JP2003109925A - Wafer polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer polishing device which is capable of surely holding a polished semiconductor wafer in a wafer loading hollow provided to a disk and surely polishing the semiconductor wafer. SOLUTION: In a wafer polishing device, semiconductor wafers 5 are each loaded into a loading hollow 4 provided to a metal disk 2, a polishing disk is made to bear against the surfaces of the semiconductor wafers 5 which are uncovered in the openings of the wafer loading hollows 4 while the metal disk 2 is rotated. A synthetic resin protective ring 7 is internally provided along the inner circumferential edge of each wafer loading hollow 4, outward protruding teeth 8 provided to the outer circumferential edge of the ring 7 are so set as to be engaged with inward protruding teeth 9 provided to the inner circumferential edge of the wafer loading hollow 4, and the outward protruding teeth 8 are engaged with the inward protruding teeth 9 to form a first sloping pair 10 which prevents the ring 7 from coming out upward from the wafer loading hollow 4 and a second sloping pair 11 which prevents the ring 7 from coming out downward from the wafer loading hollow 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer polishing apparatus, and more particularly, to a synthetic resin protective ring provided in a wafer loading hole of a semiconductor wafer to be polished.
Regarding the improvement of No. 65.

[0002]

2. Description of the Related Art Japanese Unexamined Patent Publication Nos. 2000-15565 and 2
No. 000-15566 shows a typical example of this type of semiconductor wafer polishing apparatus. As shown in FIGS. 1 and 2, this polishing apparatus engages a plurality of planetary discs 2 having a gear structure with a drive gear 1 provided at the center, and further engages with each disc 2 on the circumscribed circle of the whole disc 2. An annular gear 3 is arranged so that each disk 2 revolves while revolving with the rotation of the drive gear 1, while the semiconductor wafer 5 is loaded into a plurality of wafer loading holes 4 arranged concentrically on each disk 2. As described above, a structure is used in which the disc 2 is rotated (rotated and revolved) and the polishing disc 6 is brought into contact with the upper and lower surfaces of the semiconductor wafer exposed from the opening face of the wafer loading hole 4 to perform surface polishing. That is, the semiconductor wafer 5 held on the disk 2 is sandwiched between the upper and lower polishing disks 6, and the disk 2 and the semiconductor wafer 5 are rotated and polished.

In the above 2000-15565, a protective ring made of synthetic resin is provided at the inner peripheral edge of the wafer loading hole 4 formed in the metal disk 2, and the metal powder is transferred to the surface of the semiconductor wafer 5. The problem that makes it difficult to properly perform mirror polishing is corrected, and the semiconductor wafer 5 is protected during loading and polishing.

[0004]

However, the above 2000-
The No. 15565 has a fitting structure in which the wafer loading hole 4 and the synthetic resin protective ring 7 are press-fitted by concavo-convex. However, this simple press-fitting structure (tight fit structure) prevents the synthetic resin protective ring from rotating. However, it is inevitable that the protective ring made of synthetic resin will fall and deform upward and downward.

Moreover, due to the flexibility of the synthetic resin protective ring,
There is a risk of falling and deformation due to bending toward the center.

During the polishing operation of the synthetic resin protective ring, the semiconductor wafer 5 is deformed in the vertical direction and the central direction.
Will hinder the polishing.

[0007]

SUMMARY OF THE INVENTION
The present invention provides a wafer polishing apparatus that appropriately solves the problems of No. 0-15565.

In summary, according to the present invention, a semiconductor wafer (silicon wafer) is loaded into a wafer loading hole provided in a metal disk, and the surface of the semiconductor wafer exposed from the opening surface of the wafer loading hole is rotated while the disk is rotated. When a polishing disk is abutted to perform surface polishing, a synthetic resin protective ring is provided inside along the inner peripheral edge of the wafer loading hole, and a plurality of outwardly projecting teeth provided on the outer peripheral edge of the synthetic resin protective ring. The plurality of inwardly projecting teeth provided on the inner peripheral edge of the wafer loading hole are in an occlusal structure.

The outer convex teeth of the synthetic resin ring and the occlusal surfaces of the inner convex teeth of the wafer loading hole provided on the metal disk are engaged with each other to move the synthetic resin protection ring upward from the wafer loading hole. A pair of inclined surfaces is formed to prevent the synthetic resin protective ring from slipping downward from the wafer loading hole by engaging with the same occlusal surface.
A pair of inclined surfaces is formed, and the first and second pairs of inclined surfaces effectively prevent vertical deformation and falling.

As a suitable example, the first inclined surface pair is formed on one occlusal surface of the outward convex tooth and the inward convex tooth, and the second inclined surface pair is formed on the other occlusal surface thereof.

As another example, the first inclined surface pair is formed on the bottom surface of the groove between the convex teeth and the tip end surface of the convex tooth fitted thereto, and the second inclined surface pair is formed between the other convex teeth. It is formed on the bottom surface of the tooth groove and the tip surface of the convex tooth fitted to this.

Further, the tooth thicknesses of the inwardly convex teeth and the outwardly convex teeth are formed so as to gradually increase from the root side to the tip side, and both side surfaces of both convex teeth are engaged with each other to make a synthetic resin protective ring. The third pair of inclined surfaces is formed so as to incline toward the center (inward) to prevent the synthetic resin ring from colliding with each other in cooperation with the pair of first and second inclined surfaces. Effectively prevent falling and deformation.

The synthetic resin protective ring may be prepared by molding in advance, or may be formed by molding a synthetic resin into the inner peripheral edge of the wafer loading hole having the inwardly projecting teeth and curing the synthetic resin to prevent dimensional error. The backlash is eliminated and the regulation effect of the first to third inclined surface pairs is fully exhibited.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION As described above, the present invention is disclosed in
Provided is a wafer polishing apparatus that appropriately solves the problems of 000-15565.

In this wafer polishing apparatus, as shown in FIGS. 1 and 2, and as shown in FIGS. 3 and 4, a plurality of planetary disks 2 having a gear structure are engaged with a drive gear 1 provided at the center, and further, On the circumscribed circle of the whole disc 2, an annular gear 3 that meshes with each disc 2 is arranged so that each disc 2 revolves around its own axis as the drive gear 1 rotates, while it is arranged on the concentric circle of each disc 2. The semiconductor wafer 5 is loaded into the plurality of wafer loading holes 4, and the polishing disk 6 is attached to the upper and lower surfaces of the semiconductor wafer exposed from the opening surface of the wafer loading hole 4 while rotating (rotating and revolving) the disk 2 as described above. In addition to the structure of contacting and polishing the surface, the semiconductor wafer 5 is held in the wafer loading hole 4 of the disk 2 and rotated (revolved and / or rotated) to bring the polishing plate 6 into contact. , Other polishing for polishing one or both sides of the semiconductor wafer 5. Device which can be applied to.

The semiconductor wafer 5 is loaded into the wafer loading hole 4 provided in the above-described metal disk 2 and the surface of the semiconductor wafer 5 exposed from the opening surface of the wafer loading hole 4 is polished while rotating the disk 2. When the disk 6 is contacted and the surface is polished,
A synthetic resin protective ring 7 is provided along the inner peripheral edge of the wafer loading hole 4, and a plurality of outwardly projecting teeth 8 provided on the outer peripheral edge of the synthetic resin protective ring 7 and the inner peripheral edge of the wafer loading hole 4. And the plurality of inwardly projecting teeth 9 provided on the above are formed into an occlusal structure.

Similar to the gear meshing structure, the outwardly projecting teeth 8 and the inwardly projecting teeth 9 are fitted in the tooth grooves 12, 13 between the respective projecting teeth 8, 9 to form the above-mentioned meshing structure. There is.

Then, the outer convex teeth 8 of the synthetic resin ring 7 and the occlusal surfaces of the inner convex teeth 9 of the wafer loading hole 4 formed in the metal disk 2 are engaged with each other and the synthetic resin protective ring 7 is formed.
Of the first inclined surface pair 10 for preventing the upper side of the wafer loading hole 4 from coming off, and engaging the interlocking surfaces with each other to prevent the synthetic resin protection ring 7 from moving downward from the wafer loading hole 4. The second pair of inclined surfaces 11 for preventing coming off is formed,
The pair of second inclined surfaces 10 and 11 effectively prevent vertical deformation and falling.

As shown in FIGS. 5 to 8, the occlusal surfaces mean side surfaces 14 and 15 (one side occlusal surface and the other side occlusal surface) of the outward convex tooth 8 and the inward convex tooth 9, respectively. Each tooth groove 12,1
3 and the occlusal surface of the tip surface 17 of each convex tooth 8 and 9. That is, the three side surfaces, the tip surface, and the bottom surface 14 of each convex tooth 8 and 9 are formed.
1 to 17, the first and second inclined surface pairs 1
Including the case of forming 0 and 11.

To restate, the first inclined surface pair 10 is formed on one side surface 14, 15 of the outward convex tooth 8 and the inward convex tooth 9, and the second inclined surface pair 11 is formed on the other side surface 14 thereof. , 1
5 to form. As another example, the first pair of inclined surfaces 10 includes the bottom surface 16 of the tooth groove 12, 13 between the convex teeth 8 and 9 and the convex teeth 8 and 9 respectively.
And the second inclined surface pair 1
1 is formed on the bottom surfaces 16 of the tooth grooves 12, 13 between the other convex teeth 8 and 9 and the tip surfaces 17 of the other convex teeth 8 and 9.

The convex teeth 8 and 9 are formed in a ring shape with a high density pitch, and the adjacent first and second inclined surface pairs 10 and 11 which engage with each other are alternately formed between the adjacent convex teeth 8 and 9. Is desirable.

As an example, as shown in FIG. 6, as the inward convex teeth 9, trapezoidal convex teeth and inverted trapezoidal convex teeth are alternately formed in a cross-sectional view (cross-sectional view on a pitch circle), and the trapezoidal convex teeth and the inverted trapezoidal convex teeth are formed. The outwardly convex teeth 8 fitted between the teeth are alternately formed into a regular parallelogram and an anti-parallelogram.

Alternatively, conversely to FIG. 6, trapezoidal convex teeth and inverted trapezoidal convex teeth are alternately formed in cross-section (cross-sectional view on a pitch circle) as the outward convex teeth 8, and the trapezoidal convex teeth and the inverted trapezoidal convex teeth are formed. The inwardly projecting teeth 9 fitted between them are alternately formed into a regular parallelogram and an antiparallelogram.

The regular parallelogram and the antiparallel parallelogram mean parallelograms in which two sides (left and right side surfaces of the convex tooth) facing each other in the pitch circle direction have opposite inclination directions.

By the structure shown in FIG. 6, both side surfaces 14 (or 15) inclined from the upper side to the lower side in the pitch circle direction of the inverted trapezoidal inwardly projecting teeth 9 (or outwardly projecting teeth 8),
Adjacent to each side face, each side face 15 of the parallelogram outward convex tooth 8 (or inward convex tooth 9) in the forward and reverse directions, which is tuned and inclined,
(Or 14) is engaged to form a first inclined surface pair 10 for preventing upward disengagement, and further, a trapezoidal inward convex tooth 9 is formed.
(Or outward convex teeth 8) both side surfaces 14 (or 15) inclined from the upper side to the lower side in the pitch circle direction, and the parallelogram outward convex teeth 8 (or 15) adjacent to each side surface in the forward and reverse directions (or Each side surface 15 (or 1) of the inwardly convex tooth 9) which is inclined to be tuned
4) to form a second inclined surface pair 11 which is engaged with and prevents the downward slant.

As another example, as shown in FIG. 7, all of both side surfaces 14 and 15 of the outwardly projecting tooth 8 and the inwardly projecting tooth 9 are tilted in synchronization with each other from the upper side to the lower side in the pitch circle direction. The adjacent one side surfaces of the teeth 8 and 9 and the synchronized inclined surfaces formed on the other side surfaces 14 and 15 are engaged with each other, and the upper direction (upper opening surface of the wafer loading hole 4) and the lower direction of the wafer loading hole 4 are engaged with each other. A first inclined surface pair 10 and a second inclined surface pair 11 are formed to prevent the wafer from being removed from the lower opening surface of the wafer loading hole 4.

As another example, as shown in FIG. 8, only adjacent one side surfaces 14 and 15 of the inwardly projecting tooth 9 and the outwardly projecting tooth 8 are slanted and engaged in a pitch circle direction in synchronization with each other from the upper side to the lower side. Then, the first inclined surface pair 10 and the second inclined surface for preventing the wafer loading hole 4 from coming out upward (upper opening surface of the wafer loading hole 4) and downward (downward opening surface of the wafer loading hole 4). Pairs 11 are formed alternately.

As described above, the relationship between the first inclined surface pair 10 and the second inclined surface pair 11 shown in FIGS.
The same applies to the front end surface 17 of the and the bottom surfaces 16 of the tooth grooves 12 and 13, and these are alternately formed.

Further, as shown in FIG. 9, the inwardly projecting teeth 9 are
And the tooth thickness (dimension in the pitch circle direction) of the outward convex tooth 8 is gradually enlarged from the root side to the tip side,
A third pair of inclined surfaces 18 is formed which engages with both side surfaces 14 and 15 or one side surface of 9 to prevent the synthetic resin protective ring 7 from coming off in the central direction (inward). This third inclined surface pair 18
Cooperates with the pair of first and second inclined surfaces 10 and 11 to prevent the synthetic resin ring 7 from dropping and deforming in each direction.

In other words, the outward convex teeth 8 and the inward convex teeth 9
Both side surfaces 14 and 15 of the above are gradually inclined toward the tip end in a direction away from each other, or one side surface is inclined toward the tuning direction,
Each convex tooth 8 and 9 is trapezoidal in plan view. In other words, the tooth groove 1 between the inwardly projecting teeth 9 and the outwardly projecting teeth 8 is different.
2 and 13 are formed into a shape (trapezoidal shape in plan view) which gradually becomes narrower from the root to the tip of the tooth, and both side surfaces 14 and 15 of the biconvex teeth 8 and 9 or one side surface 14 and 15 are engaged with each other to make a synthetic resin Third inclined surface pair 1 for preventing the protective ring 7 from coming off toward the center
8 is formed.

The protective ring 7 made of synthetic resin, which has been molded and prepared in advance, is assembled into the wafer loading hole 4 and engaged with the convex teeth 9 formed on the inner peripheral edge of the wafer loading hole 4.

As a suitable example, as shown in FIG. 10, a flow synthetic resin is molded into the inner peripheral edge of the wafer loading hole 4 having the inwardly projecting teeth 9 and hardened to eliminate play due to dimensional error. The first to third inclined surface pairs 10, 11 and 18 are used to prevent upward disengagement, downward disengagement and inward disengagement.

For example, while the upper die 19 is in close contact with the upper surface of the disk 2 and the lower die 20 is in intimate contact with the lower surface thereof, one of the upper die 19 and the lower die 20 is loosely fitted into the wafer loading hole 4 of the disk 2. A resin is injected into the annular gap 22 formed between the loose part and the wafer loading hole 4 from the injection port 21 of the upper mold 19 or the lower mold 20 and cured to mold the synthetic resin protective ring 7. The synthetic resin protective ring 7 has better adhesion to the convex teeth 8 and 9 than in the case where a preformed product is simply fitted and assembled, and the first to third inclined surface pairs 10 and 11 are provided. , 18 can be accurately aligned (engagement), which is effective in achieving the intended purpose.

[Brief description of drawings]

FIG. 1 is a plan view of a conventional wafer polishing apparatus.

FIG. 2 is a sectional view of the same main part.

FIG. 3 is a plan view of a wafer polishing apparatus showing an embodiment of the present invention.

FIG. 4 is a sectional view of the same main part.

FIG. 5 is a first diagram in which a synthetic resin protective ring is provided in a wafer loading hole in the wafer polishing apparatus so as to prevent upward removal.
FIG. 6 is an enlarged plan view of an essential part for explaining a pair of inclined surfaces and a second pair of inclined surfaces for preventing downward slippage.

FIG. 6 is an enlarged cross-sectional view of an essential part in the pitch circle direction of the convex teeth, showing an example of forming the upper retainer and the lower retainer of the semiconductor wafer.

FIG. 7 is an enlarged cross-sectional view of a main part in the pitch circle direction of the convex teeth showing another example of the formation of the upper retainer and the lower retainer of the semiconductor wafer.

FIG. 8 is an enlarged cross-sectional view of a main portion in the pitch circle direction of the convex tooth, showing still another example of the formation of the pair of third inclined surfaces for preventing the above-mentioned removal and the above-mentioned removal.

FIG. 9 is an enlarged plan view of a main part of a convex tooth showing an example of forming an inner stopper for a semiconductor wafer in the wafer polishing apparatus.

FIG. 10 is an enlarged cross-sectional view of a main part showing a method and a structure in which the protective ring made of synthetic resin is internally provided on an inner peripheral edge of a wafer loading hole by an upper die and a lower die.

[Explanation of symbols]

1 drive gear 2 discs 3 ring gear 4 Wafer loading hole 5 Semiconductor wafer 6 polishing machine 7 Synthetic resin protection ring 8 outward convex teeth 9 Inward convex teeth 10 First inclined surface pair 11 Second inclined surface pair 12 and 13 teeth 14 Sides of outward convex teeth 15 Sides of inward convex teeth 16 Bottom 17 Tip surface 18 3rd inclined surface pair 19 Upper mold 20 Lower mold 21 Inlet 22 annular void

Claims (4)

[Claims] 1. A semiconductor wafer is loaded into a wafer loading hole provided in a metal disk, and the surface of the semiconductor wafer exposed from the opening surface of the wafer loading hole is brought into contact with a polishing disk while rotating the disk to perform surface polishing. In the wafer polishing apparatus, a protective ring made of synthetic resin is provided along the inner peripheral edge of the wafer loading hole, and a plurality of outwardly projecting teeth provided on the outer peripheral edge of the synthetic resin protective ring and the wafer loading A plurality of inwardly projecting teeth provided on the inner peripheral edge of the hole has an occlusal structure, and is engaged with the occlusal surfaces of the outwardly projecting teeth and the inwardly projecting teeth so that the synthetic resin protection ring is above the wafer loading hole. To prevent slipping out
Wafer polishing characterized by forming a pair of inclined surfaces and forming a second pair of inclined surfaces which engage with each other on the occlusal surface to prevent the synthetic resin protective ring from coming out downward from the wafer loading hole. apparatus. 2. The first inclined surface pair is formed on one occlusal surface of the outward convex tooth and the inward convex tooth, and the second inclined surface pair is formed on the other occlusal surface of the same. Claim 1
The wafer polishing apparatus described. 3. A protective ring made of synthetic resin, wherein the tooth thicknesses of the inward convex teeth and the outward convex teeth are formed so as to gradually increase from the root side to the tip side and engage with both side surfaces of both convex teeth. 2. The wafer polishing apparatus according to claim 1, wherein a third pair of inclined surfaces is formed to prevent the inner surface of the wafer from coming off. 4. The synthetic resin protective ring is formed by molding a synthetic resin into the inner peripheral edge of a wafer loading hole having the inwardly projecting teeth and hardening the synthetic resin.
The wafer polishing apparatus described.