JP2003133108A - Method of manufacturing electronic part and burnout resin for use therein - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing electronic parts and a burnout resin paste for use therein whereby preventing a sag or flow of a film material to be formed using a thick paste in the manufacture of various electronic parts, and improving a yield of production substantially. SOLUTION: The method for manufacturing electronic parts having an insulating substrate and a film member formed by printing and baking a thick film paste thereon comprises the steps of: (a) forming a dam by printing and drying a burnout resin paste in a portion which includes a region where a sag and flow may occur at the time of forming the film member using the thick film paste, and which does not impair the printing of the thick film paste; (b) printing the thick film paste, then drying the same; and (c) baking a dried paste product formed in the step (b) to obtain the film member, and evaporating the dam formed in the step (a).

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to glass powder and / or
Alternatively, the present invention relates to a method for manufacturing electronic components such as capacitor elements, inductor elements, resistors, fuses, and various integrated circuits, which are provided with various film members formed of thick film paste containing metal powder, and materials used for the method.

[0002]

2. Description of the Related Art Conventionally, in the manufacture of electronic parts, electrodes,
There is known a method of forming a film member made of a conductor film member such as a circuit pattern, a resistance element film, a fuse element film, and a protective film member such as a glass film on an insulating substrate by screen printing using a thick film paste. There is. The thick film paste used for manufacturing the electronic component usually includes glass powder and / or metal powder, a resin binder, a dispersant, and a solvent. In particular, a thick film paste containing glass powder and metal powder or containing metal powder may be referred to as metal glaze. The paste is printed, then dried and fired to remove the solvent, the resin binder and the dispersant, thereby forming a film member substantially made of metal and / or glass. Such a film member is formed of a single layer or multiple layers. In the technique of forming the thick film paste by printing, it has become possible to form a desired film member with excellent accuracy due to recent developments in printing techniques. But,
Since the thick film paste contains glass powder and / or metal powder, paste sag or flow may occur during printing or before drying. Currently, such problems have not been completely solved. . In particular, with the recent miniaturization and high integration of electronic parts, and with the strict demand for finish accuracy of appearance, complex pattern parts, fine corners and curved parts, and vertically and horizontally separable parts are formed. In the slit groove and the like of the collective insulating substrate having the V-shaped slit groove, the frequency of occurrence of such paste sag and flow tends to increase.

The dripping and flow of the paste may occur to some extent at the edge of the paste printing section. A portion where such sagging or flow is likely to occur will be described below with reference to the drawings. FIG. 4 shows the state of sagging and flow generated when the front electrode 42 is formed by a thick film paste on the collective insulating substrate 40 provided with slit grooves (41a, 41b) formed so as to be vertically and horizontally separable. It is a partially expanded state figure. In FIG. 4, when the separation distance between the adjacent front electrodes 42 facing the slit groove 41a is reduced, the front electrodes 4
The thick film paste for forming No. 2 drops or flows on the illustrated portion of the slit groove 41a during printing or before drying.
3 may occur. Further, FIG. 5 shows that when the back electrode 52 is formed by the thick film paste so as to straddle the slit groove 51b on the collective insulating substrate 50 in which the slit grooves (51a, 51b) formed so as to be vertically and horizontally separable are provided. It is a partially expanded state view which shows the state of the sagging and flow which arose. In FIG. 5, the thick film paste for forming the back electrode 52 may cause sagging or flow 53 in the illustrated portion of the slit groove 51b during printing or before drying.
Further, FIG. 6 is an explanatory state diagram of a resistor showing a state of sagging or flow that occurs when the front electrode 61 and the resistance pattern 62 are formed on the insulating substrate 60 by the thick film paste. In FIG. 6, the thick film paste for forming the resistance pattern 62 may cause sagging or flow 63 in the illustrated portion during printing or before drying. Conventionally, when the sag or flow of the thick film paste as described above occurs,
Since the work of removing these is extremely complicated, it is actually treated as a defective product and difficult to reuse,
If the occurrence rate becomes high, there arises a problem that the yield in manufacturing electronic components deteriorates.

Therefore, in order to prevent such sagging and flow, a filling member such as an insulating glass material or a resin material is filled in the slit groove, and after the resistance film is formed, the filling member is etched. A method of manufacturing a rectangular chip resistor to be removed is proposed (Japanese Patent Laid-Open No. 5-24302).
No. 2). However, in the above method, since the filling member filled in the slit groove is removed by the etching process, it is necessary to perform the etching process in addition to the filling member filling process, and there is a problem that the process becomes complicated. Moreover, such an etching process requires strict control and the like in a complicated pattern portion and the like, which is very difficult to carry out. Therefore, in reality, the use of the filling member in the above method can be applied only to the filling portion of the slit groove.

[0005]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to easily prevent sagging or flow that occurs when forming a film member formed of a thick film paste in the production of various electronic parts, and to prevent the sag or flow. An object of the present invention is to provide an electronic component manufacturing method capable of minimizing the increase in the number of steps required to prevent the above, and significantly improving the manufacturing rate. Another object of the present invention is to be able to finely finish the edge of a film member formed of a thick film paste in the production of various electronic parts by a simple process,
An object of the present invention is to provide a method for manufacturing an electronic component that enables easy high integration. Another object of the present invention is to provide a burnout resin paste which has printability and which disappears by baking after drying and at a predetermined temperature or more in order to easily achieve the object of the above-mentioned manufacturing method. .

[0006]

Means for Solving the Problems The inventors of the present invention have made extensive studies to solve the above problems. First, as a method for easily preventing sagging or flow of a thick film paste that occurs when forming a film member of an electronic component, before forming the thick film paste, a portion including at least a portion where the sag and flow of the paste may occur is formed. A method for easily forming the weir portion and easily removing the weir portion in a small number of steps was examined. Then, the present inventors have found that the thick film paste forming the film member has a solvent, a resin binder, and a dispersant in the paste completely disappeared due to the firing profile after printing, so that the metal and / or glass is substantially dissolved. Focusing on the formation of a film member made of, the thick film paste component excluding the metal powder and / or the glass powder was focused and studied. As a result, the solvent, the resin binder and the dispersant constituting the thick film paste are appropriately selected, and the resin paste having the adjusted printability is suitable for forming the dam portion, and in addition, such a resin paste is The present invention has been completed by finding that the thick film paste disappears as the firing profile is executed, and acts as a burnout resin paste that does not require a special step for removing the weir. Further, they have also found that by mixing a specific organic pigment with the burnout resin paste, it becomes easy to control the shape of the weir.

That is, according to the present invention, there is provided a method of manufacturing an electronic component, which comprises at least an insulating substrate and a film member formed by printing and firing a thick film paste containing glass powder and / or metal powder. The burnout resin paste is printed and dried at a desired portion including a portion where sagging and a flow may occur when forming a film member by the film paste and which does not hinder the printing of the thick film paste. Forming step (a), and after forming the film member after the step (a), printing the thick film paste, drying step (b), and drying the paste obtained in step (b) A method for manufacturing an electronic component is provided, which includes a step (c) of firing an object to form the film member and eliminating the dam portion formed in the step (a). According to the invention,
A burnout resin paste used in the above manufacturing method, which contains a resin and a solvent, and optionally a dispersant and an organic pigment, and has a printable viscosity, and after printing, drying and firing at a predetermined temperature or higher. A burnout resin paste is provided which is characterized by disappearance.

[0008]

The present invention will be described in more detail below. The electronic component manufactured by the manufacturing method of the present invention is not particularly limited as long as it includes at least an insulating substrate and a film member obtained by printing and firing a thick film paste containing glass powder and / or metal powder. Examples of the electronic component include a capacitor element, an inductor element, a resistor, a fuse, and various integrated circuits. Further, as the film member, for example, an electrode, a circuit pattern, a resistive element film,
Examples thereof include a conductive film member such as a fuse element film and a protective film member such as a glass film.

According to the manufacturing method of the present invention, the burnout resin paste is included in a desired portion including a portion where sagging and flow may occur at the time of forming the film member by the thick film paste and which does not hinder the printing of the thick film paste. The method includes a step (a) of printing, drying, and forming a sag and a flow prevention weir. In the step (a), the location where sagging and flow may occur when forming the film member of the thick film paste means at least a part or all of the location along the edge of the thick film paste printed portion on the insulating substrate or the like. To do. Further, the desired portion that does not hinder the printing of the thick film paste means a part or all of the portion on the insulating substrate or the like excluding the portion where the thick film paste is printed.

The burn-out resin paste used in the step (a) is capable of forming a sag and a sag and a flow-preventing dam portion which have a function of damaging the sag and flow of the thick film paste by printing and drying. Any resin paste that disappears by firing in step (c) described below may be used. That is,
The burnout resin paste contains a resin and a solvent,
In addition, it has a printable viscosity and disappears when it is printed and dried and then fired at a predetermined temperature or higher, and does not include non-erasable components such as metal powder and glass powder.

Basically, the components contained in the burnout resin paste, such as the resin and the solvent, are basically selected such that they can disappear according to the conditions of the firing profile when firing the film member formed by the thick film paste. Can be determined by The simplest selection includes, but is not limited to, a method of selecting from a resin binder, a solvent, a resin and a solvent of the same type as the dispersant contained in the thick film paste to be used, and a dispersant if necessary. The respective compounding ratios of the selected resin, solvent and dispersant can be appropriately determined so as to obtain a printable viscosity. At this time, the burnout resin paste is different from the thick film paste.
Since it does not contain glass powder and / or metal powder, it is easy to adjust the viscosity, and it is not always necessary to add a dispersant, and a desired paste can be easily manufactured.
The viscosity can be adjusted by appropriately selecting the composition of the resin and the solvent and the like in consideration of various conditions such as the type of printing machine and the thickness of the dam to be formed. As described above, the types of the resin and the solvent as the components of the burnout resin paste in the present invention, the types of the dispersant to be contained as necessary, and the mixing ratios thereof are the film members formed by the thick film paste. The composition can be appropriately selected according to the type and the like, and is not limited to a specific composition.

Various additives may be added to the burnout resin paste within a range that does not impair the desired effects of the present invention and to obtain other effects.
For example, when the burnout resin paste is colored, and when the paste is printed and dried, an organic pigment or the like may be added so that the inspection of the printed portion and the formed dam portion can be easily controlled with good visibility. it can. The organic pigment is not particularly limited as long as it prints the burnout resin paste, can color the dam portion formed by drying, and can be eliminated by firing in the step (c) described later, for example, blue and red. It is preferable to use an organic pigment that exhibits a yellow color. Specifically, for example, it is preferable to use an organic pigment selected from the group consisting of phthalocyan series, polyazo series, monoazo series, watching manganese red, naphthol, quinagridone, berylene, and mixtures thereof. The blending ratio of the organic pigment can be appropriately selected according to the type of the burnout resin paste, the type of the organic pigment, and the like in consideration of its action.

In the step (a), the printing and drying of the burnout resin paste can be carried out by the usual drying such as screen printing at about 100 to 200 ° C. By this drying, the solvent in the burnout resin paste usually disappears, and a sag and a flow prevention dam portion are formed. The printing conditions can be appropriately selected according to the printing pattern, the printing thickness, the type of paste, and the like. The important point is that the thickness of the dried product of the burnout resin paste, that is, the weir portion, is thick film paste printing so that the weir portion formed in this printing and drying can prevent sagging and flow of the thick film paste. It is preferable to perform printing so that the thickness is equal to or greater than the printing thickness at that time. At this time, printing and drying may be performed once at the same location, or may be repeated a plurality of times when the dam portion to be formed is thickened.

In the manufacturing method of the present invention, after the step (a), a step (b) of printing and drying a thick film paste is performed in forming the film member. The thick film paste used in the step (b) is usually particularly limited as long as it can be used as a raw material for various film members including glass powder and / or metal powder, a resin binder, a dispersant, and a solvent. Instead, it can be appropriately selected and used according to the type of film member to be formed.

Printing the thick film paste in step (b),
Drying is usually performed at 100 to 100 by a known screen printing method or the like.
It can be carried out by drying at about 200 ° C. The printing conditions can be appropriately selected according to the printing pattern, the printing thickness, the type of paste, and the like. At this time, the dam portion formed in the step (a) can sufficiently prevent the thick film paste from sagging and flowing before printing or before drying. Also,
Even if the printing of the thick film paste is displaced on the surface of a part of the weir, the thickness will be very thin, which will interfere with the electronic components obtained by firing in step (c) described later. It rarely survives to such an extent. Therefore, the formation of the dam portion also facilitates management during thick film paste printing. Further, by forming the dam portion in the step (a) along the edge of the thick film paste printing portion, it is possible to achieve finer edges of the film member formed by the thick film paste, and, It is also possible to control the width of the film member formed by the thick film paste to a desired width. The printing and drying of the thick film paste may be performed once at the same location, or may be repeated multiple times to form a multilayer structure for adjusting the thickness.

In the manufacturing method of the present invention, a step (c) in which the dried paste obtained in the step (b) is fired to form a desired film member and the dam portion formed in the step (a) disappears. I do. Firing in step (c) can be performed according to the firing profile of the thick film paste printed and dried in step (b), and its peak temperature is usually 400 to 900 ° C, preferably 600 to 850 ° C. However, the present invention is not limited to this as long as the thick film paste can be fired and the dam portion can be eliminated. The firing atmosphere may be an atmosphere such that the thick film paste can be fired and the weir can be lost, or an oxidizing atmosphere including an oxygen supply and exhaust system. Further, the firing furnace is not particularly limited as long as it is a firing furnace that enables decomposition and combustion in which the resin components and the like in the thick film paste and the dam portion are not carbonized and remain. In the manufacturing method of the present invention, by firing in one step by this step (c), a desired film member without sagging or flow can be formed on an insulating substrate or the like, and the weir portion formed in step (a) is completely formed. Can be made to disappear.

In the manufacturing method of the present invention, the above-mentioned steps
(a) ~ (c) can usually be repeated every time the same kind of film member is formed in an electronic component, etc.
When the firing profile conditions in (c) are the same, it is possible to perform step (c) after repeatedly performing steps (a) and (b) in forming different film members. In the electronic component obtained by the manufacturing method of the present invention, the steps other than the above steps (a) to (c) can be appropriately performed by a known method or the like depending on the type of the electronic component.

[0018]

Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited thereto. 1 (A) and 1 (B) show an assembly insulating substrate 10 provided with slit grooves (11a, 11b) formed so as to be vertically and horizontally separable, each front electrode 12 serving as a film member by the manufacturing method of the present invention. FIG. 7A is a partially enlarged explanatory view for explaining a step of forming as close to each other as possible, and the step will be described below.

In FIG. 1A, first, before printing the thick film paste for forming the front electrode 12 on the substrate 10, there is a high possibility that the thick film paste sags and flows. The burnout resin paste is screen-printed on a portion (13) shown in the figure including the intersection of 11a and 11b and the edge of the front electrode 12 parallel to the slit groove 11a. At this time, as the burnout resin paste, diethylene glycol monobutyl acetate 70 to 80% by mass, ethyl cellulose 10 to 15% by mass, maleic anhydride resin 5 to 15% by mass, amide resin less than 5% by mass,
A paste consisting of less than 1% by weight of organic pigment was used. Further, the interval between the front electrodes 12 to be formed can be controlled by adjusting the print width of the burnout resin paste. Then, the printed burnout resin paste is dried to form each dam 13 having a thickness equal to or greater than the thickness of the thick film paste printed in the next step. The formed weir portion 13 is colored with an organic pigment, and the weir formation position and the presence / absence of defects thereof can be visually and easily managed. At this time, if a defect occurs, the dam portion 13 can be easily removed by firing or the like, so that the substrate can be reused very easily. Then
The front electrode 12 is printed using a thick film paste for electrodes and dried. In the steps up to this point, the sagging and flow of the thick film paste shown in FIG. 4 can be completely prevented.

Next, the substrate shown in FIG. 1A is introduced into a firing furnace in an oxidizing atmosphere and fired according to the firing profile of the thick film paste for forming the front electrode 12.
By this firing, as shown in FIG. 1 (B), each front electrode 12
Is finely baked without any sagging or traces of flow, and the weir 13 has completely disappeared, and the slit groove 11a
No trace of the dam portion 13 remains at the top or at the intersection of the slit grooves 11a and 11b. Further, this firing may be performed after dividing the collective insulating substrate 10 along the slit grooves.

In the example shown in FIG. 1, the burnout resin paste is included in the slit groove 1 including the intersections of the slit grooves.
The portion shown in the figure including the edge of the front electrode 12 parallel to 1a (1
3), but the burnout resin paste is printed only on the intersections of the slit grooves and the edge portions in contact with the front electrode 12 above and below the intersections. Can be prevented. Therefore, in the manufacturing method of the present invention, the burnout resin paste may be printed on only such a portion. Further, in the example of FIG. 1, the burnout resin is printed in a part of the slit groove 11a, but in the case of printing the part covering the entire slit groove 11a and dividing the collective insulating substrate 10 before the firing, It is possible to suppress burrs and chips on the split surface. Therefore, in such a case, a division surface with good finishing accuracy can be obtained, and the stabilization of the outer dimensions of the electronic component can be improved.

2 (A) and 2 (B) show a collective insulating substrate 20 provided with slit grooves (21a, 21b) formed so as to be vertically and horizontally separable by the manufacturing method of the present invention. It is a partially enlarged explanatory view for explaining the step of forming the back electrode 22, and the step will be described below.

In FIG. 2A, first, before printing the thick film paste for forming the back electrode 22 on the substrate 20, the thick film paste may be dripped and flow, and In order to keep the width of the back electrode 22 to be formed in a uniform fine state, a burnout resin is included in a portion (23) shown in the figure including a part of the slit groove 21a and along the edge of the back electrode 22 parallel to the slit groove 21b. Screen print the paste. Subsequently, the printed burnout resin paste is dried to form each dam portion 23 having a thickness equal to or greater than the thickness of the thick film paste printed in the next step. Next, the back electrode 22 is printed using a thick film paste for electrodes and dried. In the steps up to this point, the sagging and flow of the thick film paste shown in FIG. 5 can be completely prevented.

Next, the substrate shown in FIG. 2A is introduced into a firing furnace in an oxidizing atmosphere and fired according to the firing profile of the thick film paste for forming the back electrode 22.
As a result of this firing, as shown in FIG.
Is finely baked without any sagging or traces of flow, and the weir 23 has completely disappeared, and the slit groove 21a
Even on the upper side, the trace of the weir 23 does not remain. This firing may be performed after dividing the collective insulating substrate 20 along the slit grooves.

In the example shown in FIG. 2, the burnout resin paste is applied to the back electrode 22 parallel to the slit groove 21b.
Although it is printed on the portion (23) shown in the drawing along the edge of FIG. 5, by printing the burnout resin paste only around the intersection of the slit groove 21a and the edge of the back electrode 22, for example, as shown in FIG. Sag and flow can be prevented.
Therefore, in the manufacturing method of the present invention, the burnout resin paste may be printed on only such a portion. However, by printing the burnout resin paste at the position shown in FIG. 2, it is possible to prevent the formation position shift of the back electrode 22, and to achieve improvement in fineness at the edge of the back electrode 22. You can

FIGS. 3A and 3B are for explaining a process of forming a resistance pattern 32 as a film member on the insulating substrate 30 on which the front electrodes 31 facing each other are formed in advance by the manufacturing method of the present invention. It is an explanatory diagram, and the process will be described below.

In FIG. 3A, first, the resistance pattern 3
Before printing the thick film paste for forming No. 2, on the substrate 30 and the preformed front electrode 31 in order to prevent the thick film paste from sagging and flowing, and to realize the finer edges of the pattern. The burnout resin paste is screen-printed on the portion (33) shown in the figure. continue,
The printed burnout resin paste is dried to form a dam 33 having a thickness equal to or greater than the thickness of the thick film paste printed in the next step. Next, the resistance pattern 32 is printed using a thick film paste for a resistance film and dried. In the steps up to this point, the sagging and flow of the thick film paste shown in FIG. 6 can be completely prevented.

Next, the substrate shown in FIG. 3A is introduced into a firing furnace in an oxidizing atmosphere and fired according to the firing profile of the thick film paste for forming the resistance pattern 32. By this firing, as shown in FIG. 3 (B), the resistance pattern 32 is finely fired without any sagging or traces of flow, and the dam 33 is completely eliminated, and the front electrode previously formed is formed. Even on the part 31, the dam 33 can be eliminated without adversely affecting the electrode.

In the example of FIG. 3 described above, the burnout resin paste is printed so as to surround the entire edge of the resistance pattern to be formed. However, for example, only the portion where the sag and flow of the thick film paste shown in FIG. 6 occur. It is also possible to print a burnout resin paste.

By the way, when a film member having a complicated pattern having fine corners and the like as shown in FIG. 3A is formed by a thick film paste, when the thick film paste is printed, the paste is insulated. There is a possibility that the substrate may seep into the substrate and deteriorate the fineness of the formed pattern. To solve such a problem, for example, as shown in FIG.
It is preferable to print the burnout resin paste so as to surround the entire edge of the resistance pattern to be formed so as to provide the dam portion. It is possible to prevent such thick film paste from seeping in and form a fine resistance pattern. . Since such an action does not always occur only when forming a complicated pattern, a similar effect can be obtained by printing the burnout resin paste so as to surround the entire edge even when forming an electrode or a protective film. Can be obtained.

[0031]

The method of manufacturing an electronic component of the present invention comprises a step (a) of printing and drying a burnout resin paste at a desired location to form sag and a flow prevention weir, and a step after the step (a). ,
In forming the film member, the step (b) of printing and drying a thick film paste, and the paste dried product obtained in step (b) are fired to form the film member and also formed in step (a). Since it includes the step (c) of eliminating the weir, it is possible to easily prevent sagging and flow that occur during the formation of the film member formed by the thick film paste in the production of various electronic components, and significantly improve the production rate. be able to. Further, by selecting the formation location of the sag and the flow prevention weir, it is possible to improve the fineness at the edge of the film member,
It is also possible to control the deviation of the formation position of the film member and the like, and it is possible to easily achieve high integration. Furthermore, by adding an organic pigment to the burnout resin paste, the weir portion formed can be visually controlled, and defective products can be easily found. It can be reused.

The burnout resin paste of the present invention contains a resin and a solvent and has a printable viscosity.
Since it disappears by baking after drying to a predetermined temperature or higher, it is useful for easily achieving the production method of the present invention.

[Brief description of drawings]

1A and 1B are partially enlarged explanatory views for explaining a step of forming a front electrode on a collective insulating substrate provided with slit grooves by a manufacturing method of the present invention.

2 (A) and 2 (B) are partial enlarged explanatory views for explaining a step of forming a back electrode on a collective insulating substrate provided with slit grooves by a manufacturing method of the present invention.

3 (A) and 3 (B) are explanatory views for explaining a step of forming a resistance pattern on an insulating substrate having a front electrode formed thereon by a manufacturing method of the present invention.

FIG. 4 is a partially enlarged state diagram showing a state of sagging and flow generated when a front electrode is formed by a thick film paste on a collective insulating substrate provided with slit grooves.

FIG. 5 is a partially enlarged state diagram showing a state of sagging and flow generated when a back electrode is formed of a thick film paste on a collective insulating substrate provided with slit grooves.

FIG. 6 is an explanatory state diagram of a resistor showing a state of sagging and flow generated when a front electrode and a resistance pattern are formed on an insulating substrate with a thick film paste.

[Explanation of symbols]

10, 20, 30, 40, 50, 60: Insulating substrate 12, 31, 42, 61: front electrode 22, 52: back electrode 32, 62: resistance pattern 13, 23, 33: weir 43, 53, 63: Sagging and flow

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tatsuki Hirano             1-7-1 Shibuya, Yamato-shi, Kanagawa Kamayaden             Machine Co., Ltd. F term (reference) 2H113 AA01 AA03 AA04 BA09 BC00                       CA17 FA29                 5E032 BA04 BB01 CC06

Claims (3)

[Claims] 1. A method of manufacturing an electronic component, comprising at least an insulating substrate and a film member formed by printing and firing a thick film paste containing glass powder and / or metal powder, the film member comprising a thick film paste. The burnout resin paste is printed at a desired location including a location where sagging and flow may occur at the time of forming, and which does not hinder the printing of the thick film paste,
A step (a) of drying to form a sag and a flow prevention weir, and a step (b) of printing and drying the thick film paste in forming the film member after the step (a), (b) firing the paste dried product, to form the film member, and a step (c) of eliminating the weir portion formed in step (a) production of an electronic component characterized by including Method. 2. A burnout resin paste for use in the manufacturing method according to claim 1, comprising a resin and a solvent, having a printable viscosity, printing, drying, and then firing at a predetermined temperature or higher. Burnout resin paste characterized by disappearance. 3. The paste according to claim 2, further comprising an organic pigment as a colorant.