧電振動子を樹脂モールドすることを特徴とする表面
実装型圧電振動子の製造方法。
Claims: 1. A lead-type cylindrical piezoelectric vibrator having two leads at one end is fixed to a lead frame,
A surface mount type piezoelectric vibrator in which the lead frame is insert-molded with a resin and cut and formed, wherein a part of the lead frame becomes an electrode of the surface mount type piezoelectric vibrator, and a lower surface of the electrode is covered with a resin. In the method of manufacturing a surface mount type piezoelectric vibrator, the insert molding die does not have the holding pin of the lead type cylindrical piezoelectric vibrator, and the upper die of the molding die moves upward and downward during insert molding of resin. A method for manufacturing a surface mount type piezoelectric vibrator, wherein a die moves downward and a lead type cylindrical piezoelectric vibrator is resin-molded.
JP2001362593A 2001-11-28 2001-11-28 Manufacturing method of surface-mounted piezoelectric vibrator Pending JP2003163557A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001362593A JP2003163557A (en) 2001-11-28 2001-11-28 Manufacturing method of surface-mounted piezoelectric vibrator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001362593A JP2003163557A (en) 2001-11-28 2001-11-28 Manufacturing method of surface-mounted piezoelectric vibrator

Publications (1)

Publication Number Publication Date
JP2003163557A true JP2003163557A (en) 2003-06-06

Family

ID=19173072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001362593A Pending JP2003163557A (en) 2001-11-28 2001-11-28 Manufacturing method of surface-mounted piezoelectric vibrator

Country Status (1)

Country Link
JP (1) JP2003163557A (en)

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