JP2003105569A - Surface roughening agent for copper-containing metallic material, and surface treatment method for copper- containing metallic material - Google Patents
Surface roughening agent for copper-containing metallic material, and surface treatment method for copper- containing metallic materialInfo
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- JP2003105569A JP2003105569A JP2001300509A JP2001300509A JP2003105569A JP 2003105569 A JP2003105569 A JP 2003105569A JP 2001300509 A JP2001300509 A JP 2001300509A JP 2001300509 A JP2001300509 A JP 2001300509A JP 2003105569 A JP2003105569 A JP 2003105569A
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- JP
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- Prior art keywords
- copper
- metal material
- containing metal
- roughening agent
- metallic material
- Prior art date
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、銅や銅合金等の銅
含有金属材料の表面を粗化するための表面粗化剤及びこ
れを用いた銅含有金属材料の表面粗化方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface roughening agent for roughening the surface of a copper-containing metal material such as copper or a copper alloy, and a surface roughening method for a copper-containing metal material using the same.
【０００２】[0002]
【従来の技術】銅や銅合金等の銅含有金属材料は種々の
用途に使用されており、用途に応じて表面積を増大させ
たり表面接着性を向上させたりするため表面の粗化が行
われている。例えば、多層プリント基板の製造において
は、銅含有金属材料層を粗化した後、この粗化面に樹脂
やフィルムやインク等を積層することが行われている。
このため、特開平１０−５６２６３号公報、特開平１０
−９６０８８号公報、特開平１１−２９８８３号公報、
特開２０００−６４０６７号公報、特開２０００−２３
９８６５号公報、特開２０００−３０９８８９号公報等
に種々の表面粗化手段が提案されているが、いずれも積
層材料との接着性が不十分なものであった。2. Description of the Related Art Copper-containing metal materials such as copper and copper alloys are used for various purposes, and the surface is roughened in order to increase the surface area or improve the surface adhesion depending on the application. ing. For example, in the production of a multilayer printed circuit board, after roughening a copper-containing metal material layer, a resin, a film, an ink or the like is laminated on the roughened surface.
Therefore, JP-A-10-56263 and JP-A-10-56263
-96088, JP-A-11-29883,
JP-A-2000-64067, JP-A-2000-23
Various surface roughening means have been proposed in Japanese Patent Application Laid-Open No. 9865, Japanese Patent Application Laid-Open No. 2000-309889, and the like, but all of them have insufficient adhesiveness with a laminated material.
【０００３】[0003]
【発明が解決しようとする課題】従って、本発明の目的
は、積層材料との接着性向上のために用いても良好な接
着性を与えることのできる良好な銅含有金属材料表面粗
化剤を提供することにあり、また、良好な接着性を与え
ることのできる良好な銅含有金属材料表面粗化方法を提
供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a good surface-roughening agent for a copper-containing metal material which can give good adhesion even when used for improving the adhesion to a laminated material. It is to provide a good copper-containing metal material surface roughening method that can provide good adhesion.
【０００４】[0004]
【課題を解決するための手段】本発明者らは上記に鑑み
鋭意研究の結果、無機酸、銅の酸化剤及びアゾール類化
合物を含有する水溶液にさらに特定のアミド化合物を加
えることによって、上記課題が解消できることを見出
し、本発明を完成した。即ち、本発明は、無機酸、銅の
酸化剤、アゾール類化合物及び式（１）：As a result of intensive studies in view of the above, the present inventors have found that the above-mentioned problems can be solved by further adding a specific amide compound to an aqueous solution containing an inorganic acid, a copper oxidizing agent and an azole compound. The inventors have found that the above can be solved and completed the present invention. That is, the present invention relates to an inorganic acid, an oxidizing agent for copper, an azole compound and the formula (1):
【０００５】[0005]
【化２】 [Chemical 2]
【０００６】（式中、Ｒ１、Ｒ２及びＲ３は、それぞれ
独立に、水素、炭素原子数１〜８のアルキル基もしくは
アルキレン基又は炭素原子数１もしくは２のアルキル基
で置換されていてもよい炭素原子数６〜８のアリール基
である）で表されるアミド化合物を含有する水溶液から
なることを特徴とする銅含有金属材料表面粗化剤であ
る。(In the formula, R 1 , R 2 and R 3 are each independently substituted with hydrogen, an alkyl group having 1 to 8 carbon atoms or an alkylene group, or an alkyl group having 1 or 2 carbon atoms. Is an aryl group having 6 to 8 carbon atoms), which is an aqueous solution containing an amide compound represented by the formula (6) is a copper-containing metal material surface roughening agent.
【０００７】また本発明は、好ましくはアミド化合物
が、ホルムアミド、アセトアミド、プロピオン酸アミ
ド、酪酸アミド、Ｎ，Ｎ−ジメチルホルムアミド、Ｎ−
メチルホルムアミド、Ｎ，Ｎ−ジエチルホルムアミド、
（メタ）アクリルアミド、Ｎ−フェニルホルムアミド、
ベンズアミド、Ｎ−メチルアセトアミド及びＮ，Ｎ−ジ
メチルアセトアミドからなる群より選択される１種もし
くは２種以上の化合物である上記銅含有金属材料表面粗
化剤であり、また、好ましくは、更にハロゲンイオンを
含有する上記銅含有金属材料表面粗化剤である。また、
本発明は上記の銅含有金属材料表面粗化剤を用いて銅含
有金属材料を処理する銅含有金属材料の表面処理方法で
ある。In the present invention, preferably, the amide compound is formamide, acetamide, propionic acid amide, butyric acid amide, N, N-dimethylformamide, N-
Methylformamide, N, N-diethylformamide,
(Meth) acrylamide, N-phenylformamide,
The copper-containing metal material surface roughening agent, which is one or more compounds selected from the group consisting of benzamide, N-methylacetamide and N, N-dimethylacetamide, and preferably further a halogen ion. The above-mentioned copper-containing metal material surface roughening agent containing. Also,
The present invention is a surface treatment method for a copper-containing metal material, which comprises treating the copper-containing metal material with the above-mentioned copper-containing metal material surface roughening agent.
【０００８】[0008]
【発明の実施の形態】本発明に用いる無機酸は特に限定
されず、どのような無機酸であっても用いることができ
る。具体例として、塩酸、硫酸、硝酸、リン酸、硼酸、
過塩素酸、亜塩素酸、次亜塩素酸、スルファミン酸等を
例示することができるが、良好な粗化のために好ましい
のは塩酸、硫酸、硝酸、リン酸であり、最も好ましいの
は硫酸である。BEST MODE FOR CARRYING OUT THE INVENTION The inorganic acid used in the present invention is not particularly limited, and any inorganic acid can be used. As specific examples, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, boric acid,
Perchloric acid, chlorous acid, hypochlorous acid, sulfamic acid and the like can be exemplified, but preferred for good roughening are hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, and most preferred is sulfuric acid. Is.
【０００９】無機酸の使用割合は用途に応じて求める粗
化の程度により適宜選択すればよいが、通常は、１０〜
４００ｇ／Ｌ程度であれば好ましく用いることができ、
特に３０〜２５０ｇ／Ｌであることが良好な粗化のため
に好ましい。また、無機酸が極端に多くなると銅塩が析
出しやすくなるので、この点からも上記範囲が好まし
い。The proportion of the inorganic acid used may be appropriately selected according to the degree of roughening required depending on the application, but usually 10 to
If it is about 400 g / L, it can be preferably used,
It is particularly preferably 30 to 250 g / L for good roughening. Further, when the amount of the inorganic acid is extremely large, the copper salt is likely to be deposited, and the above range is preferable also from this point.
【００１０】本発明に用いる銅の酸化剤は、水溶液中に
おいて銅を酸化する能力を有するものであれば特に限定
されず、どのような酸化剤でも使用することができる。
具体例として、過酸化水素、過硫酸塩、第二鉄塩、第二
銅塩、過酢酸、過硼酸、過マンガン酸等を例示すること
ができるが、良好な粗化のために好ましいのは過酸化水
素、過硫酸塩、第二鉄塩、第二銅塩であり、最も好まし
いのは過酸化水素である。銅の酸化剤の使用割合は用途
に応じて求める粗化の程度により適宜選択すればよい
が、通常は、１０〜２００ｇ／Ｌ程度であれば好ましく
用いることができ、特に１５〜１５０ｇ／Ｌであること
が良好な粗化のために好ましい。The copper oxidizing agent used in the present invention is not particularly limited as long as it has an ability to oxidize copper in an aqueous solution, and any oxidizing agent can be used.
Specific examples thereof include hydrogen peroxide, persulfates, ferric salts, cupric salts, peracetic acid, perboric acid, permanganic acid, etc., but preferred for good roughening. Hydrogen peroxide, persulfates, ferric salts, cupric salts, most preferred is hydrogen peroxide. The proportion of the copper oxidizer to be used may be appropriately selected depending on the degree of roughening required depending on the application, but usually, it is preferably about 10 to 200 g / L, and preferably 15 to 150 g / L. Is preferred for good roughening.
【００１１】本発明に用いるアゾール類化合物は特に限
定されず、アゾール構造をもつ化合物であればどのよう
な化合物も用いることができる。通常は、ジアゾール
類、トリアゾール類、テトラゾール類が好ましく用いら
れる。具体例として、１，２，３−ベンゾトリアゾー
ル、５−メチル−１Ｈ−ベンゾトリアゾール、１Ｈ−
１，２，４−トリアゾール、５−アミノ−テトラゾー
ル、１−フェニルテトラゾール等を例示することができ
るが、良好な粗化のために特に好ましいのは１，２，３
−ベンゾトリアゾール、５−メチル−１Ｈ−ベンゾトリ
アゾール、５−アミノ−テトラゾールである。アゾール
類化合物の使用割合は用途に応じて求める粗化の程度に
より適宜選択すればよいが、通常は、１〜２００ｇ／Ｌ
程度であれば好ましく用いることができ、特に５〜１０
０ｇ／Ｌであることが良好な粗化のために好ましい。The azole compound used in the present invention is not particularly limited, and any compound having an azole structure can be used. Usually, diazoles, triazoles and tetrazoles are preferably used. As a specific example, 1,2,3-benzotriazole, 5-methyl-1H-benzotriazole, 1H-
Although 1,2,4-triazole, 5-amino-tetrazole, 1-phenyltetrazole and the like can be exemplified, 1,2,3 is particularly preferable for good roughening.
-Benzotriazole, 5-methyl-1H-benzotriazole, 5-amino-tetrazole. The use ratio of the azole compound may be appropriately selected according to the degree of roughening required depending on the application, but usually 1 to 200 g / L
It can be preferably used as long as it is about 5 to 10
It is preferably 0 g / L for good roughening.
【００１２】本発明に用いるアミド化合物は、式（１）The amide compound used in the present invention has the formula (1)
【００１３】[0013]
【化３】 [Chemical 3]
【００１４】（式中、Ｒ１、Ｒ２及びＲ３は、それぞれ
独立に、水素、炭素原子数１〜８の直鎖もしくは分岐の
アルキル基もしくはアルキレン基又は炭素原子数１〜２
のアルキル基で置換されていてもよい炭素原子数６〜８
のアリール基である）で表される化合物であればどのよ
うな化合物であってもよいが、溶解性の点でＲ１、Ｒ２
及びＲ３の合計炭素原子数が８以下であるものが好まし
く用いられる。(In the formula, R 1 , R 2 and R 3 are each independently hydrogen, a linear or branched alkyl group or alkylene group having 1 to 8 carbon atoms, or 1 to 2 carbon atoms.
6-8 carbon atoms which may be substituted with an alkyl group of
Any compound can be used as long as it is a compound represented by the formula (1) is an aryl group of R 1 and R 2 in terms of solubility.
And those in which the total number of carbon atoms of R 3 is 8 or less are preferably used.
【００１５】このような好ましい化合物の具体例として
は、ホルムアミド、アセトアミド（アセトアミド）、プ
ロピオン酸アミド（プロピオンアミド）、酪酸アミド
（ブチルアミド）、Ｎ，Ｎ，−ジメチルホルムアミド、
Ｎ−メチルホルムアミド、Ｎ，Ｎ−ジエチルホルムアミ
ド、（メタ）アクリルアミド、Ｎ−フェニルホルムアミ
ド、ベンズアミド、Ｎ−メチルアセトアミド、Ｎ，Ｎ−
ジメチルアセトアミド等を挙げることができるが、最も
好ましいのはホルムアミド、ベンズアミド、メタクリル
アミドである。アミド化合物の使用割合は用途に応じて
求める粗化の程度により適宜選択すればよいが、通常
は、１〜１００ｇ／Ｌ程度であれば好ましく用いること
ができ、特に１〜５０ｇ／Ｌであることが良好な粗化の
ために好ましい。Specific examples of such preferred compounds include formamide, acetamide (acetamide), propionic acid amide (propionamide), butyric acid amide (butylamide), N, N, -dimethylformamide,
N-methylformamide, N, N-diethylformamide, (meth) acrylamide, N-phenylformamide, benzamide, N-methylacetamide, N, N-
Although dimethylacetamide and the like can be mentioned, formamide, benzamide and methacrylamide are most preferable. The proportion of the amide compound used may be appropriately selected depending on the degree of roughening required depending on the application, but normally it is preferably about 1 to 100 g / L, and preferably 1 to 50 g / L. Is preferred for good roughening.
【００１６】本発明の銅含有金属材料表面粗化剤には、
上記成分に加えてさらに、ハロゲンイオンを含有させる
ことにより、より良好な粗化を得ることができる。ハロ
ゲンイオンとしては、塩化物イオン、臭化物イオン、ヨ
ウ化物イオン等を挙げることができ、これらはハロゲン
イオンを含有する酸又は水溶性の塩を本発明の銅含有金
属材料表面粗化剤に添加することにより含有させること
ができる。酸及び水溶性の塩の具体例としては、ＨＣ
ｌ、ＨＢｒ、ＨＩ、ＮａＣｌ、ＮＨ４Ｃｌ等を挙げるこ
とができる。これらは、良好な粗化の観点からは効果に
差が無いが、扱いやすさや工業化適性等の観点からＮａ
Ｃｌ、ＨＣｌ、ＮＨ４Ｃｌが好ましいといえる。The copper-containing metal material surface roughening agent of the present invention includes
By adding a halogen ion in addition to the above components, a better roughening can be obtained. Examples of the halogen ion include chloride ion, bromide ion, iodide ion, and the like. These are added with an acid containing a halogen ion or a water-soluble salt to the copper-containing metal material surface roughening agent of the present invention. It can be contained by Specific examples of the acid and the water-soluble salt include HC
1, HBr, HI, NaCl, NH 4 Cl and the like. These have no difference in effect from the viewpoint of good roughening, but Na from the viewpoint of ease of handling and suitability for industrialization.
It can be said that Cl, HCl and NH 4 Cl are preferable.
【００１７】ハロゲンイオンの使用割合は用途に応じて
求める粗化の程度により適宜選択すればよいが、２００
ｍｇ／Ｌを超えるような大量のハロゲンイオンを含有さ
せると良好な粗化を阻害することがある。通常は、２０
０ｍｇ／Ｌ以下が用いられるが、８０ｍｇ／Ｌを超えて
使用してもそれ以上の効果向上は軽微なので、工業化適
性のためには８０ｍｇ／Ｌ以下の使用が好ましい。ハロ
ゲンイオンの使用割合の下限値に特に制限はないが、ハ
ロゲンイオンを用いた効果を有意なものとするには１ｍ
ｇ／Ｌ以上であることが好ましい。The proportion of halogen ions used may be appropriately selected according to the degree of roughening required depending on the application, but is 200
If a large amount of halogen ions exceeding mg / L is contained, good roughening may be hindered. Usually 20
Although 0 mg / L or less is used, even if it is used in excess of 80 mg / L, further improvement in effect is slight, so use of 80 mg / L or less is preferable for industrial suitability. There is no particular lower limit to the usage rate of halogen ions, but 1 m is required to make the effect of using halogen ions significant.
It is preferably at least g / L.
【００１８】尚、ＨＣｌのように上記の無機酸としても
用いることのできる化合物についてその使用量を考慮す
る場合は、それぞれの観点から独立に考慮、即ち、重複
してカウントして最適使用量を決めることが好ましい。
本発明の銅含有金属材料表面粗化剤は、従来知られた銅
含有金属材料表面粗化剤に添加することのできることが
知られているその他の添加剤を、本発明の目的を阻害し
ない範囲内で、通常の使用量の範囲で適宜任意に使用す
ることができる。When considering the use amount of a compound that can be used as the above-mentioned inorganic acid such as HCl, the use amount should be considered independently from each viewpoint, that is, the optimum use amount should be obtained by counting in duplicate. It is preferable to decide.
Copper-containing metal material surface roughening agent of the present invention, other additives known to be able to be added to the conventionally known copper-containing metal material surface roughening agent, within the range that does not impair the object of the present invention Within the range, it can be arbitrarily used within the range of the usual amount used.
【００１９】次に本発明の銅含有金属材料の表面処理方
法について説明する。本発明の表面処理方法は、上記し
た本発明の銅含有金属材料表面処理剤で銅含有金属材料
を処理すればよい。銅含有金属材料の種類は銅を含有す
る限り特に限定されない。通常は銅又は銅合金が使用に
供されるが、箔材料であっても板材料であっても用いる
ことができる。Next, the surface treatment method of the copper-containing metal material of the present invention will be described. In the surface treatment method of the present invention, the copper-containing metal material may be treated with the above-described copper-containing metal material surface treatment agent of the present invention. The type of copper-containing metal material is not particularly limited as long as it contains copper. Usually, copper or a copper alloy is used, but either a foil material or a plate material can be used.
【００２０】本発明の表面処理方法においては、上記本
発明の銅含有金属材料表面処理剤を用いること以外は従
来公知の方法を用いることができる。即ち、処理の方法
としては、銅含有金属材料表面処理剤中に銅含有金属材
料を浸漬する方法や、銅含有金属材料表面に上記銅含有
金属材料表面処理剤をシャワー等の方法で散布する方法
等が用いられる。銅含有金属材料表面処理剤の温度も特
に限定されず従来公知の方法の範囲内で用いることがで
きるが、通常は、常温〜４０℃程度で好ましく処理する
ことができる。処理時間は、用途に応じて求める粗化の
程度により適宜選択すればよいが、概ね３０秒〜５分程
度でよく、実用的には３０秒〜２分程度が工業的に好ま
しい。In the surface treatment method of the present invention, conventionally known methods can be used except that the above-mentioned copper-containing metal material surface treatment agent of the present invention is used. That is, as the treatment method, a method of immersing the copper-containing metal material in the copper-containing metal material surface treatment agent, or a method of spraying the copper-containing metal material surface treatment agent on the copper-containing metal material surface by a method such as a shower Etc. are used. The temperature of the copper-containing metal material surface treatment agent is not particularly limited, and it can be used within the range of conventionally known methods, but normally, it can be preferably treated at room temperature to about 40 ° C. The treatment time may be appropriately selected according to the degree of roughening required depending on the application, but may be about 30 seconds to 5 minutes, and practically about 30 seconds to 2 minutes is industrially preferable.
【００２１】[0021]
【実施例】以下実施例を挙げさらに本発明を説明するが
本発明はこれらに限定されるものではない。
実施例１〜２０、比較例１〜２
表１〜５に示す各組成の銅含有金属材料表面処理剤を調
製した。３０℃に維持したこの処理剤０．２Ｌ中に、両
面銅張積層板（５ｃｍ×５ｃｍ、銅層厚さ１８μｍ）を
１分間浸漬処理して銅表面を粗化した。処理後の粗化銅
表面にレジスト（太陽インキ製造（株）製フォトソルダ
ーレジストＰＳＲ−４０００Ｇ２４／ＣＡ−４０Ｇ２
３）を塗布し、硬化後、１０％塩酸に３０分間浸漬した
後、１ｍｍ間隔で碁盤目状にクロスカットし、ＪＩＳ５
４００に準じてテープ剥離試験を行った。結果を表１〜
５に示す。EXAMPLES The present invention will be further described below with reference to examples, but the present invention is not limited thereto. Examples 1 to 20, Comparative Examples 1 to 2 Copper-containing metal material surface treatment agents having the respective compositions shown in Tables 1 to 5 were prepared. A double-sided copper-clad laminate (5 cm × 5 cm, copper layer thickness 18 μm) was immersed in 0.2 L of this treatment agent maintained at 30 ° C. for 1 minute to roughen the copper surface. Resist on the roughened copper surface after the treatment (Photosolder resist PSR-4000G24 / CA-40G2 manufactured by Taiyo Ink Mfg. Co., Ltd.)
3) is applied and after curing, it is dipped in 10% hydrochloric acid for 30 minutes and then cross-cut into a grid pattern at 1 mm intervals according to JIS5.
A tape peeling test was performed according to 400. The results are shown in Table 1
5 shows.
【００２２】[0022]
【表１】 [Table 1]
【００２３】[0023]
【表２】 [Table 2]
【００２４】[0024]
【表３】 [Table 3]
【００２５】[0025]
【表４】 [Table 4]
【００２６】[0026]
【表５】 [Table 5]
【００２７】[0027]
【発明の効果】本発明により、積層材料との接着性向上
のために用いても良好な接着性を与えることのできる良
好な銅含有金属材料表面粗化剤が提供され、また良好な
接着性を与えることのできる良好な銅含有金属材料表面
粗化方法が提供される。EFFECT OF THE INVENTION The present invention provides a good copper-containing metal surface roughening agent which can give good adhesiveness even when used for improving the adhesiveness with a laminated material, and also has good adhesiveness. A good copper-containing metallic material surface roughening method that can provide
フロントページの続き (72)発明者 井谷 勝利 東京都荒川区東尾久７丁目２番35号 旭電 化工業株式会社内 Ｆターム(参考） 4K057 WA05 WB04 WE01 WE11 WE25 WE30 WN01 Continued front page (72) Inventor Itani Victory 7-35 Higashiokyu, Arakawa-ku, Tokyo Asahiden Chemical Industry Co., Ltd. F term (reference) 4K057 WA05 WB04 WE01 WE11 WE25 WE30 WN01
Claims (5)
及び式（１）： 【化１】 （式中、Ｒ１、Ｒ２及びＲ３は、それぞれ独立に、水
素、炭素原子数１〜８のアルキル基もしくはアルキレン
基又は炭素原子数１もしくは２のアルキル基で置換され
ていてもよい炭素原子数６〜８のアリール基である）で
表されるアミド化合物を含有する水溶液からなることを
特徴とする銅含有金属材料表面粗化剤。1. An inorganic acid, a copper oxidizer, an azole compound and a compound of formula (1): (In the formula, R 1 , R 2 and R 3 are each independently hydrogen, an alkyl group having 1 to 8 carbon atoms or an alkylene group, or a carbon which may be substituted with an alkyl group having 1 or 2 carbon atoms. A copper-containing metal material surface roughening agent comprising an aqueous solution containing an amide compound represented by an aryl group having 6 to 8 atoms.
Ｒ２及びＲ３の合計炭素原子数が８以下である請求項１
に記載の銅含有金属材料表面粗化剤。2. R 1 in formula (1) representing an amide compound,
The total number of carbon atoms of R 2 and R 3 is 8 or less.
The copper-containing metal material surface-roughening agent according to.
アミド、プロピオン酸アミド、酪酸アミド、Ｎ，Ｎ−ジ
メチルホルムアミド、Ｎ−メチルホルムアミド、Ｎ，Ｎ
−ジエチルホルムアミド、（メタ）アクリルアミド、Ｎ
−フェニルホルムアミド、ベンズアミド、Ｎ−メチルア
セトアミド、Ｎ，Ｎ−ジメチルアセトアミドからなる群
より選択される１種もしくは２種以上の化合物である請
求項１又は２に記載の銅含有金属材料表面粗化剤。3. The amide compound is formamide, acetamide, propionic acid amide, butyric acid amide, N, N-dimethylformamide, N-methylformamide, N, N.
-Diethylformamide, (meth) acrylamide, N
-A copper-containing metal material surface roughening agent according to claim 1 or 2, which is one or more compounds selected from the group consisting of phenylformamide, benzamide, N-methylacetamide and N, N-dimethylacetamide. .
〜３の何れか１項に記載の銅含有金属材料表面粗化剤。4. The method according to claim 1, further comprising a halogen ion.
The copper-containing metal material surface roughening agent according to any one of 1 to 3.
有金属材料表面粗化剤を用いて銅含有金属材料を処理す
ることを特徴とする銅含有金属材料の表面処理方法。5. A surface treatment method for a copper-containing metal material, which comprises treating the copper-containing metal material with the copper-containing metal material surface-roughening agent according to any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001300509A JP2003105569A (en) | 2001-09-28 | 2001-09-28 | Surface roughening agent for copper-containing metallic material, and surface treatment method for copper- containing metallic material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001300509A JP2003105569A (en) | 2001-09-28 | 2001-09-28 | Surface roughening agent for copper-containing metallic material, and surface treatment method for copper- containing metallic material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003105569A true JP2003105569A (en) | 2003-04-09 |
Family
ID=19121069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001300509A Pending JP2003105569A (en) | 2001-09-28 | 2001-09-28 | Surface roughening agent for copper-containing metallic material, and surface treatment method for copper- containing metallic material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003105569A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005060754A (en) * | 2003-08-08 | 2005-03-10 | Nikko Materials Co Ltd | Surface treatment agent for copper and copper alloy |
| JP2005290423A (en) * | 2004-03-31 | 2005-10-20 | Best Ginning Enterprise Co Ltd | Surface adhesion accelerator for copper and copper alloy, and its use method |
| US7431861B2 (en) | 2003-07-25 | 2008-10-07 | Mec Company Ltd. | Etchant, replenishment solution and method for producing copper wiring using the same |
| CN110499509A (en) * | 2019-10-10 | 2019-11-26 | 昆山成功环保科技有限公司 | Copper seed etching solution for wafer-level packaging |
-
2001
- 2001-09-28 JP JP2001300509A patent/JP2003105569A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7431861B2 (en) | 2003-07-25 | 2008-10-07 | Mec Company Ltd. | Etchant, replenishment solution and method for producing copper wiring using the same |
| JP2005060754A (en) * | 2003-08-08 | 2005-03-10 | Nikko Materials Co Ltd | Surface treatment agent for copper and copper alloy |
| JP2005290423A (en) * | 2004-03-31 | 2005-10-20 | Best Ginning Enterprise Co Ltd | Surface adhesion accelerator for copper and copper alloy, and its use method |
| CN110499509A (en) * | 2019-10-10 | 2019-11-26 | 昆山成功环保科技有限公司 | Copper seed etching solution for wafer-level packaging |
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