JP2003158105A5 - - Google Patents

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Publication number
JP2003158105A5
JP2003158105A5 JP2001355020A JP2001355020A JP2003158105A5 JP 2003158105 A5 JP2003158105 A5 JP 2003158105A5 JP 2001355020 A JP2001355020 A JP 2001355020A JP 2001355020 A JP2001355020 A JP 2001355020A JP 2003158105 A5 JP2003158105 A5 JP 2003158105A5
Authority
JP
Japan
Prior art keywords
substrate
substrate holding
contact
elastic film
ring body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001355020A
Other languages
English (en)
Japanese (ja)
Other versions
JP3989234B2 (ja
JP2003158105A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001355020A priority Critical patent/JP3989234B2/ja
Priority claimed from JP2001355020A external-priority patent/JP3989234B2/ja
Publication of JP2003158105A publication Critical patent/JP2003158105A/ja
Publication of JP2003158105A5 publication Critical patent/JP2003158105A5/ja
Application granted granted Critical
Publication of JP3989234B2 publication Critical patent/JP3989234B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2001355020A 2001-11-20 2001-11-20 基板保持装置及びポリッシング装置 Expired - Fee Related JP3989234B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001355020A JP3989234B2 (ja) 2001-11-20 2001-11-20 基板保持装置及びポリッシング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001355020A JP3989234B2 (ja) 2001-11-20 2001-11-20 基板保持装置及びポリッシング装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007160986A Division JP2007229922A (ja) 2007-06-19 2007-06-19 基板保持装置及びポリッシング装置

Publications (3)

Publication Number Publication Date
JP2003158105A JP2003158105A (ja) 2003-05-30
JP2003158105A5 true JP2003158105A5 (cg-RX-API-DMAC7.html) 2005-06-30
JP3989234B2 JP3989234B2 (ja) 2007-10-10

Family

ID=19166785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001355020A Expired - Fee Related JP3989234B2 (ja) 2001-11-20 2001-11-20 基板保持装置及びポリッシング装置

Country Status (1)

Country Link
JP (1) JP3989234B2 (cg-RX-API-DMAC7.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4515047B2 (ja) * 2003-06-06 2010-07-28 株式会社荏原製作所 弾性膜、基板保持装置、研磨装置、及び研磨方法
JP2005123485A (ja) * 2003-10-17 2005-05-12 Ebara Corp 研磨装置
JP4822744B2 (ja) * 2004-06-04 2011-11-24 三星電子株式会社 化学機械的研磨装置、キャリアヘッド及び区画リング
US7364496B2 (en) * 2006-03-03 2008-04-29 Inopla Inc. Polishing head for polishing semiconductor wafers
JP5081490B2 (ja) * 2007-04-19 2012-11-28 不二越機械工業株式会社 ワークの片面研磨装置および片面研磨方法
JP2009131920A (ja) 2007-11-29 2009-06-18 Ebara Corp 研磨装置及び方法
JP5197644B2 (ja) * 2010-02-08 2013-05-15 株式会社荏原製作所 研磨装置及び研磨方法
JP5635482B2 (ja) 2011-11-30 2014-12-03 株式会社荏原製作所 弾性膜
JP5976522B2 (ja) * 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
CN119328670A (zh) * 2024-12-19 2025-01-21 荣芯半导体(宁波)有限公司 研磨头及化学机械研磨设备

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