JP2003110051A - High-frequency packaging body and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-frequency packaging body that can arrange high-frequency modules at narrower intervals. SOLUTION: A mother board 30 is equipped with first and second dielectric layers 33 and 34. The first dielectric layer 33 has first layer board wires 31e and 31f, and an opening passing from the front to the back. The second dielectric layer 34 has second board wires 32a and 32g whose one portion is exposed to the opening, and is in contact with the back of the first dielectric layer 33 so that the other portion of the second layer board wires 32a and 32g is buried. A module board 2 allows a first main surface to face the front of the second dielectric layer 34, and is accommodated into the opening of the first dielectric layer 33. Bulk-like electrodes 6a and 6g are mounted onto the surface of the second board wires 32a and 32g. Second front wires 9h and 9e are connected to first layer board wires 31e and 31f by board-side connection members 35e and 35f.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency mounting body (secondary mounting body) in which a high-frequency module used in a base station for subscriber radios or the like is further mounted on a circuit board, and more particularly to a high-frequency mounting body for signal processing of an adaptive array antenna. The present invention relates to a high-frequency circuit in which the signal circuit of is arranged on a circuit board.

[0002]

2. Description of the Related Art In recent years, interest in multimedia communication has increased, and various infrastructures have been proposed. With regard to these wireless infrastructures, if the number of users increases in the future, there are concerns that the quality of products will be deteriorated due to the tightness of frequencies, the increase of interfering stations, and the influence of multipath. Therefore, from the viewpoints of effective use of frequency and improvement of communication quality, researches applying an antenna having variable directivity such as an adaptive array antenna has been attracting attention.
In the signal circuit of the high frequency part of these adaptive array antennas, a plurality of high frequency modules (primary mounting bodies) that perform signal processing corresponding to each element of the adaptive array antenna are arranged in parallel on a motherboard such as a circuit board (printed circuit board). This is the structure of the high frequency mounting body (secondary mounting body) mounted on. In each high-frequency module, in addition to a signal input / output port, a port for supplying power is usually formed on the same plane by a pad electrode or a ball-shaped electrode.

When these high-frequency modules are applied to the signal circuit of the adaptive array antenna, when the number of patch antenna elements increases, many high-frequency modules are mounted in parallel on the motherboard and the high-frequency package (2
Next implementation body) is configured. It is virtually impossible to assemble a plurality of signal lines and power supply systems for a large number of these high frequency modules on a single surface of the motherboard. Therefore, in general, a mother board is formed by a laminated board 30 in which signal lines, power supply systems, grounds, etc. are laminated as shown in FIG. 12, and through holes 91, 92 are used.
The layers 33 and 34 which are laminated are connected to each other. In FIG. 12, the motherboard is the first layer 3 of the motherboard.
3 and the second layer 34 of the motherboard. Normally, the mother board 30 on which a large number of module substrates 93 are arranged is formed of a laminated dielectric substrate or an epoxy-based substrate because of the size and cost of the substrate.

[0004]

However, as shown in FIG. 12, in the conventional high frequency mounting body (secondary mounting body), through holes 91, 92 having a diameter of about 0.3 mm are arranged on the motherboard 30. Must be secured, which requires a certain amount of extra area in comparison with the size of the module board 93 to be mounted.

In order to reduce the loss in the RF part,
The transmission line between the antenna element and the module substrate 93 is
It is necessary to connect as short a distance as possible. Therefore,
When the antenna elements are directly connected to the module substrate 93, it is ideal that the module substrates 93 are arranged at the same interval as the antenna elements. As the frequency of application increases, the spacing between antenna elements decreases. For example, in the case of a 25 GHz band half-wavelength adaptive array antenna, the distance between the antenna elements is about 6 mm.
By arranging 3 as close as possible to this distance, the transmission line length between the antenna and the module can be shortened.

However, in the conventional high-frequency mounting body (secondary mounting body) shown in FIG. 12, it is necessary to secure an area of the module substrate 93 and an area necessary for forming the through holes 91 and 62 on the mother board 30. However, it is difficult to reduce the interval at which the module substrates 93 are arranged.

As described above, in the structure of the conventional high frequency mounting body (secondary mounting body) in this type of signal circuit, it is necessary to secure a certain area on the motherboard 30 for forming the through holes 91 and 92. Therefore, there is a drawback that the interval between the module substrates 93 cannot be narrowed, the transmission line length becomes long, and the loss increases.

In view of the above-mentioned problems, it is an object of the present invention to provide a high frequency mounting body in which high frequency modules can be arranged at narrower intervals and a mounting method thereof.

[0009]

In order to achieve the above object, a first feature of the present invention is that (a) a first layer board wiring is provided on the front surface and an opening penetrating from the front surface to the back surface. A first dielectric layer, a second layer board wiring part of which is exposed in the opening, is formed on the surface, and the other part of the second layer board wiring is embedded to contact the back surface of the first dielectric layer. A circuit board having a dielectric layer; (b) having a first main surface and a second main surface facing the first main surface, with the second main surface facing the surface of the second dielectric layer; A module substrate housed in the opening of the first dielectric layer; (c) a first main surface disposed first surface.
Surface wiring; (d) second surface wiring arranged on the second main surface; (e) interlayer connection portion connecting the first and second surface wirings to each other through a through hole penetrating the inside of the module substrate; To) a bulk-like electrode for electrically connecting the second surface wiring and the second layer board wiring; (g) a wire or strip-shaped board side connection for electrically connecting the first surface wiring and the first layer board wiring A high-frequency package including a member; (h) a semiconductor chip mounted on the first main surface; and (b) a chip-side connecting member that connects the semiconductor element mounted on the semiconductor chip and the first surface wiring. That is the summary. A typical example of the “bulk-shaped electrode” is a ball-shaped electrode such as a solder ball, but it is not limited to a ball-shaped electrode and may be a columnar shape, a prismatic shape, a rectangular parallelepiped or the like. The module substrate is made of alumina (Al
A substrate such as ₂ O ₃ ) or aluminum nitride (AlN) having a high dielectric constant and a high thermal conductivity and capable of fine processing is preferable.

The "line-shaped or strip-shaped board-side connecting member" corresponds to a bonding wire or bonding ribbon of gold (Au) or aluminum (Al). The circuit board according to the first feature of the present invention is not limited to the two-layer board including the first and second dielectric layers, but may be provided under the second dielectric layer and further with the third dielectric layer. Of course, the case where the body layer, the fourth dielectric layer, the fifth dielectric layer, ... Are provided is also included. Further, another dielectric layer having a second opening larger than the opening of the first dielectric layer may be provided on the first dielectric layer. Further, embedded wiring layers may be formed between the second dielectric layer and the third dielectric layer, between the third dielectric layer and the fourth dielectric layer, and the like.

According to the first feature of the present invention, the number of large through holes having a diameter of 0.3 mm formed on the mother board is reduced by forming through holes having a fine diameter in the microfabricated module substrate. Therefore, it is possible to arrange a plurality of module substrates at narrower intervals.

A second feature of the present invention is: (a) a first dielectric layer having a first-layer board wiring on the surface and having an opening penetrating from the front surface to the back surface; A circuit board having a two-layer board wiring on the front surface and a second dielectric layer in contact with the back surface of the first dielectric layer by embedding another part of the second layer board wiring; Main surface and this first
A module substrate having a second main surface facing the main surface, the first main surface facing the surface of the second dielectric layer, and the module substrate housed in the opening of the first dielectric layer; First surface wiring arranged on the main surface; (d) Second surface arranged on the second main surface
Surface wiring; (e) An interlayer connecting portion connecting the first and second surface wirings to each other through a through hole penetrating the inside of the module substrate; (f) Electrically connecting the first surface wiring and the second layer board wiring. A bulk-shaped electrode connected to the substrate; (g) a wire-side or strip-shaped board-side connecting member that electrically connects the second surface wiring and the first-layer board wiring; (h) a semiconductor chip mounted on the first main surface; (B) The gist is that it is a high-frequency package including a chip-side connecting member that connects the semiconductor element mounted on the semiconductor chip and the first surface wiring.
As described in the first feature, the "bulk-shaped electrode" can adopt various geometric shapes such as a ball shape, a column shape, a prism shape, and a rectangular parallelepiped. By forming through holes having a fine diameter in the microfabricated module substrate, it is possible to reduce the number of large through holes formed in the mother board, and it is possible to arrange a plurality of module substrates at narrower intervals. Similar to the first feature, the circuit board according to the second feature is not limited to the two-layer substrate including the first and second dielectric layers, and the circuit board under the second dielectric layer may further include A third dielectric layer, a fourth dielectric layer, a fifth dielectric layer, ... May be provided, which is larger than the opening of the first dielectric layer on the first dielectric layer. Another dielectric layer having the second opening may be provided. Further, embedded wiring layers may be formed between the second dielectric layer and the third dielectric layer, between the third dielectric layer and the fourth dielectric layer, and the like.

In the first and second features of the present invention, the second layer board wiring can be a high frequency signal line.
For example, a microstrip line or a coplanar line may be formed between the high frequency signal line and the ground plate on the back surface of the second dielectric layer. Further, in the first and second features of the present invention, it is possible to further have a high frequency circuit component on the surface of the first dielectric layer or between the first dielectric layer and the second dielectric layer. "High-frequency circuit components"
Includes a patch antenna element and the like.

The third feature of the present invention is that (a) the first surface
A first dielectric layer having a layer board wiring and having an opening penetrating from the front surface to the back surface, and a second layer board wiring partially exposed in the opening portion on the surface, and other second layer board wiring A circuit board having a second dielectric layer that is in contact with the back surface of the first dielectric layer by embedding a part of the first dielectric layer; (b) a first surface wiring on the first main surface and a second main surface on the second main surface. A step of forming a second surface wiring and preparing a module substrate having an interlayer connecting portion for connecting the first and second surface wirings to each other through a through hole; (c) mounting a semiconductor chip on the first main surface; A step of connecting the semiconductor element mounted on the semiconductor chip and the first surface wiring with a chip-side connecting member; (d) second
A step of mounting the bulky electrode on the layer board wiring; (e) a step of connecting the second surface wiring to the bulky electrode and housing and fixing the module substrate in the opening; (f) the first surface wiring and the first surface wiring It is a gist of the present invention to provide a mounting method of a high frequency mounting body including a step of electrically connecting to a one-layer board wiring.
Similar to the first and second characteristics, the circuit board according to the third characteristic is not limited to the two-layer board including the first and second dielectric layers, but may be provided under the second dielectric layer. , And may further include a third dielectric layer, a fourth dielectric layer, a fifth dielectric layer, ..., And the like. Above the first dielectric layer, from the opening of the first dielectric layer. May also include another dielectric layer having a larger second opening. Further, embedded wiring layers may be formed between the second dielectric layer and the third dielectric layer, between the third dielectric layer and the fourth dielectric layer, and the like.

The fourth feature of the present invention is that (a) the first surface
A first dielectric layer having a layer board wiring and having an opening penetrating from the front surface to the back surface, and a second layer board wiring partially exposed in the opening portion on the surface, and other second layer board wiring A circuit board having a second dielectric layer that is in contact with the back surface of the first dielectric layer by embedding a part of the first dielectric layer; (b) a first surface wiring on the first main surface and a second main surface on the second main surface. A step of forming a second surface wiring and preparing a module substrate having an interlayer connecting portion for connecting the first and second surface wirings to each other through a through hole; (c) mounting a semiconductor chip on the first main surface; A step of connecting the semiconductor element mounted on the semiconductor chip and the first end of the first surface wiring with a chip side connecting member; (d) a step of mounting a bulk electrode on the second layer board wiring; ) While connecting the second end of the first surface wiring to the bulk electrode, And summarized in that a (f) how to implement the high-frequency mounting body and a step of electrically connecting the second surface wiring and the first layer board line; the step of housing the module substrate to the mouth portion fixing. Similar to the first to third characteristics, the circuit board according to the fourth characteristic is not limited to the two-layer board including the first and second dielectric layers.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, first to fifth embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the plane dimension, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, the specific thickness and dimensions should be determined in consideration of the following description. Also, it is needless to say that the drawings include portions having different dimensional relationships and ratios.

(First Embodiment) FIG. 1A is a plan view of the high-frequency module (primary mounting body) according to the first embodiment of the present invention viewed from the first surface side, FIG. (B) is the second
It is the top view seen from the surface side. FIG. 2A is A- of FIG.
FIG. 2B viewed from the A direction is a cross-sectional view viewed from the BB direction in FIG. 1. As shown in FIGS. 1 and 2, the high frequency module according to the first embodiment has a semiconductor chip 1 mounted on a module substrate 2. A semiconductor element such as a field effect transistor is mounted on the semiconductor chip 1. The module substrate 2 has a first main surface and a second main surface facing the first main surface. Here, the semiconductor chip 1 is mounted on the first main surface of the module substrate 2 and is fixed by using gold-tin solder 12.
On the first main surface of the module substrate 2, the first surface wiring 3
a, 3b, ..., 3h, 4a, 4b, ..., 4h, ...
Are arranged, and second front surface wirings (rear surface wirings) 9a, 9b, ..., 9h, ... Are arranged on the second main surface. The backside wirings 9a, 9b, ..., 9h ,. As shown in FIG. 2B, through holes 5a, 5b, ..., 5h ,. The first surface wirings 4a, 4b, ..., 4h, ... And the second surface wirings are provided through the through holes 5a, 5b ,. , 9h, ... Are connected to each other. The semiconductor elements mounted on the semiconductor chip 1 and the first surface wirings 3a, 3b, ..., 3h,
, 4h, ... Chip-side connecting members (bonding wires) 8a, 8b ,.
, 8p are connected.

Further, the semiconductor chip 1 is sealed with a sealing resin 13 as shown in FIG. Also, FIG. 1 (a)
, The first surface wirings 3a, 3b, ..., 3
h, 4a, 4b, ..., 4h, ... are chip components such as ball-shaped electrodes 6a, 6b ,. 21a, 21b, 21c, 21d,
... is also installed.

For example, as the semiconductor chip 1, 150 μm
A GaAs chip that has been thinly polished to some extent and a field effect transistor or the like is used as a semiconductor element. Semiconductor chip 1
A back surface electrode 11 is formed on the back surface of with a metal film. The semiconductor chip 1 is mounted on the module substrate 2 by using gold tin solder or silver paste 12 and the bonding wires 8a, 8b, ..., 8p are used to form the surface wirings 3a, 3b of the chip 1 and the module substrate 2.・ ・ ・ ・ ・ ・ ・ ・ 、 3h 、 ・ ・ ・
・ ・ Connect with. The sealing resin 13 is made of epoxy or the like and has a substantially uniform thickness and ball-shaped electrodes 6a, 6b ,.
6l, ... covers the entire semiconductor chip 1 with a lower height. In FIG. 2, the sealing resin 13 has a structure that covers only the semiconductor chip 1, but the ball-shaped electrodes 6a, 6b ,.
6l, ... Chip parts 21a, 21b, except the part
The structure may cover almost the entire surface of the module substrate 2 including 21c, 21d, ....

The module substrate 2 is formed of an alumina (Al ₂ O ₃ ) substrate having a thickness of 200 μm. Surface wirings 3a, 3b, ..., 3 on the first main surface of the module substrate 2
h, ..., Through-hole connection wiring 4a, 4b ,.
4h, ..., Backside wirings 9a, 9b, ..., 9h, ... On the second main surface of the module substrate 2, and through holes 5a, 5b ,. , 5h, ... The inner wall metal is
It is made of a material such as titanium (Ti) / nickel (Ni) / gold (Au) having a thickness of about 0.1 μm to 5 μm. Back wiring 9a, 9b, ..., 9h, ... on the second main surface
Is a metal film (through hole inner wall metal) formed on the inner walls of the through holes 5a, 5b, ..., 5h ,. ,·····age,
First main surface through-hole connection wiring 4a, 4b, ...,
4h, ... In addition, through hole 5
a, 5b, ..., 5h, ... Are completely embedded into a plug shape, and the interlayer connection parts 55a, 55b ,.
... may be configured.

On the first main surface, the through-hole connecting wirings 4a, 4b, 4c, 4d, 4e, 4h, ... Are respectively bonded by bonding wires (chip side connecting members) 8
Bonding pads 7c, 7d, 7f, 7g, 7k, 7l, 7n, 7o arranged around the semiconductor chip 1 via c, 8d, 8f, 8g, 8k, 8l, 8n, 8o.
It is connected to the.

FIG. 3 shows a cross section of a high-frequency mounting body (secondary mounting body) in which the high-frequency module (primary mounting body) described above is mounted on a mother board (circuit board) 30. The motherboard 30 has a first dielectric layer (motherboard first layer) 3
3 and a second dielectric layer (motherboard second layer) 34. The first dielectric layer (motherboard first layer) 33 has a first layer board wiring 31e, ...
.., 31f, .. Further, the first dielectric layer (motherboard first layer) 33 has an opening penetrating from the front surface to the back surface. This opening is slightly larger than the size of the module substrate 2. The second dielectric layer (motherboard second layer) 34 has second layer board wirings 32a, ..., 32g ,. The second dielectric layer (motherboard second layer) 34
, Is in contact with the back surface of the first dielectric layer (motherboard first layer) 33 so as to embed other parts of the second layer board wirings 32a, ..., 32g ,. .

In the module substrate 2, the first main surface faces the surface of the second dielectric layer (motherboard second layer) 34, and the first
It is housed in the opening of the dielectric layer (motherboard first layer) 33. Then, the bulk electrodes (ball electrodes) 6a, 6
The second layer board wirings 32a, ...
..., 32g, ... mounted on the surface. The module substrate 2 is housed and mounted in the opening of the first dielectric layer (motherboard first layer) 33. As a result, as shown in FIG. 3, the first surface wirings 3a, 3b ,.
..., and the second layer board wiring 32a, ..., 32g,
... and bulk-shaped electrodes (ball-shaped electrodes) 6a, 6b, ...
.., 6l, ..

On the other hand, rear surface wiring (second surface wiring) 9a, 9b, ... Formed on the second surface of the module substrate 2
9h, ... are first-layer board wirings 31e, ..., 31f, ..
And a board-side connecting member (bonding wire) 35e,
.., 35f, ..

When the above-mentioned configuration is adopted, the first layer board wiring 31 arranged on the surface of the mother board first layer 33.
31f, ..., and the second layer 34 of the motherboard
Second layer board wiring 32a formed on the surface of the
Through-holes 5a, 5b, ... Of the module substrate 2 capable of finely processing the interlayer connection between 32g ,.
., 5h, ..., so that the extra area around the module substrate 2 can be reduced, and the module substrate 2
Can be arranged at narrower intervals (pitch).

The high frequency mounting body according to the first embodiment of the present invention can be mounted by the following procedure: (a) First, the first layer board wiring 31e ,. ，
A first dielectric layer (motherboard first layer) 33 having openings 31f ,.
Second layer board wiring 32a, a part of which is exposed in the opening, ...
, 32g, ..., On the surface, the other part of the second layer board wiring 32a ,. A circuit board having a second dielectric layer (motherboard second layer) 34 in contact with the back surface of the mother board first layer 33 is prepared.

(B) On the other hand, the first surface wiring 3 is formed on the first main surface.
a, 3b, ..., 3h, 4a, 4b, ..., 4h, ...
, On the second main surface of the second surface wiring 9a, 9b ,.
9h, ..., Further, the first surface wirings 3a, 3b ,.
..., 3h, 4a, 4b, ..., 4h, ... Second surface wirings 9a, 9b, ..., 9h, ... are connected to each other Interlayer connection parts (through-hole inner wall metal) 55a, 55
Prepare a module substrate 2 having b, ..., 55h.

(C) The semiconductor chip 1 is mounted on the first main surface, and the semiconductor chip 1 is fixed to the module substrate 2 using gold-tin solder (or silver paste) 12. Furthermore,
The bonding pads 7a, 7b, ..., 7p, ... of the semiconductor elements mounted on the semiconductor chip 1 and the first
Surface wiring 3a, 3b, ..., 3h, 4a, 4b, ...
, 4h, ..., And the first ends are connected by bonding wires (chip side connecting members) 8a, 8b ,. After this, sealing resin 1 such as epoxy
3 is applied, and as shown in FIG. 2 (a), the ball-shaped electrodes 6a, 6b, ..., 6l ,.
It covers the entire semiconductor chip 1 at a lower height.

(D) Second layer board wiring 32a, ...
Bulk electrodes (ball-shaped electrodes) 6a, 6b, ...
·················· 6 The ball-shaped electrodes 6a, 6b, ..., 6l, ... Use tin lead solder having a diameter of 300 μm, for example.

(E) Then, the first surface of the module substrate 2 in the opening of the first dielectric layer (motherboard first layer) 33, the second layer board wiring 32a, ..., 32g.・ ・ ・
・ ・ ・ ・ Align with the top. In this way, the bulk-shaped electrodes (ball-shaped electrodes) 6a, 6b, ..., 6l, ... To the first surface wirings 3a, 3b, ..., 3h, 4a, 4b ,.・
The second ends of 4h, ..., 4h are connected. The module mounting body is put into an electric oven or the like, electrically connected by solder reflow, and the module substrate 2 is housed and fixed in the opening.

(F) After that, the second surface wirings 9a, 9b,
..., 9h, ... and first layer board wiring 31e, ...
, 31f, ... Are electrically connected by using board side connecting members (bonding wires) 35e ,. The high frequency mounting body according to the embodiment is completed.

(Second Embodiment) The second embodiment of the present invention is different from the first embodiment in that the semiconductor chip 1 is flip-chip mounted on the module substrate 2. As shown in FIG. 4A, the semiconductor chip 1 is formed on the first surface of the module substrate 2 with stud bumps 10a, ...
., 10i, ... Flip chip mounting. On the first surface, ball-shaped electrodes 6a, 6b, ..., 6l, ...
..... Chip components 21a, 21 such as capacitors and resistors
b, 21c, 21d, ... Are also mounted. The second
The back surface wiring 9a, 9b, ...
..., 9h, ... are mounted. Semiconductor chip 1
Is a GaAs chip thinly polished to about 150 μm, and a field effect transistor or the like is used as a semiconductor element. Stud bumps 10a, ..., 10 for flip-chip mounting the semiconductor chip 1 on the module substrate 2
i, ... are gold (Au) bumps, silver (Ag) bumps,
Copper (Cu) bump, nickel / gold (Ni-Au) bump, or nickel / gold / indium (Ni-Au-I)
n) Use stud bumps such as bumps. The stud bump height is about 30 μm after mounting. Chip part 2
1a, 21b, 21c, 21d, ... Are the same as those in the first embodiment.

FIG. 4B shows a cross section of a high frequency mounting body (secondary mounting body) in which the high frequency module (primary mounting body) described above is mounted on a mother board 30. The mother board 30 is formed of a laminated dielectric substrate, and the uppermost mother board first layer 33 has an opening of a size slightly larger than the size of the module board 2, and the module board 2 fits in this opening. The method of mounting the module substrate 2 on the mother board 30 is the same as that of the first embodiment.

In the second embodiment, by flip-chip mounting with less parasitic capacitance and the like, it is possible to form a module having higher high frequency characteristics than in the first embodiment. Further, also in the input / output of the module, the ball-shaped electrode 6 having less parasitic capacitance is used for the input / output of the RF signal.
a, 6b, ..., 6l, .., power is supplied to the back surface wiring 9a having pad electrodes via bonding wires.
9b, ..., 9h, ...
A high frequency mounting body (secondary mounting body) having excellent high frequency characteristics can be formed.

The high frequency mounting body according to the second embodiment of the present invention can be mounted by the following procedure: (a) First, the same mother board (circuit board) as that of the first embodiment. Prepare 30.

(B) Further, the module substrate 2 similar to that of the first embodiment is prepared.

(C) First surface wiring 3a, 3b, ...
At one end of 3h, ..., Stud bumps (chip side connecting member) 10a, ..., 10i, made of gold (Au).
... is formed. Then, as shown in FIG. 4A, the stud bumps (chip-side connecting members) 10a ,.
The semiconductor chip 1 is mounted on the first main surface of the module substrate 2 via 0i ,. At this time, the bonding pads 7a, 7a provided on the peripheral portion of the surface of the semiconductor chip 1
, 7p, ... Are aligned so that the stud bumps 10a ,.

(D) Second layer board wiring 32a, ...
Bulk electrodes (ball-shaped electrodes) 6a, 6b, ...
······················

(E) Then, as shown in FIG.
The first surface of the module substrate 2 is placed above the second layer board wirings 32a, ..., 32g, .. in the opening of the first dielectric layer (motherboard first layer) 33. , Align.
In this way, the bulk electrodes (ball-shaped electrodes) 6a, 6b,
......, 6l, ... to the first surface wirings 3a, 3b, ...
The second ends of 3h, 4a, 4b, ..., 4h ,. Then, the module substrate 2 is housed and fixed in the opening by solder reflow.

(F) After that, the second surface wirings 9a, 9b,
..., 9h, ... and first layer board wiring 31e, ...
, 31f, ... Are electrically connected by using board side connecting members (bonding wires) 35e ,. The high frequency mounting body according to the embodiment is completed.

(Third Embodiment) In the third embodiment of the present invention, ball-shaped electrodes 6a, 6b, ..., 6l ,.
... and the semiconductor chip 1 are mounted on different surfaces of the module substrate 2, which is different from the first and second embodiments. As shown in FIGS. 5A, 5 </ b> B, and 6 </ b> A, the semiconductor chip 1 is mounted on the module substrate 2 with gold tin solder or the like 12. Bonding wire 8
, 8i, ..., Bonding pads 7a, 7b, which are arranged on the peripheral portion of the surface of the semiconductor chip 1.
..., 7p, ... and surface wirings 3a, 3b, ..., 3h, ..., through-hole connection wiring 4a formed on the first surface of the module substrate 2. , 4b, ..., 4h ,. Bonding pad patterns for connecting to the motherboard 30 are formed on the surface wirings 3a, 3b, ..., 3h, ... Formed on the first surface. Ball-shaped electrodes 6a, 6b, ..., 6
are mounted on the front surface of the back surface wirings 9a, 9b, ..., 9h, ... Arranged on the second surface of the module substrate 2. Back wiring 9a, 9b, ..., 9h ,.
Is a through hole 5 formed in the module substrate 2.
, 5h, .. are respectively connected to through-hole connection wirings 4a, 4b ,.

6B is a cross-sectional view of a high-frequency package (secondary mount) in which the high-frequency module (primary mount) primarily mounted as shown in FIG. 6A is secondarily mounted on the mother board 30.
Shown in. Like the secondary mounting body shown in FIG. 6B, the semiconductor chip 1 and the ball-shaped electrodes 6a, 6b ,.
, Are arranged on different surfaces of the module substrate 2 so that the size of the ball-shaped electrodes 6a, 6b ,. Can be designed.

The high frequency mounting body according to the third embodiment of the present invention can be mounted by the following procedure: (a) First, the same circuit board (motherboard) as that of the first embodiment. Prepare 30.

(B) First surface wirings 3a, 3 on the first main surface
b, ..., 3h, 4a, 4b, ..., 4h ,.
, The second surface wirings 9a, 9b, ..., 9 on the second main surface.
h, ..., Further, the first surface wirings 3a, 3b ,.
.., 3h, 4a, 4b, .., 4h, .. and the second surface wirings 9a, 9b ,. Part (through-hole inner wall metal) 55b, ...
.., 55f, ..

(C) As shown in FIG. 6 (a), the semiconductor chip 1 is mounted on the first main surface, and the semiconductor elements mounted on the semiconductor chip 1 and the first surface wirings 3a, 3b, ...
..., 3h, 4a, 4b, ..., 4h, ... and bonding wires (chip side connecting members) 8a, ..., 8
Connect with i, ....

(D) As shown in FIG. 6 (b), the bulk layer electrodes (ball-shaped electrodes) 6a, 6b ,. ···· Equipped with 6l.

(E) This bulk electrode (ball electrode)
The second surface wirings 9a, 6a, 6b ,.
While connecting 9b, ..., 9h, ..., As shown in FIG. 6B, the module board 2 is housed and fixed in the opening.

(F) As shown in FIG. 6B, the first surface wirings 3a, 3b, ..., 3h, ... And the first layer board wirings 31e ,. , 31f, ... Are electrically connected to complete the high-frequency mounting body according to the third embodiment of the present invention.

(Fourth Embodiment) In the fourth embodiment of the present invention, as shown in FIGS. 7A and 8, the semiconductor chip 1 is flip-chip mounted on the module substrate 2. A heat radiator 41 for dissipating heat generated in the semiconductor chip 1 is provided on the back surface side of the semiconductor chip 1.

The semiconductor chip 1 has stud bumps 10q, ..., 10t, ... On the first surface of the module substrate 2.
And the like are flip-chip mounted. As shown in FIG. 7A, the module substrate 2 has first surface wirings 3a, 3b, ..., 3h ,.
Further, as shown in FIG. 7B, second surface wirings 9a, 9b, 9p, 9r, ..., 9u, ... Are provided on the second main surface. Then, the first surface wirings 3a, 3b, ..., 3h, ...
... and the second surface wirings 9a, 9b, 9p, 9r, ...,
9u, ... are through holes 5a, 5b, 5c, 5
, 5p, 5q, ..., 5u, ... Are connected to each other. As shown in FIGS. 8 and 9, the through hole 5
a, 5b, 5c, 5d, 5p, 5q, ..., 5u, ...
・ Interlayer connection part (through-hole inner wall metal) on the inner wall of
55q, ..., 55t ,. A back surface electrode 11 made of a metal film is formed on the back surface of the semiconductor chip 1. In order to dissipate the heat generated by the semiconductor chip 1, a radiator 41 is mounted on the back surface electrode 11 of the semiconductor chip 1 via the heat conducting member 12. The heat conductive member 12 is made of gold tin solder or the like, and is bonded to the back surface electrode 11 of the semiconductor chip 1 through a process such as solder reflow.

As shown in FIG. 7B, the ball-shaped electrodes 6a, 6b, ..., 6 are formed on the second surface of the module substrate 2.
j, 6p, 6q, ..., 6u are mounted. On the other hand, on the first surface, surface wirings 3a, 3 having bonding pad patterns for connecting to the mother board 30 are formed.
b, ..., 3h ,. It is mounted on the motherboard 30 by the secondary mounting similar to that of the third embodiment.

By adopting the secondary mounting structure shown in FIG. 9, the heat generated in the semiconductor chip 1 can be radiated from the radiator 41 to the surrounding space, which is particularly effective when mounting a power amplifier or the like which generates a large amount of heat. Is.

(Fifth Embodiment) FIG. 10 shows an array antenna (secondary mounting body) according to a fifth embodiment of the present invention. The mother board 30 is composed of a laminated dielectric substrate,
It has at least the motherboard first layer 33 and the motherboard second layer 34 below the motherboard first layer 33. First layer board wirings 221 and 222 are arranged on the mother board first layer 33. The first layer board wirings 221 and 222 are power supply lines. Further, a plurality of patch antenna elements 3 are provided on the surface of the mother board first layer 33.
01, 302, ..., 304 ,. For example, at 25 GHz, a plurality of patch antenna elements 301, 302, ...
..., 304, ... are arranged.

A plurality of patch antenna elements 30 are provided between the mother board first layer 33 and the mother board second layer 34.
, 302, ..., Plural second layer board wirings 201, 202 ,.
04, ... are embedded. Second layer board wiring 2
01, 202, ..., 204, ... run parallel to each other at a pitch of 6 mm. As is apparent from the cross-sectional view of FIG. 10 taken along the line XX in FIG. 10, a ground plate 35 is formed on the entire surface below the mother board second layer 34. Therefore, the motherboard second layer 34
As a dielectric layer, and the second layer board wiring 201, 202, ...
..., 204, ... and the ground plate 35,
Each second layer board wiring 201, 202, ...
A microstrip line having the RF signal lines 204, ... Is constructed.

Further, a plurality of second layer board wirings 2 are provided between the mother board first layer 33 and the mother board second layer 34.
, 202, ..., 204, ... In the respective extension directions of the plurality of second layer board wirings 211, 212 ,.
., 214, ... Are embedded. The plurality of second layer board wirings 211, 212, ..., 214, ...
Like the layer board wirings 201, 202, ..., 204, ..., They run parallel to each other at a pitch of 6 mm.
The mother board second layer 34 is used as a dielectric layer, and the second
Layer board wiring 211, 212, ..., 214, ...
Between the second layer board wirings 211, 212, ..., 214 ,.
A microstrip line that serves as a signal line is configured.

As shown in FIG. 10, a plurality of module boards 101, 102, ...
There is an opening of a size that allows a plurality of, ..., 104 to be arranged. Then, a plurality of module substrates 1 are provided in this opening.
01, 102, ..., 104 ,. Multiple module boards 101, 102, ..., 1
04, ... Are arranged in a one-dimensional direction at equal intervals with a pitch of 6 mm. Although not shown in the cross-sectional view of FIG. 11, in the fifth embodiment, the plurality of semiconductor chips 1 are arranged in the plurality of module substrates 101, 102, ... As in the second embodiment. .., 104, .. are flip chip mounted. Then, as shown in FIG. 11, ball-shaped electrodes 601 and 602 are used to realize electrical connection to the RF signal lines 202 and 212. On the other hand, power is supplied to the bonding wires 401, 4
1 through 11 and the backside wiring of the module substrate 102.
The layer board wirings 221 and 222 are connected to each other. Figure 1
Although not shown in the sectional view of FIG. 1, another module substrate 10
Of course, the same applies to 1, 103, 104 ,. That is, the first layer board wirings 221 and 22
Each of the two has a branch, and the tip of the branch constitutes a bonding pad. Then, the module substrate 10
1, 103, 104, ... and the first layer board wiring 221
And the bonding wires 411, 413, 414, ...
Are connected through the module substrates 101, 10
, And the first layer board wiring 222 are connected via bonding wires 401, 403, 404 ,.

According to the array antenna of the fifth embodiment of the present invention, the patch antenna elements 301, 302,
..., 304, ... and module boards 101, 10
Since the transmission line length between 2, ..., 104 ,. Therefore, the area of the entire array antenna is also reduced.

As described above, the present invention has been described by the first to fifth embodiments, but it should not be understood that the description and drawings forming a part of this disclosure limit the present invention. . From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art. Although the present invention has been described by focusing on the first dielectric layer 33 and the second dielectric layer 34 in the first to fifth embodiments, the circuit board according to the embodiment of the present invention is a two-layer board. It is not limited to. For example, a third dielectric layer, a fourth dielectric layer, a fifth dielectric layer, ... May be further provided under the second dielectric layer 34. Further, another dielectric layer having a second opening larger than the opening of the first dielectric layer 33 may be provided on the first dielectric layer 33. Further, embedded wiring layers may be formed between the second dielectric layer 34 and the third dielectric layer, between the third dielectric layer and the fourth dielectric layer, and the like.

As described above, it goes without saying that the present invention includes various embodiments not described here. Therefore, the technical scope of the present invention is defined only by the matters specifying the invention according to the scope of claims appropriate from the above description.

[0060]

According to the present invention, it is possible to provide a high frequency mounting body in which the number of through holes formed in a mother board can be reduced and modules can be arranged at narrower intervals.

[Brief description of drawings]

FIG. 1 (a) is a plan view of a first surface of a high-frequency module (primary mounting body) according to a first embodiment of the present invention, and FIG. 1 (b) shows a second surface of the same. It is a top view.

FIG. 2 is a cross-sectional view of a high frequency module (primary mounting body) according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view showing the structure of a high-frequency package (secondary package) on which the high-frequency module (primary package) according to the first embodiment of the invention is mounted.

4A is a cross-sectional view of a high frequency module (primary mounting body) according to a second embodiment of the present invention, and FIG.
(B) is a cross-sectional view showing a structure of a high-frequency package (secondary package) on which the high-frequency module (primary package) is mounted.

FIG. 5 (a) is a plan view of a first surface of a high-frequency module (primary mounting body) according to a third embodiment of the present invention, and FIG. 5 (b) shows a second surface of the same. It is a top view.

FIG. 6 is a cross-sectional view of a high-frequency module (primary mounting body) according to a third embodiment of the present invention, and FIG. 6 (b) shows a high-frequency mounting body on which the high-frequency module (primary mounting body) is mounted. It is sectional drawing which shows the structure of (secondary mounting body).

FIG. 7 (a) is a plan view of a first surface of a high-frequency module (primary mounting body) according to a fourth embodiment of the present invention, and FIG. 7 (b) shows a second surface of the same. It is a top view.

FIG. 8 is a cross-sectional view of a high frequency module (primary mounting body) according to a fourth embodiment of the present invention.

FIG. 9 is a cross-sectional view showing the structure of a high-frequency package (secondary mount) on which a high-frequency module (primary mount) according to a fourth embodiment of the present invention is mounted.

FIG. 10 is a plan view of an array antenna according to a fifth embodiment of the present invention.

11 is a cross-sectional view as seen from the XX direction in FIG.

FIG. 12 is a cross-sectional view showing a structure of a high frequency mounting body (secondary mounting body) on which a high frequency module (primary mounting body) according to a conventional example is mounted.

[Explanation of symbols]

1 Semiconductor chip 2, 101, 102, ..., 104 Module substrate 3a, 3b, .., 3h Surface wiring (first surface wiring) 4a, 4b, .., 4h Through hole Connection wiring (first surface wiring) 5a, 5b, ..., 5h Through holes 6a, 6b, ..., 6l Ball-shaped electrodes (bulk-shaped electrodes) 7a, 7b, ..., 7p Bonding pads 8a, 8b, ..., 8p Bonding wires (chip side connecting members) 9a, 9b, .., 9h Backside wiring (second surface wiring) 10a, .. Stud bump (chip side connecting member) 11 Back surface electrode 12 Gold tin solder (or silver paste etc.) 13 Encapsulating resin 21a, 21b, 21c, 21d Chip component 30 Mother board (circuit board) 31e, ... 31f, 221 and 222 first layer board line 32a, ·····, 32g, 201~204,211~2
14 Second Layer Board Wiring 33 Motherboard First Layer (First Dielectric Layer) 34 Motherboard Second Layer (Second Dielectric Layer) 35e to 35f, 401 to 404, 411 to 414
Bonding wire (board-side connecting member) 41 Heat sinks 55a, 55b, ..., 55h Interlayer connection part (through-hole inner wall metal) 301, 302, ..., 304 Patch antenna element

Claims (6)

[Claims] 1. A first dielectric layer having a first-layer board wiring on the front surface and having an opening penetrating from the front surface to the back surface, and a second-layer board wiring partially exposed at the opening portion on the front surface. A circuit board having a second dielectric layer having a second dielectric layer in contact with the back surface of the first dielectric layer, the second dielectric layer being in contact with the back surface of the first dielectric layer, the first main surface and the first main surface And a second main surface facing the second main surface, and directing the second main surface toward the surface of the second dielectric layer,
A module substrate housed in the opening of the first dielectric layer; a first surface wiring arranged on the first main surface; a second surface wiring arranged on the second main surface; An interlayer connecting portion that connects the first and second surface wirings to each other through a through hole that penetrates the inside of the substrate, and a bulk electrode that electrically connects the second surface wiring and the second layer board wiring. And the first surface wiring and the first
A line-shaped or strip-shaped board-side connection member for electrically connecting the layer board wiring, a semiconductor chip mounted on the first main surface, a semiconductor element mounted on the semiconductor chip, and the first
A high-frequency package, comprising: a chip-side connecting member for connecting to surface wiring. 2. A first dielectric layer having a first layer board wiring on the front surface and having an opening penetrating from the front surface to the back surface, and a second layer board wiring partially exposed in the opening portion on the surface. A circuit board having a second dielectric layer having a second dielectric layer in contact with the back surface of the first dielectric layer, the second dielectric layer being in contact with the back surface of the first dielectric layer, the first main surface and the first main surface And a second main surface facing the first main surface toward the surface of the second dielectric layer,
A module substrate housed in the opening of the first dielectric layer; a first surface wiring arranged on the first main surface; a second surface wiring arranged on the second main surface; An interlayer connecting portion that connects the first and second surface wirings to each other through a through hole that penetrates the inside of the substrate, and a bulk electrode that electrically connects the first surface wiring and the second layer board wiring. And the second surface wiring and the first
A line-shaped or strip-shaped board-side connection member for electrically connecting the layer board wiring, a semiconductor chip mounted on the first main surface, a semiconductor element mounted on the semiconductor chip, and the first
A high-frequency package, comprising: a chip-side connecting member for connecting to surface wiring. 3. The high frequency package according to claim 1, wherein the second layer board wiring is a high frequency signal line. 4. The high frequency circuit component according to claim 1, further comprising a high-frequency circuit component between the surface of the first dielectric layer or between the first dielectric layer and the 21st dielectric layer. The high-frequency package according to item. 5. A first dielectric layer having a first-layer board wiring on the front surface and having an opening penetrating from the front surface to the back surface, and a second-layer board wiring partially exposed at the opening portion on the front surface. Preparing a circuit board having a second dielectric layer in contact with the back surface of the first dielectric layer by embedding another part of the second layer board wiring, and A step of preparing a module substrate having a first surface wiring, a second surface wiring formed on a second main surface, and an interlayer connecting portion connecting the first and second surface wirings to each other through a through hole; Mounting a semiconductor chip on the main surface and connecting a semiconductor element mounted on the semiconductor chip and the first surface wiring with a chip side connecting member; and mounting a bulk electrode on the second layer board wiring. And a step of connecting the second surface wiring to the bulk electrode. While including and fixing the module substrate in the opening, and a step of electrically connecting the first surface wiring and the first layer board wiring, How to implement. 6. A first dielectric layer having a first layer board wiring on the front surface and having an opening penetrating from the front surface to the back surface, and a second layer board wiring partially exposed at the opening portion on the surface. Preparing a circuit board having a second dielectric layer in contact with the back surface of the first dielectric layer by embedding another part of the second layer board wiring, and A step of preparing a module substrate having a first surface wiring, a second surface wiring formed on a second main surface, and an interlayer connecting portion connecting the first and second surface wirings to each other through a through hole; A step of mounting a semiconductor chip on the main surface and connecting the semiconductor element mounted on the semiconductor chip and the first end of the first surface wiring with a chip side connecting member; A step of mounting a bulk electrode, and the first electrode on the bulk electrode. A step of housing and fixing the module substrate in the opening while connecting the second end of the surface wiring, and a step of electrically connecting the second surface wiring and the first layer board wiring. A method for mounting a high-frequency mounting body, which includes: