JP2003136386A - Method for recognition of needle polisher, and device for recognition of needle polisher - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problems of conventional methods for recognition of a needle polisher 8 using a CCD camera 5B which is incapable of optically correctly detecting the surface of a polishing brush, causing insufficient cleaning or damaging of a probe 6A because of easiness of the polishing brush of the needle polisher 8 to transmit light, or disorder of hair tips of the polishing brush. SOLUTION: This method for recognition of the needle polisher 8 is provided with a main chuck 4 movably disposed in a device main body, a probe card disposed above the main chuck 4, the needle polisher 8 to polish the probe of the probe card, and a device for recognition of height of the needle polisher 8, so that the needle polisher 8 following the main chuck 4 is recognized by the device for recognition. As the device for recognition 10, a load sensor 11 is used. As the main chuck 4 is moved, the needle polisher 8 following the main chuck 4 gets in contact with the load sensor 11, when the load sensor 11 detects a load, and the needle polisher 8 is recognized based on the load detected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for recognizing a needle polishing tool used in a probe device and a device for recognizing a needle polishing tool, and more specifically, needle polishing when polishing a probe of a probe card with a needle polishing tool. The present invention relates to a needle polishing tool recognition method and a needle polishing tool recognition device capable of detecting the height of the tool.

[0002]

2. Description of the Related Art A conventional probe apparatus, for example, as shown in FIG. 5, includes a loader chamber 1 for transferring a wafer W and a prober chamber 2 for inspecting the electrical characteristics of the wafer W delivered from the loader chamber 1. It is equipped with. In the loader chamber 1, a cassette storage unit 3, a transfer mechanism (not shown) for transferring the wafer W to the loader chamber 1, and pre-alignment with the orientation flat as a reference in the process of transferring the wafer W through the transfer mechanism. A sub chuck (not shown) is provided. Further, in the prober chamber 2, a mounting table (main chuck) 4 for mounting the pre-aligned wafer W from the transfer mechanism and moving in the X, Y, Z, and θ directions, and on the main chuck 4. A probe card 6 having a positioning mechanism (alignment mechanism) 5 for accurately positioning the wafer W, and a probe 6A that electrically contacts the electrode pad of the wafer W after the positioning by the alignment mechanism 5.
And are provided. The probe card 6 is in the prober chamber 2
Is fixed to the head plate 2A forming the upper surface of the.

As shown in FIG. 5, the alignment mechanism 5 includes a lower CCD camera 5A and an upper CCD camera 5B, and is driven under the control of a control device. Lower CCD camera 5
A is attached to the main chuck 4, and images the probe 6A of the probe card 6 from below. Upper CCD camera 5B
Is arranged at the center of the alignment bridge 5C and images the wafer W on the main chuck 4 from above. The imaged probe 6A and wafer W are displayed on the monitor screen 7. Further, the alignment bridge 5C is used in the prober chamber 2
A pair of guide rails 5D, 5D arranged above and along the front-rear direction (Y direction) moves the prober chamber 2 from the innermost portion (the upper portion in FIG. 6B) to the probe center. Further, the main chuck 4 is provided with a target 5E that can move back and forth above the lower CCD camera 5A,
After the needle tip of the probe 6A is imaged by the CD camera 5A to obtain the height of the needle tip, the lower CCD is passed through the target 5E.
The optical axes of the camera 5A and the upper CCD camera 5B are aligned with each other, and the position of the main chuck 4 at this time is set to the wafer W and the probe 6.
It is used as a reference position when performing alignment between A.

A test head T is rotatably disposed in the prober chamber 2, and the test head T is electrically connected to the probe card 6 via an interface section (not shown) to connect the test head T and the probe 6A. A signal from the tester is transmitted to the electrode pads of the wafer W via the tester to inspect the electrical characteristics of a plurality of semiconductor elements (chips) formed on the wafer W.

By the way, when inspecting the wafer W,
For example, while the main chuck 4 moves in the X, Y, Z and θ directions, the electrode pad on the surface of the wafer W and the probe 6A of the probe card 6 are aligned with each other via the alignment mechanism 5. After alignment, the main chuck 4 is X,
The wafer W on the main chuck 4 moves in the Y and Z directions.
The electrode pad and the probe 6A are electrically contacted to inspect the electrical characteristics of the chip. When this inspection is repeated, the metal oxide on the electrode pad surface adheres to the needle tip of the probe 6A as shavings, which interferes with the subsequent inspection. Therefore, for example, a cleaning operation of polishing the needle tip to remove shavings by using the needle polishing tool 8 shown in FIG. 6 is performed. As shown in FIG. 6, the needle polishing tool 8 is detachably mounted on a support 9 that projects laterally from the main chuck 4.
The polishing material 8A of the needle polishing tool 8 is, for example, a polishing brush,
Alternatively, it is formed as a polishing plate coated with a gel containing abrasive grains. As shown in FIG. 6, the polishing plate may be of a type that is fixedly used as a polishing material 8A on a support 9 or a type of a wafer-sized one that is placed on the main chuck 4 and used.

When polishing the probe 6A, for example, the needle polishing tool 8 moves to the polishing position of the probe 6A via the main chuck 4, and moves up and down through the main chuck 4 at that position to move the shavings of the probe 6A. To remove. At this time, in order to automate the polishing work, it is necessary to detect the distance that the needle polishing tool 8 rises to the polishing position and control the main chuck 4 based on this detected height. Therefore, conventionally, the height of the needle polishing tool 8 is set based on the design value of the needle polishing tool 8, and the main chuck 4 is raised according to this setting. Further, for example, the upper CCD camera 5B of the alignment mechanism 5 images the polishing surface of the needle polishing tool 8, and the height of the polishing surface is detected based on the position coordinates of the needle polishing tool 8 located at the focal length at that time. . Further, the height of the polishing surface of the probe 6A and the needle polishing tool 8 was detected using a capacitance sensor.

[0007]

However, even if the height of the needle polishing tool 8 is set on the basis of the design value of the needle polishing tool 8, the needle polishing tool 8 has variations in individual products, and the polishing is difficult. There was a problem that the polishing brushes would wear and the height would change if they were piled up. Further, when the upper CCD camera 5B is used, light easily passes through the polishing brush of the needle polishing tool 8, or in some cases, the tips of the polishing brush are uneven, so that the surface of the polishing brush is optically. However, there is a problem in that the surface height of the needle polishing tool 8 cannot be accurately recognized, cleaning is insufficient, and the probe 6A is damaged.
Further, in the case of a polishing plate coated with gel containing abrasive grains as the needle polishing tool 8, the surface of the polishing plate can be optically accurately detected by, for example, transmitting light through the gel layer. As in the case of the polishing brush, there is a problem that the surface height of the needle polishing tool 8 cannot be recognized. When using the capacitance sensor, there is a problem that the surface of the needle polishing tool 8 cannot be accurately recognized if the surface of the needle polishing tool 8 is uneven.

The present invention has been made to solve the above problems, and accurately and reliably detects the surface height of a needle polishing tool by accurately recognizing the polishing surface of the needle polishing tool regardless of the type. An object of the present invention is to provide a needle polishing tool recognition method and a needle polishing tool recognition device that can perform the above.

[0009]

According to a first aspect of the present invention, there is provided a method for recognizing a needle-polishing tool, comprising: a mounting table for an object to be inspected, which is movably arranged in a main body of the apparatus; A probe card arranged, a needle polishing tool for polishing the probe of the probe card, and a recognition device for recognizing the needle polishing tool, and the height of the needle polishing tool with the mounting table described above by the recognition device. A method of recognizing, using a load sensor as the recognizing device, the load table is moved and the load is detected after the load sensor comes into contact with the needle polisher accompanying the load table, and based on the detected load. It is characterized by recognizing the height of the needle polishing tool.

A needle polishing tool recognition method according to a second aspect of the present invention is characterized in that, in the first aspect, the switch mechanism of the load sensor is activated by the detected load. .

According to a third aspect of the present invention, in the method of recognizing a needle polishing tool according to the second aspect of the invention, the switch mechanism turns off the power.

According to a fourth aspect of the present invention, there is provided a method for recognizing a needle polishing tool according to any one of the first to third aspects, wherein the needle polishing tool is attached to the mounting table. It is characterized by recognition.

Further, a needle polishing tool recognizing method according to claim 5 of the present invention is the method according to any one of claims 1 to 4, wherein the needle polishing tool is placed on the needle polishing tool. It is characterized by recognizing the needle polishing tool.

Further, a needle polishing tool recognizing method according to a sixth aspect of the present invention is the method according to any one of the first to fifth aspects, wherein a brush-shaped or plate-shaped needle polishing tool is used. It is characterized by recognition.

According to a seventh aspect of the present invention, there is provided a device for recognizing a needle-polishing tool, wherein a mounting base for an object to be inspected is movably arranged in the main body of the device, and a probe arranged above the mounting base. A device for recognizing a needle polishing tool of a probe device provided with a card and a polishing tool for polishing a probe of this probe card, and for a load after contact with the needle polishing tool that moves with the mounting table described above. A load sensor for recognizing the height of the needle polishing tool based on the above is provided.

According to an eighth aspect of the present invention, in the recognizing device for a needle polishing tool according to the seventh aspect, an alignment mechanism for aligning the load sensor with the object to be inspected and the probe is provided. It is characterized by being attached to an alignment bridge.

According to a ninth aspect of the present invention, in the recognizing device for a needle polishing tool according to the seventh aspect or the eighth aspect, the load sensor is a switch mechanism that operates based on the load. It is characterized by having.

According to a tenth aspect of the present invention, in the recognizing device for a needle polishing tool according to any one of the seventh to ninth aspects, the load sensor is made of a conductive material. A first tubular body, a second tubular body coaxially arranged inside the first tubular body via an insulator, and having one end sealed with a conductive material, and a second tubular body It has a plunger made of a conductive material, one end of which is inserted into the body through an elastic member and the other end of which is formed as an expanded diameter portion, and a switch made of a conductive material protruding from the outer peripheral surface of the expanded diameter portion of the plunger. A locking portion for locking the switch of the plunger biased via the elastic member is formed at the opening end of the first cylindrical body.

Further, an apparatus for recognizing a needle polishing tool according to an eleventh aspect of the present invention is characterized in that, in the invention according to the tenth aspect, the switch is provided at one place.

According to a twelfth aspect of the present invention, in the recognition device for a needle polishing tool according to the tenth aspect or the eleventh aspect, the first cylinder and the second cylinder are connected to a power source. It is characterized by having done.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below with reference to the embodiments shown in FIGS. First, an embodiment of the needle polishing tool recognition device of the present invention, which is preferably used in the needle polishing tool recognition method of the present invention, will be described.

A device for recognizing a needle polishing tool of the present embodiment (hereinafter,
It is simply called a "recognition device". ) 10 is provided with a load sensor 11 for recognizing the needle polishing tool 8 based on the load when it contacts the polishing surface of the abrasive 8A of the needle polishing tool 8 that moves with the mounting table (main chuck) 4. Has been done. As shown in FIG. 1, the load sensor 11 is attached to, for example, an alignment bridge 5C that constitutes the alignment mechanism 5. The alignment bridge 5C moves between the innermost portion of the prober chamber 2 and the probe center as in the conventional case. A main chuck 4 is disposed below the alignment bridge 5B, and the main chuck 4 can be moved in the X, Y, Z, and θ directions via a moving mechanism 12.

The moving mechanism 12 is, for example, as shown in FIG. 1, an X table 1 having a main chuck 4 fixed to the upper surface thereof.
2A, a pair of X guide rails 12B that move and guide the X table 12A in the X direction, a Y table 12C to which the X guide rails 12B are fixed, and a pair of Y guides that move and guide the Y table 12C in the Y direction. It is provided with a Y guide rail 12D and a substrate 12E to which these Y guide rails 12D are fixed. Also, Y table 12C
An X-direction ball screw 12F that is driven via an X motor (not shown) is arranged above the X-direction ball screw 12F.
F is screwed with the X table 12A. On the board 12E, a Y-direction ball screw 1 driven via a Y motor 12G
2H is provided, and this Y-direction ball screw 12H is screwed with the Y table 12C. Therefore, X, Y table 1
2A and 12C move in the X and Y directions via the X and Y motors 12G and the X and Y direction ball screws 12F and 12H.
Further, the main chuck 4 rotates forward and backward in the θ direction via a built-in θ direction drive mechanism. This moving mechanism 12 is under the control of the controller.

The load sensor 11 is, as shown in FIG. 2, a first cylindrical member made of a conductive material.
And the insulator 11 inside the first cylinder 111.
A second cylindrical body 113 which is coaxially arranged with the second cylindrical body 111 and whose one end (upper end) is sealed with the same conductive material as that of the first cylindrical body 111, and is elastic in the second cylindrical body 113. One end (upper end) is inserted through a member (for example, spring) 114, and the other end (lower end) is expanded diameter portion (flange) 115.
Plunger 11 made of a conductive material formed as A
5, a switch 116 made of a conductive material that protrudes from the outer peripheral surface of the flange 115A, and a power supply 17 that is turned on and off by the operation of the switch 116, and outputs an on / off signal to the control device to output the main chuck. 4 is driven and controlled. The first cylindrical body 111 is formed as an outer conductor,
The second tubular body 113 is formed as an internal conductor. Furthermore, the first and second cylindrical bodies 111 and 113 and the plunger 1
The entire surface of each of 15 is vapor-deposited with gold to enhance the electrical conductivity of the contact surfaces.

The conductive material of the first and second cylindrical bodies 111 and 113 is not particularly limited, but phosphor bronze, beryllium copper or the like is preferably used. The material of the insulator 112 is not particularly limited, but for example, tetrafluoroethylene resin or the like is preferably used. The conductive material of the plunger 115 is not particularly limited, but SK material or the like is preferably used. The conductive material of the switch 116 is not particularly limited, but phosphor bronze, beryllium copper, or the like is preferably used. Since the inspection of the wafer W is performed by a low temperature test and a high temperature test, the first and second cylindrical bodies 111 and 113 and the plunger 1 are inspected.
All of 15 have a small coefficient of thermal expansion and are preferably thermally stable. The spring 114 has an initial spring pressure of 20.
Those having ± 5 gf are preferably used.

As shown in FIG. 2, the first cylindrical body 111 is formed.
A thick-walled reinforcing portion 111A is formed at the upper end of the, and a twisted portion 111B is formed slightly below the reinforcing portion 111A. In addition, an engagement groove 112A of the insulator 112 that engages with the twisted portion 111B of the first cylindrical body 111 is formed on the upper end portion of the insulator 112 over the entire circumference. The twisted portion 111B and the engagement groove 112A may be formed at predetermined intervals over the entire circumference thereof.
In this way, the twisted portion 111B of the first tubular body 111 and the engagement groove 112A of the insulator 112 are engaged with each other, so that the insulator 1
12 does not move in the axial direction. The first cylindrical body 111 is formed longer than the insulator 112.

As shown in FIG. 2, the second cylindrical body 113 is provided.
A plate-like connection terminal 113A is extended at the upper end of the. A first locking portion 113B that engages with the upper end surface of the insulator 112 is formed on the connecting terminal 113A, and the second tubular body 113 is axially inward of the insulator 112 via the locking portion 113B. Not to move to. Also, the second
The tubular body 113 is formed in a solid shape from the first locking portion 113B to a little inward in the axial direction, and has a solid shape, and the upper end is sealed. A spring 114 is interposed between the upper end of the plunger 115 inserted into the second tubular body 113 and the sealing portion, and the spring 114 constantly urges the plunger 115 downward in the axial direction. In addition, the second tubular body 113
The second locking portion 113C is formed at the lower end of the
113C is engaged with the lower end surface of the insulator 112. Therefore, the insulator 112 includes the second locking portion 113C,
The first through the twisted portion 111B and the engagement groove 112A,
The second cylinders 111 and 113 are sandwiched and fixed so as not to move in the axial direction.

At the lower end of the first cylindrical body 111, a thick-walled locking portion 111C that projects radially inward is formed. A switch 116 is mounted on the flange 115A of the plunger 115 at only one position in the radial direction, and the switch 116 projects from the outer peripheral surface of the flange 115A. Therefore, this plunger 115 is
The switch 116 is constantly urged downward through the switch 116, and the switch 116 elastically contacts the locking portion 111C of the first tubular body 111 at one location. Further, the first tubular body 111 and the second tubular body 113 are connected to the power source 117, respectively, and when the load sensor 11 is not in operation, the first tubular body 111 and the second tubular body 113 are connected to the plunger 115 and one location. It is conducted through the switch 116. That is, when the plunger 115 receives a load and moves upward, for example, within a range of 100 μm or less, specifically 10 μm or less, the switch 116 is separated from the locking portion 111C of the first cylindrical body 111 and is switched off. When the load is removed, the plunger 115 returns to its original position, and the switch 116 makes electrical contact with the locking portion 111C of the first tubular body 111 at one point to switch on. At this time, the plunger 115 uses, for example, the spring force of the spring 114 (for example, 1
It works against 5-25 gf).

Next, a method of recognizing a needle polishing tool of the present invention using the above-described needle polishing tool recognizing device 10 will be described with reference to FIGS. FIG. 3 shows the case where the abrasive 8A of the needle polisher 8 is a polishing brush, and FIG. 4 is the abrasive 8 of the needle polisher 8.
The case where A is a polishing plate is shown.

First, the alignment bridge 5C of the alignment mechanism 5 moves from the standby position at the innermost portion of the prober chamber 2 shown in FIGS. 1 and 3 (a) to the probe center. Next, the main chuck 4 moves from the reference position, for example, under the control of the control device, and the lower CCD camera 5A attached to the main chuck 4 finds the center of the load sensor 11 attached to the alignment bridge 5C. Based on the position of the chuck 4, the X, Y, Z position coordinates of the center of the load sensor 11 are stored in the control device.

On the other hand, the X and Y position coordinates of the center of the needle polishing tool 8 fixed to the main chuck 4 are registered in advance in the storage device of the control device as position coordinates based on the center of the main chuck 4. Based on this registered coordinate position and the position coordinate of the load sensor 11, the needle polishing tool 8 moves to just below the load sensor 11 via the main chuck 4 under the control of the controller, and the center of the needle polishing tool 8 and the load sensor are controlled. Match the centers of 11. After that, when the main chuck 4 moves up under the control of the control device, the needle polishing tool 8 and the load sensor 11 come into contact with each other as shown in FIG.

Subsequently, the needle polishing tool 8 is attached to the main chuck 4
When the load sensor 11 receives a load of, for example, 20 gf, the plunger 115 of the load sensor 11 resists the spring force of the spring 114 and starts to rise along the second tubular body 113. If the plunger 115 rises by a distance of, for example, 100 μm or less, specifically 10 μm or less, the switch 116 is released.
Is separated from the engaging portion 111C of the second tubular body 111, is switched off to turn off the power supply 117, the load sensor 11 detects the needle polishing tool 8, and the height from the reference position can be recognized. . At this time, even if the bristles of the polishing brush of the needle polishing tool 8 are not aligned and come into contact with the longest bristles, the load is too small and the switch 116 does not work, and the average surface of the bristles with the most bristles comes into contact. Only then does the plunger 115 switch off due to the load. That is, regardless of the length of each polishing brush, it is possible to recognize the reference surface of the polishing brush based on the average length and detect the height thereof.
In addition, even if the average length of the polishing brush differs depending on the needle polishing tool 8, the load sensor 11 can reliably detect the respective reference surface heights. Moreover, since the switch 116 is in contact with the locking portion 111C at one point, the reproducibility of the on / off operation is good and stable switching operation can be performed. In this way, the load sensor 1
When 1 outputs an off signal to the control device, the control device stops the main chuck 4 based on the off signal, and stores the rising distance of the needle polishing tool 8 at this time in the storage device of the control device,
The height of the polishing brush can be calculated based on this rising distance. After that, when the probe 6A is polished by using the needle polishing tool 8, the probe 6A can be polished at an appropriate position by raising the main chuck 4 with the height of the needle polishing tool 8 as a reference, resulting in defective cleaning. There is also no risk of damaging the probe 6A.

FIG. 4 shows a case where a wafer-size polishing plate 8B is used as the needle polishing tool 8. In this case, since the area of the polishing plate 8B is large, its height is obtained at a plurality of points on the polishing plate 8B. To this end, as in the case shown in FIG. 3, after moving the main chuck 4 to the alignment center 5C of the alignment bridge, the main chuck 4 is moved from the reference position to the polishing plate 8B.
After moving the appropriate peripheral portion of the main chuck 4 directly below the load sensor 11, the main chuck 4 is lifted to bring the polishing plate 8B and the load sensor 11 into contact with each other until the load sensor 11 is switched off. To raise. The height at one point of the peripheral edge of the polishing plate 8B can be obtained by this switch-off. After that, similarly, the height of the polishing plate 8B is obtained at the other peripheral portion and the central portion of the polishing plate 8B. Then, the average value of the heights at these detection points is obtained through the control device, and the probe 6A
When polishing, the average value is used as the height of the polishing plate 8B. At this time, even if the polishing plate 8B is a gel layer through which light easily passes, the height can be accurately obtained.

As described above, according to this embodiment,
When the main chuck 4 moves and the needle polishing tool 8 fixed to the side of the main chuck 4 or the polishing plate 8B placed on the main chuck 4 comes into contact with the load sensor 11,
Since the load is detected by the rise of the plunger 115 and the needle polishing tool 8 or the polishing plate 8B is recognized based on the detected load, it is possible to detect the load like the needle polishing tool 8 having a polishing brush or a gel layer as the polishing material 8A. The surface height of the needle polishing tool 8 can be reliably detected by accurately recognizing the surface of the abrasive 8A composed of the polishing brush or gel layer of the needle polishing tool 8 regardless of its type. The reference height of the polishing brush or gel layer of the needle polishing tool 8 can be set.

Therefore, the surface height of the polishing brush or gel layer of the needle polishing tool 8 can be accurately recognized by implementing the needle polishing tool recognition method using the needle polishing tool recognition device 10 of the present embodiment. Therefore, when polishing the probe 6A, the probe 6 can be polished with reference to the detection height of the polishing brush 8A of the needle polishing tool 8 or the polishing material 8A formed of a gel layer.
The degree of polishing of A can be adjusted appropriately. For example, when the probe 6A is strongly polished, the needle polishing tool 8 may be raised above the reference height obtained as described above, and when the probe 6A is weakly polished, it may be raised below the reference height. By such an operation, the probe 6A can be polished at an appropriate position, and there is no risk of cleaning failure or damage to the probe 6A.

Further, according to this embodiment, the load sensor 1
1 is attached to the alignment bridge 5C of the alignment mechanism 5, the load sensor 11 is used when the wafer W is inspected.
Since it has been evacuated from the inspection place, it will not interfere with the inspection. Further, since the load sensor 11 has a switch mechanism that operates based on the load at the time of contact with the needle polishing tool 8, the needle polishing tool 8 can be recognized reliably and accurately. Further, the load sensor 11 is coaxially arranged with the first cylindrical body 111 formed of a conductive material via the insulator 112 inside the first cylindrical body 111 and has one end sealed with a conductive material. A second cylindrical body 113 formed in this manner, a plunger 115 made of a conductive material, one end of which is inserted into the second cylindrical body 113 via a spring 114 and the other end of which is formed as a flange 115A, and this plunger. And a switch 116 made of a conductive material that protrudes from the outer peripheral surface of the flange 115A of the first cylinder 111.
At the opening end of the locking portion 111 for locking the switch 116 of the plunger 115 urged via the spring 114
Since C is formed, the load sensor 11 can be miniaturized while reliably and accurately acting as a switch mechanism due to the load at the time of contact with the needle polishing tool 8. Moreover, since the switch 116 is provided at one location, the switch 116 contacts the locking portion 111C at one point, and reproducible switch operation can be reliably and stably realized without malfunction. In addition, the first cylinder 111 and the second cylinder 113
Is connected to the power supply 117, it is possible to reliably know the on / off operation of the switch mechanism.

The present invention is not limited to the above-described embodiments, and the constituent elements can be appropriately designed and changed as long as they do not violate the gist of the present invention. For example, although the case where the switch 116 is provided at one place in order to ensure reproducibility and stability of the switch operation has been described in the present embodiment, the switches may be provided at a plurality of places.
In short, the present invention only needs to be a method and apparatus for recognizing a needle polishing tool that recognizes the needle polishing tool based on a predetermined load that is received when it contacts the needle polishing tool.

[0038]

According to the inventions of claims 1 to 12, the surface height of the needle polishing tool can be accurately and reliably recognized by accurately recognizing the polishing surface of the needle polishing tool regardless of the type. It is possible to provide a method for recognizing a needle polishing tool and a device for recognizing a needle polishing tool that can detect with high reproducibility.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of a probe device to which an embodiment of a recognition device for a needle polishing tool of the present invention is applied.

FIG. 2 is a cross-sectional view showing a load sensor of the recognition device for the needle polishing tool shown in FIG.

FIG. 3 is a conceptual diagram showing an embodiment of a method of the present invention using the recognition device for a needle polishing tool shown in FIG. 1, and FIG. 3A is a diagram showing a state in which a load sensor is in a standby position in a prober chamber; FIG. 7B is a diagram showing a state in which the needle sensor is recognized by the load sensor shown in FIG.

FIG. 4 is a conceptual diagram showing another embodiment of the method of the present invention using the recognition device for the needle polishing tool shown in FIG. 1, in which (a) shows a state in which the load sensor is in the standby position of the prober chamber, (B)
FIG. 6 is a diagram showing a state in which the load sensor of FIG.

FIG. 5 is a partial cutaway view showing an example of a probe device.

6 is a perspective view showing a main chuck used in the probe device shown in FIG. 5 and a needle polishing tool attached to the main chuck.

[Explanation of symbols]

5C alignment bridge 8-needle polishing tool 10 Needle polisher recognition device 11 load sensor 111 First cylinder 111C locking part 112 insulator 113 Second cylinder 114 Spring (elastic member) 115 Plunger 116 switch 117 power supply W wafer

Claims (12)

[Claims] 1. A mounting table for an object to be inspected, which is movably arranged in an apparatus main body, a probe card arranged above the mounting table, a needle polishing tool for polishing a probe of the probe card, and A method for recognizing the height of the needle polishing tool according to the above-mentioned mounting table by the recognition device, comprising a recognition device for recognizing a needle polishing tool, wherein the above-mentioned mounting table is moved by using a load sensor as the recognition device. Then, the load is detected after the load sensor comes into contact with the needle polisher associated with the mounting table, and the height of the needle polisher is recognized based on the detected load. Method. 2. The needle polishing tool recognition method according to claim 1, wherein a switch mechanism of the load sensor is activated by the detected load. 3. The needle polishing tool recognizing method according to claim 2, wherein the switch mechanism turns off the power. 4. The method for recognizing a needle polishing tool according to claim 1, wherein the needle polishing tool attached to the mounting table is recognized. 5. The needle polishing tool recognizing method according to claim 1, wherein the needle polishing tool placed on the needle polishing tool is recognized. 6. The needle polishing tool recognizing method according to claim 1, wherein a brush-shaped or plate-shaped needle polishing tool is recognized. 7. A mounting table for an object to be inspected, which is movably arranged in the apparatus main body, a probe card arranged above the mounting table, and a polishing tool for polishing the probe of the probe card. A device for recognizing a needle polishing tool of a probe device, comprising a load sensor for recognizing a height of the needle polishing tool based on a load after contact with the needle polishing tool moving with the mounting table. A device for recognizing a needle polishing tool, which is characterized in that: 8. The needle polisher recognition device according to claim 7, wherein the load sensor is attached to an alignment bridge of an alignment mechanism that aligns the object to be inspected with the probe. 9. The needle polisher recognition device according to claim 7, wherein the load sensor has a switch mechanism that operates based on the load. 10. The load sensor is arranged coaxially with a first cylinder formed of a conductive material, inside the first cylinder via an insulator, and has one end sealed with a conductive material. And a plunger made of a conductive material, one end of which is inserted into the second cylinder via an elastic member and the other end of which is formed as a diameter expansion portion, and the diameter expansion of the plunger. A switch made of a conductive material protruding from the outer peripheral surface of the plunger, and a locking portion for locking the switch of the plunger biased via the elastic member is provided at the opening end of the first cylindrical body. It is formed, It is characterized by the above-mentioned.
A device for recognizing a needle polishing tool according to claim 9. 11. The needle polishing tool recognizing device according to claim 10, wherein the switch is provided at one place. 12. The needle polishing tool recognition device according to claim 10, wherein the first cylinder and the second cylinder are connected to a power source.