JP2003113320A5 - - Google Patents

Download PDF

Info

Publication number
JP2003113320A5
JP2003113320A5 JP2002183021A JP2002183021A JP2003113320A5 JP 2003113320 A5 JP2003113320 A5 JP 2003113320A5 JP 2002183021 A JP2002183021 A JP 2002183021A JP 2002183021 A JP2002183021 A JP 2002183021A JP 2003113320 A5 JP2003113320 A5 JP 2003113320A5
Authority
JP
Japan
Prior art keywords
resin composition
film
adhesive
less
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002183021A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003113320A (ja
JP4238525B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002183021A priority Critical patent/JP4238525B2/ja
Priority claimed from JP2002183021A external-priority patent/JP4238525B2/ja
Publication of JP2003113320A publication Critical patent/JP2003113320A/ja
Publication of JP2003113320A5 publication Critical patent/JP2003113320A5/ja
Application granted granted Critical
Publication of JP4238525B2 publication Critical patent/JP4238525B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002183021A 2001-07-06 2002-06-24 樹脂組成物、半導体装置用接着剤付きフィルム、金属箔付き積層フィルム及びそれを用いた半導体装置 Expired - Fee Related JP4238525B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002183021A JP4238525B2 (ja) 2001-07-06 2002-06-24 樹脂組成物、半導体装置用接着剤付きフィルム、金属箔付き積層フィルム及びそれを用いた半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-206071 2001-07-06
JP2001206071 2001-07-06
JP2002183021A JP4238525B2 (ja) 2001-07-06 2002-06-24 樹脂組成物、半導体装置用接着剤付きフィルム、金属箔付き積層フィルム及びそれを用いた半導体装置

Publications (3)

Publication Number Publication Date
JP2003113320A JP2003113320A (ja) 2003-04-18
JP2003113320A5 true JP2003113320A5 (enrdf_load_stackoverflow) 2005-10-20
JP4238525B2 JP4238525B2 (ja) 2009-03-18

Family

ID=26618273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002183021A Expired - Fee Related JP4238525B2 (ja) 2001-07-06 2002-06-24 樹脂組成物、半導体装置用接着剤付きフィルム、金属箔付き積層フィルム及びそれを用いた半導体装置

Country Status (1)

Country Link
JP (1) JP4238525B2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5013426B2 (ja) * 2007-12-25 2012-08-29 株式会社アドマテックス 硬化性樹脂組成物及びその製造方法並びに樹脂硬化物
WO2010050220A1 (ja) * 2008-10-30 2010-05-06 日東電工株式会社 有機－無機複合物およびその製造方法
KR101605221B1 (ko) * 2008-12-26 2016-03-21 도요보 가부시키가이샤 접착제용 수지 조성물, 이것을 함유하는 접착제, 접착 시트 및 이것을 접착층으로서 포함하는 프린트 배선판
JP5422836B2 (ja) * 2010-03-24 2014-02-19 平岡織染株式会社 発熱性透光シートおよび発熱性透光膜屋根構造物
JP5691244B2 (ja) * 2010-05-26 2015-04-01 日立化成株式会社 フィルム状接着剤、接着シート及び半導体装置
JP7593314B2 (ja) * 2019-06-26 2024-12-03 三菱瓦斯化学株式会社 レジンシート、金属箔張積層板、及びプリント配線板

Similar Documents

Publication Publication Date Title
CN101677072B (zh) 封装电子装置的方法
JP6495334B2 (ja) 封止フィルム
JP2016108556A5 (enrdf_load_stackoverflow)
KR102145757B1 (ko) 봉지 필름
JP2010077372A5 (enrdf_load_stackoverflow)
CN105247699A (zh) 包封薄膜和使用该包封薄膜包封有机电子装置的方法
JP2007536261A5 (enrdf_load_stackoverflow)
CN105121581A (zh) 粘合剂组合物、粘合剂膜以及使用其制备有机电子器件的方法
JP2023016887A5 (enrdf_load_stackoverflow)
JP2005503468A5 (enrdf_load_stackoverflow)
CN110710013B (zh) 封装膜
JP2019504783A5 (enrdf_load_stackoverflow)
TW200844203A (en) Adhesive film for semiconductor device and semiconductor device using same
CN112219291B (zh) 封装膜
JP2018009049A5 (enrdf_load_stackoverflow)
JP2003113320A5 (enrdf_load_stackoverflow)
JP2022103008A5 (enrdf_load_stackoverflow)
JP3617639B2 (ja) 半導体加工用シート、並びに、それを用いた半導体装置の製造方法及び半導体装置
CN112640144B (zh) 封装膜
CN110710012B (zh) 封装膜
CN204151284U (zh) 导热胶带
BR0307034A (pt) Adesivo de laminação curável por radiação, material de embalagem flexìvel laminado, embalagem flexìvel laminada, produto alimentìcio, farmacêutico, de bebida embalado, processo para ligar duas ou mais camadas de materiais de embalagem flexìveis
JP2010016383A5 (enrdf_load_stackoverflow)
JP7155395B2 (ja) 封止フィルム
CN113166492A (zh) 封装组合物