JP2003152337A - Method of manufacturing multilayer wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board whose surface layer can be prevented from varying in thickness even after a constraining sheet is removed. SOLUTION: A constraining green sheet 3 contains ceramic powder, and the same coloring agent is contained in both a glass ceramic green sheet 1 and the constraining green sheet 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer wiring board, a multilayer wiring board suitable for a package for housing a semiconductor element, and the like.

[0002]

2. Description of the Related Art Hitherto, as a wiring board, for example, a multilayer wiring board used for a package accommodating a semiconductor element, a multilayer ceramic wiring board capable of relatively high-density wiring has been widely used. This multilayer ceramic wiring board is composed of an insulating substrate such as alumina or glass ceramic and a wiring conductor formed on the surface thereof and made of a metal such as W, Mo, Cu, or Ag. A cavity is formed in the portion, the semiconductor element is housed in the cavity, and the cavity is hermetically sealed by the lid.

In recent years, a high density has been achieved in a wiring board applied to a semiconductor element housing package for mounting semiconductor elements such as IC and LSI, which are becoming highly integrated, and a hybrid integrated circuit device in which various electronic components are mounted. In order to obtain a low dielectric constant, a low resistance metal such as Cu can be used for the wiring circuit layer, and a low firing temperature can be used as the wiring circuit layer. 1
The so-called glass-ceramic wiring board having a temperature of 000 ° C. or less is receiving more attention.

As a method of forming such a glass-ceramic wiring board, a conductor paste containing a metal powder such as Cu or Ag as a main component is formed on a glass-ceramic green sheet by a screen printing method or the like, and a plurality of sheets are laminated. After that, the firing method is generally performed at a temperature equal to or lower than the melting point of the conductor.

However, the glass-ceramic green sheet shrinks about 10 to 20% in the X, Y, and Z directions during firing, and it is difficult to control the shrinkage rate. Direction dimension is typically ± 0.5
% Fluctuates.

The following methods have been disclosed as methods for reducing the dimensional fluctuations in the XY directions. For example, Japanese Patent Laid-Open Nos. 4-243978 and 5-2886.
7, JP-A-5-102666 and JP-A-10-2.
In No. 00261 and the like, binding green sheets that do not sinter at the firing temperature of the glass ceramic green sheets are laminated on the upper and lower surfaces of the laminated body formed by the glass ceramic green sheets and fired. This is to suppress firing shrinkage in the Y direction. Then, a method has been proposed in which the constraint green sheet is removed by rubbing with a brush or the like after firing, or by ultrasonic cleaning.

Further, among the above publications, Japanese Patent Laid-Open No. 5-288
No. 67 and Japanese Patent Laid-Open No. 10-200261 describe a method in which a colorant is added to either one of the glass ceramic green sheet and the constraining green sheet so that the guideline for removing the constraining sheet after firing can be visually determined. Has been done.

[0008]

However, in the method of manufacturing a multilayer wiring board disclosed in the above publication, for example,
When the glass ceramic green sheet contains a colorant, white ceramic powder such as Al ₂ O ₃ or ZrO ₂ used for the restraining sheet adheres to the surface of the glass ceramic wiring board after firing, and the glass ceramic The colorant component dissolved in the glass in the material diffuses to the restraint sheet side, and a color tone distribution due to the concentration distribution of the colorant component occurs near the interface between the glass ceramic wiring board and the restraint sheet. Therefore, in order to completely remove the ceramic powder of the constraining sheet until the original color tone of the glass-ceramic wiring board itself appears, it is necessary to scrape the board surface, and the thickness of one layer on the board surface tends to fluctuate in the thin direction. Become.

On the other hand, even when the constraining sheet contains a colorant, the colorant diffuses from the constraining sheet side to the glass-ceramic wiring board side exhibiting a white color and the vicinity of the substrate surface is colored. Similar to the case where the coloring agent is included in the glass-ceramic wiring board side, it is necessary to scrape the board surface until the original color tone of the glass-ceramic material appears, so the thickness of one layer on the board surface tends to fluctuate in the thin direction. In some cases, there is a problem that the thickness of the wiring circuit layer on the outermost surface becomes thin and the sheet resistance changes.

Accordingly, it is an object of the present invention to provide a method for manufacturing a multilayer wiring board which can suppress the thickness variation of the surface layer even after removing the restraining sheet.

[0011]

The method for producing a multilayer wiring board according to the present invention comprises the steps of forming a conductor wiring circuit layer on the surface of a glass ceramic green sheet containing a glass powder, an inorganic filler powder and an organic binder, and then forming the glass. A plurality of ceramic green sheets are laminated to form a laminated body, and constraining green sheets capable of maintaining porosity at the firing temperature of the glass ceramic green sheet are laminated on the upper and lower surfaces of the laminated body, and the laminated body is formed. In the method for producing a multilayer wiring board, which comprises firing at a temperature equal to or lower than the melting point of the wiring circuit layer while suppressing shrinkage in the planar direction, the constraining green sheet contains ceramic powder and the glass ceramic green. The same colorant is contained in the sheet and the restraining green sheet.

According to this structure, since there is no color tone distribution due to the concentration distribution of the colorant near the interface between the restraining sheet and the glass ceramic wiring board after firing, the restraint is applied from the surface of the glass ceramic wiring board. When removing the ceramic powder of the sheet, it is possible to determine the conditions for removing the constraining sheet without having to worry about variations in the color tone of the substrate.
Variations in layer thickness can be suppressed.

In the above-mentioned method for manufacturing a multilayer wiring board, it is desirable that the restraining green sheet contains glass powder. By including the glass powder in the constraining green sheet, the constraining sheet can be sintered even at the temperature at which the glass ceramic wiring board is fired.

In the above-mentioned method for manufacturing a multilayer wiring board, the content of the colorant in the constraining green sheet is preferably the same as or larger than the content of the colorant in the glass ceramic green sheet.

Color difference between the glass ceramic wiring board and the glass ceramic wiring board whose sintering is darkened by increasing or decreasing the amount of the coloring agent on the restraining sheet side, which is hardly sintered during firing. Can be reduced.

In the above-mentioned method for manufacturing a multilayer wiring board, the content of the coloring agent is 0.2 in the inorganic components in the constraining green sheet.
It is desirable that the content is 5.0% by mass. By setting the content of the colorant in such a range, the constraining sheet can be colored, and the sintering property of the constraining sheet and the firing shrinkage of the glass ceramic wiring board in the XY direction can be suppressed.

In the above-mentioned method for manufacturing a multilayer wiring board, the colorant is preferably one of chromium oxide and cobalt oxide. When the colorant is the above metal oxide, chromium oxide can be colored green and cobalt oxide can be colored blue, and the sinterability and constrainability of the constraining sheet and the sinterability of the glass-ceramic wiring board can be improved. It is possible to reduce the influence on the mechanical and electrical characteristics.

In the above-mentioned method for manufacturing a multilayer wiring board, if the firing shrinkage of the constraining green sheet is 0.05 to 0.5%, the strength of the constraining sheet itself can be increased and the air permeability can be secured. The sheet itself can be prevented from being broken and good binder removal property can be maintained.

In the above-mentioned method for manufacturing a multilayer wiring board, it is desirable that the wiring circuit layer is a copper foil. By using the copper foil as the wiring circuit layer, fine and highly conductive wiring can be easily formed even when co-firing with the glass ceramic.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION A method for manufacturing a glass ceramic wiring board, which is one of the multilayer wiring boards of the present invention, will be described below.

In the method for manufacturing a glass-ceramic wiring board of the present invention, first, the starting material has an average particle size of 0.5 to 1
0 μm, especially 1 to 5 μm glass powder and average particle size 0.5
Inorganic filler powder having an average particle size of 10 to 10 μm, especially 1 to 5 μm, and an average particle size of 0.1 to 2 μm, especially 0.2
Prepare ~ 1 μm colorant powder.

The glass powder used is a glass component.
At least SiO₂Including, Al₂O₃, B₂O₃, Zn
O, PbO, alkaline earth metal oxides, alkali metal acids
Of at least one of the
For example, SiO₂-B₂O ₃System, SiO₂-B₂O₃-A
l₂O₃-MO system (However, M is Ca, Sr, Mg, Ba or
Or Zn), etc., borosilicate glass, alkali silicic acid
Glass, Ba-based glass, Pb-based glass, Bi-based glass, etc.
Is mentioned.

These glasses are those which are amorphous glass by baking treatment, and by the baking treatment, alkali metal silicate, quartz, cristobalite,
Those that precipitate at least one crystal of cordierite, mullite, enstatite, anorthite, cergian, spinel, garnite, diopside, ilmenite, willemite, dolomite, petalite or a derivative thereof are used.

Further, as the inorganic filler powder, SiO ₂ such as quartz and cristobalite, Al ₂ O ₃ and Zr are used.
O ₂ , mullite, forsterite, enstatite,
At least one selected from the group consisting of spinel, magnesia and ZnO is preferably used.

The above glass powder and inorganic filler powder are
In particular, the glass component is mixed in an amount of 10 to 90% by mass, particularly 40 to 80% by mass, and the ceramic filler component is mixed in a ratio of 10 to 90% by mass, particularly 20 to 60% by mass. Considering the binder removal property and sinterability of the glass ceramic green sheet, the amount of the glass component is preferably 40 to 80% by mass.

Further, as a colorant, chromium oxide (Cr ₂
O ₃ ), or cobalt oxide (Co ₃ O ₄ , CoO), 0.2 to 5.0% by mass based on 100% by mass of the total of the glass powder and the inorganic filler powder (inorganic component).
It is desirable to be added. Chromium oxide has the effect of coloring in green, and cobalt oxide has the effect of coloring in blue, which can enhance the recognizability of the conductor pattern by an automatic machine. Iron oxide and manganese dioxide are also effective as colorants, but chromium oxide and cobalt oxide are preferable because the addition of the colorant does not easily change the dielectric loss tangent of the glass ceramic material. Further, the addition amount is particularly preferably 0.3 to 1.0 mass% because the increase of the dielectric loss tangent is small.

The restraint sheet is made of a hardly-sinterable ceramic that does not substantially shrink even when fired in order to enhance the restraint property of the glass ceramic green sheet. The restraint green sheet also contains glass powder. It is preferable that the glass powder has the same composition as the glass powder used for the glass ceramic green sheet. Regarding the glass content, although it depends on the composition of the glass-ceramic material and the composition of the restraining sheet, the firing shrinkage ratio when firing the restraining green sheet alone is 0.05 to
The glass content is preferably 0.5%, and if the firing shrinkage is in this range, the shrinkage in the XY directions of the glass ceramic wiring board can be controlled with high accuracy.

When the firing shrinkage is less than 0.05%, the strength of the constraining sheet itself is low, so that the constraining sheet is likely to be locally peeled off during firing on a large substrate, and the ceramic powder is handled during handling after firing. And glass powder are likely to scatter. On the other hand, when the firing shrinkage is more than 0.5%, the effect of increasing the dimensional accuracy becomes poor due to excessive sintering of the restraining sheet, and the air permeability decreases. In addition, it becomes difficult to remove the binder and it becomes difficult to remove the restraining sheet after firing. From such a point, it is more preferable that the proper amount of glass powder contained in the constraining green sheet is such that the firing shrinkage of the constraining sheet becomes 0.1 to 0.3%.

As described above, since the restraint sheet hardly shrinks during firing, even if the content of the coloring agent is the same as that of the glass ceramic green sheet, the color tone tends to be lighter than that of the glass ceramic material after firing. Therefore, when the amount of the coloring agent in the constraining green sheet is small, the same color tone distribution as in the case where the coloring agent is not added is likely to occur. Therefore, it is desirable that the content of the colorant in the constraining green sheet is larger than that in the glass ceramic green sheet.

Next, a method for manufacturing the glass ceramic wiring board of the present invention will be described with reference to the process chart of FIG.

First, as shown in FIG. 1A, the glass ceramic green sheet 1 is prepared by adding an organic binder, a plasticizer and the like to the above composition for glass ceramic, and then applying a doctor blade method, It is formed into a sheet having a thickness of about 50 to 500 μm by a forming method such as a rolling method or a pressing method. On the other hand, although not shown, the constraining green sheet is also formed using the same molding method as that for the glass ceramic green sheet.

As the organic binder, it is desirable to use a methacrylic resin from the viewpoint of debinding property, specifically, i-BMA (isobutyl methacrylate), n-BMA.
Examples thereof include BMA (normal butyl methacrylate) and MMA (methyl methacrylate). Among these, i-BMA is most preferable.

Next, as shown in FIG. 1 (b), the glass ceramic green sheet 1 has a diameter of 50 to 200 μm by using a processing method such as laser, microdrill, punching or the like.
m through-holes are formed, and a conductor paste is filled in the through-holes to form the via-hole conductor 5.

The conductor paste is formed by mixing a metal component such as Cu and Ag with an organic binder such as an acrylic resin and an organic solvent such as terpineol. A glass component or the like may be added to this conductor paste.

Next, as shown in FIGS. 1 (c) and 1 (d),
A wiring circuit layer 7 is formed on the surface of the glass ceramic green sheet 1. The wiring circuit layer 7 can also be formed by a printing method or the like using a conductor paste containing a metal conductor powder for forming the above-mentioned via-hole conductor 5, but in particular, the width of the wiring circuit layer 7 is 75 μm or less. , Especially 5
It is desirable to use a metal foil in order to form a fine wiring of 0 μm or less and the pitch of the wiring circuit layer 7 of 100 μm or less, particularly 75 μm or less. As the metal foil, Cu, A having a purity of 99.5% by mass or more is particularly used in consideration of lowering resistance.
It is desirable that it is made of at least one high-purity metal selected from the group consisting of g, Al, Au, Ni, Pt, and Pd.
Cu foil is particularly preferable in terms of resistance and cost. The thickness of the metal foil is preferably 30 μm or less in order to prevent delamination between the substrate layers after firing. In order to improve the adhesion to the glass ceramic green sheet, the surface roughness of at least one of the metal foils is most preferably 0.6 μm or more, especially 2 μm or more in Rz.

A wiring circuit layer 7 made of such a metal foil
There is known a method of forming a desired circuit by a well-known method such as a photo-etching method after adhering a metal foil to the surface of the glass ceramic green sheet 1. In such a method, the glass ceramic green sheet 1 is formed by an etching solution. Therefore, it is desirable to form by a transfer method.

As shown in FIG. 2, the wiring circuit layer 7 used in the transfer method is obtained by adhering a high-purity metal conductor, particularly a metal foil 13, onto a transfer film 11 made of a polymer material, and then, the surface of the metal foil 13. After the resist 15 is formed into a circuit pattern, the resist 15 is removed by etching.

Then, as shown in FIG. 1C, the transfer film 11 having the wiring circuit layer 7 formed thereon is aligned with the surface of the glass ceramic green sheet 1 having the via-hole conductor 5 and laminated and pressure-bonded thereto. Transfer film 11
By peeling off, one unit of the green sheet 1a as shown in FIG. 1 (d) having the wiring circuit layer 7 to which the via-hole conductor 5 is connected can be formed.

Thereafter, as shown in FIG. 1 (e), a plurality of green sheets 1a to 1d obtained in the same manner are laminated and pressure-bonded to form a laminated body. Green sheets 1a-1d
Of the stacked green sheets 1a to 1d
In addition, a method of applying heat and pressure to perform thermocompression bonding, an adhesive including an organic binder, a plasticizer, a solvent, and the like are added to the green sheet 1
A method of applying between the a to 1d and thermocompression bonding can be adopted.

Next, as shown in FIG. 1 (f), in order to suppress shrinkage in the plane direction, a ceramic material which is difficult to sinter at the firing temperature of the laminated body 21 composed of the green sheets 1a to 1d is used as a main component. The restraining green sheet 3 is pressure-laminated on both sides of the laminate 21. In this case, the green sheet 1a-
It is also possible to stack 1d and the restraining green sheet 3 at the same time.

Here, the thickness of the constraining green sheet 3 laminated on the laminated body of the green sheets 1a to 1d enhances the constraining force of the laminated body 21 and facilitates volatilization of the organic component, and the glass formed after firing. Considering the removability of the restraining sheet from the ceramic wiring board, the thickness of the laminated body 21 of the green sheets 1a to 1d is 10 to 20 with respect to the thickness thereof.
It is preferably 0%, and particularly 20 to 10 for the reason that XY shrinkage of the substrate can be effectively suppressed.
0% is desirable. The thickness of the constraining green sheet 3 refers to the thickness of the constraining green sheet 3 laminated on the surface on one side.

Next, as shown in FIG. 1 (g), the laminated body 21 sandwiched by the constraining green sheets 3 is formed into 10 layers.
After the heat treatment at 0 to 850 ° C., particularly 400 to 750 ° C., the organic components contained in the glass ceramic green sheet 1, the constraining green sheet 3 and the conductor paste embedded in the through holes are decomposed and removed, and then, hand,
Simultaneous firing of the laminated body 21 and the constraining green sheet 3 sandwiching the laminated body 21 at a temperature of 800 to 1100 ° C., particularly 800 to 1000 ° C. causes firing shrinkage in the Z direction but in the XY direction. The glass-ceramic wiring board 23 in which firing shrinkage is suppressed is manufactured. At this time, the restraining sheets 25 formed by firing are adhered to the upper and lower surfaces of the glass ceramic wiring board 23.

When a readily oxidizable conductor such as a Cu conductor is used as the wiring circuit layer 7, the firing atmosphere needs to be an atmosphere such as nitrogen containing water vapor, and the wiring circuit layer 7 is not easily oxidized such as an Ag conductor. When using, the firing atmosphere can be an oxidizing atmosphere such as air. If the cooling rate after firing in this firing is too fast,
The cooling rate is preferably 400 ° C./hr or less because cracks occur due to the temperature difference and the thermal expansion difference among the glass ceramic wiring board 23, the wiring circuit layer 7, and the restraining sheet 25. In addition, a load may be applied by placing a weight on the upper surface of the laminate to prevent warpage during firing. A suitable load at that time is 50 Pa to 1 MPa.

After that, the restraining sheets 25 adhered to the upper and lower surfaces of the glass ceramic wiring board 23 are removed by ultrasonic cleaning, polishing, water jet, chemical blast, sand blast, wet blast, dry blast and the like. According to the method for manufacturing a multilayer wiring board of the present invention, since the same colorant is contained in both the glass ceramic wiring board 23 and the restraining sheet 25, even if both layers are co-fired and adhered, the interface between them will be reduced. Variations in color tone in the vicinity are suppressed.

Therefore, the glass ceramic wiring board 23
Alternatively, as compared with the conventional method for manufacturing a multilayer wiring board in which a coloring agent is contained in only one of the restraining sheets 25 so that the vicinity of the interface can be easily visually determined, the glass ceramic wiring board 23 or the restraining sheet is used. Since the diffusion of the colorant from the sheet 25 is suppressed, when removing the ceramic powder of the constraining sheet 25 from the surface of the glass ceramic wiring board 23, without worrying about the variation in the color tone of the glass ceramic wiring board 23, The removal conditions for the restraint sheet 25 can be determined, so that the restraint sheet 23 can be removed.
It is possible to suppress variation in the thickness of one layer on the substrate surface due to removal.

In the glass-ceramic wiring board 23 obtained by the above-mentioned method, firing shrinkage occurs only in the thickness direction due to the action of the restraining sheet 25.
For example, when the laminated body 21 has a rectangular shape, the contraction rate of the length of one side can be suppressed to 1% or less, and the glass ceramic wiring board 23 is constrained by the restraining sheet 25. Since the binding is performed uniformly and surely over the entire surface, it is possible to prevent the restraint sheet 25 from being warped or deformed due to partial peeling or the like.

Glass-ceramic wiring board 2 manufactured by the method for manufacturing a multilayer wiring board obtained by the above method
A schematic cross-sectional view of an example of No. 3 is shown in FIG.

The glass-ceramic wiring board 2 shown in FIG.
3, the plurality of insulating layers 31a having a thickness of 50 to 250 μm
31d is laminated on the insulating substrate 33, and between the insulating layers 31a to 31d and on the surface of the insulating substrate 33,
A wiring circuit layer 35 made of a high-purity metal foil having a thickness of about 9 to 18 μm is adhered and formed.

Further, via-hole conductors 37 having a diameter of 50 to 200 μm are formed so as to penetrate through the insulating layers 31a to 31d in the thickness direction, thereby connecting the wiring circuit layers 35 to achieve a predetermined circuit. A network for Further, semiconductor elements, electronic components, etc. are mounted on the surface of the wiring circuit layer 35.

In the present invention, the glass-ceramic wiring board 23 has a coefficient of thermal expansion of the glass-ceramic insulating board in order to reduce the difference in average coefficient of thermal expansion from an external circuit board such as a printed board to improve mounting reliability. Is 8 × 10
It is preferably ⁻⁶ / ° C. or higher, and particularly preferably 9 × 10 ⁻⁶ / ° C. or higher.

[0051]

Example A glass-ceramic wiring board, which is one of the multilayer wiring boards, was manufactured as follows.

First, SiO₂-BaO-B₂O₃-Al₂O
₃Amorphous glass powder with an average particle size of 5 μm, average particles
Quartz powder with a diameter of 5 μm, acid with an average particle size of 0.5 μm
Chromide (Cr₂O₃) 50% by weight of each powder: 50
Glass-ceramic composed of mass%: 0.3 mass%
Composition A and SiO₂-Al₂O₃-MgO-B₂O₃−
ZnO-based crystalline glass powder with an average particle size of 3 μm, average
SiO with a particle size of 1 μm ₂Glass powder, average particle size 1μm
ZnO powder, cobalt oxide having an average particle size of 0.9 μm
(Co₃O_Four) 75% by weight of powder: 15% by weight:
Glass cerami composed of 10% by mass: 0.4% by mass
Preparation composition B was prepared.

An average mass molecular weight of 4 as an organic binder is 100% by weight of the above composition A and composition B.
Glass ceramic green with a thickness of 300 μm was prepared by mixing 100,000 of isobutyl methacrylate at 12% by mass and DBP (dibutylphthalate) as a plasticizer at a ratio of 5% by mass with toluene as a solvent and using a prepared slurry by a doctor blade method. Sheets A1 and B1 were produced. The glass ceramic green sheet was designed so as to shrink to a thickness of 180 μm by constrained firing.

On the other hand, the polymer film has a purity of 99.5%.
The above Cu foil was adhered and a wiring circuit layer was formed by etching to prepare a transfer sheet. The wiring width was 50 μm and the wiring circuit layer pitch was 100 μm. Then, an adhesive containing an organic component used for forming the green sheet is applied to the surface of the transfer sheet on which the wiring circuit layer is formed by screen printing, and then the transfer sheet is laminated on the glass ceramic green sheets A1 and B1. ℃, 5MP
It was thermocompression bonded with a. Then, the transfer sheet was peeled off to form one unit of the wiring circuit layer including the wiring circuit layer. Also, five arbitrary one unit green sheets were laminated to form laminated bodies A10 and B10.

Regarding the composition of the constraining green sheet, for the laminate A10, forsterite powder having an average particle size of ₂ μm and SiO ₂ —BaO— having an average particle size of 5 μm were used.
B ₂ O ₃ —Al ₂ O ₃ -based amorphous glass powder and chromium oxide powder having an average particle size of 0.5 μm were mixed at the ratio shown in Table 1, and the same organic binder as in the production of the glass ceramic green sheet A1 was used, A restraining green sheet A2 having a thickness of 300 μm was produced using a plasticizer and a solvent.

For the laminated body B10, the average particle size is 2 μm.
m of alumina powder, SiO ₂ -Al ₂ having an average particle size of 3 μm
O ₃ —MgO—B ₂ O ₃ —ZnO-based crystalline glass powder and cobalt oxide powder having an average particle size of 0.9 μm were mixed at the ratio shown in Table 1, and the same organic binder as when the glass ceramic green sheet B1 was prepared. A constraining green sheet B2 having a thickness of 300 μm was prepared using a plasticizer and a solvent.

Next, the constraining green sheet A1 was pressure-laminated on both upper and lower surfaces of the laminated body A10 at 50 ° C. and 5 MPa, and the laminated body A20 composed of a plurality of green sheets was sandwiched by the constraining green sheet A2. Similarly, the laminated body B20 composed of the glass ceramic green sheet B1 was sandwiched by the constraining green sheets B2.

Next, the laminates A20 and B20 sandwiched by the restraining green sheets A2 and B2 are placed on a porous setter to contain water vapor in order to decompose and remove organic components such as an organic binder. It was heated to 750 ° C. in a nitrogen atmosphere, and was further fired at 950 ° C. for 1 hour in the same atmosphere. After firing, it was observed whether or not the restraint sheets adhered to the upper and lower surfaces of the glass ceramic wiring board were peeled off.
The firing shrinkage in the X-Y direction of the restraint sheet was evaluated by firing the restraint green sheet alone.

Next, the restraining sheets adhered to the upper and lower surfaces of the glass ceramic wiring board were removed by blasting. The blasting conditions were such that the constraining sheet component completely disappeared from the surface copper foil conductor. However, when the colorant is not contained in both the constraining sheet and the insulating layer made of glass ceramic, or when the content of the colorant on the side of the constraining sheet is smaller than the content of the insulating layer made of glass ceramic, Since the color tone of the surface of the insulating layer made of glass ceramic was different from the original color tone under the blast conditions, blast treatment was added until the original color tone of the insulating layer porcelain appeared. Then, the cross section of the produced glass-ceramic wiring board was observed and the thickness of the board surface layer was measured. Table 1 shows the evaluation results of the shrinkage rate of the restraint sheet, the peeling of the restraint sheet after firing, and the thickness of the substrate surface layer after the blast treatment.
Are also shown.

[0060]

[Table 1]

As is clear from Table 1, sample No. 1 in which the same colorant was contained in the glass ceramic green sheet and the constraining green sheet was used. 1-3, 5-10,
The thickness of the surface layer of the glass ceramic wiring board is 180 ± 5μ
m, and the surface layer thickness could be brought close to the design value.

On the other hand, Sample No. 1 in which the colorant was added to the glass ceramic green sheet but the colorant was not added to the restraining green sheet. In Nos. 4 and 11, since the colorant on the surface layer of the glass-ceramic wiring board diffused toward the restraint sheet side, the ceramic powder of the restraint sheet should be completely removed until the color tone of the surface layer of the glass-ceramic board becomes whitish and the original color tone of the substrate itself appears. When a large amount of the substrate surface was shaved, the thickness of one layer on the substrate surface became significantly smaller than the design value.

[0063]

As described in detail above, according to the present invention,
By including the same colorant in the glass ceramic green sheet and the constraining green sheet, there is no color tone distribution due to the concentration distribution of the colorant near the interface between the constraining sheet and the glass ceramic wiring board after firing. When removing the ceramic powder of the constraining sheet from the surface of the glass-ceramic wiring board, the removal condition of the constraining sheet can be determined without worrying about the change in the color tone of the substrate. Since the variation in the thickness of one layer on the surface can be suppressed, a multilayer wiring board with high dimensional accuracy can be obtained.

[Brief description of drawings]

FIG. 1 is a process chart for explaining a method for manufacturing a multilayer wiring board according to the present invention.

FIG. 2 is a process drawing of producing a transfer sheet used for producing the multilayer wiring board of the present invention.

FIG. 3 is a schematic cross-sectional view of a multilayer wiring board obtained by the method for manufacturing a multilayer wiring board of the present invention.

[Explanation of symbols]

1 glass ceramic green sheet 3 restraint green sheets 7 Wiring circuit layer 21 laminate

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yasuhide Minmin             Kyocera Co., Ltd. 1-4 Yamashita Town, Kokubun City, Kagoshima Prefecture             Shikisha Research Institute F-term (reference) 5E346 AA12 AA15 AA24 AA38 BB01                       CC18 CC32 CC34 CC37 CC38                       CC39 CC60 DD02 DD33 EE24                       EE25 FF18 GG02 GG03 GG08                       GG09 HH11 HH33

Claims (7)

[Claims] 1. A conductor wiring circuit layer is formed on the surface of a glass ceramic green sheet containing a glass powder, an inorganic filler powder and an organic binder, and a plurality of the glass ceramic green sheets are laminated to form a laminate. A constraining green sheet capable of maintaining porosity at the firing temperature of the glass ceramic green sheet is laminated on the upper and lower surfaces of the laminated body, and the laminated body is arranged in a plane direction at a temperature equal to or lower than the melting point of the wiring circuit layer. In the method for manufacturing a multilayer wiring board formed by firing while suppressing the shrinkage of the glass, the constraining green sheet contains ceramic powder, and the glass ceramic green sheet and the constraining green sheet contain the same colorant. A method for manufacturing a multilayer wiring board, comprising: 2. The method for manufacturing a multilayer wiring board according to claim 1, wherein the restraining green sheet contains glass powder. 3. The colorant content in the constraining green sheet is the same as or higher than the colorant content in the glass ceramic green sheet.
A method for manufacturing the multilayer wiring board according to. 4. The multilayer wiring board according to claim 1, wherein the content of the colorant in the inorganic components of the constraining green sheet is 0.2 to 5.0% by mass. Manufacturing method. 5. The method for manufacturing a multilayer wiring board according to claim 1, wherein the coloring agent is one of chromium oxide and cobalt oxide. 6. The firing shrinkage of the restraining green sheet is
It is 0.05-0.5%, The manufacturing method of the multilayer wiring board in any one of Claim 1 thru | or 5 characterized by the above-mentioned. 7. The method for manufacturing a multilayer wiring board according to claim 1, wherein the wiring circuit layer is a copper foil.