JP2005251891A - Thin metal package and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin metal package which improves the arrangement accuracy of a lead terminal and which makes facilitation of a mass production treatment. <P>SOLUTION: The thin metal package 10 is hermetically sealed at a predetermined position by the insulating material 15 at a plurality of lead terminals 20 inserted into a plurality of through holes 11 of a metal base 12. The lead terminal 20 is molded integrally with a molding member having a coupling part for coupling between four metal protruding parts and a metal protruding part by working, such as pressing, electroforming, welding, etc. of a metal plate, and the metal base 12 and the molding member are sealed through the insulator 15. The sealing step integrates the metal base 12 having the four through holes 11 and the coupling part for coupling between the four metal protruding parts and the metal protruding part by using an assembling jig, heat treats the vicinity of the melting temperature of the insulating material, and hermetically welds. A surface finishing step removes the coupling part by polishing the rear surface side of the molding member, individually separates the metal protruding parts, and thereby becoming four lead terminals 20 by it. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a thin metal package in which a metal base and lead terminals are hermetically welded with an insulating material and a manufacturing method thereof, and more particularly to a thin metal package which is suitable as a surface mounting electronic component and facilitates mass production processing and a manufacturing method thereof. About.

Surface-mount electronic component devices such as crystal resonators, filters, and oscillators are configured by accommodating crystal pieces and piezoelectric device pieces in a surface-mount package. There are four types of surface-mount packages: base and cap. Are known. For example, as shown in Patent Documents 1 and 2, a structure in which a functional component such as a crystal resonator is housed in a metal package in which lead terminals are sealed with borosilicate high melting point glass on a metal base to prevent intrusion of disturbing electromagnetic waves Low-melting glass by combining a ceramic base and a top plate that closes the opening with a translucent glass cap when there is no concern about the invasion of electromagnetic waves. Easy to adjust the oscillation frequency by laser trimming by sealing, and by using a combination of ceramic base and metal cap, a silver thin film of Ag low material is formed on the upper surface of the spacer on the side wall of the base, and the metal cap and seam welding or electronic Some are beam welded.
JP 2003-124382 A JP 2003-086723 A

  That is, in Patent Document 1, a metal lead is inserted into a through hole of a metal base using an insulating material, a cap serving as a lid is formed to form a combined base, and a metal base is formed inside the base of an airtight atmosphere. Disclosed is a metal package in which electronic component elements are installed and bonded inside a lead base. Furthermore, the lower surface of the metal base is used as the board mounting surface, and the insulation distance between the metal lead and the board mounting surface is set to a sufficient distance, 0.05 to 0.3 mm, so that the metal package is mounted on the board. In addition to facilitating the confirmation of solder fillets after mounting, in the manufacture of metal packages, a number of metal leads are inserted into each metal base using a lead frame plate, and an insulating material is used. It is also disclosed to cut individual thin metal packages after welding. As described above, packages for mounting electronic component elements such as crystal resonators are mainly metal packages in which metal leads are sealed on a metal base with an advantageous shielding effect by interposing an insulating material. Surface mounting is also increasing in the mounting method. In particular, when a large number of electronic devices such as crystal resonators are accommodated, a metal package having a plurality of metal leads is used.

  However, in the conventional metal package used in the surface mounting method, the outer diameter is increased in order to increase the insulation distance because it is necessary to ensure insulation by using an insulating material interposed around the lead, and the package becomes smaller and thinner. It was difficult. In particular, in a metal package having a plurality of lead terminals, it is easy to cause a problem in the alignment accuracy of the lead terminals sealed with an insulating material on the metal base, for example, the lead length varies and the terminal connection surfaces are not uniform. In some cases, the vertical parallelism between the leads caused some inclination to be corrected. In addition, the heating work in which the lead terminals are hermetically welded with an insulating material requires a high degree of skill and a great number of man-hours. Is difficult. Furthermore, in a thin metal package product having a large number of lead terminals, many problems remain in surface mounting in assembling into electronic equipment.

  Accordingly, the present invention has been proposed in view of the above-described defects, and a thin metal package suitable for surface mounting and a manufacturing method thereof suitable for surface mounting that reduces the processing cost by an original structure of the lead terminal and a device method. For the purpose of provision. Especially for thin metal packages that require precise alignment and alignment of a large number of lead terminals at predetermined positions, it is suitable for mass production and enables a significant reduction in work man-hours and at the same time improves the lead terminal arrangement accuracy. The object is to provide a new and improved thin metal package.

  Another object of the present invention is a thin metal package for surface mounting comprising a hermetic terminal type metal base having a large number of lead terminals, wherein the lead terminal connecting portions exposed on the back side, which is the mounting side of the metal base, are flush with each other. It is an object of the present invention to provide a new and improved thin metal package preliminarily provided with a solder material and a manufacturing method thereof in order to facilitate surface mounting work by finishing so as to be aligned.

  According to the present invention, a metal base in which a through hole is formed, and a lead terminal sealed with an insulating material selected from a plastic material such as high melting or low melting glass or polyimide resin in the through hole, and An airtight terminal type metal package comprising: a thin metal package characterized in that the lead terminal is formed of a molded member having a metal convex portion, and the top surface portion and the bottom surface portion of the molded member are terminal connection portions. Is provided. In this case, there are a plurality of through holes and lead terminals, and the molded member has a plurality of metal convex portions and connecting portions, which are separated and divided individually to form a plurality of lead terminals. It is characterized by being arranged in line. Further, the metal plate is a lead frame body composed of a molding member having a plurality of metal convex portions and a connecting portion and a frame frame, and a thin metal package characterized by disconnecting the connecting portion of the lead frame body is also disclosed. Is done. In addition, it is also disclosed that the bottom surface portion of the molded member has a concave portion formed by integral molding, and a terminal connection portion loaded with a solder material is provided in the concave portion to facilitate surface mounting.

  In addition, the lead terminal is formed by pressing a metal plate, pressing the back side of the metal plate, etching or pressing the metal plate, and forming a metal convex portion thereon by electroforming by plating. It is manufactured from a molded member in which a metal convex portion is formed by resistance welding of a rod to a plate. That is, the formed member is one metal formed member selected from a pressed metal plate, an etched metal plate, a plated electroformed metal plate, or a rod welded metal plate, and the thin metal plate is protruded by pressing or an etching method. It is proposed to make it easier to make the manufacturing process by forming the shape part, electroplating of plating (electroforming) or welding of the rod. According to the present invention, a processing step of manufacturing a molded member having a metal convex portion and a connecting portion by pressing, etching, plating and welding the metal plate, and the metal base having the molded member and the through hole, The metal convex portion is inserted into the through-hole while maintaining a predetermined gap, and is placed at a predetermined position and hermetically welded with an insulating material interposed in the predetermined gap, and the molding sealed to the metal base A method of manufacturing a thin metal package is proposed, which includes a surface finishing step of forming a terminal connection portion on a member, wherein the metal convex portion is a lead terminal. Here, the process of preparing the molded member is to integrally form a molded member having a plurality of metal convex portions and connecting portions on a metal plate, and the sealing step is to mold the molded member into a metal base having a plurality of through holes. The metal convex portion of the member is inserted and arranged in the through-hole and hermetically sealed, and the final surface finishing step is a polishing step for removing the connecting portion so as to separate the metal convex portion from the sealed molded member. Disclose inclusion. In addition to pressing, electroforming, welding, and the like being applied to the processing step, it is also proposed that a lead frame body in which a plurality of metal convex portions are coupled to the frame frame by connecting portions on a metal plate is proposed.

  In the thin metal package of the present invention, the lead terminal sealed on the metal base is manufactured as an integrally formed member by pressing, etching, electroforming, welding, etc. to the metal plate, so that the arrangement on the mounting substrate is stabilized. Solder connection is ensured and easy, and the cost is reduced by reducing the number of work steps. In particular, when multiple lead terminals are inserted into a metal-based through hole and hermetically welded with an insulating material, each lead terminal is integrally formed by processing with a metal plate, so the assembly man-hours can be reduced and the dimensions of each molded part can be reduced. In addition, the metal package product can maintain the accuracy of the arrangement interval and maintain the lead terminal length and the mounting position after sealing, and has a great practical effect such as easy surface mounting. For example, when four lead terminals are provided, the dimensional variation between the leads can be reduced to 0.02 mm in the method of the present invention, which was about 0.05 mm, and the height of the lead terminals in the package cavity is varied. In the conventional method using four single pins, it was 0.06 mm, but in the method of the present invention, it could be substantially halved to 0.03 mm.

  In addition, assembly is facilitated when a large number of lead terminals are inserted into a large number of through holes in a metal base using an assembly jig and airtight welding is performed with an insulating material, yield is improved, and the life of the jig is extended and sealed. The top surface of the subsequent lead terminal is flat and maintains parallelism. Furthermore, depending on the selection of the insulating material, the welding temperature at the time of airtight welding between the metal base and the lead terminal can be lowered, and therefore, a thin metal package with high dimensional accuracy can be provided without lead terminal irregularities. Therefore, there are practical effects such as easy mounting of electronic component elements such as a crystal resonator housed in the package and surface mounting of the packaged product on the substrate.

  Embodiments of the present invention include a metal base having a plurality of through holes, and an encapsulant interposed between the through holes and a high or low melting glass or plastic material, preferably a polyimide resin. An airtight terminal type thin metal package having a plurality of attached lead terminals, wherein the lead terminals are a plurality of metal protrusions produced by pressing, etching, electroforming, welding or the like on a prepared metal plate. The molding member is formed by separating and dividing a metal plate, and a plurality of lead terminals are arranged and arranged at predetermined positions, and terminals are formed on the top surface portion and the bottom surface portion of the molding member. It is a thin metal package in which a connection part is formed. This method of manufacturing a thin metal package has a processing step of a molded member having a plurality of metal convex portions by press forming of a metal plate or electrocasting or welding of a plated metal plate, and a plurality of through holes. A sealing step in which a metal convex portion is inserted into the through-hole while maintaining a predetermined gap with the metal base, the molding member is disposed at a predetermined position, and an insulating material is interposed in the predetermined gap to perform airtight welding; A surface finishing process in which the exposed surface of the molded member hermetically welded is processed to form a terminal connection portion. The molded member in the processing process is integrally formed, and in the sealing process, the molded member is integrated into a metal base. In the surface finishing step, a removal step is performed by polishing or cutting a connecting portion that individually separates the plurality of sealed metal convex portions.

  Another embodiment is a combined lead frame body having a plurality of metal convex portions and connecting portions by processing a metal plate, and the connecting portions of the lead frame bodies are separated into individual lead terminals. A thin metal package is disclosed. In this case, in the forming member processing step, a lead frame body in which a plurality of metal convex portions are respectively coupled to the frame frame via connecting portions is integrally formed on the metal plate, and in the sealing step, the lead frame body is formed as a through hole. After the gas base is hermetically welded to the metal base having a metal layer, the connecting portion is cut and the frame frame is removed to separate the plurality of metal convex portions from the lead frame body sealed in the surface finishing process.

  Still another embodiment is a method for surface mounting as a terminal connection portion by loading a solder material into a concave portion formed on the bottom surface portion of a molded member during molding such as press working in the surface finishing step in the manufacturing method of a thin metal package It is a thin metal package that facilitates the connection by. In this case, the solder material is used for connection to the wiring land on the substrate by melting the solder material in mounting the thin metal package on the substrate. Therefore, the metal package suitable for surface mounting and capable of being made thinner can be obtained. Moreover, it is also possible to use a high melting point solder material for the recessed portion of the concave portion when the solder material is unnecessary, and fill the recessed portion to make the external electrode portion of the lead terminal flat.

  Embodiments according to the present invention will be described in detail below with reference to the drawings. A thin metal package 10 of the present invention includes a metal base 12 having a through hole 11 and a lead terminal 20 hermetically sealed with an insulating material 15 as shown in a sectional view in FIG. A plurality of lead terminals 20 inserted into the through holes 11 are sealed in place. Here, the lead terminal 20 is manufactured through the steps of FIGS. First, as shown in FIG. 1, a molding member 30 having four metal convex portions 32 and a connecting portion 33 for joining the metal convex portions is molded by pressing a metal plate 31. Next, FIG. As shown, the metal base 12 having a plurality of through-holes 11 and the molded member 30 are sealed with an insulating portion 15 interposed. That is, a metal plate as shown in a forming member 342 having a metal base 12 having four through-holes 11, four metal convex portions 32, and a connecting portion 33 for joining the metal convex portions using an assembly jig. The molding member 30 having the four metal convex portions 32 and the connecting portions 33 for joining the metal convex portions is molded by the press processing of 31, and then, as shown in FIG. The metal base 12 and the molding member 30 that are formed are sealed with the insulating portion 15 interposed therebetween. That is, the metal base 12 having the four through-holes 11, the four metal convex portions 32, and the molding member 30 having the connecting portion 33 that connects the metal convex portions are combined with each other using an assembly jig, and insulated. Heat treatment is performed near the melting temperature of the material, and both are hermetically welded. The insulating material 15 is selected from high melting or low melting glass and plastic such as polyimide resin. Next, the shaping | molding member 30 is grind | polished from the back surface side of a metal plate, the connection part 33 of a metal plate is removed, and a metal convex-shaped part is mutually isolate | separated independently. The separated metal convex portions become lead terminals 20, and electronic devices such as a crystal resonator are mounted on the top surface portion 22 (not shown), and the bottom surface portion 24 is surface-mounted on a substrate (not shown). It is used for electrical connection as a connection part. Since the plurality of lead terminals 20 of the present invention are formed of a molded member integrally formed by pressing a metal plate, the lead terminals 20 can be aligned and arranged at predetermined positions without any irregularities, which is advantageous for improving the dimensional accuracy of the terminal connection portion of the lead terminals 20. .

Next, the manufacturing method of the thin metal package of this invention is demonstrated easily. This method of manufacturing a thin metal package includes a step of pressing a metal plate 31 to form a plurality of, for example, four metal protrusions 32 and a connecting member 33, and a plurality of, for example, four through-holes. While maintaining a predetermined gap with the metal base 12 having the holes 11, the metal convex portion 33 is inserted into the through hole 11, the molding member 30 is disposed at a predetermined position, and the insulating material 15 is interposed in the predetermined gap to perform airtight welding. And a surface finishing process in which the exposed surface of the molded member 30 hermetically welded to the metal base 12 is subjected to surface treatment to form a terminal connection portion to form the lead terminal 20. In the processing process, a plurality of molding processes are performed. The member 30 is integrally formed, and in the sealing process, the molded member 30 is arranged in the state where the molded member 30 is integrated and the metal base 12 is inserted with the metal convex portion 32 inserted into the through hole 11 and is sealed in the surface finishing process. From metal convex part 32 The connecting portion 33 so as to independently separate the lead terminals 20 removed by polishing. In addition, although the exposed surface used as the terminal connection part of the lead terminal 20 is plated and completed, compared with the case where it assembles using four single lead terminals by such a manufacturing method, an assembly process time is about 1 in the sealing process. Reduce to / 4. Further, the molded member 30 integrated with the metal base 12 obtained by press molding is pretreated such as pickling and oxidation, and the metal base, the tablet-like insulating material press-molded with powder, and the molded member are inserted into a carbon jig in this order.
Further, in the processing step, the formed member can be integrally formed by electroforming plating or welding on an etched metal plate in addition to pressing.

  Next, a thin metal package of another embodiment shown in FIG. 4 will be described in detail. In this embodiment, the forming member 40 for press working of the metal plate 41 is a lead frame body composed of a plurality of metal convex portions 42 and a connecting portion 43, and a plurality of independent members by cutting the connecting portion 43 and separating the frame frame. This is a thin metal package having individual lead terminals 25. In this case, in the processing step, a molding member 40 in which a plurality of metal convex portions 42 are coupled to the frame frame on the metal plate by the connecting portions 43 is press-molded as an integrally formed lead frame body, and in the sealing step, the molding member 40 is formed. The lead frame body is inserted and arranged in the metal base 12 having the through-holes 11 and hermetically welded with the insulating material 15. In the surface finishing process, it is unnecessary to separate the metal convex portions 42 from the molded member 40 sealed. The resulting frame is cut at the connecting portion 43 and removed. In addition, the use as a lead frame body formed so that the plurality of molded members 40 can be punched out is useful for improving the efficiency of the insertion and placement work in assembly. The insertion arrangement procedure is to insert the lead frame body, the insulating material of the glass tablet, and the metal base into individual positions in the carbon jig using the assembly aid. After assembly and insertion, a carbon jig for positioning and positioning is placed on the carbon jig and placed in a high temperature furnace for heat treatment. In the heat treatment, the metal base is integrally hermetically welded to the lead frame body with a glass insulating material. In this state, the plating process is performed. In the plating process, the lead frame body is suspended by a belt by a hanging plating method and immersed in a plating tank to plate the lead frame body. In order to reduce the thickness, the insulating material is welded to the integrally formed product of the molded member on the back side of the metal base. Therefore, by allowing the insulating material to flow into the gap between the back surface of the metal base and the terminal connecting portion of the lower surface portion of the lead terminal, the height dimension of the insulating material is set in a range of 0.2 to 0.6 mm, The distance between the insulated distances is preferably 0.05 to 0.3 mm. And the terminal connection part of the bottom face part of a lead terminal is connected with the conductive land on the board | substrate to mount, and there exists an advantage which makes surface mounting easy.

  FIG. 5 shows a thin metal package having a lead terminal structure suitable for surface mounting as another embodiment. In this case, the structure is the same as that in FIG. 1, and the same parts are denoted by the same reference numerals and the description thereof is omitted. That is, the concave portion 26 formed in the bottom surface portion 24 of the lead terminal 20 is loaded with the solder material 28 to facilitate solder connection on the surface-mounted substrate. The solder material 28 is loaded in a surface finishing process, and is loaded so that the solder material is not dropped into the concave portion on the bottom side of the molded member integrally formed by pressing, electroforming, welding, or the like. At this time, it is convenient to easily reduce the thickness of the connection between the terminal connection portion and the mounting substrate conductive pattern.

  The present invention is a hermetic terminal type thin metal package suitable for a surface mounting method, and is used for a package product in which a crystal unit is mounted, and particularly for an electronic device requiring a large number of lead terminals suitable for thinning. Suitable for use field of metal package.

It is principal part sectional drawing of the thin metal package of the Example which concerns on this invention. FIG. 2 is a perspective view of a lead terminal molding member used in the manufacture of the thin metal package of FIG. 1. FIG. 3 is a cross-sectional view of the main part in the sealing process of the thin metal package of FIG. It is the perspective view and sectional drawing of the principal part in the metal package of another Example similarly. It is sectional drawing of the principal part in the metal package of another Example similarly.

Explanation of symbols

10: Thin metal package 11: Through hole 12: Metal base 15: Insulating material 20, 25: Lead terminal 22: Top surface portion (terminal connection portion)
24: Bottom part (terminal connection part)
26: Concave portion 28: Solder material 30, 40: Molded member 31, 41: Metal plate 32, 42: Metal convex portion 33, 43: Connection portion

Claims (8)

  An airtight terminal type metal package comprising a metal base having a through hole formed therein and a lead terminal inserted into the through hole and sealed with the metal base and an insulating material, wherein the lead terminal has a metal convex portion A thin metal package comprising a member and having a top surface portion and a bottom surface portion of the molded member as terminal connection portions.   The molded member is one metal molded member selected from a pressed metal plate, an etched metal plate, a plated electroformed metal plate, or a rod welded metal plate, and the insulating material is a high melting glass, a low melting glass or 2. The thin metal package according to claim 1, comprising a kind of insulating material selected from resin materials.   The through-hole and the lead terminal are composed of a plurality, and the molded member has a connecting portion and a plurality of metal convex portions, and these metal convex portions are separated and divided to be predetermined as a plurality of lead terminals. The thin metal package according to claim 1 or 2, wherein the thin metal package is aligned at a position.   The molding member includes a lead frame body in which a plurality of metal convex portions and a connection portion are coupled to a frame frame, and after sealing with the metal base, the frame frame is separated from the connection portion and a plurality of lead terminals. The thin metal package according to claim 3, wherein:   The thin metal according to any one of claims 1 to 4, wherein a bottom surface portion of the molding member includes a concave portion formed by molding, and a solder material is loaded into the concave portion to form a surface mounting side terminal connection portion. package.   The metal plate is pressed, etched, plated, and welded to form a molded member having a metal convex portion and a connecting portion, and the molded member and the metal base having a through-hole are maintained at a predetermined gap. While the metal convex portion is inserted into the through-hole and disposed at a predetermined position and hermetically welded with an insulating material interposed in the predetermined gap, and the terminal connecting portion on the molded member sealed on the metal base A method of manufacturing a thin metal package, comprising a surface finishing step for forming a metal substrate, wherein the metal convex portion is a lead terminal.   In the processing step, a molded member having a plurality of metal convex portions and connecting portions is integrally formed from the metal plate, and in the sealing step, the metal base has a plurality of metal convex portions of the molded member. Inserting and arranging in a plurality of through-holes and hermetic welding, and the surface finishing step includes a polishing step of removing the connecting portion so as to separate the metal convex portions from the sealed molded member. A method for manufacturing a thin metal package according to claim 6. The processing step is integrally formed as a molding member of a lead frame body in which a plurality of metal convex portions are respectively coupled to the frame frame via connecting portions, and the sealing step is a plurality of metal convex portions of the molding member. A cutting step of separating the connecting portion so as to separate the metal convex portion from the sealed molded member in an airtight manner by inserting and arranging the portion into a plurality of through holes of the metal base. The manufacturing method of the thin metal package of Claim 6 characterized by the above-mentioned.

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