JP2003137633A - Wood chip cement board - Google Patents

Wood chip cement board

Info

Publication number
JP2003137633A
JP2003137633A JP2001331064A JP2001331064A JP2003137633A JP 2003137633 A JP2003137633 A JP 2003137633A JP 2001331064 A JP2001331064 A JP 2001331064A JP 2001331064 A JP2001331064 A JP 2001331064A JP 2003137633 A JP2003137633 A JP 2003137633A
Authority
JP
Japan
Prior art keywords
wood
wood chip
water
cement
cement board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001331064A
Other languages
Japanese (ja)
Inventor
Takashi Sawara
敬 佐原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2001331064A priority Critical patent/JP2003137633A/en
Publication of JP2003137633A publication Critical patent/JP2003137633A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B28/00Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
    • C04B28/02Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing hydraulic cements other than calcium sulfates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00241Physical properties of the materials not provided for elsewhere in C04B2111/00
    • C04B2111/00413Materials having an inhomogeneous concentration of ingredients or irregular properties in different layers
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00612Uses not provided for elsewhere in C04B2111/00 as one or more layers of a layered structure
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/20Resistance against chemical, physical or biological attack
    • C04B2111/27Water resistance, i.e. waterproof or water-repellent materials
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/40Porous or lightweight materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/91Use of waste materials as fillers for mortars or concrete

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Curing Cements, Concrete, And Artificial Stone (AREA)
  • Laminated Bodies (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a lightweight wood chip cement board which has excellent strength and water resistance. SOLUTION: The wood chip cement board consists of a cement material, wood chips, an inorganic lightweight aggregate, and water, and, at least one side of a base material layer in which the amount of the chips accounts for 5 to 10 wt.% to the total weight is stacked with a surface layer consisting of a cement material, fine wood chips finer than the above chips, an inorganic fine aggregate having a mean grain diameter of <=100 μm, and water, and in which the amount of the chips accounts for 5 to 15 wt.% to the total weight, and, a coefficient A defined by the formula (1) is >=3: A=a/bc (1) [wherein, a and b respectively denote the yield stress (MPa) and an elastic modulus (MPa) in a bend test measured in accordance with JIS A1408, and c denotes a dimensional change ratio on drying at 60 deg.C for 48 hr after the saturation of water].

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は、外壁などの建築材
料として用いられる木片セメント板に関するものであ
る。 【0002】 【従来の技術】従来、木片セメント板は、セメント硬化
体の持つ防火性と、木質材料の持つ加工性や釘打ち性の
併せ持ちうることから、主に建物の外壁などに用いられ
ている(特公平5−13098号公報)。しかし、上記
木片セメント板は、加工性を上げるために木片量を増加
させると、セメント板表面からの吸水量が増加し、寸法
変化が大きくなり、経年において反り、割れの発生率が
高くなり、長期耐久性が低下するという問題があるとと
もに、耐火性が低下するという欠点があった。また、耐
水性を向上させるために木片量を減少させると、木片セ
メント板の強度、耐割れ欠け性能が低下し、施工作業性
が悪化するという欠点があった。 【0003】 【発明が解決しようとする課題】本発明は、このような
問題点に鑑みてなされたものであり、軽量で強度、耐水
性に優れた木片セメント板を提供するものである。 【0004】 【課題を解決するための手段】本発明の木片セメント板
は、セメント材料、木片、無機質軽量骨材、及び水から
なり、上記木片の量が総重量に対して5〜15重量%を
占める基材層の少なくとも片面に、セメント材料、上記
木片より細かい細木片、平均粒径100μm以下の無機
質細骨材、及び水からなり、上記細木片の量が総重量に
対して5〜15重量%を占める表層が積層されている木
片セメント板であって、(1)式で定義される係数A
が、3以上であることを特徴とする。 A=a/bc ・・・ (1) 〔ここで、a及びbは、それぞれ、JIS A1408
に準拠して測定された曲げ試験における降伏応力(MP
a)、弾性率(MPa)を表し、cは、飽水後、60℃
で48hr乾燥したときの寸法変化率を表す〕 【0005】本発明の木片セメント板において、基材層
に用いられるセメント材料は、特に限定されず、例え
ば、普通ポルトランドセメント、特殊ポルトランドセメ
ント(早強ポルトランドセメント)等のポルトランドセ
メントを始めとする水硬性無機物質;石灰、石膏等の気
硬性無機物質などが挙げられる。さらに、成形工程にホ
ットプレス等の加熱工程を使用する場合には、硬化時間
を短縮できる熱硬化成分をポルトランドセメントと併用
してもよい。 【0006】上記熱硬化成分としては、例えば、アルミ
ナセメント、無水石膏、半水石膏などが挙げられる。こ
れらは単独で使用されてもよいし、2種類以上併用され
てもよい。これら熱硬化成分は、ポルトランドセメント
と併用されることにより、水和したときにエトリンガイ
ト(3CaO・Al2 3 ・3CaS04 ・32H
20)を生成し、硬化反応を促進させる。 【0007】上記セメント材料には、必要に応じて、カ
ルシウム成分量の調整のために、消石灰、生石灰等の
(水)酸化カルシウムが添加されても良い。 【0008】本発明の木片セメント板において、基材層
に用いられる木片は特に限定されず、新木材および建築
廃木材などから作製された木チップを細分化した木片が
好適に使用でき、樹種としては例えば、杉、檜、松、
栂、さわら、樫、なら、かば、ブナ、オーク、ラワン、
ひば、栗、けやき、椎、柳、竹などの材料からなるもの
が使用できる。 【0009】上記木片を作製する方法としては、公知の
方法を使用することができ、例えば、プレス、回転ロー
ルによる圧搾、スリッターや切断機による切断などが挙
げられる。 【0010】木片の形状は、用途、所望とする強度など
に応じて適宜選択されるが、長さ60mm以下、幅20
mm以下、厚さ2mm以下のものが好ましい。 【0011】上記木片の量は、少なすぎると基材層の補
強効果が小さくなり、強度不足となるとともに、比重が
大きくなり、木片セメント板の重量が大きくなり、軽量
性が損なわれる。また、多すぎると吸水速度が大きくな
り、寸法安定性が低下し、耐火性も低下するので、基材
層の総重量に対して5〜15重量%に限定される。 【0012】本発明の木片セメント板において、基材層
に用いられる無機質軽量骨材も特に限定されず、例え
ば、フライアッシュバルーン、ガラスビーズ、ガラスバ
ルーン、パーライト、シラスバルーン、バーミキュライ
ト等が挙げられる。 【0013】上記無機質軽量骨材の平均粒径は、小さす
ぎると嵩密度の小さな軽量骨材を形成しにくく、大きす
ぎると欠陥となりやすく、基材の強度が低下するので、
30〜400μmが好ましく、より好ましくは50〜2
00μmである。 【0014】上記無機質軽量骨材の嵩密度は、高すぎる
と木片セメント板の軽量化の効果が低下するので、1g
/cm3 以下が好ましい。 【0015】上記無機質軽量骨材の量は、少なすぎると
木片セメント板の軽量化の効果が少なく、多すぎると基
材層の強度が低下するので、上記セメント材料100重
量部に対して5〜40重量部が好ましい。 【0016】本発明の木片セメント板において、基材層
に用いられる水の量は、少なすぎるとセメント材料の水
和反応が不十分となり、強度低下を引き起こす。また、
多すぎると混合時において、小さな固まりができて均一
に混合できなくなり、成形された基材層が不均質で低強
度のものとなるので、上記セメント材料100重量部に
対し、20〜60重量部が好ましい。 【0017】本発明の木片セメント板の基材層は、上記
セメント材料、木片、無機質軽量骨材、及び水からな
り、上記木片の量が総重量に対して5〜15重量%を占
めるものである。 【0018】本発明の木片セメント板において、表層に
用いられるセメント材料は、基材層に用いられるものと
同様のものが使用できる。 【0019】本発明の木片セメント板において、表層に
用いられる細木片は、基材層に用いられる木片より平均
体積の小さなものが使用できる。 【0020】上記細木片は、前記木片を、微粉砕するこ
とで得られる。微粉砕する方法としては、例えば、リン
グ型ハンマーミル(パールマン社製)やディスクカッタ
ーミル(「HT−300型」ホーライ社製)による方法
が挙げられる。 【0021】上記細木片の形状は、用途、所望とする強
度などに応じて適宜選択される。上記細木片の平均寸法
は、小さすぎると混合時に分散性が低下し、大きすぎる
と表面加飾性能が低下するので、長さ0.5〜10m
m、幅0.1〜2mm、厚さ0.05〜1mmが好まし
く、平均体積(長さ×幅×厚み)としては、上記基材に
使用される木片の平均体積の0.02倍以下が好まし
い。 【0022】特に、表層の少なくとも一方(通常、外壁
として使用した場合、使用時に裏面となる側)に使用さ
れる細木片が、平均アスペクト比8以上の繊維状木片を
使用することが好ましい。このようにすることにより、
この側の表層の強度が増大し、木片セメント板を外壁と
して使用した場合、風圧により割れを防止できる。ま
た、他層の表面(通常、外壁として使用した場合、使用
時に表面となる側)には、加飾模様を形成させるため
に、おがくず状の細木片を用いることが好ましい。 【0023】上記細木片の量は、少なすぎると表層の補
強効果が小さく、強度不足となるとともに、比重が大き
くなり、木片セメント板の重量が大きくなり、軽量性が
損なわれる。また、多すぎると吸水速度が大きくなり、
寸法安定性が低下し、耐火性も低下するので、表層の総
重量に対して5〜15重量%に限定される。 【0024】上記基材層中の木片量、及び表層中の細木
片量は、各層の乾燥、湿潤変化の寸法変化率を同じにす
るためには、互いに同程度とすることが好ましい。 【0025】本発明の木片セメント板において、表層に
用いられる無機質細骨材は、平均粒径100μm以下の
ものであれば限定されず、例えば、珪砂、珪石粉、珪ソ
ウ土、高炉スラグ、フライアッシュ、シリカヒューム、
ワラストナイト、マイカなどが挙げられる。 【0026】平均粒径が100μm以下の微細な無機質
細骨材を用いることにより、セメント材料が硬化したと
きに、表層の細木片とセメント材料の界面などの空隙に
無機質細骨材が充填され、緻密性が高く、強度に優れた
硬化体が得られ、吸水速度が遅くなるために耐透水性に
優れるものとなる。 【0027】上記無機質細骨材の平均粒径が100μm
より大きくなると、細木片とセメント材料の界面などの
空隙に無機質細骨材が充填されにくく、緻密な硬化体が
得られず、強度が低下し、吸水速度が速くなるために耐
透水性に劣るものとなる。 【0028】上記無機質細骨材の量は、少なすぎると硬
化体中の細木片とセメント材料の空隙を充填するのに不
足し、緻密な硬化体が得られず、強度不足になるととも
に吸水速度が速くなり、寸法安定性が低下し、多すぎる
と、接着成分であるセメント材料の割合が減少し、強度
低下を起こすことがあるので、セメント材料100重量
部に対して10〜80重量部が好ましい。 【0029】本発明の木片セメント板において、表層に
用いられる水の量は、基材層と同様であるが、必ずしも
等量でなくて良い。 【0030】上記表層の厚みは、薄すぎると耐水性能や
補強効果が期待できないため、0.5mm以上が好まし
い。 【0031】本発明の木片セメント板は、上記基材層の
少なくとも片面に、上記表層が積層されているものであ
って、上記(1)式で定義される係数Aが、3以上であ
ることを特徴とする。 【0032】上記(1)式中、a/bは、降伏点伸びに
相当し(必ずしも完全に一致しない)、これが大きいも
の程、木片セメント板の破壊が発生し難くなる。また、
cは、これが小さいもの程、経年の乾燥湿潤サイクルに
基づく破壊(降伏点伸びに至る寸法変化)が発生し難く
なる。従って、a/bが大きく、cが小さいもの程、係
数Aが大きく、乾燥収縮による寸法変化、セメント硬化
体の経年の水和中性化に伴う収縮による破壊が発生し難
くなる。 【0033】上記降伏応力a(MPa)、弾性率b(M
Pa)は、それぞれ、JIS A1408に準拠して測
定された曲げ試験により算出することができる。上記寸
法変化率cは、飽水後(例えば、水中に1日浸漬した
後)の寸法、及び、60℃で48hr乾燥したときの寸
法を測定し、その変化量から算出することができる。 【0034】本発明の木片セメント板の製造方法として
は、例えば、上記セメント材料、細木片、無機質細骨
材、及び水からなる組成物を、ヘンシェルミキサー、オ
ムニミキサー等、従来公知の方法で混合した後、該混合
物を、型枠上に散布落下し、堆積させ、その上面に、セ
メント材料、木片、無機質軽量骨材、及び水からなる組
成物を同様に散布し、さらにその上面に、上記セメント
材料、細木片、無機質細骨材、及び水からなる組成物を
同様にして散布し、ホットプレス等により所定時間加圧
加熱して硬化させた後、脱型する方法が挙げられる。 【0035】 【実施例】以下、本発明を実施例に基づき、さらに詳し
く説明する。 【0036】 (実施例1〜5、比較例2) 木片セメント板の製造使用原料 ・セメント材料A 早強ポルトランドセメント(太平洋セメント社製) 80重量部 熱硬化成分 アルミナセメント(電気化学社製、商品名「デンカ2号」) 10重量部 焼石膏(アドラ工業社製) 6重量部 消石灰(駒形石灰工業社製) 4重量部 を予め混合したもの。 【0037】・木片 檜、杉の混合された木材チップを、切削あるいは粉砕
し、長さ60mm以下、幅20mm以下、厚さ2mm以
下(平均長さ10mm、平均幅1mm、平均厚み0.5
mm)としたもの。 【0038】・細木片A 上記木片を、リング型ハンマーミル(パールマン社製)
で微粉砕し、平均長さ1.4mm、平均幅0.3mm、
平均厚み0.1mmとしたもの。 【0039】・細木片B 上記木片を、ディスクカッターミル(ホーライ社製、型
式「HT−300型」)で微粉細し、平均長さ4mm、
平均幅0.4mm、平均厚み0.2mmとしたもの。 【0040】・フライアッシュバルーン 太平洋セメント社製、商品名「ポゾースフィアーズ」
(平均粒径130μm) 【0041】・珪砂 8号珪砂(六呂屋鉱業社製、平均粒径70μm) ・フライアッシュ 太平洋セメント社製、商品名「スーパーフロー」(平均
粒径10μm) 【0042】製造方法 表1に示した所定量のセメント材料A、細木片A、珪
砂、フライアッシュ、及び水をヘンシェルミキサーに供
給して得られた混練物を、5mm深さの目地模様が設け
られた金属製の型板上に散布落下させ、所定厚みの表層
(表面側)を得た。次いで、所定量のセメント材料A、
木片、無機質軽量骨材、及び水をヘンシェルミキサーに
供給して得られた混練物を、上記表層上に散布落下させ
て堆積積層させ、所定厚みの基材層を得た。さらに、所
定量のセメント材料A、細木片A、細木片B、珪砂、フ
ライアッシュ、及び水をヘンシェルミキサーに供給して
得られた混練物を、上記基材層上に散布落下させて堆積
積層させ、所定厚みの表層(裏面側)を得た。 【0043】上記のようにして得られた、基材層の両面
に表層が積層された積層体を、圧力4MPa、温度97
℃にて12分間ホットプレスすることにより硬化させ、
その後、型板から離型し、基材層に表層が積層された厚
み約15mmの木片セメント板を得た。 【0044】(比較例1)セメント材料Aに代えて普通
ポルトランドセメント(太平洋セメント社製以下、「セ
メント材料B」という)を用いたこと、積層体を160
℃、1MPaで押圧させながら、18時間のオートクレ
ーブ養生により硬化させたこと以外は、実施例2と同様
にして木片セメント板を得た。 【0045】 【表1】【0046】係数Aの算出 実施例1〜5、比較例1、2で得られた木片セメント板
を、以下の試験に供した。 降伏応力、弾性率 材齢1週間に調整した木片セメント板をJIS A14
08に準じて曲げ試験を行い、降伏応力a、弾性率bを
算出した。 【0047】寸法変化率 得られた木片セメント板を150mm×50mmのダン
ベル形状に切断し、水中に1日浸漬した後の寸法、及
び、さらに60℃で48hr乾燥した後の寸法をマイク
ロメーターで測定し、(2)式より寸法変化率cを算出
した。 c=(水中浸漬後寸法−乾燥後寸法)/乾燥後寸法 ・・・ (2) 【0048】耐久性試験 実施例1〜5、比較例1、2で得られた木片セメント板
を、900mm×900mmの形状に切断し、アルミ合
金製の幅30mm、高さ15mm、肉厚1mmの角パイ
プ状四角形のフレームに、接着剤とビスで固定し、30
℃、80%RH、10%CO2 下で3日間水和炭酸化処
理を行った後、乾湿繰り返し試験(散水2h→90℃乾
燥9hrのサイクルを30回繰り返し)を行った。水和
炭酸化処理と乾湿繰り返し試験を交互に3回づつ繰り返
した後、フレームから取り外して、150mm×50m
mに切断し、以下の試験に供した。 【0049】耐久性試験後の物性評価 曲げ試験 JIS A1408に準じて曲げ試験を行い、降伏応
力、弾性率を算出した。 【0050】吸水試験 −1)寸法変化率 水中に1日浸漬した後の寸法、及び、さらに60℃で4
8hr乾燥した後の寸法をマイクロメーターで測定し、
(2)式と同様にして寸法変化率を算出した。 −2)曲げ降伏応力 水中に1日浸漬した後、さらに60℃で48hr乾燥し
た後の曲げ降伏応力を、JIS A1408に準じて測
定した。測定は、サンプル数40点で行い、降伏応力が
9MPa以下のものの比率を表2に示した。 −3)反り量 水中に1日浸漬した後、さらに60℃で48hr乾燥し
た後、木片セメント板の両端に糸を張り、中央部のくぼ
み量(反り量)をスケールで計測した。以上の結果を、
表2に纏めて示した。 【0051】 【表2】 【0052】 【発明の効果】本発明の木片セメント板は、セメント材
料、木片、無機質軽量骨材、及び水からなり、上記木片
の量が総重量に対して5〜15重量%を占める基材層の
少なくとも片面に、セメント材料、上記木片より細かい
細木片、平均粒径100μm以下の無機質細骨材、及び
水からなり、上記細木片の量が総重量に対して5〜15
重量%を占める表層が積層されている木片セメント板で
あって、(1)式で定義される係数Aが、3以上である
ことを特徴とするものであるから、軽量で強度、耐水性
に優れたものとなる。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piece of wood cement board used as a building material for an outer wall or the like. 2. Description of the Related Art Conventionally, wood chip cement boards have been used mainly for the outer walls of buildings, because they can have both the fire resistance of a hardened cement body and the workability and nailing properties of a wood material. (Japanese Patent Publication No. 5-13098). However, the wood chip cement board, when increasing the amount of wood chip to increase the workability, the amount of water absorption from the cement board surface increases, the dimensional change increases, warping over time, the incidence of cracks increases, In addition to the problem that the long-term durability is reduced, there is a disadvantage that the fire resistance is reduced. In addition, when the amount of wood chips is reduced in order to improve water resistance, there is a disadvantage that the strength and cracking resistance of the wood chip cement plate are reduced, and the workability is deteriorated. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a light-weight, high-strength, water-resistant wood chip cement board. A wood chip cement board of the present invention comprises a cement material, a wood chip, an inorganic lightweight aggregate, and water, and the amount of the wood chip is 5 to 15% by weight based on the total weight. On at least one side of the base material layer occupying a cement material, fine wood pieces finer than the above wood pieces, inorganic fine aggregate having an average particle size of 100 μm or less, and water, and the amount of the above fine wood pieces is 5 to 15 with respect to the total weight. A wood chip cement board on which a surface layer occupying weight% is laminated, wherein a coefficient A defined by the equation (1) is used.
Is 3 or more. A = a / bc (1) [where a and b are JIS A1408, respectively.
Stress (MP) in the bending test measured according to
a) represents the elastic modulus (MPa), and c is 60 ° C. after water saturation.
[0005] In the wood chip cement board of the present invention, the cement material used for the base layer is not particularly limited. For example, ordinary portland cement, special portland cement (early strength) Hydraulic cements such as Portland cements such as Portland cement); air-hard inorganic substances such as lime and gypsum. Further, when a heating step such as a hot press is used in the molding step, a thermosetting component capable of shortening the curing time may be used in combination with Portland cement. [0006] Examples of the thermosetting component include alumina cement, anhydrous gypsum, gypsum hemihydrate and the like. These may be used alone or in combination of two or more. These thermosetting components, by being combined with Portland cement, ettringite when hydrated (3CaO · Al 2 0 3 · 3CaS0 4 · 32H
20 ) to accelerate the curing reaction. [0007] If necessary, calcium hydroxide (hydroxide) such as slaked lime or quick lime may be added to the cement material to adjust the amount of calcium component. In the wood chip cement board of the present invention, the wood chip used for the base layer is not particularly limited, and a wood chip obtained by subdividing a wood chip made from new wood, construction waste wood, or the like can be suitably used. For example, cedar, cypress, pine,
Toga, straw, oak, nara, birch, beech, oak, lauan,
Materials made of materials such as lark, chestnut, zelkova, shii, willow and bamboo can be used. As a method for producing the above-mentioned wood piece, a known method can be used, and examples thereof include pressing, pressing with a rotating roll, cutting with a slitter and a cutter. [0010] The shape of the wood piece is appropriately selected according to the application and the desired strength.
mm and a thickness of 2 mm or less are preferable. If the amount of the above-mentioned wood chips is too small, the effect of reinforcing the base material layer becomes small, the strength becomes insufficient, the specific gravity increases, the weight of the wood chip cement plate increases, and the lightness is impaired. On the other hand, if the amount is too large, the water absorption rate increases, the dimensional stability decreases, and the fire resistance also decreases. Therefore, the amount is limited to 5 to 15% by weight based on the total weight of the base material layer. In the wood chip cement board of the present invention, the inorganic lightweight aggregate used in the base layer is not particularly limited, and examples thereof include fly ash balloons, glass beads, glass balloons, perlite, shirasu balloons, vermiculite, and the like. If the average particle size of the inorganic lightweight aggregate is too small, it is difficult to form a lightweight aggregate having a small bulk density, and if the average particle size is too large, it tends to become a defect and the strength of the base material is reduced.
It is preferably from 30 to 400 μm, more preferably from 50 to 2 μm.
00 μm. If the bulk density of the inorganic lightweight aggregate is too high, the effect of reducing the weight of the wood chip cement board is reduced.
/ Cm 3 or less. When the amount of the inorganic lightweight aggregate is too small, the effect of reducing the weight of the wood chip cement board is small, and when the amount is too large, the strength of the base material layer is reduced. 40 parts by weight are preferred. In the wood chip cement board of the present invention, if the amount of water used for the base material layer is too small, the hydration reaction of the cement material becomes insufficient and the strength is reduced. Also,
If the amount is too large, a small mass can be formed at the time of mixing and cannot be uniformly mixed, and the formed base material layer becomes inhomogeneous and low-strength. Therefore, 20 to 60 parts by weight with respect to 100 parts by weight of the cement material. Is preferred. The base layer of the wood chip cement board of the present invention comprises the above cement material, wood chip, inorganic lightweight aggregate and water, and the amount of the wood chip accounts for 5 to 15% by weight based on the total weight. is there. In the wood chip cement board of the present invention, the same cement material as that used for the base material layer can be used for the surface layer. In the wood chip cement board of the present invention, the fine wood piece used for the surface layer can be smaller in average volume than the wood piece used for the base material layer. The above-mentioned thin wood pieces are obtained by finely pulverizing the wood pieces. Examples of the method for fine pulverization include a method using a ring-type hammer mill (manufactured by Pearlman) and a disk cutter mill (“HT-300” manufactured by Horai). The shape of the thin wood piece is appropriately selected according to the application, the desired strength and the like. If the average size of the thin wood pieces is too small, the dispersibility decreases during mixing, and if the average size is too large, the surface decoration performance decreases, so the length is 0.5 to 10 m.
m, a width of 0.1 to 2 mm and a thickness of 0.05 to 1 mm are preferable, and the average volume (length × width × thickness) is 0.02 times or less of the average volume of a piece of wood used for the base material. preferable. In particular, it is preferable to use a fibrous wood piece having an average aspect ratio of 8 or more as a thin wood piece used for at least one of the surface layers (usually, when used as an outer wall, the back side when used). By doing this,
When the strength of the surface layer on this side is increased and the wood chip cement board is used as the outer wall, cracks can be prevented by wind pressure. Also, on the surface of the other layer (usually, when used as an outer wall, the side that becomes the surface when used), it is preferable to use sawdust-shaped small pieces of wood in order to form a decorative pattern. If the amount of the thin wood pieces is too small, the effect of reinforcing the surface layer is small, the strength is insufficient, the specific gravity is increased, the weight of the wood chip cement board is increased, and the lightness is impaired. Also, if too much, the water absorption rate will increase,
Since the dimensional stability is reduced and the fire resistance is also reduced, the content is limited to 5 to 15% by weight based on the total weight of the surface layer. The amount of wood chips in the base material layer and the amount of fine wood chips in the surface layer are preferably substantially the same in order to make the dimensional change rates of dry and wet changes of each layer the same. In the wood chip cement board of the present invention, the inorganic fine aggregate used for the surface layer is not limited as long as it has an average particle size of 100 μm or less. For example, silica sand, silica stone powder, silica sand, blast furnace slag, fly Ash, silica fume,
Wollastonite, mica and the like. By using a fine inorganic fine aggregate having an average particle size of 100 μm or less, when the cement material is hardened, the voids such as the interface between the fine particles of the surface layer and the cement material are filled with the inorganic fine aggregate, A cured product having high denseness and excellent strength is obtained, and has a low water absorption rate, and thus has excellent water resistance. The above-mentioned inorganic fine aggregate has an average particle size of 100 μm.
When it becomes larger, it is difficult to fill the voids such as the interface between the thin wood pieces and the cement material with the inorganic fine aggregate, and a dense cured body cannot be obtained, the strength is reduced, and the water absorption speed is increased, so that the water permeability is poor. It will be. If the amount of the above-mentioned inorganic fine aggregate is too small, it is insufficient to fill the gap between the fine wood pieces and the cement material in the hardened material, a dense hardened material cannot be obtained, the strength becomes insufficient, and the water absorption rate becomes lower. Becomes faster, the dimensional stability is reduced, if too much, the proportion of cement material as an adhesive component is reduced, and strength may be reduced, so 10 to 80 parts by weight with respect to 100 parts by weight of cement material preferable. In the wood chip cement board of the present invention, the amount of water used for the surface layer is the same as that of the base material layer, but is not necessarily equal. The thickness of the surface layer is preferably 0.5 mm or more, since if it is too thin, water resistance and reinforcing effect cannot be expected. The wood chip cement board of the present invention has the above-mentioned surface layer laminated on at least one surface of the above-mentioned substrate layer, and the coefficient A defined by the above formula (1) is 3 or more. It is characterized by. In the above formula (1), a / b corresponds to the elongation at the yield point (not always completely coincident), and the larger the ratio, the more difficult it is for the wood chip cement board to break. Also,
As for c, the smaller this is, the more difficult it is to cause breakage (dimensional change leading to yield point elongation) based on the aging dry and wet cycle. Therefore, the larger the value of a / b and the smaller the value of c, the larger the coefficient A, and the smaller the dimensional change due to drying shrinkage and shrinkage due to shrinkage due to aging and neutralization of the hardened cement over time. The yield stress a (MPa) and the elastic modulus b (M
Pa) can be calculated by a bending test measured according to JIS A1408, respectively. The dimensional change rate c can be calculated from the amount of change after measuring the size after being saturated (for example, after immersing in water for one day) and the size after drying at 60 ° C. for 48 hours. As a method for producing the wood chip cement board of the present invention, for example, a composition comprising the above cement material, fine wood pieces, inorganic fine aggregate and water is mixed by a conventionally known method such as a Henschel mixer or an omni mixer. After that, the mixture is sprayed and dropped on a mold and deposited, and on the upper surface, a composition consisting of cement material, wood chips, inorganic lightweight aggregate, and water is similarly sprayed, and further on the upper surface, In the same manner, a composition comprising a cement material, a thin wood piece, an inorganic fine aggregate, and water is sprayed in the same manner, and the composition is cured by pressurizing and heating with a hot press or the like for a predetermined time and then released. The present invention will be described below in more detail with reference to examples. (Examples 1 to 5, Comparative Example 2) Raw material and cement material A used for manufacturing wood chip cement board A early strength Portland cement (manufactured by Taiheiyo Cement) 80 parts by weight Thermosetting component Alumina cement (manufactured by Denki Kagaku) Name "DENKA No. 2") 10 parts by weight Plaster of Paris (Adra Industry Co., Ltd.) 6 parts by weight Slaked lime (Komagata Lime Industry Co., Ltd.) 4 parts by weight previously mixed. A wood chip in which wood cypress and cedar are mixed is cut or pulverized to a length of 60 mm or less, a width of 20 mm or less, and a thickness of 2 mm or less (average length 10 mm, average width 1 mm, average thickness 0.5
mm). Thin wood piece A Ring wood hammer mill (manufactured by Pearlman)
Finely pulverized, average length 1.4 mm, average width 0.3 mm,
One with an average thickness of 0.1 mm. Thin wood piece B The above wood piece is finely pulverized with a disk cutter mill (manufactured by Horai Co., model "HT-300"), and the average length is 4 mm.
The average width is 0.4 mm and the average thickness is 0.2 mm. Fly Ash Balloon manufactured by Taiheiyo Cement Co., Ltd., trade name "Pozzospheres"
(Average particle size: 130 μm) Silica sand No. 8 (Rokuriya Mining Co., Ltd., average particle size: 70 μm) Fly Ash Pacific Cement Co., Ltd., trade name “Super Flow” (average particle size: 10 μm) Manufacturing Method A kneaded product obtained by supplying a predetermined amount of cement material A, fine wood chip A, silica sand, fly ash, and water shown in Table 1 to a Henschel mixer was mixed with a metal having a joint pattern with a depth of 5 mm. It was sprayed and dropped on a mold plate made of a resin to obtain a surface layer (surface side) having a predetermined thickness. Then, a predetermined amount of cement material A,
The kneaded material obtained by supplying the wood chips, the inorganic lightweight aggregate, and the water to the Henschel mixer was scattered and dropped on the above-mentioned surface layer to be stacked and laminated to obtain a base material layer having a predetermined thickness. Further, a kneaded material obtained by supplying a predetermined amount of cement material A, fine wood piece A, fine wood piece B, silica sand, fly ash, and water to the Henschel mixer is sprayed and dropped on the above-mentioned base material layer to be deposited and laminated. Thus, a surface layer (back side) having a predetermined thickness was obtained. The laminate obtained by laminating the surface layers on both sides of the base material layer obtained as described above was subjected to a pressure of 4 MPa and a temperature of 97
Cured by hot pressing at 12 ° C for 12 minutes,
Thereafter, the mold was released from the template to obtain a wood chip cement plate having a thickness of about 15 mm in which the surface layer was laminated on the base material layer. (Comparative Example 1) In place of cement material A, ordinary Portland cement (manufactured by Taiheiyo Cement Co., hereinafter referred to as “cement material B”) was used.
A wood chip cement board was obtained in the same manner as in Example 2, except that the mixture was cured by autoclaving for 18 hours while being pressed at 1 ° C at 1 ° C. [Table 1] Calculation of Coefficient A The wood chip boards obtained in Examples 1 to 5 and Comparative Examples 1 and 2 were subjected to the following tests. Yield stress, modulus of elasticity Wood piece cement board adjusted to one week of age is JIS A14
Bending test was performed according to the method described in No. 08, and yield stress a and elastic modulus b were calculated. Dimensional change rate The obtained wood chip cement board was cut into a 150 mm × 50 mm dumbbell shape, and the dimensions after immersion in water for 1 day and the dimensions after further drying at 60 ° C. for 48 hours were measured with a micrometer. Then, the dimensional change rate c was calculated from the equation (2). c = (dimension after immersion in water−dimension after drying) / dimension after drying (2) Durability test The wood chip cement boards obtained in Examples 1 to 5 and Comparative Examples 1 and 2 were each 900 mm × Cut into a shape of 900 mm, fixed to a square pipe-shaped square frame made of aluminum alloy with a width of 30 mm, a height of 15 mm, and a thickness of 1 mm with an adhesive and a screw.
After hydration carbonation treatment was performed at 80 ° C., 80% RH, and 10% CO 2 for 3 days, a dry / wet repetition test (a cycle of watering 2 h → 90 ° C. drying 9 hr) was repeated 30 times. After repeating the hydration carbonation treatment and the dry / wet repetition test alternately three times, remove from the frame and remove 150 mm x 50 m
m and subjected to the following test. Evaluation of physical properties after durability test Bending test A bending test was performed according to JIS A1408, and the yield stress and elastic modulus were calculated. Water absorption test -1) Dimensional change rate Dimension after immersion in water for 1 day, and 4% at 60 ° C.
The dimensions after drying for 8 hours are measured with a micrometer,
The dimensional change rate was calculated in the same manner as in the equation (2). -2) Flexural yield stress After immersion in water for 1 day, the flexural yield stress after further drying at 60 ° C for 48 hours was measured according to JIS A1408. The measurement was performed with 40 samples, and the ratio of those having a yield stress of 9 MPa or less is shown in Table 2. -3) Warp amount After immersion in water for one day and further drying at 60 ° C. for 48 hours, a thread was attached to both ends of the wood chip cement board, and the hollow amount (warpage amount) at the center was measured on a scale. From the above results,
The results are summarized in Table 2. [Table 2] The wood chip cement board of the present invention comprises a cement material, a wood chip, an inorganic lightweight aggregate, and water, wherein the amount of the wood chip accounts for 5 to 15% by weight based on the total weight. At least one surface of the layer is composed of a cement material, fine wood pieces finer than the above wood pieces, inorganic fine aggregate having an average particle size of 100 μm or less, and water, and the amount of the above wood pieces is 5 to 15 with respect to the total weight.
This is a wood chip cement board on which a surface layer occupying weight% is laminated, wherein the coefficient A defined by the equation (1) is 3 or more, so that it is lightweight, strong, and water-resistant. It will be excellent.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C04B 16:02 C04B 16:02 Z 18:26 18:26 14:02) 14:02 B Fターム(参考) 4F100 AA01A AA01B AA01C AA20 AE02A AE02B AE02C AJ04A AJ04B AJ04C BA02 BA03 BA10B BA10C BA27 CA24A CA24B CA24C DE05A DE05B DE05C GB07 JB07 JK01 JK04 JK07 JK08 JL03A YY00A YY00B YY00C 4G012 PA04 PA27 PA34 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C04B 16:02 C04B 16:02 Z 18:26 18:26 14:02) 14:02 BF term (Reference) ) 4F100 AA01A AA01B AA01C AA20 AE02A AE02B AE02C AJ04A AJ04B AJ04C BA02 BA03 BA10B BA10C BA27 CA24A CA24B CA24C DE05A DE05B DE05C GB07 JB07 JK01 JK04 JK07 JK08 PA00

Claims (1)

【特許請求の範囲】 【請求項1】セメント材料、木片、無機質軽量骨材、及
び水からなり、上記木片の量が総重量に対して5〜15
重量%を占める基材層の少なくとも片面に、セメント材
料、上記木片より細かい細木片、平均粒径100μm以
下の無機質細骨材、及び水からなり、上記細木片の量が
総重量に対して5〜15重量%を占める表層が積層され
ている木片セメント板であって、(1)式で定義される
係数Aが、3以上であることを特徴とする木片セメント
板。 A=a/bc ・・・ (1) 〔ここで、a及びbは、それぞれ、JIS A1408
に準拠して測定された曲げ試験における降伏応力(MP
a)、弾性率(MPa)を表し、cは、飽水後、60℃
で48hr乾燥したときの寸法変化率を表す〕
Claims: 1. A cement material, a wood chip, an inorganic lightweight aggregate, and water, wherein the amount of the wood chip is 5 to 15 with respect to the total weight.
At least one surface of the base layer occupying 5% by weight is composed of a cement material, fine wood pieces finer than the above wood pieces, inorganic fine aggregate having an average particle size of 100 μm or less, and water. A wood chip cement board on which a surface layer occupying 〜15% by weight is laminated, wherein the coefficient A defined by the formula (1) is 3 or more. A = a / bc (1) [where a and b are JIS A1408, respectively.
Stress (MP) in the bending test measured according to
a) represents the elastic modulus (MPa), and c is 60 ° C. after water saturation.
Represents the dimensional change rate when dried for 48 hours.]
JP2001331064A 2001-10-29 2001-10-29 Wood chip cement board Pending JP2003137633A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001331064A JP2003137633A (en) 2001-10-29 2001-10-29 Wood chip cement board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001331064A JP2003137633A (en) 2001-10-29 2001-10-29 Wood chip cement board

Publications (1)

Publication Number Publication Date
JP2003137633A true JP2003137633A (en) 2003-05-14

Family

ID=19146695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001331064A Pending JP2003137633A (en) 2001-10-29 2001-10-29 Wood chip cement board

Country Status (1)

Country Link
JP (1) JP2003137633A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008081327A (en) * 2006-09-26 2008-04-10 Nichiha Corp Inorganic molded product
JP2008081328A (en) * 2006-09-26 2008-04-10 Nichiha Corp Inorganic molded product and method for producing the same
CN101885203A (en) * 2010-06-08 2010-11-17 宫安 Cement wood particle board and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008081327A (en) * 2006-09-26 2008-04-10 Nichiha Corp Inorganic molded product
JP2008081328A (en) * 2006-09-26 2008-04-10 Nichiha Corp Inorganic molded product and method for producing the same
CN101885203A (en) * 2010-06-08 2010-11-17 宫安 Cement wood particle board and manufacturing method thereof

Similar Documents

Publication Publication Date Title
JP5173109B2 (en) Dry gypsum cement mixture and method for producing outdoor gypsum cement using the mixture
JP4911580B2 (en) Low specific gravity lightweight foam concrete and method for producing the same
WO2007111850A3 (en) Lightweight concrete compositions
WO2023213065A1 (en) Gypsum-based ground tile bonding mortar and preparation method therefor
JP4648668B2 (en) Inorganic board and method for producing the same
JP2009057226A (en) Method for manufacturing autoclaved lightweight concrete
US10669205B2 (en) Construction units in form of bricks, blocks or tiles made from recyclable materials and by-products, methods of making the construction units and their use
JP3374515B2 (en) Manufacturing method of inorganic plate
JP5041521B2 (en) High strength restoration material
JP2002292612A (en) Method for manufacturing inorganic cement composite plate
CA3161526A1 (en) Method for producing supersulphated cement
JP2007099546A (en) Method of producing autoclaved light-weight concrete
Baghban Thermal insulating cementitious composite containing aerogel and phosphate-based binder
JP2003137633A (en) Wood chip cement board
JP2009215136A (en) Hydraulic composition
JP2007145670A (en) Expansive admixture for resin-finished floor, and its use
JP4617073B2 (en) Quick hardening material and quick hardening cement composition
JP2002285667A (en) Board for buried form
JP2002154858A (en) Cemented chip board and multilayer cemented chip board
JP2002321305A (en) Cemented chip laminated board
JP2006069807A (en) Inorganic board and its manufacturing method
JP3223162U (en) Dry plastering panel
MOHAMMED Influence of silica-nano particles on properties of rice husk ash and calcium carbide waste binder based mortar
Ekaputri et al. Optimization of pressure and curing time in producing autoclaved aerated concrete
JP2002166491A (en) Wood piece and cement laminate