JP2003133378A - Method of manufacturing inspection system and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make clear which components of foreign matters there are and the manner of their distribution. SOLUTION: A system has a process for processing the wafer, a process for inspecting the processed wafer, a process for analyzing the wafer by using coordinate data, included in an inspection result obtained by inspection and a process for displaying information on an analysis result, obtained by analysis with the coordinate data contained in the inspection result made to correspond to identification of the wafer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic device by displaying the analysis result of foreign matter on a wafer according to its distribution.

[0002]

2. Description of the Related Art In semiconductor manufacturing, foreign substances adhering to wafers are a significant factor in reducing yield. Therefore, the foreign matter adhering to the wafer is counted to control the amount of foreign matter generated, and the foreign matter adhering to the wafer is analyzed to analyze the foreign matter generation source.

Conventionally, when analyzing foreign substances adhering to a semiconductor wafer, the portion of the wafer on which the foreign substances are adhering is cut into small pieces, which are then subjected to an analyzer. However, there are inconveniences such that it takes time and effort to cut the wafer and that chips of the wafer adhere to the surface during the cutting. Therefore, an apparatus having both the function of detecting foreign matter on a wafer and the function of analyzing adhering foreign matter without cutting the wafer as it is has been developed (Japanese Patent Laid-Open No. 60-218845). The apparatus of the invention detects a foreign substance, records the coordinates, and analyzes the foreign substance at the coordinate. The apparatus saves the trouble of cutting the foreign matter, and the cutting powder no longer adheres to the surface, so that the cutting powder is not erroneously analyzed.

[0004]

However, since the foreign matter analyzed in the past utilizes only the component information and not its position information, what kind of component the foreign matter was distributed on the wafer and how it was distributed. I didn't understand.

An object of the present invention is to manufacture an electronic device by clarifying what kind of component foreign matter is distributed on a wafer. When the object is achieved, the state of foreign matter adhering to the wafer can be seen at a glance, and it becomes easy to elucidate the cause of foreign matter generation.

[0006]

In order to achieve the above object, the present invention provides a step of processing a wafer, a step of detecting a defect on the appearance of the wafer, and a step of detecting the appearance obtained by the detection. A step of obtaining detailed information on the appearance defect by using position information of the defect on the wafer; and a step on the wafer of the appearance defect obtained by detecting the detailed information on the appearance defect. And a step of displaying the information together with the information for identifying the wafer in association with the position information in step 1, wherein the detailed information is obtained by analyzing the detected external defect with an SEM. The information obtained by analyzing the appearance defect by SEM is displayed as a symbol together with the information on the position of the appearance defect.

Further, the process of processing the wafer, the process of detecting a defect on the appearance of the wafer, and the position information on the wafer of the defect on the appearance obtained by the detection are used to determine the appearance of the wafer. A step of obtaining detailed information of the defect and a display together with information for identifying the wafer in correspondence with the position information on the wafer of the external defect obtained by detecting the detailed information of the external defect In addition, the detailed information of the defect on the external appearance is symbolized and displayed on the screen in correspondence with the position of the defect on the wafer.

The appearance defects are displayed by classifying them into a predetermined category, and if there are defects belonging to a plurality of categories, one of them is displayed.

Further, a step of processing the wafer, a step of detecting a defect on the appearance of the wafer, and a position information on the wafer of the appearance defect obtained by the detection are used to detect the appearance of the wafer. A step of obtaining detailed information of the defect and a display together with information for identifying the wafer in correspondence with the position information on the wafer of the external defect obtained by detecting the detailed information of the external defect And a step of displaying detailed information on the appearance defect by classifying it into a plurality of categories.

Further, if there is a defect belonging to the plurality of categories, one of them is displayed.

Further, a step of processing the wafer, a step of inspecting the processed wafer, a step of analyzing the wafer using coordinate data included in the inspection result obtained by the inspection, and a step of performing the analysis. And a step of displaying the information of the obtained analysis result in association with the coordinate data included in the inspection result together with the information for identifying the wafer.

Further, the analysis result information is classified into a predetermined category and displayed, and if there is analysis result information belonging to a plurality of categories, one of them is displayed.

As a result, it becomes possible to know the foreign substance distribution of a specific component, and for example, the shape of the distribution of each component reveals the jig, device, etc. that caused dust generation.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings.

Embodiment 1 In this embodiment, a device configuration necessary for the present invention will be described.
FIG. 1 will be described. The inspection device 1 may be a foreign substance inspection device capable of detecting a foreign substance on a wafer, and may be any device capable of outputting the coordinates of the detected foreign substance on the wafer. As the inspection device, IS manufactured by Hitachi Electronic Engineering Co., Ltd.
-1010 is available. The analyzer 2 may be an analyzer that can analyze foreign matter without cutting the wafer, and can analyze foreign matter based on the coordinate data of the inspection apparatus 1. The analysis device 2 analyzes all foreign substances in the order detected by the inspection device 1. A large number of such analyzers are commercially available. The workstation 3 may have a function of recording the foreign matter coordinate data and the foreign matter analysis data, and a function of matching the two data and a function of displaying a result of the matching.
The data transfer means 4 is means for passing the foreign matter coordinate data from the inspection device 1 to the analysis device 2, and the operator may input the data printed out by the inspection device 1 to the analysis device 2, or a floppy disk or The data may be passed through a light-weight storage medium such as a memory card, or may be passed over a network. The data transfer means 5 is means for transferring the foreign matter coordinate data and the foreign matter analysis data from the analysis device 2 to the workstation 3, and the implementation method is the same as that of the data transfer means 4. The display unit 200 displays the combined foreign matter coordinate data and foreign matter analysis data.

Second Embodiment Here, an alternative to the first embodiment will be shown. The foreign substance analysis device 100 in FIG. 2 is a device having a function of detecting a foreign substance and further analyzing the foreign substance. For example, Japanese Patent Laid-Open No. 60-21 mentioned above.
It can be realized by the device described in 8845. The workstation 6 plays the same role as the workstation 3. The data transfer means 7 plays the same role as the data transfer means 5. The display unit 200 displays the combined foreign matter coordinate data and foreign matter analysis data.

Embodiment 3 Here, an alternative to Embodiment 1 will be shown. The inspection device 8 in FIG. 3 has the same function as the inspection device 1, but transfers the coordinate data of the foreign matter to the analysis device 9 and the workstation 10.
The analyzer 9 has the same function as the analyzer 2. The workstation 10 has the same function as the workstation 3. The data transfer means 11 is the same as the data transfer means 4. The data transfer means 12 is means for transferring the foreign matter coordinate data from the foreign matter inspection apparatus 8 to the workstation 10, and the method of implementation is the same as that of the data transfer means 4. The data transfer means 14 is means for transferring the foreign substance analysis data from the analyzer 9 to the workstation 10, and the implementation method is the same as that of the data transfer means 4. The display unit 200 displays the combined foreign matter coordinate data and foreign matter analysis data.

Embodiment 4 The processing in the workstation 3 will be described. The present embodiment corresponds to the device configurations of the first and second embodiments. In FIG. 1, the workstation 3 receives the foreign substance coordinate data and the analysis data from the analysis device, and creates the data table 15. The format of the data table 15 is shown in FIG. The data table 15 has at least foreign particle coordinate data 1
6 and foreign matter analysis data 17. A foreign matter ID 18 and additional information 19 for each foreign matter are provided as necessary. In FIG. 4, information about the size of the foreign matter is given as an example of the incidental information 19. Here, the particle size of the foreign matter is classified into three and described as L, M, and S in descending order. Data table 1
A number 5 is created for each analyzed wafer, and a wafer identifier 20 is assigned to each to distinguish them. As a method of assigning a foreign matter ID, there is a method of assigning serial numbers in the order in which data is sent after the wafer identifier. Workstation 3
When the operator inputs the wafer identifier, the data table 15 having the same identifier is searched, and the corresponding data is displayed on the display means 200.

Embodiment 5 An alternative to Embodiment 4 will be described. This embodiment corresponds to the device configuration described in the third embodiment. In FIG. 3, the workstation 10 receives the coordinate data of the foreign matter from the inspection device 8,
The coordinate data table 21 is created. The format of the coordinate data table is shown in FIG. Coordinate data table 2
Reference numeral 1 includes a wafer identifier 22, a foreign matter ID 23, and foreign matter coordinate data 24. Additional information 25 may be added as necessary. The additional information 25 includes information indicating the particle size of the foreign matter as shown in the fourth embodiment. Further, the workstation 10 receives the foreign substance analysis data from the analysis device 9 and creates the analysis data table 26. The format of the analysis data table is shown in FIG. The analysis data table 26 includes a wafer identifier 27, a foreign matter ID 28, and foreign matter analysis data 29.

In the analyzer 9, all foreign substances are analyzed in the order of the coordinate data sent from the inspection device 8. The analysis device 9 sends the result to the workstation 10. By adding serial numbers to the workstation in the order in which the data is sent for each wafer, the foreign matter ID 23,
The foreign matter ID 28 matches.

The workstation 10 creates the data table 15 shown in the fourth embodiment from the coordinate data table 21 and the analysis data table 26 via the foreign substance ID.
The result is displayed on the display means 200.

Embodiment 6 In this embodiment, an embodiment of a method of displaying the contents of the data table 15 will be shown. First, the analysis results are divided into several categories. An example is shown in FIG. Category 1 containing Na and Cl, Category 2 containing Fe,
Those containing Si as category 3, C as category 4
And others are classified as category 5. If there are items that belong to multiple categories, the one with the smallest category number is given priority.

The workstation plots on the wafer displayed on the CRT at the foreign matter detection position based on the foreign matter coordinate data (FIGS. 8 and 30). The above-mentioned category number to which each foreign substance belongs is used as a symbol for plotting. An example is shown in FIG. Here, it can be seen that NaCl (salt) and C (carbon compound) are attached on an ellipse in the lower right corner.

From this, it can be understood that the operator accidentally touched the finger.

Embodiment 7 In this embodiment, the analyzer 3 or the foreign substance analyzer 10 is used.
0 or the analysis capability of the analyzer 9 will be described. The device used in the present invention may perform organic analysis or inorganic analysis. In the case of performing organic analysis, the classification categories listed in Example 6 may be used as the organic substances or the groups constituting the organic substances.

[0026]

As a result of the practice of the present invention, the distribution of foreign matter on the wafer and the components of each foreign matter can be seen at a glance. The shapes of jigs, devices, etc. can be estimated from the distribution of foreign matter. In addition, it is now possible to easily analyze the materials and materials used in jigs, equipment, processes, etc. that are sources of dust from foreign matter components. For this reason, the work of analyzing the foreign matter generation source is much easier than in the past, and the foreign matter level of the manufacturing line can be lowered and the product yield can be improved.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of the present invention.

FIG. 2 is a diagram showing an alternative of FIG.

FIG. 3 is a diagram showing an alternative of FIG.

FIG. 4 is a diagram showing a format of a data table 15.

5 is a diagram showing a format of a coordinate data table 21. FIG.

FIG. 6 is a diagram showing a format of an analysis data table.

FIG. 7 is a diagram showing an output example.

FIG. 8 is a diagram showing foreign matter detection points on a wafer.

[Explanation of symbols]

1 ... Inspection device 2 ... Analysis device 3 ... work station 4 ... Data transfer means 5 ... Data transfer means 6 ... Workstation 7 ... Data transfer means 8 ... Inspection device 9 ... Analysis device 10 ... Workstation 11 ... Data transfer means 12 ... Data transfer means 14 ... Data transfer means 15 ... Data table 16 ... Foreign object coordinate data 17 ... Foreign substance analysis data 18 ... Foreign substance ID 19 ... Supplementary information 20 ... Wafer identifier 21 ... Coordinate data table 22 ... Wafer identifier 23 ... Foreign matter ID 24 ... Foreign matter coordinate data 25 ... Attached information 26 ... Analysis data table 27 ... Wafer identifier 27 ... Foreign matter ID 29 ... Foreign matter analysis data 30 ... Plot showing foreign matter 100 ... Foreign matter analyzer 200 ... Display means

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[Procedure amendment]

[Submission date] October 2, 2002 (2002.10.
2)

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Title of invention

[Correction method] Change

[Correction content]

Title: Inspection system and method for manufacturing electronic device

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Correction content]

[Claims]

Claims (7)

[Claims] 1. A step of processing a wafer, a step of detecting a defect on the appearance of the wafer, and a step of detecting the appearance defect by using position information on the wafer of the appearance defect obtained by the detection. A step of obtaining detailed information of the defect and a display together with information for identifying the wafer in correspondence with the position information on the wafer of the external defect obtained by detecting the detailed information of the external defect A method of manufacturing an electronic device, the method including: a step of performing SEM analysis of the detected appearance defect to obtain the detailed information;
A method of manufacturing an electronic device, characterized in that information obtained by analysis by EM is displayed as a symbol together with information on the position of the defect on the appearance. 2. A step of processing a wafer, a step of detecting a defect on the appearance of the wafer, and a step of detecting a defect on the appearance of the wafer by using position information of the defect on the appearance obtained on the wafer. A step of obtaining detailed information of the defect and a display together with information for identifying the wafer in correspondence with the position information on the wafer of the external defect obtained by detecting the detailed information of the external defect And a detailed step of displaying detailed information of the defect on the screen in correspondence with the position of the defect on the wafer, and displaying the symbol on the screen. 3. The defect according to claim 1, wherein the appearance defect is classified into a predetermined category and displayed, and when there is a defect belonging to a plurality of categories, one of them is displayed. Item 2. A method for manufacturing an electronic device according to Item 2. 4. A step of processing a wafer, a step of detecting a defect on the appearance of the wafer, and a step of detecting the appearance defect by using position information on the wafer of the appearance defect obtained by the detection. A step of obtaining detailed information of the defect and a display together with information for identifying the wafer in correspondence with the position information on the wafer of the external defect obtained by detecting the detailed information of the external defect And a step of classifying and displaying detailed information of the appearance defect in a plurality of categories and displaying the detailed information. 5. If there is a defect belonging to the plurality of categories, one of them is displayed.
A method for manufacturing the electronic device described. 6. A step of processing a wafer, a step of inspecting the processed wafer, a step of analyzing the wafer using coordinate data included in the inspection result obtained by the inspection, and a step of performing the analysis. And a step of displaying the information of the obtained analysis result in correspondence with the coordinate data included in the inspection result together with the information for identifying the wafer, and manufacturing the electronic device. 7. The analysis result information is classified into a predetermined category and displayed, and if there is analysis result information belonging to a plurality of categories, one of them is displayed. 6. The method for manufacturing an electronic device according to 6.