JP2003163238A - 挿入された支持シムを使用してハンダカラムアレイ相互接続部を有する回路構成要素を支持するための方法及び装置 - Google Patents

挿入された支持シムを使用してハンダカラムアレイ相互接続部を有する回路構成要素を支持するための方法及び装置

Info

Publication number
JP2003163238A
JP2003163238A JP2002331828A JP2002331828A JP2003163238A JP 2003163238 A JP2003163238 A JP 2003163238A JP 2002331828 A JP2002331828 A JP 2002331828A JP 2002331828 A JP2002331828 A JP 2002331828A JP 2003163238 A JP2003163238 A JP 2003163238A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit package
circuit board
substrate
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002331828A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003163238A5 (enExample
Inventor
Jeffrey L Deeney
ジェフレイ・エル・ディーネイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2003163238A publication Critical patent/JP2003163238A/ja
Publication of JP2003163238A5 publication Critical patent/JP2003163238A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2002331828A 2001-11-16 2002-11-15 挿入された支持シムを使用してハンダカラムアレイ相互接続部を有する回路構成要素を支持するための方法及び装置 Withdrawn JP2003163238A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/992,864 US6813162B2 (en) 2001-11-16 2001-11-16 Method and apparatus for supporting circuit component having solder column array interconnects using interposed support shims
US09/992864 2001-11-16

Publications (2)

Publication Number Publication Date
JP2003163238A true JP2003163238A (ja) 2003-06-06
JP2003163238A5 JP2003163238A5 (enExample) 2006-01-05

Family

ID=25538825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002331828A Withdrawn JP2003163238A (ja) 2001-11-16 2002-11-15 挿入された支持シムを使用してハンダカラムアレイ相互接続部を有する回路構成要素を支持するための方法及び装置

Country Status (2)

Country Link
US (2) US6813162B2 (enExample)
JP (1) JP2003163238A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6914785B1 (en) * 2002-10-11 2005-07-05 Massachusetts Institute Of Technology Variable electronic circuit component
US7372147B2 (en) * 2003-07-02 2008-05-13 Hewlett-Packard Development Company, L.P. Supporting a circuit package including a substrate having a solder column array
US6923658B2 (en) * 2003-12-03 2005-08-02 Hewlett-Packard Development Company, L.P. Support for an integrated circuit package having a column grid array interconnect
JP2011023683A (ja) * 2009-07-21 2011-02-03 Alps Electric Co Ltd 電子回路モジュール

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403438A (en) * 1964-12-02 1968-10-01 Corning Glass Works Process for joining transistor chip to printed circuit
US4063791A (en) 1976-12-27 1977-12-20 Cutchaw John M Connector for leadless integrated circuit packages
US4164033A (en) * 1977-09-14 1979-08-07 Sundstrand Corporation Compressor surge control with airflow measurement
US4545610A (en) 1983-11-25 1985-10-08 International Business Machines Corporation Method for forming elongated solder connections between a semiconductor device and a supporting substrate
US4581680A (en) 1984-12-31 1986-04-08 Gte Communication Systems Corporation Chip carrier mounting arrangement
JPH01215023A (ja) 1988-02-24 1989-08-29 Hitachi Ltd 表面処理方法およびその装置
US5200362A (en) 1989-09-06 1993-04-06 Motorola, Inc. Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
US5220200A (en) * 1990-12-10 1993-06-15 Delco Electronics Corporation Provision of substrate pillars to maintain chip standoff
US5222014A (en) 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
US5244143A (en) 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
US5615735A (en) 1994-09-29 1997-04-01 Hewlett-Packard Co. Heat sink spring clamp
US5585671A (en) * 1994-10-07 1996-12-17 Nagesh; Voddarahalli K. Reliable low thermal resistance package for high power flip clip ICs
US5541450A (en) 1994-11-02 1996-07-30 Motorola, Inc. Low-profile ball-grid array semiconductor package
US5557503A (en) 1995-05-12 1996-09-17 International Business Machines Corporation Circuit card having a large module strain relief and heat sink support
US6231333B1 (en) 1995-08-24 2001-05-15 International Business Machines Corporation Apparatus and method for vacuum injection molding
US5745344A (en) 1995-11-06 1998-04-28 International Business Machines Corporation Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device
US5805427A (en) 1996-02-14 1998-09-08 Olin Corporation Ball grid array electronic package standoff design
US5956576A (en) 1996-09-13 1999-09-21 International Business Machines Corporation Enhanced protection of semiconductors with dual surface seal
KR100268460B1 (ko) 1996-12-07 2000-10-16 윤종용 표면실장용 반도체ic의 위치결정장치
DE19725177C1 (de) * 1997-06-13 1998-10-15 Emitec Emissionstechnologie Verfahren und Lotfolie zum Herstellen eines metallischen Wabenkörpers
US5990418A (en) 1997-07-29 1999-11-23 International Business Machines Corporation Hermetic CBGA/CCGA structure with thermal paste cooling
US6317333B1 (en) * 1997-08-28 2001-11-13 Mitsubishi Denki Kabushiki Kaisha Package construction of semiconductor device
JP2991172B2 (ja) * 1997-10-24 1999-12-20 日本電気株式会社 半導体装置
US6235996B1 (en) 1998-01-28 2001-05-22 International Business Machines Corporation Interconnection structure and process module assembly and rework
US6084178A (en) 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
US5926370A (en) 1998-10-29 1999-07-20 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for multi-function components
US6061235A (en) 1998-11-18 2000-05-09 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management
US6198630B1 (en) 1999-01-20 2001-03-06 Hewlett-Packard Company Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
US6276596B1 (en) 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed
US6472762B1 (en) * 2001-08-31 2002-10-29 Lsi Logic Corporation Enhanced laminate flipchip package using a high CTE heatspreader

Also Published As

Publication number Publication date
US6813162B2 (en) 2004-11-02
US20050017349A1 (en) 2005-01-27
US20030095392A1 (en) 2003-05-22

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