JP2003138393A - Method of manufacturing metal parts and metal parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing metal parts which can simultaneously form a plurality of micropores of a uniform pore diameter and a high aspect ratio. SOLUTION: The method of manufacturing the metal parts by electroforming a metallic material on the forming surface of a mold is furnished with a mold forming process step of depositing a resist film on the forming surface of the mold and depositing a conductive film for electroforming on this resist film, an electroforming process step of depositing a metallic material on the conductive film for electroforming by energizing the conductive film for electroforming by charging the mold into a metallic bath and a peeling process step of forming the metal parts by removing the resist film thereby peeling the metallic material from the mold.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a metal part and a metal part thereof, and more particularly to a method of manufacturing a metal part having a high aspect ratio and small holes.

[0002]

2. Description of the Related Art In general, various injection nozzles such as spinning nozzles and ink jet nozzles are constructed by providing a base material such as a metal material with one or a plurality of through holes having a hole diameter of several tens of μm and a high aspect ratio. The spinning raw material, ink, and the like can be jetted from these holes. Also,
Similarly, various optical parts such as photomasks for forming semiconductors are also constructed by providing one or a plurality of holes having a high aspect ratio in the base material, and various kinds of radiant light and electron beams can be irradiated through these holes. It is like this. Here, the aspect ratio is a value obtained by dividing the depth of the hole (the length of the hole) by the hole diameter, and the hole having a high aspect ratio has a deep (long) depth (long) and a small hole diameter. It means a small shaped hole.

[0003]

Problems to be Solved by the Invention To form the above holes,
For example, an etching method using a photofabrication technique is adopted. However, in this method, due to subtle variations in the density of the metallic material that is the base material,
There is a problem in that the etching rate has a distribution and the hole diameters vary among the holes.

Further, as other methods, a drilling method, an electric discharge machining method, a laser machining method, an electron beam irradiation machining method and the like have been proposed. However, these methods usually
Since one hole is formed in one processing step, the processing step needs to be repeated a plurality of times to form a plurality of holes, which complicates the process and may cause displacement of the relative positions of the holes. . Further, these methods also have a problem in that it is difficult to form the desired fine holes having a high aspect ratio.

Therefore, recently, for example, Japanese Patent Application Laid-Open No. 7-890.
Like No. 78, a molding die having a plurality of convex portions is prepared, and the die is immersed in a metal bath or the like, and then a metal is electroformed on the surface of the die to form a metal part. There has been proposed a method for manufacturing a metal component having a hole corresponding to a convex portion by peeling the metal component from the mold.

In the above conventional method, the convex portion of the mold is formed into a tapered shape so that the metal component can be easily separated from the mold. On the other hand, the tapered shape of the convex portion corresponds to the shape of the hole of the metallic component. It was reflected, and it was difficult to form a hole having a constant diameter. Further, since the mold and the metal component are in direct contact with each other, the surface of the mold may be damaged during the peeling, which may make it difficult to reuse the mold. Furthermore,
There is also a problem that labor is required to manufacture the mold because the mold manufacturing process is complicated. Furthermore, since the electric discharge machining method is used to form the convex portions of the mold, there is a limit to reducing the diameter of the convex portions, which makes it difficult to form fine holes with a high aspect ratio. .

The present invention has been made in view of the above circumstances, and provides a method of manufacturing a metal component and a metal component capable of simultaneously forming a plurality of fine holes having a uniform diameter and a high aspect ratio. With the goal.

[0008]

In order to achieve the above object, the present invention has the following constitutions. The method for producing a metal part of the present invention is a method for producing a metal part by electroforming a metal material on the molding surface of a mold, and forming a resist film on the molding surface of the mold and the resist film. A mold forming step of depositing a conductive film for electroforming thereon, and electroforming for depositing a metal material on the conductive film by introducing the mold into a metal bath and energizing the conductive film for electroforming. And a peeling step of peeling the metal material from the mold to form a metal component by removing the resist film.

According to the method for manufacturing a metal component, the mold and the metal material can be easily separated by removing the resist film located between the mold and the metal material in the peeling step. Does not damage the molding surface of the mold or metal parts. Therefore, the mold can be reused,
It becomes possible to manufacture high quality metal parts. Further, since the electroforming conductive film is formed on the resist film, the metal material can be easily deposited by electroforming.

The metal part manufacturing method of the present invention is the metal part manufacturing method described above, wherein the mold is a plate-shaped base part and a plurality of columnar holes protruding from one surface of the base part. The molding surface comprises at least the one surface of the base body and the side surfaces of the plurality of hole forming portions, and in the mold forming step, the resist film is formed on the one surface and the side surface. While forming a film on the entire surface,
The electroconductive film for electroforming is formed only on the one surface.

According to the method of manufacturing a metal part, since the resist film is formed on the entire one surface and the side surface, the resist film can be necessarily interposed between the mold and the metal material. By removing the, it becomes possible to easily separate the mold and the metal material. Therefore, unlike the conventional case, it is not necessary to provide a tapered surface in the columnar hole forming portion, and it is possible to form a hole having a constant hole diameter along the depth direction (length direction) and a high aspect ratio. Become. Furthermore, since the electroforming conductive film is formed only on the one surface, the growth direction of the metal material in the electroforming step can be made substantially coincident with the vertical direction of the one surface of the die, which makes the thickness substantially constant. It becomes possible to form a plate-shaped metal part.

The method of manufacturing a metal part according to the present invention is the method of manufacturing a metal part described above, wherein a columnar mold damage preventing hole is formed around the plurality of columnar hole forming portions of the mold. A part is formed, and in the mold forming step, the resist film is formed on the entire surface of the one surface and the side surface and also on the side surface of the mold damage preventing hole forming portion, and the electroforming conductive film is formed. It is characterized in that the film is formed on one surface.

According to the method of manufacturing a metal part, the column-shaped hole-forming portion for preventing damage to the die is formed around the plurality of column-shaped hole forming portions, so that when the metal material is peeled from the die, Even if the part is damaged, the damaged part is limited to the mold damage preventing hole forming part, so that the hole forming part is not likely to be damaged and the mold can be reused repeatedly.

Further, the method for producing a metal component of the present invention is the method for producing a metal component described above, wherein the metal material is deposited on the electroforming conductive film in the electroforming step. A plurality of holes corresponding to the hole forming portion are formed in the metal material.

According to the method of manufacturing a metal part, since a plurality of holes corresponding to the hole forming portion are formed in the metal material, the shape and position of the hole forming portion are changed so that the holes formed in the metal material can be formed. It is possible to arbitrarily change the hole diameter, the aspect ratio, the hole forming position, and the like.

Further, the method for manufacturing a metal part according to the present invention is the above-described method for manufacturing a metal part, wherein the columnar hole-forming portion has a substantially circular shape or a substantially cross shape in plan view. Is characterized by. According to the method for manufacturing the metal component,
A hole having a circular shape in plan view or a cross shape in plan view can be formed. In particular, a metal component having a cross-shaped hole can be suitably used as a spinning nozzle.

A method of manufacturing a metal part according to the present invention is the method of manufacturing a metal part described above, characterized in that the resist film is formed by an electrodeposition method.

According to the method for manufacturing a metal part, since the resist film is formed by the electrodeposition method, the film thickness of the resist film can be made uniform even if the molding surface of the mold has a complicated shape. It becomes possible to form a metal part that faithfully corresponds to the molding surface of the mold.

Furthermore, the method for manufacturing a metal part of the present invention is the method for manufacturing a metal part described above, wherein in the mold forming step, the resist is formed after forming a conductive underlayer film on the molding surface. A feature is that a film is formed.

According to the method for manufacturing a metal part, since the conductive underlayer film is formed in advance before the resist film is formed by the electrodeposition method, even if the mold is made of a high resistance material, the mold is molded. It is possible to easily form a resist film on the surface. The conductive base film has a mold specific resistance value of, for example, 20Ω.
-Cm or more, preferably 15 Ω-cm or more, more preferably 10 Ω-cm or more.

Further, a method for manufacturing a metal part of the present invention is the method for manufacturing a metal part described above, characterized in that the resist film is formed by a spray method.

According to the method for manufacturing a metal part, since the resist film is formed by the spray method, the film thickness of the resist film can be made uniform even if the molding surface of the mold has a complicated shape. It is possible to form a metal part that faithfully corresponds to the molding surface of.

The method for manufacturing a metal part of the present invention is the method for manufacturing a metal part described above, characterized in that the mold is washed with running water after the resist film is formed. According to the method for manufacturing a metal part, since the mold is washed with running water after forming the resist film, excess uncured resist solution can be removed, and a metal that accurately reflects the shape of the hole forming portion can be removed. You can get the parts.

Furthermore, the method for producing a metal part of the present invention is the method for producing a metal part as described above, wherein in the stripping step, the resist film is placed in a solvent in which the resist film is soluble. Is added to dissolve and remove the resist film with the solvent.

According to the method of manufacturing a metal part, since the resist film is dissolved and removed by putting the mold and the metal material together in a solvent, the resist film can be easily removed.

Furthermore, the method for producing a metal part of the present invention is the method for producing a metal part described above, wherein the solvent is selected from acetone, xylene and a hydrogen peroxide-ammonia mixed solution. It is characterized by being one of them. According to the method for manufacturing a metal part, the resist film can be rapidly dissolved by using the above solvent. In particular, a hydrogen peroxide-ammonia mixed solution can dissolve the resist film most quickly.

The method for manufacturing a metal part according to the present invention is the method for manufacturing a metal part described above, wherein the thickness of the metal material is equal to or less than the height of the hole forming portion in the electroforming step. By doing so, the resist film formed on the side surface of the hole forming portion is exposed on the upper surface side of the hole forming portion, and the solvent is permeated from the exposed portion. According to the method for manufacturing a metal component, since the resist film formed on the side surface of the hole forming portion is exposed on the upper surface side, the solvent can be quickly impregnated into the resist film, and the resist film can be dissolved more quickly. Can be done.

Next, the metal part of the present invention is a metal part obtained by electroforming a metal material on the molding surface of a mold, and includes a plate-shaped base part and a plurality of columnar parts protruding from one surface of the base part. Forming a resist film on the molding surface of the mold including the hole forming part, and forming an electroforming conductive film on the resist film, and further introducing the mold into a metal bath. The hole forming formed by energizing the electroforming conductive film to deposit a metal material on the electroforming conductive film, further removing the resist film and peeling the metal material from the mold. It is characterized by comprising a plurality of holes corresponding to the parts.

According to such a metal part, the metal part can be obtained by peeling the metal material from the mold by removing the resist film located between the mold and the metal material, so that the metal part is not damaged. Further, since the mold and the metal material can be easily separated by removing the resist film, it is not necessary to provide a tapered surface in the hole forming portion as in the conventional case, and the hole diameter of the hole provided in the metal component can be reduced. It becomes possible to make it constant along the depth direction (length direction) and to increase the aspect ratio.

[0030]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. The manufacturing method of the metal component of the present invention,
A mold forming step of forming a resist film on the molding surface of the mold and forming a conductive film for electroforming on the resist film, and putting the mold in a metal bath to energize the conductive film for electroforming. Due to
It comprises an electroforming step of depositing a metal material on the conductive film, and a peeling step of removing the resist film and peeling the metal material from the mold to form a metal part. Each of the above steps will be described with reference to the drawings. 1 to 10 are process diagrams of a method for manufacturing a metal component.

First, in the mold forming step, as shown in FIG. 1, the shielding films 2 are patterned on the upper surface of the plate-shaped substrate 1. The patterning is performed, for example, by forming a thin film of Al, Cu, W or the like on the entire upper surface 1a by a sputtering method or the like, and forming a mask layer, etching the thin film previously formed, or removing the mask layer. Further, as the shielding film 2 ...
iO ₂ film or a resist film or the like may be used as patterning the. The shape of each shielding film 2 ... Is preferably, for example, substantially circular in a plan view. The material of the base material 1 is silicon,
Metals, plastics, resist materials, etc. can be used. In particular, as silicon, it is preferable to use P, B or the like doped to have a resistivity of, for example, about 0.331 to 0.46 Ω · cm, because the formation of a conductive base film described later can be omitted. Incidentally, the resistivity of silicon is not limited to the above range, and one having a resistivity larger than 0.46 Ω · cm,
It may be smaller than 0.331 Ω · cm. The resistivity of silicon serves as a criterion for determining whether or not a conductive underlayer film is formed as described later.

Next, as shown in FIG. 2, anisotropic etching is performed on a portion other than the region where the shielding films 2 ... Are formed. Etching is performed by using, for example, CF ₄ and O ₂ as etching gases.
It is preferable to use a high-frequency inductively coupled plasma-reactive ion etching method (ICP-RIE method). According to the combination of the above etching gases, anisotropic etching can be performed on the base material 1 exposed in a portion other than the region where the shielding film 2 is formed, without etching the shielding film 2. Further, as another etching means, reactive ion etching using parallel plates as electrodes can be used. According to these etching means, as shown by the arrow in FIG. 2, the etching particles can be made incident from the direction perpendicular to the upper surface of the shielding film 2, side etching or the like does not occur, and anisotropic etching can be performed. You can

As a result of the etching, the base material 1 other than the region where the shielding films 2 are formed is etched to form a plurality of columnar (columnar) hole forming portions 1a as shown in FIG. The intervals, arrangements, and shapes of the hole forming portions 1a ... Correspond to the formation position and the pattern shape of the light shielding film 2. Further, the height of the hole forming portions 1a is preferably larger than the thickness dimension of the finally obtained metal component, for example, 1
The height is preferably about 0 to 200 μm. still,
When forming a hole in the metal component, it is preferable that the height of the hole forming portions 1a is smaller than the thickness dimension of the metal component. The height of the hole forming portions 1a ... Can be controlled by adjusting the etching time.

Next, as shown in FIG. 3, the shielding films 2 ... Are removed by acid treatment or immersion in a solvent. 3 and FIG. 3 each including a substantially plate-shaped base portion 1b and a plurality of hole forming portions 1a ... Which project from the one surface 1c of the base portion 1b in the same direction (perpendicular to the one surface 1c). A mold 11 as shown in 11 is obtained. Since the hole forming portions 1a ... Are formed by anisotropic etching, the side surface 1d is
It is not a conventional tapered surface but a vertical surface to the upper surface 1c of the base portion 1b. The upper surface 1c of the base portion 1b
With the side surface 1d of the hole forming portion 1a, the molding surface 11 of the mold 11 is formed.
a is constructed. In this way, the mold is formed by the etching method instead of the conventional electric discharge machining method, so that it is possible to obtain the mold 11 having the finer hole forming portions 1a ...

Next, as shown in FIG. 4, at least one surface 1c of the base portion 1b and the side surface 1d (forming surface 11) of the hole forming portion 1a.
In a), the conductive base film 3 is formed. In the case of FIG. 4, the conductive base film 3 is also formed on the upper surface 1e of the hole forming portion 1a. As the conductive base film 3, a laminated film of a Cr film and a Cu film is preferable, and a laminated film of a Cr film and an Ag film may be used. As shown in FIG. 4, the conductive base film 3 is preferably formed by a method such as a sputter vapor deposition method or a vacuum vapor deposition method. Particularly, it is performed under the condition that the incident directions of vapor deposition particles are non-uniform.
The conductive base film 3 can be uniformly formed on the side surfaces 1d of the hole forming portions 1a ... The thickness of the conductive base film 3 is
It is preferably in the range of 0.1 to 1 μm. If the film thickness is less than 0.1 μm, it is not preferable because the conductivity is not sufficiently imparted to the side surface 1d, and if the film thickness exceeds 1 μm, the diameter of the hole forming portion 1a becomes large, which is not preferable.

As will be described later, the conductive underlayer film 3 imparts conductivity to the molding surface 11a when the resist film is formed by the electrodeposition method to promote the growth of the resist film. Therefore, if the mold 11 itself has conductivity, it is not necessary to form the conductive base film 3. Whether or not the conductive base film 3 is formed can be determined based on the resistivity of the mold 11 itself. For example, when the mold 11 (base material 1) is made of silicon, the conductive base film 3 is formed. Membrane is required for type 1
The resistivity of 1 is 10 Ω · cm or more, more preferably 12.
The case is 5 Ω · cm or more, more preferably 15 Ω · cm or more, and most preferably 20 Ω · cm or more. In other cases, it is not necessary to form the conductive base film 3.

Next, as shown in FIG. 5, the conductive base film 3 is formed.
A resist film 4 is formed on top. As the resist film 4, for example, a positive type or negative type resist film is preferably used. Further, as the film thickness of the resist film 4,
The range of 3 to 5 μm is preferable. If the film thickness is less than 2 μm,
It is not preferable because the resist film 4 cannot be formed with a uniform film thickness, and if the film thickness exceeds 7 μm, the shape of the hole forming portion 1a cannot be precisely transferred, which is not preferable.

For forming the resist film 4, means such as electrodeposition, spraying, and CVD vapor deposition can be used. By using these film forming means, the molding surface 11a of the mold 11 having severe irregularities can be formed. The resist film 4 can be formed with a uniform film thickness on the entire surface. Next, a method of forming the resist film 4 by the electrodeposition method will be described. FIG. 12 shows an electrodeposition apparatus used when forming the resist film 4 by the electrodeposition method. This electrodeposition apparatus 30 is composed of an electrodeposition bath 3 filled with an electrodeposition resist solution 31.
2, a cathode electrode 33 made of platinum, stainless steel or the like, an insulating support 34 for holding the mold 11 with the molding surface 11a of the mold 11 facing the cathode electrode 33 side, and a conductive base film 3 for the mold 11.
The main component is an anode terminal 35 connected to the cathode electrode 33 and a DC power source 36 connected to the cathode electrode 33 and the anode terminal 35. The conductive base film 3 is connected to the anode of the DC power supply 36 via the anode terminal 35, and is configured to function as an anode electrode corresponding to the cathode electrode 33.

As the electrodeposition resist solution, for example,
(A) 0.5 to 1 carboxyl group per 1 kg of polymer
A polymer containing 0 equivalent and optionally 1 equivalent or more of a hydroxyphenyl group, (B) 1
A composition containing at least two vinyl ether groups in the molecule, (C) a compound that generates an acid upon irradiation with visible light, and (D) a composition containing a sensitizing dye are neutralized with a basic compound to form an aqueous medium. Examples thereof include those dissolved or dispersed therein.

The above-mentioned polymer (A) is, for example, a homopolymer of a polymerizable unsaturated monomer containing a carboxyl group; the carboxyl group-containing monomer and another copolymerizable monomer. The copolymers thereof include polyester-based, polyurethane-based and polyamide-based resins having a carboxyl group in the molecular chain or at the molecular end. Examples of the polymer containing both a carboxyl group and a hydroxyphenyl group include a copolymer of hydroxystyrene such as p-hydroxystyrene and a polymerizable unsaturated monomer containing a carboxyl group; hydroxy. Examples thereof include a copolymer of styrene and the carboxyl group-containing monomer and another copolymerizable monomer.

The above compound (B) has the formula: --R '-O--CHCH ₂ [wherein R'is one having 1 to 6 carbon atoms such as ethylene, propylene, butylene, etc.]. A linear or branched alkylene group], which is a low molecular weight or high molecular weight compound containing at least 2, preferably 2 to 4 vinyl ether groups represented by, for example, bisphenol A and bisphenol F. , Polyphenol compounds such as bisphenol S, phenol resin, ethylene glycol, propylene glycol, trimethylolpropane, trimethylolethane,
Condensates of polyols such as pentaerythritol and halogenated alkyl vinyl ethers such as chloroethyl vinyl ether; polyisocyanate compounds such as tolylene diisocyanate, xylylene diisocyanate, hexamethylene diisocyanate and isophorone diisocyanate, and hydroxyalkyl vinyl ethers such as hydroxyethyl vinyl ether. And the like.

Further, the above-mentioned compound (C) is decomposed by irradiation with visible light to give a compound (B) between the polymer (A) or the polymer (A ') and / or (A ") and the compound (B). The photoacid generator is a photoacid generator that generates an acid having a sufficient strength to cleave the cross-linked structure formed in 1. and the sensitizing dye (D) may be 400 or more. Excited by absorbing light (visible light) in the wavelength region of ˜700 nm, the above-mentioned polymer (A) or polymer (A ′), (A ″), compound (B) and / or photoacid-generating compound It is a compound having an interaction property with (C), and examples thereof include a cyanine dye, a merocyanine dye, and a coumarin dye.

The above electrodeposition resist solution contains four components of the above polymer (A), compound (B), photoacid generating compound (C) and sensitizing dye (D) as essential components, and The carboxyl group in the polymer (A) is neutralized with a basic compound and dissolved or dispersed in an aqueous medium. The mixing ratio of these components in the composition depends on the use of the composition and the like. The amount of the compound (B) is generally 0.1 to 150 parts by weight, particularly 10 to 100 parts by weight, and particularly 3 to 80 parts by weight, relative to 100 parts by weight of the polymer (A). It is preferable to use the photoacid generating compound (C) in an amount of 0.1 parts by weight, and the photoacid generating compound (C) is generally 0.1 per 100 parts by weight of the total amount of the polymer (A) and the compound (B).
.About.40 parts by weight, especially 0.2 to 20 parts by weight, more particularly 0.1.
It is suitable to use within the range of 5 to 15 parts by weight. Further, the sensitizing dye (D) is generally 0.1 to 10 parts by weight, preferably 0.5 to 5 parts by weight, more preferably 100 parts by weight of the total amount of the polymer (A) and the compound (B). Is 0.5
It can be used within the range of 3 parts by weight. The above-mentioned electrodeposition resist solution contains the above-mentioned components (A) to (D).
Can be prepared as it is or by mixing it in a solvent as the case requires, then neutralizing with a basic compound, and dissolving or dispersing it in an aqueous medium. The solvent that can be used at that time is preferably one that can dissolve each component of the composition, and dissolves in water at 10% by weight or more at room temperature. For example, ketones such as acetone and methyl ethyl ketone; methanol, ethanol, 1-10 carbon atoms such as propanol
Aliphatic alcohols; glycols such as ethylene glycol and propylene glycol; glycol ethers such as mono- or diethers such as methanol, ethanol, butanol or esters of the monoether; cyclics such as dioxane and tetrahydrofuran Ethers and the like can be mentioned. These solvents may be used alone or in combination of two or more, if necessary. These solvents are usually each component (A) ~
60 parts by weight or less based on 100 parts by weight of the total amount of (D),
It is particularly preferable to use 40 parts by weight or less.

The resist film 4 can be formed by the electrodeposition method, for example, as described below. First, the electroconductive underlayer film 3 of the mold 11 is immersed in the electrodeposition resist solution 31 as an anode, a DC power supply 36 is connected between the electrode layer 33 and the cathode electrode 33, and the electroconductive underlayer film 3 is energized. The energization can be performed by a constant voltage method of applying a constant voltage, a constant current method of applying a constant current density, or an energization method of a combination of these methods. Also, a method of gradually increasing the voltage or current density at the initial stage of energization to bring it to a predetermined value may be combined. In the case of the constant voltage method, a voltage of 5 to 250 V is usually applied for 10 seconds to 5 minutes, and in the case of the constant current method, usually 5 to 100 mA / d.
By applying the current density of m ² for 5 seconds to 5 minutes, the resist film 4 having a predetermined film thickness can be formed.

When the resist film 4 is formed by the electrodeposition method in this way, even if the molding surface 11a of the mold 11 has a complicated shape, the resist film is formed on the entire molding surface 11a to have a uniform film thickness. It is possible to form the metal part 12 that faithfully corresponds to the molding surface 11a of the mold 11. Further, since the conductive underlayer film 3 is formed in advance before the resist film 4 is formed by the electrodeposition method, the resist film 4 is formed on the molding surface 11a of the mold 11 even when the mold 11 is made of a material having high resistance.
Can be easily formed into a film.

The formed resist film 4 is, for example, 65 ° C.
Below, preferably about 1 to about 30 at a temperature of about 60 to 65 ° C.
It is preferable to heat for a minute to crosslink and cure.

As described above, the resist film 4 may be formed by the spray method. FIG. 13 shows a perspective view of a step of forming a resist film by a spray method. Figure 1
In FIG. 3, reference numeral 41 is a spray head that sprays the atomized resist liquid onto the molding surface 11 a of the mold 11. The spray head 41 is connected to a drive means (not shown) and is configured to be freely movable in the X direction or the Y direction in the drawing with a predetermined gap from the mold 11. FIG. 14 shows an enlarged sectional view of the tip of the spray head 41. The tip of the spray head 41 includes an air cap 43 having a spray hole 42, a tubular nozzle sheet 44 having a tapered tip housed inside the air cap 43, and a needle valve 45 inserted inside the nozzle sheet 44. It consists of The inner diameter of the air cap 43 is the nozzle sheet 4
The diameter is larger than the outer diameter of No. 4, and the gap between the air cap 43 and the nozzle sheet 44 serves as a gas flow path 46.
Further, the inner diameter of the nozzle seat 44 is set to be larger than the outer diameter of the needle valve 45, and the nozzle seat 44 and the needle valve 4 are
A gap between the resist liquid flow path 47 and the resist liquid flow path 5 is formed. Also,
The needle valve 45 is inserted into the nozzle 44a of the nozzle seat 44, and the needle valve 45 is moved up and down to open and close the nozzle 44a.

To spray the mist-like resist solution, while the nozzle 44a is closed by the needle valve 45, the resist solution is pressurized and supplied to the resist solution flow passage 47, and the inert gas such as air or argon or nitrogen is used. Gas flow path 46
Supply under pressure. When the needle valve 45 is raised and the nozzle 44a is opened in this state, the resist solution is drawn out from the nozzle 44a by the Venturi effect by the air and the like supplied from the outside of the nozzle sheet 44, and the resist solution and the air and the like are mixed. As a result, the atomized resist liquid is sprayed from the jet port 42. The atomized resist solution is sprayed onto the molding surface 11a of the mold 11 to evaporate the solvent of the resist solution, whereby the resist film 4 having a uniform film thickness is formed. The resist solution used here may be a known positive or negative photoresist dissolved in a solvent such as acetone. Thus, if the resist film 4 is formed by the spray method, even if the molding surface 11 of the mold 11 is formed.
Even if a has a complicated shape, the mist-like resist solution can flow into every corner of the molding surface 11a to make the film thickness of the resist film 4 uniform, and faithfully correspond to the molding surface 11a of the mold 11. The metal part 12 can be formed.

Next, as shown in FIG. 6, the electroforming conductive film 5 (5a) is formed on the resist film 4 on the one surface 1c of the base portion 1b.
To form a film. In the case of FIG. 6, the electroforming conductive film 5 (5
b) is also formed on the resist film 4 on the upper surface 1e of the hole forming portion 1a. However, the electroforming conductive film 5b on the upper surface 1e
It is preferable that the electroforming conductive film 5a formed on the upper surface 1c of the base portion is not continuous with each other. Conductive film 5 for electroforming
As will be described later, a functions as a negative electrode in the electroforming step of depositing a metal material.

As the electroforming conductive film 5, a Cu film or A
g-membranes are preferred. The electroforming conductive film 5 is, as shown in FIG.
It is preferable to form the film by a method such as a sputter deposition method or a vacuum deposition method. In particular, when the vapor deposition particles are made incident on the one surface 1c in a direction perpendicular to the one surface 1c, the electroforming conductive film 5 is formed on the one surface 1c.
It is preferable to form a film only on the upper side and prevent film formation on the side surface 1d of the hole forming portion 1a. When the electroforming conductive film 5 is formed on the side surface 1d, a metal material is deposited on the side surface 1d in addition to the one surface 1c in the electroforming step described later, and the thickness of the metal material to be formed becomes uneven. There is a risk of this being undesirable.
Further, by forming the electroforming conductive film 5 on the side surface 1d of the hole forming portion 1a, the hole forming portion upper surface 1e and the base portion whole surface 1 are formed.
If the electroforming conductive film 5 on c is continuous, a metal material will be deposited on the upper surface 1e of the hole forming portion in the electroforming step described later, which is not preferable.

The electroconductive film 5 for electroforming has a thickness of 0.05 to
The range is preferably 0.1 μm. Film thickness 0.0
If the thickness is less than 5 μm, the wire may be broken during electroforming, which is not preferable. If the thickness exceeds 0.1 μm, the hole forming portion 1a may be formed.
It is not preferable because a conductive film may be formed on the side surface 1d.

Next, as shown in FIG. 7, in the electroforming step, the metal material 12 is deposited on the electroforming conductive film 5. Examples of the material of the metal material 12 include Ni, Cu, Cr, N
Examples thereof include i-Cr alloy, Ni-Fe alloy, and Ni-W alloy. The thickness of the metal material 12 is preferably smaller than the height of the hole forming portion 1a, specifically, 5 to 195 μm.
Is preferred. If the thickness of the metal material 12 is less than 5 μm, the strength of the metal material 12 is extremely reduced and the metal parts may be damaged in the peeling step described later, which is not preferable, and if the thickness exceeds 195 μm. , Hole forming part 1a
Since the metal material 12 is formed beyond the hole, the hole forming portion 1a
It is not preferable because the inner shape of the hole corresponding to (3) may become distorted.

The metal material 12 can be formed by an electroforming method. By using this means, the metal material 1 having a uniform thickness can be obtained.
2 can be formed. FIG. 15 shows an electroforming apparatus used when the metal material 12 is formed by the electroforming method. This electroforming apparatus 50 includes an electroforming tank 52 filled with a metal bath solution 51.
An anode electrode 53 made of depolized nickel, carbonized nickel, or the like; an insulating support 54 that holds one surface 1c of the mold 11 toward the anode electrode 53 side;
The main components are a cathode terminal 55 connected to the electroforming conductive film 5a, and a DC power source 56 connected to the anode electrode 53 and the cathode terminal 55. The electroforming conductive film 5 a is connected to the cathode of the DC power supply 56 via the cathode terminal 55 and is configured to function as a cathode electrode corresponding to the anode electrode 53. The conductive underlayer film 5b formed on the upper surface 1e of the hole forming portion 1a does not function as a cathode electrode because it is electrically insulated from the conductive underlayer film 5a on the one surface 1c.

As the metal bath solution, for depositing a Ni metal material, for example, a mixed aqueous solution of nickel sulfamate, nickel chloride and boric acid (pH 3.5 to 4.5, liquid temperature 60 to 70 ° C.) is used. In addition, when depositing a metal material of Ni-Co alloy, a mixed aqueous solution of nickel sulfamate, cobalt sulfamate, nickel chloride and boric acid (pH 3.5 to 4.5, liquid temperature 40 to 60)
C.), and when further depositing a metal material of Ni-Fe alloy, nickel sulfamate, ferrous sulfamate, sodium acetate and nickel chloride mixed aqueous solution (pH 2.5 to 3.5, liquid temperature 25 to 35 ° C.) can be used. The electroforming conditions may be, for example, a current density of 10 to 500 A / m ² and an energization time of 30 to 90 minutes. In particular, it is preferable that the electroforming conditions are two stages, the current density immediately after the start of electroforming is 10 to 20 A / m ² , and the energization time is 30 to 90 minutes. 200-500A / m
² and the energization time is preferably 30 to 90 minutes. By setting the condition immediately after the start of electroforming within the above range, the amount of current applied to the electroforming conductive film 5 can be limited to prevent damage to the electroforming conductive film 5, and the following condition With the above range, the deposition time of the metal material 12 can be shortened.

By performing electroforming under the above conditions, the metal material 12 gradually grows from the electroforming conductive film 5a in the direction perpendicular to the upper surface 1c. The metal material 12 is the hole forming portion 1a ...
The holes 12a ... Corresponding to the hole forming portions 1a ... Are formed in the metal material 12 by growing in the direction perpendicular to the upper surface 1c except for the formation region. The inner diameters of the holes 12a formed are approximately equal to the outer diameter of the hole forming portion 1a plus twice the film thickness of the conductive base film 3 and the resist film 4. Since the conductive base film 5b formed on the upper surface 1e of the hole forming portion 1a is electrically insulated from the conductive base film 5a on the one surface 1c, a metal material is used for the conductive base film 5b. Does not precipitate. In addition, the side surface 1d of the hole forming portion 1a
Since only the resist film 4 is exposed, the metal material 12
And the resist film 4 are in contact with each other.

At this time, as shown in FIG.
It is preferable that the thickness of the holes is approximately equal to or less than the height of the hole forming portions 1a. As a result, the resist film 4 formed on the side surface d of the hole forming portion 1a ... Is exposed on the upper surface 1e side of the hole forming portion 1b. By forming the exposed portion 4a of the resist film 4 in this way, the solvent easily penetrates into the resist film 4 in the peeling step described later.

Next, in the peeling step, as shown in FIG.
The resist film 4 is dissolved and removed, and the metal material 12 is peeled from the mold 11. The solvent that dissolves the resist film 4 is preferably one that dissolves only the resist film 4 but not the mold 11 and the metal material 12. For example, acetone, xylene, a hydrogen peroxide-ammonia mixed solution, or the like can be used. .
Particularly, the hydrogen peroxide-ammonia mixed solution is used as the resist film 4.
Therefore, the resist film 4 can be dissolved in a short time. To remove the metal material 12 from the mold 11 specifically, for example, the metal material 12 is put together with the mold 11 in a container filled with the solvent, and the resist film 4 is dissolved by immersing the metal material 12 for several minutes to several hours. , Mold 11 to metal material 12
Can be easily peeled off. The solvent penetrates into the resist film 4 from the exposed portion 4a of the resist film 4 shown in FIG. 7, and eventually the solvent spreads over the entire resist film 4 and the resist film 4 is dissolved. When the hydrogen peroxide-ammonia mixed solution is used, the dissolution of the resist film 4 can be accelerated by heating in the range of room temperature or higher and 45 ° C. or lower. However, if the heating temperature exceeds 45 ° C., bumping of the mixed liquid may occur, which is not preferable. Furthermore, when a hydrogen peroxide-ammonia mixed solution is used, the electroforming conductive film 5a is also dissolved and removed at the same time.

The resist film 4 is dissolved and removed, so that the electroformed conductive film 5a formed on the upper surface 1c of the base portion 1b adheres to the metal material 12 after peeling, while the mold 11 is formed. The conductive base film 3 is attached. Further, the hole forming portion 1a
The electroforming conductive film 5b formed on the upper surface 1e of the is removed from the mold 11 by removing the resist film 4. Also, the mold 11
The conductive underlying film 3 still attached to the mold 11 is removed from the mold 11 by means such as acid treatment. After the mold 11 is washed and the like, it is transferred to the mold forming step and repeatedly used for manufacturing metal parts.

Then, as shown in FIG. 9, when peeled off with acetone or the like, a metal material 12 having a part of the electroforming conductive film 5a attached thereto is obtained. The desired metal component 13 shown in FIGS. 10 and 16 is obtained by dissolving and removing with a hydrogen-ammonia mixed solution or the like.
As described above, by removing the resist film 4 located between the mold 11 and the metal material 12, the metal material 12 can be easily peeled from the mold 11, and the metal material 12 is not damaged. Further, by removing the resist film 4, the mold 11
The metal material 12 can be easily separated from each other, and it is not necessary to provide a tapered surface in the hole forming portion as in the conventional case, and the hole diameter of the hole 12a provided in the metal component 13 can be changed in the depth direction (length direction). Can be made constant along with, and the aspect ratio can be increased.

The obtained metal part 13 is provided with a large number of fine holes 12a having a hole diameter of 15 to 45 μm, a length of 20 to 50 μm and an aspect ratio of 0.91 to 3.3, for example. The internal shape of the hole 12a is a shape corresponding to the hole forming portion 1a, and the hole diameter does not change along the length direction of the hole, and exhibits a high aspect ratio.

According to the above-described method of manufacturing a metal part, the mold 11 and the metal material 12 are removed by removing the resist film 4 located between the mold 11 and the metal material 12 in the peeling step.
Since the and can be easily peeled off, the molding surface 11a of the mold 11 and the metal component 13 are not damaged. Therefore, the mold 11 can be reused and a high quality metal part 13 can be manufactured. In addition, the resist film 4
Since the electroconductive film 5 for electroforming is formed thereon, the metal material can be easily deposited by electroforming.

Further, according to the above-described method of manufacturing a metal part, the resist film 4 is formed on the entire molding surface 11a, so that the resist film 4 can be always interposed between the mold 11 and the metal material 12. Therefore, the mold 11 and the metal material 12 can be easily separated by removing the resist film 4. Therefore,
Unlike the conventional case, it is not necessary to provide a tapered surface in the columnar hole forming portion, and it is possible to form a hole having a constant hole diameter along the depth direction (length direction) and a high aspect ratio.
Further, since the electroforming conductive film 5 is formed only on the one surface 1c,
The growth direction of the metal material 12 in the electroforming step can be made substantially coincident with the vertical direction of the one surface 1c of the mold 11, whereby the plate-shaped metal part 13 having a substantially constant thickness can be formed.

Further, according to the above metal part, the metal material 12 is obtained by peeling the metal material 12 from the mold 11 by removing the resist film 4 located between the mold 11 and the metal material 12.
The metal part 13 is not damaged. Further, since the mold 11 and the metal material 12 can be easily separated by removing the resist film 4, it is not necessary to provide a tapered surface in the hole forming portion as in the conventional case, and the metal part 13 is provided. The hole diameter of the hole 12a can be made constant along the depth direction (length direction), and the aspect ratio can be increased.

Further, instead of the mold 11, it is also possible to use a mold in which a columnar mold damage preventing hole forming portion is arranged around a plurality of columnar hole forming portions. The mold of this another example is shown in FIG. The mold 21 shown in FIG. 17 has a substantially plate-shaped base portion 1
b and one surface 1c of the base portion 1b in the same direction (one surface 1
.. projecting in the vertical direction (c) and a plurality of hole forming portions 1a ... Formed around the hole forming portions 1a. Hole forming part 1a
Are formed in 16 rows and 4 columns each. The mold-damage prevention hole forming portion 61a has a substantially rectangular column shape and is formed so as to surround the hole forming portion 1a in line with the row of the hole forming portions 1a. In FIG. 17, the hole forming portion 1a is surrounded by the mold damage preventing hole forming portion 61a in a single layer, but the present invention is not limited to this, and may be surrounded in double or triple.

18 to 21 show the mold 2 shown in FIG.
1 is a process drawing of manufacturing a metal part using a mold. Figure 1
In FIG. 8, a conductive base film 3, a resist film 4, and an electroforming conductive film 5 are formed on the mold 21, and the electroforming conductive film 5 is further formed.
The state where the metal material 62 is deposited on the upper side is shown. These conductive base film 3, resist film 4, and electroconductive film 5 for electroforming
Is formed with the same method and film thickness as those described with reference to FIGS. The conductive base film 3 includes one surface 1c of the base portion 1b and side surfaces 1d and top surface 1 of the hole forming portion 1a.
e, and is also formed on the side surface 61d and the upper surface 61e of the mold damage preventing hole forming portion 61a. The resist film 4 is formed on the entire surface of the conductive base film 3. Further, the electroforming conductive film 5 (5a) is formed on the resist film 4 on the one surface 1c of the base portion 1b. In addition, the electroconductive film 5 for electroforming
(5b) is also formed on the upper surface 1e of the hole forming portion 1a and the upper surface 61e of the mold damage preventing hole forming portion 61a. The conductive film 5b for electroforming on the upper surfaces 1e and 61e and the upper surface 1c of the base portion.
It is preferable that the electroformed conductive film 5a formed above is not continuous with each other. Then, as in the case of FIG. 7,
The metal material 22 is deposited on the electroforming conductive film 5.

Next, as shown in FIG. 19, the resist film 4
Is removed by dissolution and the metal material 22 is peeled off from the mold 21. As the solvent that dissolves the resist film 4, acetone, xylene, a hydrogen peroxide-ammonia mixed solution or the like can be used as in the case of FIG. It is preferable because it has high permeability. In order to peel the metal material 22 from the mold 21, the metal material 22 is put into the container filled with the solvent together with the mold 21 and is immersed for several minutes to several hours to dissolve the resist film 4. In this way, the metal material 22 can be easily peeled off from the mold 21.

The resist film 4 is dissolved and removed, so that the electroformed conductive film 5a formed on the upper surface 1c of the base portion 1b adheres to the metal material 22 after the peeling, while the mold 21 is formed. The conductive base film 3 is attached. In addition, hydrogen peroxide
When an ammonia mixed solution is used, the electroforming conductive film 5a is also dissolved and removed at the same time. The electroforming conductive film 5b formed on the upper surface 1e of the hole forming portion 1a and the upper surface 61e of the mold damage preventing hole forming portion 61a has the mold 21 formed by removing the resist film 4.
Stripped from. Further, the conductive base film 3 still attached to the mold 21 is removed from the mold 21 by means such as acid treatment. After the mold 21 is washed and the like, it is transferred to the mold forming step and repeatedly used for manufacturing metal parts.

Then, as shown in FIG. 20, the metal material 22 is obtained by peeling. In this case, the metal material 22 is formed with a hole 22a corresponding to the hole forming portion 1a and a mold damage preventing hole 62a corresponding to the mold damage preventing hole forming portion 61a. When the metal material 22 is peeled off, the peripheral portion of the metal material 22 and the die damage preventing hole forming portion 61a of the die 21 corresponding to the peripheral portion are very easily damaged. For this reason,
As shown in FIG. 0, a damaged portion 62b caused by breakage may occur on the inner surface of the die damage prevention hole 62a. Therefore,
The metal material 22 is cut along the alternate long and short dash line in FIG. As a result, as shown in FIG. 21, the damaged portion 62b is removed, and the metal component 23 having only the hole 22a is obtained.

According to this method of manufacturing a metal part, the column-shaped hole damage preventing portion 61 is formed around the column-shaped hole forming portion 1a.
By forming a, even if a part of the mold 21 is damaged when the metal material 22 is peeled from the mold 21, the damaged portion is the damage forming hole forming portion 61a and the mold damage preventing hole 62a.
Since the hole forming portion 1a and the hole 22a are not damaged, the mold 21 can be repeatedly reused, and the metal part 23 having no damaged portion can be obtained.

Further, as the hole forming portion, a hole forming portion 71a having a substantially cross shape in plan view as shown in FIG. 22 may be used. The metal component formed by the mold including the hole forming portion 71a is provided with a substantially cross-shaped hole in plan view.
Such a metal component can be suitably used, for example, as a nozzle for spinning. Further, when the metal part is manufactured using the hole forming part 71a having the shape shown in FIG. 22, it is preferable to wash the mold with running water after forming the resist film. As a result, excess uncured resist liquid can be removed, and a metal component that accurately reflects the complex shape of the hole forming portion 71a can be obtained.

[0071]

[Example] (Example 1) First, a silicon wafer is subjected to ICP-
20μ in diameter by etching by RIE method
A mold having a cylindrical hole forming portion having a height of 80 m and a height of 80 m was manufactured. That is, a mask made of a circular aluminum thin film having a diameter of 20 μm was formed on a silicon wafer (having a resistivity adjusted to 10 to 20 Ω · cm by doping with boron), and a reaction gas was changed to CF ₄ and O ₂ . ICP-RIE
By etching to a depth of 80 μm, a mold as shown in FIG. 11 was produced. Next, a conductive base film made of a laminated film of Cr and Cu was formed on the molding surface of the mold by a vacuum deposition method to a thickness of 0.1 μm (Cr: 0.005 μm, Cu:
A film having a thickness of 0.095 μm) was formed. Next, the mold is immersed in the electrodeposition resist solution, the current density is 4 A / m ² , and the solution temperature is 23 ° C.
Under these conditions, electrodeposition was performed for 20 seconds to form a resist film having a film thickness of 2 μm. Furthermore, a film thickness of 0.1 μm is formed on the resist film.
The electroconductive film for electroforming comprising the Cu film was formed by the vacuum evaporation method.

Next, the mold was immersed in a nickel sulfamate bath (nickel sulfamate: 600 g / L, nickel chloride: 15 g / L, boric acid: 30 g / L), and a current density of 500 A / A metal material having a thickness of 20 μm was formed on the mold by conducting electricity for 110 minutes under the conditions of m ² , pH 4.0, and bath temperature of 55 ° C. Finally, with the metal material still attached, the mold was immersed in acetone to remove the resist film, whereby the mold and the metal material were separated. As a result, the metal part as shown in FIG. 16 could be peeled off without any damage. The obtained metal part has a thickness of 20 μm
The hole diameter is 22 μm, and the aspect ratio is 0.
It was 91. Moreover, when the molding surface of the mold and the peeling surface of the metal part were observed by FE-SEM, no scratches were observed.

Example 2 Resistivity is 0.331 to 0.4
A mold is formed on a silicon wafer of 60 Ω · cm, and a conductive underlayer is not formed. The surface of the mold is charged with a current density of 6.7 A / m ² and a bath temperature of 23 ° C. for 15 seconds. A metal part was formed in the same manner as in Example 1 except that the resist layer was formed by performing deposition. The obtained metal part had a thickness of 50 μm, a hole diameter of 15 μm, and an aspect ratio of 3.3. No scratch was observed on the molding surface of the mold and the peeling surface of the metal part.

(Example 3) In the same manner as in Experimental Example 1, a silicon wafer was etched by the ICP-RIE method to obtain a diameter of 20 µm and a height of 60 µm, and a diameter of 40 µm.
And a mold provided with 144 pairs of columnar hole forming portions each having a height of 60 μm. The hole forming part has a diameter of 4
One set of each book was set, and 36 sets of 6 × 6 rows having the same shape were arranged in a matrix. Then, a metal part having a thickness of 56 μm was obtained in the same manner as in Experimental Example 1 except that this mold was used. Two
The average value of the diameters of the hole forming portions of the set and the inner diameter of the holes corresponding to the hole forming portions of each set were investigated. The results are shown below.

In this example, when a hydrogen peroxide-ammonia mixed solution (1: 1) was used to dissolve the resist film, the metal parts could be easily peeled off by immersion at 45 ° C. for 8 hours. did it.

As a result, in the hole forming portion having a diameter of 20 μm by design value, the actual diameter is 19.8 μm on average in the measured value and the roundness is 0.9 μm, and the corresponding hole of the metal part has a diameter of 20. The roundness was 9 μm and the roundness was 1.2 μm. Further, the hole forming portion having a diameter of 40 μm as a design value has an actual diameter of 39.6 μm on the average of measured values and a roundness of 1.2 μm, and the corresponding hole of the metal part has a diameter of 40.3 μm and a perfect circle Degree 0.8
was μm. Therefore, the roundness becomes 1.5 μm or less in any size of the hole forming portion, and it is possible to form a hole having a circular shape in plan view with extremely high accuracy.

[0077]

As described above in detail, according to the method for manufacturing a metal part of the present invention, the resist film located between the mold and the metal material is removed in the peeling step, so that the mold Since it can be easily peeled off from metal materials,
Does not damage the molding surface of the mold or metal parts. Therefore, the mold can be reused and high quality metal parts can be manufactured. Further, since the electroforming conductive film is formed on the resist film, the metal material can be easily deposited by electroforming.

Further, according to the metal part of the present invention, by removing the resist film located between the mold and the metal material,
Since it is obtained by peeling the metal material from the mold, the surface of the metal component is not damaged. Further, by removing the resist film, the mold and the metal material can be easily separated,
Unlike the conventional case, it is not necessary to provide a tapered surface in the hole forming portion, and the hole diameter of the hole provided in the metal component can be made constant along the depth direction (length direction) and the aspect ratio can be increased.

[Brief description of drawings]

FIG. 1 is a process chart for explaining a method for manufacturing a metal component that is an embodiment of the present invention.

FIG. 2 is a process chart for explaining a method for manufacturing a metal component that is an embodiment of the present invention.

FIG. 3 is a process chart for explaining the method for manufacturing the metal component according to the embodiment of the present invention.

FIG. 4 is a process chart for explaining the method for manufacturing the metal component according to the embodiment of the present invention.

FIG. 5 is a process drawing for explaining the manufacturing method of the metal component according to the embodiment of the present invention.

FIG. 6 is a process drawing for explaining the manufacturing method of the metal component according to the embodiment of the present invention.

FIG. 7 is a process chart for explaining the method for manufacturing the metal component according to the embodiment of the present invention.

FIG. 8 is a process drawing for explaining the manufacturing method of the metal component according to the embodiment of the present invention.

FIG. 9 is a process drawing for explaining the manufacturing method of the metal component according to the embodiment of the present invention.

FIG. 10 is a process drawing for explaining the manufacturing method of the metal component according to the embodiment of the present invention.

FIG. 11 is a perspective view of a mold used in the method for manufacturing the metal component according to the embodiment of the present invention.

FIG. 12 is a schematic diagram showing an electrodeposition apparatus used when forming a resist film on a mold by an electrodeposition method.

FIG. 13 is a perspective view showing a step of forming a resist film on a mold by a spray method.

FIG. 14 is a schematic cross-sectional view of the tip of a spray head used when forming a resist film on a mold by a spray method.

FIG. 15 is a schematic view showing an electroforming step in the method for manufacturing a metal component according to the embodiment of the present invention.

FIG. 16 is a perspective view showing a metal part obtained by the method for manufacturing a metal part according to the embodiment of the present invention.

FIG. 17 is a perspective view showing another example of a mold used in the method for manufacturing a metal component according to the embodiment of the present invention.

FIG. 18 is a process drawing for explaining the manufacturing method of the metal component using the mold shown in FIG.

FIG. 19 is a process drawing for explaining the manufacturing method of the metal component using the mold shown in FIG.

FIG. 20 is a process drawing for explaining the manufacturing method of the metal part using the mold shown in FIG.

FIG. 21 is a process drawing for explaining the manufacturing method of the metal component using the mold shown in FIG.

FIG. 22 is a perspective view showing a hole forming portion having a cross shape in plan view.

[Explanation of symbols]

1a Hole forming part 1b Base part 1c One side (one side of the base) 1d Side surface (side surface of hole forming part) 1e Upper surface (upper surface of hole forming part) 2 Shielding film 3 Conductive base film 4 Resist film 5 Conductive film for electroforming Type 11 11a molding surface 12 metal materials 12a hole 13 Metal parts

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yasuo Hirabayashi             Kanagawa Prefecture Ebina City Shimoimazumi 705 1 Kanagawa             Prefectural AIST (72) Inventor Hiroyuki Fujita             1-9-14 Senkawa, Toshima-ku, Tokyo (72) Inventor Tetsuhiko Iizuka             5-27-8 Funabashi, Setagaya-ku, Tokyo Casao             Gika Room 202 (72) Inventor Kuniyuki Kakushima             4-6-1 Komaba, Meguro-ku, Tokyo University of Tokyo students             AIST (72) Inventor Shin Mita             4-6-1 Komaba, Meguro-ku, Tokyo University of Tokyo students             AIST

Claims (13)

[Claims] 1. A method for producing a metal component by electroforming a metal material on a molding surface of a mold, wherein a resist film is formed on the molding surface of the mold and electroforming is performed on the resist film. A mold forming step of forming a conductive film; an electroforming step of depositing a metal material on the conductive film by introducing the mold into a metal bath and energizing the electroforming conductive film; A method of manufacturing a metal part, comprising a step of removing the metal material from the mold to form a metal part by removing the film. 2. The mold comprises a plate-shaped base part and a plurality of columnar hole forming parts protruding from one surface of the base part, wherein the forming surface is at least the one surface of the base and the plurality of holes. And a side surface of the hole forming part, and in the mold forming step, the resist film is formed on the entire one surface and the side surface, and the electroforming conductive film is formed only on the one surface. Claim 1 characterized by
A method for manufacturing a metal part according to. 3. A columnar mold damage preventing hole forming portion is formed around the plurality of columnar hole forming portions of the mold, and the resist film is formed on the entire one surface and the side surface in the mold forming step. The method for producing a metal part according to claim 2, wherein the film is formed on the side surface of the die damage preventing hole forming portion, and the electroforming conductive film is formed on the one surface. 4. In the electroforming step, a plurality of holes corresponding to the hole forming part are formed in the metal material by depositing the metal material on the electroforming conductive film. The method for manufacturing the metal component according to claim 2 or 3. 5. The plan view shape of the columnar hole forming part is
The method for manufacturing a metal component according to any one of claims 2 to 4, wherein the method has a substantially circular shape or a substantially cross shape. 6. The method of manufacturing a metal component according to claim 1, wherein the resist film is formed by an electrodeposition method. 7. The method of manufacturing a metal part according to claim 6, wherein, in the mold forming step, the resist film is formed after forming a conductive underlayer film on the molding surface. 8. The method of manufacturing a metal component according to claim 1, wherein the resist film is formed by a spray method. 9. The method of manufacturing a metal part according to claim 1, wherein the mold is washed with running water after the resist film is formed. 10. The stripping step, wherein the resist film is dissolved and removed by the solvent by introducing the mold and the metal material into a solvent in which the resist film is soluble. 10. A method of manufacturing a metal component according to claim 9. 11. The solvent is acetone, xylene,
The method for producing a metal component according to claim 10, wherein the metal component is any one selected from a hydrogen peroxide-ammonia mixed solution. 12. In the electroforming step, a resist film formed on the side surface of the hole forming portion is formed on the upper surface of the hole forming portion by setting the thickness of the metal material to be less than or equal to the height of the hole forming portion. The method for manufacturing a metal part according to claim 2, wherein the metal part is exposed to the side, and the solvent is impregnated from the exposed part. 13. A metal part obtained by electroforming a metal material on a molding surface of a mold, comprising a plate-shaped base portion and a plurality of columnar hole-formed portions protruding from one surface of the base portion. A resist film is formed on the molding surface of the mold, and a conductive film for electroforming is formed on the resist film. Then, the mold is placed in a metal bath and the conductive film for electroforming is energized. Then, a metal material is deposited on the electroforming conductive film, and the resist film is further removed to form the metal material from the mold.
A metal part comprising a plurality of holes corresponding to the hole forming part.