KR101631923B1 - Method for fabricating various patterned flexible plasma electrode using conductive inks and atmospheric pressure plasma jets - Google Patents

Method for fabricating various patterned flexible plasma electrode using conductive inks and atmospheric pressure plasma jets Download PDF

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KR101631923B1
KR101631923B1 KR1020150149684A KR20150149684A KR101631923B1 KR 101631923 B1 KR101631923 B1 KR 101631923B1 KR 1020150149684 A KR1020150149684 A KR 1020150149684A KR 20150149684 A KR20150149684 A KR 20150149684A KR 101631923 B1 KR101631923 B1 KR 101631923B1
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electrode
atmospheric pressure
conductive ink
patterning
pressure plasma
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KR1020150149684A
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Korean (ko)
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정희수
최승기
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국방과학연구소
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0033—Apparatus or processes specially adapted for manufacturing conductors or cables by electrostatic coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The present invention relates to a plasma electrode, and more particularly, to an electrode capable of applying a high voltage by using a conductive ink after treating the surface with a hydrophilic or hydrophobic surface by using a plasma jet in the atmosphere, A flexible plasma electrode having various patterns, and a method of manufacturing the same.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of fabricating flexible plasma electrodes using various conductive inks and atmospheric pressure plasma jets,

The present invention relates to a plasma electrode, and more particularly, to an electrode capable of applying a high voltage by using a conductive ink after treating the surface with a hydrophilic or hydrophobic surface by using a plasma jet in the atmosphere, A flexible plasma electrode having various patterns, and a method of manufacturing the same.

Atmospheric pressure plasma jet can discharge at low temperature and can discharge in various gases such as helium, argon, nitrogen, oxygen through change of electrode structure, driving frequency, input voltage. Recently, atmospheric plasma jets have been studied in biotechnology and medical fields such as changes in cell characteristics, research on skin wound healing, and sterilization of foods by using characteristics of low temperature discharge. In the field of materials, researches are being conducted in place of vacuum plasma such as surface modification, etching, and ashing using atmospheric plasma.

Conductive inks have been studied in recent years as the industry for flexible substrates such as flexible displays, flexible solar cells, and RFID [radio frequency identification] is expanding. As researches on flexible substrates have progressed, polymer materials such as plastic materials have been required for substrate types, and processes at low temperatures have been required.

Accordingly, there is a growing demand for conductive inks that can be printed on polymeric materials such as plastics. According to a recently disclosed patent, Korean Patent Publication No. 10-2014-0056045 (entitled: Copper paste composition for printing electronics), Korean Patent Laid-Open No. 10-2010-0020564 (entitled " Paste composition and a screen printing method using the paste composition).

In addition, as a method of printing a conductive ink, Korean Registered Patent No. 10-0984256 entitled " Method of Controlling Superposition Accuracy Using Self-aligned Gravure Printing ", Korean Patent Publication No. 10-2014-0100630 Title: Printed thin film battery manufacturing method and printed thin film battery) Korean Patent Laid-Open No. 10-2009-00118516 (Name of the invention: Printed RFID tag circuit and method using the roll-to- An RFID tag manufacturing method), Korean Patent Laid-Open No. 10-2014-0104582 (titled invention: a heater using a transparent substrate and a manufacturing method thereof), and the like.

However, it is only used for printed boards that are used at low voltages of several tens to hundreds of volts. In addition, the resistance of the conductive ink is higher than that of the conventional electrode, and problems arise in adhesion performance and the like.

1. Korean Patent Publication No. 10-2014-0056045 2. Korean Patent Publication No. 10-2010-0020564 3. Korean Registered Patent No. 10-0984256 (September 20, 2010) 4. Korean Patent Publication No. 10-2014-0100630 5. Korean Patent Publication No. 10-2009-00118516 6. Korean Patent Publication No. 10-2014-0104582

1. Fixed Boundary, "Implementation of High Performance Microelectrode Pattern Using High Viscosity Conductive Ink Patterning Technique", Journal of the Korean Society of Precision Engineering Volume 31, Issue 1, January 2014, pp. 83-90

Unlike the conventional printing method, the present invention has been made to solve the above-mentioned problems, and unlike the conventional printing method, the surface of a printing substrate is modified using a plasma to inject a conductive ink, The present invention provides a flexible plasma electrode having various patterns using a plasma jet and a manufacturing method thereof.

It is another object of the present invention to provide a flexible plasma electrode of various patterns using a conductive ink and an atmospheric pressure plasma jet capable of manufacturing a complicated shape or a unique shape of an electrode required by a customer in a small amount, and a method of manufacturing the same.

In addition, unlike the prior art, the present invention is applicable to a plasma display panel in which electrodes are printed on a flexible film to which a high voltage of several kV to several tens of kV can be applied, thereby forming a plasma electrode for secondary application and a flexible plasma of various patterns using an atmospheric pressure plasma jet Another object is to provide an electrode and a manufacturing method thereof.

In order to accomplish the above-mentioned object, the present invention provides a method of manufacturing a flexible plasma electrode having various patterns using a conductive ink and an atmospheric pressure plasma jet, the method comprising the steps of modifying a surface of a printing substrate using plasma to inject conductive ink, ≪ / RTI >

A method of fabricating flexible plasma electrodes of various patterns using the conductive ink and the atmospheric pressure plasma jet,

Preparing an electrode specimen;

Forming an atmospheric pressure plasma surface modification layer on the surface of the electrode specimen using an atmospheric pressure plasma method;

Forming a pattern on the plasma surface modification layer using an atmospheric plasma jet; And

And forming an electrode pattern by injecting the conductive ink into the patterning.

At this time, the atmospheric pressure plasma process is performed by using a micro-sized discharge machine, and has a discharge size of several micrometers on contact with the surface of the electrode specimen.

In addition, the atmospheric pressure plasma jet may include a gas or vapor of F (fluorine) series capable of hydrophobic modification on the surface of the electrode specimen.

The F (fluorine) -based gas or vapor is generated by heating the F (fluorine) -based resin with heat, and is deposited on the surface of the electrode specimen.

If the patterning is embossed patterning, the plasma surface modification layer is formed using a hydrophobic gas, and the relief patterning is performed using a hydrophilic gas.

If the patterning is intaglio patterning, the plasma surface modification layer may be formed using a silver hydrophilic gas, and the intaglio patterning may be performed using a hydrophobic gas.

The embossing pattern or intaglio patterning may be any one of an atmospheric pressure plasma jet, a patterning mask having a pattern of a predetermined shape, a patterning electrode plate having a pattern electrode, and a microplasma jet array comprising a plurality of microelectrode plates having a microelectrode And the like.

Here, the patterning mask may be positioned on the front surface of the atmospheric pressure plasma jet, and the pattern electrode of the patterning electrode plate may be formed using atmospheric pressure plasma jet and conductive ink.

The micro-electrode plate may include a micro-sized dielectric material; And a microelectrode formed on both ends of the microsize dielectric, wherein the microelectrode plate is a dielectric barrier discharge (DBD) electrode plate.

The electrode specimen may be a flexible electrode.

The flexible electrode may include any one dielectric material selected from silicon (Si), Teflon, PI (polyimide), TiO 2 , SiO 2 , Al 2 O 3 , ZrO 2 and Ba 2 TiO 3 can do.

Further, the flexible electrode is a high-voltage flexible electrode having chemical resistance and heat resistance, and the thickness of the flexible electrode is several mu m to several mm.

In addition, the conductive ink may be an ink containing a metal having a low resistance of either copper, silver or carbon, and may be characterized in that the surface contains a part of a curing agent or an adhesive component with good dispersion.

The conductive ink may be injected along the patterning using an atmospheric pressure plasma jet and multiple nozzles.

In addition, the multiple nozzles may be configured together or separately in an atmospheric pressure plasma jet reactor for generating the atmospheric pressure plasma jet.

Further, the conductive ink supplier for injecting the conductive ink may control the amount of the conductive ink, and may spray the conductive ink at a diameter of several micrometers at several nm.

The conductive ink may be injected by immersing the conductive ink in a solution containing the conductive ink for a predetermined time, and curing the conductive ink.

The atmospheric pressure plasma jet may be three-dimensionally driven, and may be moved at a high speed of several m / s or more by receiving a specific pattern.

On the other hand, another embodiment of the present invention relates to an electrode specimen; An atmospheric pressure plasma layer formed on the surface of the electrode specimen using an atmospheric pressure plasma method; And an electrode pattern formed by implanting a conductive ink into the plasma layer formed by using an atmospheric pressure plasma jet. The conductive ink and the atmospheric pressure plasma jet may be used to provide various patterns of flexible plasma electrodes. have.

According to the present invention, it is possible to apply to a variety of surfaces such as plastic, glass, and metal in place of etching, ashing, and deposition techniques using a conventional low-temperature vacuum plasma by suggesting a pattern printing method of a conductive ink using a plasma jet, It is expected that it can be applied to various application fields such as electric wiring and the like.

Further, another effect of the present invention is that hydrophilic or hydrophobic patterning of 탆 or more units is possible on the surface of various types of materials including 2D and 3D.

In addition, as another effect of the present invention, plasma application technology is also required to use a flexible substrate beyond a conventional flat electrode in a similar manner to flexible display technology, and a plasma flexible electrode to which a high voltage can be applied, And the electrode can be used for discharging.

Another advantage of the present invention is that it can be used in place of the conventional conductive ink printing technique.

Further, as another effect of the present invention, various types of technologies (for example, chemical purification technology, medical treatment and biotechnology industry, energy and materials industry, processing industry, etc.) and military weapons systems can be applied through the surface modification method using plasma jet It is possible to apply the

FIG. 1 is a process diagram showing a process of forming an electrode after patterning a two- or three-dimensional sample surface (that is, an electrode sample) according to an embodiment of the present invention by using a hydrophilic surface reforming micro-plasma jet for surface modification.
FIG. 2 is a process diagram showing a process of forming an electrode after patterning a two-dimensional or three-dimensional sample surface (that is, an electrode sample) according to an embodiment of the present invention by using a micro-plasma jet for surface modification after hydrophobic (water repellent) to be.
Fig. 3 is a graph showing the results obtained by placing a two-dimensional or three-dimensional sample surface (i.e., an electrode sample) according to another embodiment of the present invention in a desired patterning mask in the middle by using plasma discharge for surface reforming after hydrophilic surface modification, Which is a process diagram showing the process of making
Fig. 4 is a graph showing the results of measurement of a two-dimensional or three-dimensional sample surface (i.e., electrode specimen) according to another embodiment of the present invention by placing a desired patterning mask in the middle using a plasma- This is a process diagram showing the process of making an electrode before and after discharge.
FIG. 5 is a graph showing the relationship between a desired patterning and a desired patterning after a plasma discharge by reusing a two-dimensional or three-dimensional sample surface (i.e., an electrode sample) according to another embodiment of the present invention by using hydrophilic surface modification and using a microplasma jet and a conductive ink. FIG. 5 is a process diagram showing a process of manufacturing an electrode of FIG.
FIG. 6 is a graph showing a relationship between a surface of a two-dimensional or three-dimensional sample (that is, an electrode sample) according to another embodiment of the present invention by using a micro-plasma jet and a conductive ink after a hydrophobic (water- FIG. 2 is a process diagram showing a process of manufacturing an electrode of desired patterning before and after.
FIG. 7A is a view showing a structure of a general micro-plasma jet, and FIGS. 7B and 7C are conceptual diagrams of injecting conductive ink.
FIG. 8 is a conceptual diagram showing the manufacture of an electrode using the atmospheric pressure plasma jet reactor 301 and the patterning mask 203 according to FIGS. 3 and 4. FIG.
FIG. 9 is a conceptual diagram of manufacturing a patterned electrode after plasma discharge utilizing a patterned atmospheric pressure plasma discharge reactor 901 and a patterned electrode according to FIGS. 5 and 6.
10 is a conceptual diagram of a micro-electrode plate constituting a micro-plasma-jet array according to another embodiment of the present invention.
FIG. 11 is a conceptual diagram for manufacturing an electrode by discharging a desired pattern through a micro-plasma-jet array including the micro-electrode plate shown in FIG.
FIG. 12 is a conceptual diagram for manufacturing a two-dimensional surface conductive electrode by three-dimensional driving of a plasma jet according to another embodiment of the present invention.
FIG. 13 is a conceptual diagram for manufacturing a two-dimensional surface conductive electrode by three-dimensional driving of a plasma jet according to another embodiment of the present invention.
FIG. 14 is a conceptual diagram for manufacturing a conductive electrode on a two-dimensional surface through three-dimensional driving of a plasma jet according to another embodiment of the present invention.
FIG. 15 shows a state in which an air plasma is discharged by a pattern printed with a conductive ink on the surface of PET (polyethylene terephthalate) according to an embodiment of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Like reference numerals are used for similar elements in describing each drawing.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. The term "and / or" includes any combination of a plurality of related listed items or any of a plurality of related listed items.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Should not.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a flexible plasma electrode having various patterns using a conductive ink and an atmospheric pressure plasma jet according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a process diagram showing a process of forming an electrode after patterning a two- or three-dimensional sample surface (that is, an electrode sample) according to an embodiment of the present invention by using a hydrophilic surface reforming micro-plasma jet for surface modification. 1, an electrode specimen 101 is prepared and a hydrophobic gas (for example, fluorine-based CF 4 , SF 6 , NF 3 , etc.) is applied to the surface of the electrode specimen 101 for surface modification , C 3 F 6 , HFC, and the like) to form a hydrophobic atmospheric pressure plasma surface modification layer 102 (steps S 110 and S 120). Here, a flexible substrate is used for the electrode specimen,

The flexible electrode is a high-voltage flexible electrode having chemical resistance and heat resistance, and the thickness of the flexible electrode is several mu m to several mm. The flexible electrode may include any dielectric material selected from silicon (Si), Teflon, PI (polyimide), TiO 2 , SiO 2 , Al 2 O 3 , ZrO 2 and Ba 2 TiO 3 .

On the other hand, if the gaseous material is continuously heated to raise the temperature, an aggregate of particles composed of ion nuclei and free electrons is produced. It is called the 'fourth state of matter' with the solid state, liquid state, gas state, and so on.

Particularly, in an embodiment of the present invention, plasma by atmospheric pressure discharge is used. Atmospheric pressure plasma is a phenomenon in which seeded electrons existing under atmospheric pressure are accelerated by a voltage and physically collide with neutral particles to cause an electron proliferation process. This electron collides with an anode due to sheath acceleration, These secondary electrons collide with neutral particles to generate excited species, electrons, and ions. As the process is repeated, the electron generation rate and the extinction ratio become the same and the plasma is maintained. Atmospheric pressure plasma is a high-energy state, and vacuum equipment is not required, the process is simple, high power is not required, maintenance cost is low, and economical efficiency is excellent

Referring to FIG. 1, an atmospheric pressure plasma spraying reactor 10, such as O 2 , Air, CO 2 , H 2 O 2, or the like, is applied to the atmospheric pressure plasma surface modification layer 102, Thereby forming the patterning 11 (step S130).

Thereafter, the conductive ink 13 is injected into the embossing pattern 11 to complete the manufacture of the electrode with the electrode pattern 14 (steps S140 and S150). The injection of the conductive ink 13 may be performed by spraying onto the surface of the plasma surface modification layer using an atmospheric pressure plasma jet reactor 10 and multiple nozzles. Alternatively, the entire electrode specimen 101 may be immersed in a solution containing the conductive ink for a certain period of time and cured.

FIG. 2 is a process diagram showing a process of forming an electrode after patterning a two-dimensional or three-dimensional sample surface (that is, an electrode sample) according to an embodiment of the present invention by using a micro-plasma jet for surface modification after hydrophobic (water repellent) to be. 2, the surface of the electrode sample piece 101 is treated with an atmospheric pressure plasma process of a hydrophilic gas (for example, O 2 , Air, CO 2 , H 2 O 2, etc.).

In this case, since the surface of the plasma surface modification layer 102, which is the surface of the electrode sample piece 101, is hydrophilic, the intaglio patterning 21 is formed using a micro-plasma jet of a hydrophobic gas. Thereafter, when the conductive ink 23 is injected, the electrode pattern 24 is formed on the hydrophilic plasma surface modification layer 102 except for the intaglio patterning 21.

Figs. 7A to 7C are conceptual views showing various ways of injecting conductive ink using nozzles in Figs. 1 and 2. This will be described later.

Fig. 3 is a graph showing the results obtained by placing a two-dimensional or three-dimensional sample surface (i.e., an electrode sample) according to another embodiment of the present invention in a desired patterning mask in the middle by using plasma discharge for surface reforming after hydrophilic surface modification, Which is a process diagram showing the process of making Referring to FIG. 3, the electrode sample preparation step S310, the plasma surface treatment step S320, the conductive ink injection step S340, the electrode manufacturing completion step S350, ), A plasma surface treatment step (S120), a conductive ink injection step (S140), and an electrode production completion step (S150).

However, in FIG. 3, the embossing patterning step S330 is performed using the patterning mask 203 having a predetermined patterning in advance. In particular, the patterning mask 203 is located on the front side of the atmospheric plasma jet reactor 301. The embossed patterning 31 is formed by the patterning mask 203 and the conductive ink 33 is injected into the embossed patterning 31 to form the electrode pattern 34. [

Fig. 4 is a graph showing the results of measurement of a two-dimensional or three-dimensional sample surface (i.e., electrode specimen) according to another embodiment of the present invention by placing a desired patterning mask in the middle using a plasma- This is a process diagram showing the process of making an electrode before and after discharge. 4, the intaglio patterning 41 is formed by the patterning mask 203, conductive ink 43 is injected into the intaglio patterning 41, and the electrode pattern 44 Is formed. Since the formation of the electrode pattern 44 is similar to that of FIG. 2, a detailed description will be omitted for a clear understanding of the present invention.

The concept of injecting the conductive ink according to Figs. 3 and 4 is shown in Fig. 8 will be described later.

FIG. 5 is a graph showing the relationship between a desired patterning and a desired patterning after a plasma discharge by reusing a two-dimensional or three-dimensional sample surface (i.e., an electrode sample) according to another embodiment of the present invention by using hydrophilic surface modification and using a microplasma jet and a conductive ink. FIG. 5 is a process diagram showing a process of manufacturing an electrode of FIG. 5, the electrode sample preparation step S510, the plasma surface treatment step S520, the conductive ink injection step S540, the electrode production completion step S550, and the like are already performed in the electrode sample preparation step S110 ), A plasma surface treatment step (S120), a conductive ink injection step (S140), and an electrode production completion step (S150).

5, the embossing patterning step S530 is performed using the patterning electrode plate 501 having the predetermined patterning in advance. In particular, the patterning electrode plate 501 is formed with pre-patterned electrodes, and a patterned atmospheric pressure plasma discharge reactor is disposed on the rear surface of the electrodes. The embossing pattern 51 is formed by the patterning electrode plate 203 and the conductive ink 53 is injected into the embossing pattern 51 to form the electrode pattern 54. [

FIG. 6 is a graph showing a relationship between a surface of a two-dimensional or three-dimensional sample (that is, an electrode sample) according to another embodiment of the present invention by using a micro-plasma jet and a conductive ink after a hydrophobic (water- FIG. 2 is a process diagram showing a process of manufacturing an electrode of desired patterning before and after. 6, an intaglio pattern 61 is formed by a patterning electrode plate 501, and conductive ink 63 is injected into the intaglio pattern 61 to form an electrode pattern 64 are formed. Since the formation of the electrode pattern 44 is similar to that of FIG. 2, a detailed description will be omitted for a clear understanding of the present invention.

The concept of injecting the conductive ink according to Figs. 5 and 6 is shown in Fig. 9 will be described later.

FIG. 7A is a view showing a structure of a general micro-plasma jet, and FIGS. 7B and 7C are conceptual diagrams of injecting conductive ink. Referring to FIG. 7A, there is shown a plasma reactor including an atmospheric pressure plasma jet reactor 750, a surface reforming gas supplier 740 for supplying a surface reforming gas to the atmospheric plasma jet reactor 750, a treatment sample 720 for hydrophilic / A sample holder 710 for holding the sample holder 710, and the like. Accordingly, the micro plasma jet 730 is formed at the end of the atmospheric pressure plasma jet reactor 750, and the surface of the treated sample 720 is treated to be hydrophobic or hydrophilic. The right circle represents the cross section of the atmospheric plasma jet reactor 750.

7B, a conductive ink supplier 760 is further provided for supplying conductive ink, and this conductive ink supplier 760 is connected to the nozzle 761. [ At this time, the nozzle 761 is configured in the conductive ink supplier 760 in the same manner. The cross-sectional view is a right double circle.

Referring to FIG. 7C, a nozzle 761 connected to the conductive ink supplier 760 is configured separately from the atmospheric pressure plasma jet reactor 750.

FIG. 8 is a conceptual diagram showing the manufacture of an electrode using the atmospheric pressure plasma jet reactor 301 and the patterning mask 203 according to FIGS. 3 and 4. FIG. Referring to FIG. 8, a patterning mask 203 is placed on a treatment sample 720, and an atmospheric pressure plasma jet reactor 301 is disposed on the back side of the patterning mask 203. Further, the surface reforming gas supplier 760 is connected to the atmospheric pressure plasma jet reactor 301 to supply a hydrophilic or hydrophobic gas.

The conductive ink supplier 750 also supplies the conductive ink to the treatment sample 720.

FIG. 9 is a conceptual diagram of manufacturing a patterned electrode after plasma discharge utilizing a patterned atmospheric pressure plasma discharge reactor 901 and a patterned electrode according to FIGS. 5 and 6. Referring to FIG. 9, a patterned electrode plate 501 is formed with a patterned atmospheric pressure plasma discharge reactor 901 and a patterned electrode. The patterning electrode plate 501 may be fabricated using atmospheric pressure plasma jet and conductive ink. In addition, the pattern electrode of the patterning electrode plate 501 can be manufactured in advance using the atmospheric pressure plasma jet and the conductive ink described above.

10 is a conceptual diagram of a micro-electrode plate constituting a micro-plasma-jet array according to another embodiment of the present invention. 10, the micro-electrode plate 1000 includes a micro-sized dielectric material 1030 and micro electrodes 1020 formed at both ends of the micro-sized dielectric material 1030. Alternatively, it may be a dielectric barrier discharge (DBD) electrode plate.

FIG. 11 is a conceptual diagram for manufacturing an electrode by discharging a desired pattern through a micro-plasma-jet array including the micro-electrode plate shown in FIG. Referring to FIG. 11, a plurality of micro-electrode plates 1000 are formed to form an array.

FIG. 12 is a conceptual diagram for manufacturing a three-dimensional surface conductive electrode by three-dimensional driving of a plasma jet according to another embodiment of the present invention. 12, a hydrophobic treatment 1125 is performed on a sample surface 1121 using a three-dimensional plasma jet 1110, and a conductive ink 1123 is injected. In addition, it is possible to move at a high speed of several m / s or more by receiving a specific pattern.

FIG. 13 is a conceptual diagram for manufacturing a three-dimensional surface conductive electrode by three-dimensional driving of a plasma jet according to another embodiment of the present invention. 13, the sample surface 1221 is subjected to the hydrophilic treatment 1227 and the hydrophobic treatment 1225, and the conductive ink 1123 is injected.

FIG. 14 is a conceptual diagram for manufacturing a conductive electrode on a two-dimensional surface through three-dimensional driving of a plasma jet according to another embodiment of the present invention.

FIG. 15 shows a state in which air plasma is discharged by a pattern printed with a conductive ink on a sample surface of PET (polyethylene terephthalate) according to an embodiment of the present invention. Referring to FIG. 15, a high voltage of 6 kV is applied to a conductive pattern engraved on a sample surface of PET made of silver ink, and an AC current of 20 kHz and 8 us is applied to confirm discharge. Further, the left drawing is an example of a screen before discharge, and the right drawing is an example of a screen after discharge.

In particular, the printing electrodes can be manufactured in various patterns by using the conductive ink, and the conductive ink film of the wide type is coated with the PET dielectric, which is useful for the plasma discharge. In addition, the thickness of the entire film is less than 1 mm, which is very thin and allows flexible discharging. In one embodiment of the present invention, the flexible electrode developed with the conductive ink can be applied not only to PET but also to various surfaces including silicon, Teflon, and PI, so that it can be fabricated and / or discharged by various materials with different application fields .

101: electrode specimen
102: Plasma layer
10,301: Atmospheric pressure plasma jet reactor
11,31,51: Embossed patterning
21,41,61: intaglio patterning
13, 23, 33, 43, 53, 63: conductive ink
14, 24, 34, 44, 54, 64:
203: patterning mask
501: patterning electrode plate
730: Plasma jet
750: Conductive ink supply
760: Surface reforming gas feeder
761: Nozzles

Claims (18)

Preparing an electrode specimen;
Forming an atmospheric pressure plasma surface modification layer on the surface of the electrode specimen using an atmospheric pressure plasma method;
Forming a pattern on the plasma surface modification layer using an atmospheric plasma jet; And
And forming an electrode pattern by injecting conductive ink into the patterning,
The injection of the conductive ink is performed along the patterning using an atmospheric pressure plasma jet and multiple nozzles,
If the patterning is embossed patterning, the plasma surface modification layer is formed using a hydrophobic gas, the embossed patterning is formed using a hydrophilic gas,
If the patterning is intaglio patterning, the plasma surface modification layer is formed using a hydrophilic gas, the intaglio patterning is performed using a hydrophobic gas,
Wherein the electrode specimen is a flexible electrode, and wherein the method for fabricating the flexible plasma electrode in various patterns using the conductive ink and the atmospheric pressure plasma jet.
The method according to claim 1,
Wherein the atmospheric pressure plasma process is performed using a micrometer-sized discharge device and has a discharge size of several micrometers when contacted with the surface of the electrode sample. The conductive ink and the atmospheric pressure plasma jet Plasma electrode fabrication method.
The method according to claim 1,
Wherein the atmospheric pressure plasma jet includes a gas or vapor of F (fluorine) -based type capable of hydrophobic modification on the surface of the electrode specimen.
The method of claim 3,
Wherein the F (fluorine) -based gas or vapor is generated by heating F (fluorine) -based resin with heat and is deposited on the surface of the electrode specimen. The conductive ink and the atmospheric pressure plasma jet Plasma electrode fabrication method.
delete The method according to claim 1,
The embossing or intaglio patterning may be performed using any one of an atmospheric pressure plasma jet, a patterning mask having a pattern of a predetermined shape, a patterning electrode plate having a pattern electrode, and a microplasma jet array comprising a plurality of microelectrode plates having microelectrodes The method of any one of claims 1 to 3,
The method according to claim 6,
Wherein the patterning mask is disposed on a front surface of an atmospheric pressure plasma jet and the pattern electrode of the patterning electrode plate is formed using an atmospheric pressure plasma jet and a conductive ink. Production method.
The method according to claim 6,
The micro-electrode plate includes a micro-sized dielectric material; And a microelectrode formed on both ends of the microsize dielectric, wherein the microelectrode plate is a dielectric barrier discharge (DBD) electrode plate, and the flexible plasma electrode is fabricated in various patterns using the atmospheric pressure plasma jet. Way. delete The method according to claim 1,
Wherein the flexible electrode comprises a dielectric material selected from the group consisting of silicon (Si), Teflon, PI (polyimide), TiO 2 , SiO 2 , Al 2 O 3 , ZrO 2 , and Ba 2 TiO 3 . (Method of Making Flexible Plasma Electrodes of Various Patterns Using Ink and Atmospheric Pressure Plasma Jet).
The method according to claim 1,
Wherein the flexible electrode is a high voltage flexible electrode having chemical resistance and heat resistance and the thickness of the flexible electrode is several millimeters.
The method according to claim 1,
Wherein the conductive ink is an ink containing a metal component selected from the group consisting of copper, silver, and carbon, and includes a hardening agent or an adhesive component on the surface thereof with good dispersion, and a flexible plasma of various patterns using an atmospheric pressure plasma jet Electrode manufacturing method.
delete The method according to claim 1,
Wherein each of the plurality of nozzles is separately formed or separately formed in an atmospheric pressure plasma jet reactor generating the atmospheric pressure plasma jet.
The method according to claim 1,
Wherein the conductive ink supplier injecting the conductive ink regulates an amount of the conductive ink and injects the conductive ink at a diameter of several micrometers to several micrometers. The conductive ink and the flexible plasma of various patterns using the atmospheric pressure plasma jet Electrode manufacturing method.
The method according to claim 1,
Wherein the conductive ink is immersed in a solution containing the conductive ink for a predetermined period of time, and then the conductive ink is cured. The method of claim 1, wherein the conductive ink is cured.
The method according to claim 1,
Wherein the atmospheric pressure plasma jet is three-dimensionally driven, and receives a specific pattern and moves at a high speed of several m / s or higher.
delete
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018038578A1 (en) * 2016-08-25 2018-03-01 이명재 Method for pretreatment and printing of flexible substrate and system using same
CN109435513A (en) * 2018-10-22 2019-03-08 北京印刷学院 The method for preparing paper base electrode based on coating method
KR20200050499A (en) * 2018-11-01 2020-05-12 주식회사 라훔나노테크 Etchingless printing type method for forming micro electrode pattern
KR20200082894A (en) 2018-12-31 2020-07-08 주식회사 정록 Method for forming circuit pattern of flexible substrate
KR102403123B1 (en) 2021-09-30 2022-06-07 주식회사 정록 External electrode part and Plasma generating device having thereof
CN115449780A (en) * 2022-08-17 2022-12-09 安徽工业大学 Device and method for quickly preparing hydrophilic and hydrophobic micro-channel by plasma jet

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090118516A (en) 2008-05-14 2009-11-18 (주) 파루 Rfid tag circuit and manufacturing process the same, using roll to roll printing method
KR20100020564A (en) 2008-08-13 2010-02-23 주식회사 에프피 Conductive paste composite for screen printing and screen printing method using the same
KR100984256B1 (en) 2009-08-17 2010-09-30 (주) 파루 Control method of the overlay accuracy using by self-aligned gravure printing
KR20110061062A (en) * 2009-12-01 2011-06-09 성균관대학교산학협력단 Dual patterning method for substrate using atmospheric pressure plasma
KR20120121244A (en) * 2011-04-26 2012-11-05 엔젯 주식회사 method for forming front electrode of solar cell
KR20140049782A (en) * 2012-10-18 2014-04-28 충남대학교산학협력단 Flexible pattern forming method
KR20140056045A (en) 2012-10-31 2014-05-09 주식회사 동진쎄미켐 Copper paste composition for printed electronics
KR20140100630A (en) 2013-02-06 2014-08-18 (주) 파루 method of manufacturing printed thin film battery and printed thin film battery using the method
KR20140104582A (en) 2013-02-19 2014-08-29 (주) 파루 Heater using transparent substrate and manufacturing method thereof
KR20150008633A (en) * 2013-07-15 2015-01-23 한국생산기술연구원 The method of surface modification for polymeric substance using atmospheric plasma and the surface modified articles

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090118516A (en) 2008-05-14 2009-11-18 (주) 파루 Rfid tag circuit and manufacturing process the same, using roll to roll printing method
KR20100020564A (en) 2008-08-13 2010-02-23 주식회사 에프피 Conductive paste composite for screen printing and screen printing method using the same
KR100984256B1 (en) 2009-08-17 2010-09-30 (주) 파루 Control method of the overlay accuracy using by self-aligned gravure printing
KR20110061062A (en) * 2009-12-01 2011-06-09 성균관대학교산학협력단 Dual patterning method for substrate using atmospheric pressure plasma
KR20120121244A (en) * 2011-04-26 2012-11-05 엔젯 주식회사 method for forming front electrode of solar cell
KR20140049782A (en) * 2012-10-18 2014-04-28 충남대학교산학협력단 Flexible pattern forming method
KR20140056045A (en) 2012-10-31 2014-05-09 주식회사 동진쎄미켐 Copper paste composition for printed electronics
KR20140100630A (en) 2013-02-06 2014-08-18 (주) 파루 method of manufacturing printed thin film battery and printed thin film battery using the method
KR20140104582A (en) 2013-02-19 2014-08-29 (주) 파루 Heater using transparent substrate and manufacturing method thereof
KR20150008633A (en) * 2013-07-15 2015-01-23 한국생산기술연구원 The method of surface modification for polymeric substance using atmospheric plasma and the surface modified articles

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
1. 고정범외, "고점도 전도성 잉크 패터닝 기술을 이용한 고성능 미세전극 패턴 구현"한국정밀공학회지 제31권 제1호 통권 제274호 (2014년 1월) pp.83-90

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018038578A1 (en) * 2016-08-25 2018-03-01 이명재 Method for pretreatment and printing of flexible substrate and system using same
CN109435513A (en) * 2018-10-22 2019-03-08 北京印刷学院 The method for preparing paper base electrode based on coating method
KR20200050499A (en) * 2018-11-01 2020-05-12 주식회사 라훔나노테크 Etchingless printing type method for forming micro electrode pattern
KR102120040B1 (en) 2018-11-01 2020-06-10 주식회사 라훔나노테크 Etchingless printing type method for forming micro electrode pattern
KR20200082894A (en) 2018-12-31 2020-07-08 주식회사 정록 Method for forming circuit pattern of flexible substrate
KR102173771B1 (en) * 2018-12-31 2020-11-03 주식회사 정록 Method for forming circuit pattern of flexible substrate
KR102403123B1 (en) 2021-09-30 2022-06-07 주식회사 정록 External electrode part and Plasma generating device having thereof
CN115449780A (en) * 2022-08-17 2022-12-09 安徽工业大学 Device and method for quickly preparing hydrophilic and hydrophobic micro-channel by plasma jet
CN115449780B (en) * 2022-08-17 2024-04-09 安徽工业大学 Device and method for rapidly preparing hydrophilic and hydrophobic micro-channels by plasma jet

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