JP2002194573A - Surface treatment agent for copper and copper alloy - Google Patents
Surface treatment agent for copper and copper alloyInfo
- Publication number
- JP2002194573A JP2002194573A JP2000397353A JP2000397353A JP2002194573A JP 2002194573 A JP2002194573 A JP 2002194573A JP 2000397353 A JP2000397353 A JP 2000397353A JP 2000397353 A JP2000397353 A JP 2000397353A JP 2002194573 A JP2002194573 A JP 2002194573A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- weight
- tetrazole
- surface treatment
- treatment agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、銅および銅合金の
表面処理剤に関するものである。特に、電子工業分野に
おけるプリント配線板等の製造に有用な銅および銅合金
の表面処理剤に関するものである。[0001] The present invention relates to a surface treating agent for copper and copper alloys. In particular, the present invention relates to a copper and copper alloy surface treatment agent useful for manufacturing printed wiring boards and the like in the electronics industry.
【０００２】[0002]
【従来の技術】プリント配線板の製造においては、銅表
面をドライフィルムなどのエッチングフォトレジストや
ソルダーレジストで被覆するにあたり、これらレジスト
と銅表面の密着性を向上させる目的で、銅表面を研磨す
ることが行われている。研磨の方法としては、バフ研磨
などの機械的研磨や、化学薬品との接触による化学研磨
があるが、細線パターンを有する基板の処理には化学研
磨が用いられている。2. Description of the Related Art In the production of printed wiring boards, when the copper surface is coated with an etching photoresist such as a dry film or a solder resist, the copper surface is polished for the purpose of improving the adhesion between the resist and the copper surface. That is being done. Examples of the polishing method include mechanical polishing such as buffing and chemical polishing by contact with a chemical, and chemical polishing is used for processing a substrate having a fine line pattern.
【０００３】特開昭５１−２７８１９号公報には、過酸
化水素、硫酸系に５−アミノテトラゾールを含有させた
水溶液にて銅および銅合金をエッチングすることが提案
されている。しかし、この方法においては銅表面を均一
な面にすることが困難であるため、レジストとの密着性
に劣る部分を生ずる不具合がある。この問題を解決する
ため、特開２０００−２９７３８７号公報においては、
過酸化水素、硫酸系に５−アミノ−１Ｈ−テトラゾール
とフェニル尿素を含有させた水溶液にて銅および銅合金
をエッチングし表面を均一に粗面化する方法が提案され
ている。JP-A-51-27819 proposes to etch copper and copper alloys with an aqueous solution containing hydrogen peroxide and sulfuric acid containing 5-aminotetrazole. However, in this method, since it is difficult to make the copper surface uniform, there is a problem that a portion having poor adhesion to the resist is generated. To solve this problem, Japanese Patent Laid-Open No. 2000-297387 discloses that
A method of etching copper and a copper alloy with an aqueous solution containing hydrogen peroxide and sulfuric acid and containing 5-amino-1H-tetrazole and phenylurea to uniformly roughen the surface has been proposed.
【０００４】[0004]
【発明が解決しようとする課題】本発明の目的は、銅お
よび銅合金、特に電子工業分野における電解銅箔および
銅メッキの表面を均一な粗面化状態にでき、かつ、連続
使用に際して、経時的に安定な銅粗面化状態が得られる
表面処理剤を提供し、さらには銅表面の粗面化方法を提
供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a copper and copper alloy, particularly an electrolytic copper foil and a copper plating surface in the field of electronics industry, which can be uniformly roughened, and which can be used for a long time when used continuously. It is an object of the present invention to provide a surface treatment agent capable of obtaining a stable copper roughened state, and to provide a copper surface roughening method.
【０００５】[0005]
【課題を解決するための手段】本発明者らは、上記課題
を解決すべく、鋭意検討を重ねた結果、過酸化水素と鉱
酸からなる水溶液に、アゾール類と銀イオンを含有させ
ることで、銅表面を安定的に均一な粗面とすることが可
能となることを見出し、本発明に到達した。すなわち、
本発明は、過酸化水素、鉱酸、アゾール類および銀イオ
ンを含有する銅および銅合金の表面処理剤に関するもの
である。Means for Solving the Problems The inventors of the present invention have made intensive studies to solve the above-mentioned problems, and as a result, have found that an aqueous solution containing hydrogen peroxide and a mineral acid contains azoles and silver ions. The present inventors have found that it is possible to stably form a uniform rough surface on a copper surface, and have reached the present invention. That is,
The present invention relates to a surface treatment agent for copper and copper alloys containing hydrogen peroxide, mineral acids, azoles and silver ions.
【０００６】[0006]
【発明の実施の形態】本発明の過酸化水素の濃度は、
０．２〜１５重量％で処理が可能であるが、特に０．５
〜１０重量％が好適でり、より好ましくは０．５〜５重
量％ある。０．５重量％未満の過酸化水素濃度では管理
が煩雑かつ研磨速度が不足し、過酸化水素濃度が１０重
量％を超すと、エッチング速度が速すぎるため研磨量の
制御が困難となる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The concentration of hydrogen peroxide of the present invention is as follows:
The treatment can be performed at 0.2 to 15% by weight,
It is preferably from 10 to 10% by weight, more preferably from 0.5 to 5% by weight. If the concentration of hydrogen peroxide is less than 0.5% by weight, the management becomes complicated and the polishing rate is insufficient. If the concentration of hydrogen peroxide exceeds 10% by weight, the etching rate is too high and the control of the polishing amount becomes difficult.
【０００７】本発明の鉱酸としては、硫酸、硝酸、リン
酸等を用いることができ、また混酸であっても良いが、
硫酸が好ましい。硫酸の濃度は、０．３重量％以上含有
していれば処理が可能であるが、特に０．５〜１５重量
％が好適である。硫酸濃度が０．５重量％未満では処理
時の液管理が煩雑となり、硫酸濃度が１５重量％を超え
ると銅を溶解する過程において硫酸銅の溶解度が低下し
硫酸銅結晶を析出する。[0007] As the mineral acid of the present invention, sulfuric acid, nitric acid, phosphoric acid and the like can be used.
Sulfuric acid is preferred. The treatment can be performed if the sulfuric acid concentration is 0.3% by weight or more, but is preferably 0.5 to 15% by weight. When the sulfuric acid concentration is less than 0.5% by weight, the liquid management during the treatment becomes complicated, and when the sulfuric acid concentration exceeds 15% by weight, the solubility of copper sulfate is reduced in the process of dissolving copper, and copper sulfate crystals are precipitated.
【０００８】本発明のアゾール類として、ジアゾール、
トリアゾール、テトラゾールおよびそれらの誘導体が挙
げられ、好ましくはテトラゾールおよびその誘導体であ
るテトラゾール類である。テトラゾール類の濃度は、
０．０１〜１重量％であり、より好ましくは０．０５〜
０．５重量％である。０．０１重量％未満では粗面化の
効果が小さく、密着性の向上に寄与できず、また、１重
量％を超えると銅溶解速度が低下し生産効率の低下を招
き好ましくない。The azoles of the present invention include diazoles,
Examples include triazole, tetrazole and derivatives thereof, and preferred are tetrazole and tetrazole derivatives thereof. The concentration of tetrazoles is
0.01 to 1% by weight, more preferably 0.05 to 1% by weight.
0.5% by weight. If it is less than 0.01% by weight, the effect of surface roughening is small and it cannot contribute to the improvement of the adhesion.
【０００９】本発明に使用するテトラゾール類は、１Ｈ
−テトラゾール、５−メチル−１Ｈ−テトラゾール、５
−フェニル−１Ｈ−テトラゾールおよび５−アミノ−１
Ｈ−テトラゾールからなる群から選ばれる一種が使用で
き、特に５−アミノ−１Ｈ−テトラゾールが好適に使用
できる。The tetrazole used in the present invention is 1H
-Tetrazole, 5-methyl-1H-tetrazole, 5
-Phenyl-1H-tetrazole and 5-amino-1
One selected from the group consisting of H-tetrazole can be used, and particularly, 5-amino-1H-tetrazole can be suitably used.
【００１０】本発明の銀イオン濃度は、０．１〜１０重
量ｐｐｍであり、より好ましくは０．１〜３．０重量ｐ
ｐｍが好適である。０．１重量ｐｐｍ未満では粗面化の
効果が小さく、１０重量ｐｐｍを超えると銅表面の銀析
出量が多くなり、表面が黒色に変化する。銀イオン源と
しては、前記濃度範囲において水溶性を有する硝酸銀な
どの銀化合物が使用できる。The silver ion concentration of the present invention is 0.1 to 10 ppm by weight, more preferably 0.1 to 3.0% by weight.
pm is preferred. If it is less than 0.1 ppm by weight, the effect of surface roughening is small. If it exceeds 10 ppm by weight, the amount of silver deposited on the copper surface increases, and the surface turns black. As a silver ion source, a silver compound such as silver nitrate having water solubility in the above concentration range can be used.
【００１１】本発明の表面処理剤は、各組成物を使用時
に定められた含有量になるようにそれぞれ添加しても良
いが、予め配合しておくことも可能である。従って、濃
厚液を調製した後、本発明で定めた含有量になるように
水で希釈して使用するのが好都合である。前記水として
は、イオン交換水が望ましい。本発明の表面処理剤は、
アルコール類、有機カルボン酸類、有機アミン化合物類
等の公知の過酸化水素安定剤や、エッチング速度促進剤
等を必要に応じて添加しても良い。The surface treating agent of the present invention may be added to each composition so as to have a predetermined content at the time of use, but may be previously blended. Therefore, it is convenient to prepare a concentrated solution and then dilute it with water so as to have the content specified in the present invention. As the water, ion-exchanged water is desirable. The surface treatment agent of the present invention,
Known hydrogen peroxide stabilizers such as alcohols, organic carboxylic acids, and organic amine compounds, and etching rate accelerators may be added as necessary.
【００１２】本発明の表面処理剤を用いて電解銅箔を使
用した銅張り基板および銅メッキ基板を処理する方法に
は、特に制限はないが、スプレーエッチングマシンを使
用したスプレー法やエッチング槽での揺動、ポンプ循環
による浸漬法などの任意の方法にて処理できる。処理の
温度にも特に制限はないが、２０〜５０℃の範囲から要
望するエッチング速度に合わせて任意に温度設定するこ
とが出来る。The method for treating a copper-clad substrate using an electrolytic copper foil and a copper-plated substrate using the surface treating agent of the present invention is not particularly limited. Can be processed by an arbitrary method such as rocking of the liquid and immersion by pump circulation. There is no particular limitation on the processing temperature, but the temperature can be arbitrarily set in the range of 20 to 50 ° C. in accordance with the desired etching rate.
【００１３】銅表面のエッチング量は、要望する表面の
粗化程度により設定でき、通常、０．５〜５μｍの範囲
から設定される。０．５μｍ未満では表面の処理が不充
分であり、５μｍを超える処理では表面処理効果の向上
が見られないため粗面化を目的とする過度のエッチング
は経済的に不利となる。ただし、銅の厚さを薄くする必
要がある場合など他の目的を有する場合には、５μｍを
超えるエッチングを行っても表面の粗面は維持され、問
題なく使用できる。The amount of etching of the copper surface can be set according to the desired degree of surface roughening, and is usually set in the range of 0.5 to 5 μm. If it is less than 0.5 μm, the surface treatment is insufficient, and if it exceeds 5 μm, the surface treatment effect is not improved, so that excessive etching for the purpose of roughening is economically disadvantageous. However, when there is another purpose such as when it is necessary to reduce the thickness of copper, even if etching exceeding 5 μm is performed, the rough surface can be maintained and used without any problem.
【００１４】処理液の管理については、銅の処理量に応
じて、処理液液中の銅濃度の上昇と成分低下が生じるた
め、各成分量をそれぞれ分析により算出し、不足分を補
充すれば良い。この補充方法としては、各成分を個別に
補充する方法でも、銅溶解量、処理液成分の分析によ
り、予め求められた不足成分量をその比率で混合したい
わゆる補充液による方法でも、安定的な処理面が連続し
て得られる。この際、一部の処理液が廃棄されることに
よって、処理液中に含有される銅濃度上昇に伴う硫酸銅
結晶の析出が抑えられる。Regarding the management of the processing solution, since the copper concentration in the processing solution increases and the components decrease in accordance with the amount of copper to be processed, the amounts of the respective components are calculated by analysis, and the shortage is replenished. good. As the replenishment method, either a method of individually replenishing each component, a method using a so-called replenisher in which the amount of copper dissolved and the amount of the deficient component determined in advance by analysis of the components of the processing solution are mixed at the same ratio, and stable. The processing surface is obtained continuously. At this time, since a part of the processing solution is discarded, precipitation of copper sulfate crystals due to an increase in the concentration of copper contained in the processing solution is suppressed.
【００１５】本発明の表面処理剤は、レジストやプリプ
レグの塗布、貼付けのための前処理に限らず、プリント
配線板製造工程の各種前処理に好適に使用できる。具体
的には、無電解メッキ前処理、電解メッキ前処理、プリ
フラックス前処理、半田ホットレベラー前処理などに使
用できる。The surface treating agent of the present invention can be suitably used not only for pretreatment for applying and pasting a resist or prepreg, but also for various pretreatments in a printed wiring board manufacturing process. Specifically, it can be used for electroless plating pretreatment, electrolytic plating pretreatment, preflux pretreatment, solder hot leveler pretreatment, and the like.
【００１６】[0016]
【実施例】以下に本発明を実施例によって説明するが、
本発明は実施例によって制限されるものではない。処理
表面の評価は、光沢度、色差で示した。光沢度は、表面
の粗化度合いが大きくなるほど値は小さくなる。色差
は、表面の色調が安定である指標として測定を行い、Ｌ
値：白(＋)⇔黒(−)、ａ値：赤(＋)⇔緑(−)、ｂ値：黄
(＋)⇔青(−)で表される。EXAMPLES The present invention will be described below with reference to examples.
The present invention is not limited by the embodiments. The evaluation of the treated surface was indicated by glossiness and color difference. The value of the gloss decreases as the degree of surface roughening increases. The color difference is measured as an indicator that the color tone of the surface is stable.
Value: white (+) ⇔ black (-), a value: red (+) ⇔ green (-), b value: yellow
(+) ⇔Blue (-).
【００１７】実施例１ 過酸化水素１重量％、硫酸７重量％、５−アミノ−１Ｈ
−テトラゾール０．１重量％、銀イオン０．２重量ｐｐ
ｍからなる表面処理剤１０Ｌにて、スプレーエッチング
マシンを用いてスプレー圧０．１ＭＰａ、処理温度３０
℃で電気銅メッキ基板（１５０×１５０ｍｍ）表面につ
いて１μｍ溶解処理を行った。処理基板の表面の光沢
度、色差を測定した。Example 1 1% by weight of hydrogen peroxide, 7% by weight of sulfuric acid, 5-amino-1H
-0.1% by weight of tetrazole, 0.2% by weight of silver ion pp
m with a surface treatment agent of 10 m, a spray pressure of 0.1 MPa and a processing temperature of 30 using a spray etching machine.
At 1 ° C., a 1 μm dissolution treatment was performed on the surface of the electroplated copper substrate (150 × 150 mm). The glossiness and color difference of the surface of the processed substrate were measured.
【００１８】実施例２ 電気銅メッキ基板の代わりに電解銅箔基板を用いて処理
をした以外は実施例１と同様に処理した。Example 2 A treatment was performed in the same manner as in Example 1 except that an electrolytic copper foil substrate was used instead of the electrolytic copper plating substrate.
【００１９】実施例３ ５−アミノ−１Ｈ−テトラゾール０．５重量％、銀イオ
ン１．０重量ｐｐｍとした以外は実施例１と同様に処理
した。Example 3 The same treatment as in Example 1 was conducted except that 0.5% by weight of 5-amino-1H-tetrazole and 1.0% by weight of silver ions were used.
【００２０】実施例４ 電気銅メッキ基板の代わりに電解銅箔基板を用いて処理
をした以外は実施例３と同様に処理した。Example 4 A treatment was performed in the same manner as in Example 3 except that an electrolytic copper foil substrate was used instead of the electrolytic copper plating substrate.
【００２１】実施例５ ５−アミノ−１Ｈ−テトラゾールの代わりに１Ｈ−テト
ラゾール０．５重量％、とした以外は実施例１と同様に
処理した。Example 5 The same treatment as in Example 1 was carried out except that 0.5% by weight of 1H-tetrazole was used instead of 5-amino-1H-tetrazole.
【００２２】実施例６ 電気銅メッキ基板の代わりに電解銅箔基板を用いて処理
をした以外は実施例５と同様に処理した。Example 6 A process was performed in the same manner as in Example 5, except that the electrolytic copper foil substrate was used instead of the electrolytic copper plated substrate.
【００２３】比較例１ 過酸化水素１重量％、硫酸７重量％からなる表面処理剤
１０Ｌにて、スプレーエッチングマシンを用いてスプレ
ー圧０．１ＭＰａ、処理温度３０℃で電気銅メッキ基板
（１５０×１５０ｍｍ）表面について１μｍ溶解処理を
行った。処理基板の表面の光沢度、色差を測定した。COMPARATIVE EXAMPLE 1 Using a spray etching machine, a spray pressure of 0.1 MPa, a spray pressure of 0.1 MPa and a processing temperature of 30.degree. 150 mm) 1 μm dissolution treatment was performed on the surface. The glossiness and color difference of the surface of the processed substrate were measured.
【００２４】比較例２ 電気銅メッキ基板の代わりに電解銅箔基板を用いて処理
をした以外は比較例１と同様に処理した。Comparative Example 2 The same treatment as in Comparative Example 1 was carried out except that an electrolytic copper foil substrate was used instead of the electrolytic copper plating substrate.
【００２５】比較例３ ５−アミノ−１Ｈ−テトラゾールを０．５重量％加えた
以外は比較例１と同様に処理した。Comparative Example 3 The same treatment as in Comparative Example 1 was carried out except that 0.5% by weight of 5-amino-1H-tetrazole was added.
【００２６】比較例４ 電気銅メッキ基板の代わりに電解銅箔基板を用いて処理
をした以外は比較例３と同様に処理した。Comparative Example 4 A treatment was performed in the same manner as in Comparative Example 3 except that an electrolytic copper foil substrate was used instead of the electrolytic copper plating substrate.
【００２７】比較例５ 銀イオンを０．５重量ｐｐｍ加えた以外は比較例１と同
様に処理した。Comparative Example 5 The same treatment as in Comparative Example 1 was carried out except that 0.5% by weight of silver ion was added.
【００２８】比較例６ 電気銅メッキ基板の代わりに電解銅箔基板を用いて処理
をした以外は比較例５と同様に処理した。Comparative Example 6 A treatment was performed in the same manner as in Comparative Example 5, except that an electrolytic copper foil substrate was used instead of the electrolytic copper plating substrate.
【００２９】比較例７ １Ｈ−テトラゾールを０．５重量％加えた以外は比較例
１と同様に処理した。Comparative Example 7 The procedure of Comparative Example 1 was repeated except that 0.5% by weight of 1H-tetrazole was added.
【００３０】比較例８ 電気銅メッキ基板の代わりに電解銅箔基板を用いて処理
をした以外は比較例７と同様に処理した。Comparative Example 8 The same treatment as in Comparative Example 7 was carried out except that the electrolytic copper foil substrate was used instead of the electrolytic copper plated substrate.
【００３１】[0031]
【表１】 [Table 1]
【００３２】表１に示される結果より、テトラゾール類
と銀イオンを含有することで粗化度の向上した表面が得
られる。From the results shown in Table 1, it is possible to obtain a surface having an improved degree of roughness by containing a tetrazole and silver ions.
【００３３】実施例７ 過酸化水素２重量％、硫酸１０重量％、５−アミノ−１
Ｈ−テトラゾール０．２重量％、銀イオン０．５重量ｐ
ｐｍからなる表面処理剤４００Ｌにて、スプレーエッチ
ングマシンを用いてスプレー圧０．１ＭＰａで電気銅メ
ッキ基板（５００×３００ｍｍ）について２０００枚連
続処理を行った。過酸化水素、硫酸、５−アミノ−１Ｈ
−テトラゾール、銀イオンは基板を１枚処理する毎に補
充補正を行った。銅濃度は０ｇ／ｌよりスタートし、３
０ｇ／ｌ付近でバランスする様一部処理液を破棄した。
表面を１μｍ溶解処理した処理電気銅メッキ基板の表面
の光沢度、色差を測定した。Example 7 2% by weight of hydrogen peroxide, 10% by weight of sulfuric acid, 5-amino-1
H-tetrazole 0.2% by weight, silver ion 0.5% by weight
2,000 sheets of electroplated copper substrates (500 × 300 mm) were continuously treated with 400 L of a surface treating agent composed of pm at a spray pressure of 0.1 MPa using a spray etching machine. Hydrogen peroxide, sulfuric acid, 5-amino-1H
-Replenishment correction was performed for tetrazole and silver ions each time one substrate was processed. The copper concentration starts from 0 g / l,
A part of the processing solution was discarded so as to balance around 0 g / l.
The glossiness and color difference of the surface of the treated electrolytic copper-plated substrate whose surface was dissolved by 1 μm were measured.
【００３４】比較例９ 過酸化水素２重量％、硫酸１０重量％、５−アミノ−１
Ｈ−テトラゾール０．２重量％からなる表面処理剤４０
０Ｌにて、スプレーエッチングマシンを用いてスプレー
圧０．１ＭＰａで電気銅メッキ基板（５００×３００ｍ
ｍ）について２０００枚連続処理を行った。過酸化水
素、硫酸、５−アミノ−１Ｈ−テトラゾールは基板を１
枚処理する毎に補充補正を行った。銅濃度は０ｇ／ｌよ
りスタートし、３０ｇ／ｌ付近でバランスする様一部処
理液を破棄した。表面を１μｍ溶解処理した電気銅メッ
キ基板の表面の光沢度、色差を測定した。Comparative Example 9 Hydrogen peroxide 2% by weight, sulfuric acid 10% by weight, 5-amino-1
Surface treatment agent 40 consisting of 0.2% by weight of H-tetrazole
0 L, using a spray etching machine at a spray pressure of 0.1 MPa, using an electrolytic copper-plated substrate (500 × 300 m
For m), 2,000 sheets were continuously processed. Hydrogen peroxide, sulfuric acid and 5-amino-1H-tetrazole
Replenishment correction was performed each time one sheet was processed. The copper concentration was started from 0 g / l, and a part of the processing solution was discarded so as to balance around 30 g / l. The glossiness and color difference of the surface of the electrolytic copper-plated substrate whose surface was dissolved by 1 μm were measured.
【００３５】[0035]
【表２】 [Table 2]
【００３６】表２に示されるように、各成分の量を補充
しながら連続処理を行った際に、銅濃度０ｇ／ｌの初浴
から銅濃度に影響されずに安定的に均一な粗化処理面が
連続して得られる。As shown in Table 2, when the continuous treatment was carried out while replenishing the amounts of the respective components, the first bath having a copper concentration of 0 g / l was stable and uniform without being affected by the copper concentration. The processing surface is obtained continuously.
【００３７】[0037]
【発明の効果】本発明の表面処理剤は、銅、銅合金の表
面を粗化することが出来、従来困難であったメッキされ
た鏡面を含む銅張り基板に均一にムラの無い粗化表面を
形成し、エッチングレジスト、ソルダーレジストに加
え、プリプレグ、電子部品実装時における樹脂との密着
性を格段に向上させる技術と為したものであり、産業上
の利用価値は極めて高いものである。The surface treatment agent of the present invention can roughen the surface of copper and copper alloys, and has a rough surface that is evenly uniform on a copper-clad substrate including a plated mirror surface, which has been difficult in the past. And a technique for remarkably improving the adhesion to a resin at the time of mounting a prepreg or an electronic component, in addition to an etching resist and a solder resist, and has a very high industrial utility value.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 高橋 健一 神奈川県足柄上郡山北町950番地 三菱瓦 斯化学株式会社山北工場内 (72)発明者 池田 和彦 神奈川県足柄上郡山北町950番地 三菱瓦 斯化学株式会社山北工場内 (72)発明者 細田 篤史 神奈川県足柄上郡山北町950番地 三菱瓦 斯化学株式会社山北工場内 Ｆターム(参考） 4K057 WA05 WB04 WE03 WE25 WE30 WG03 WN02 5E343 AA02 AA12 BB24 BB67 BB71 DD32 EE52 FF16 GG04 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Kenichi Takahashi 950, Yamakita-machi, Ashigakami-gun, Kanagawa Prefecture Mitsubishi Gas Chemical Co., Ltd. Inside the Yamakita Plant (72) Inventor Atsushi Hosoda 950 Yamakita-cho, Ashigarashimo-gun, Kanagawa Prefecture Mitsubishi Gas Chemical Company Yamakita Plant F-term (reference) 4K057 WA05 WB04 WE03 WE25 WE30 WG03 WN02 5E343 AA02 AA12 BB24 BB67 BB71 DD32 EE52 FF16
Claims (6)
イオンを含有する水溶液である銅および銅合金の表面処
理剤。1. A surface treating agent for copper and a copper alloy which is an aqueous solution containing hydrogen peroxide, a mineral acid, azoles and silver ions.
理剤。2. The surface treating agent according to claim 1, wherein the mineral acid is sulfuric acid.
メチル−１Ｈ−テトラゾール、５−フェニル−１Ｈ−テ
トラゾールおよび５−アミノ−１Ｈ−テトラゾールから
なる群から選ばれる一種である請求項１記載の表面処理
剤。3. The azoles are 1H-tetrazole, 5-
The surface treating agent according to claim 1, which is one kind selected from the group consisting of methyl-1H-tetrazole, 5-phenyl-1H-tetrazole and 5-amino-1H-tetrazole.
０．５〜１５重量％、アゾール類０．０１〜１重量％お
よび銀イオン０．１〜１０ｐｐｍ含有する請求項１記載
の表面処理剤。4. The method according to claim 1, comprising 0.5 to 10% by weight of hydrogen peroxide, 0.5 to 15% by weight of a mineral acid, 0.01 to 1% by weight of azoles and 0.1 to 10 ppm of silver ions. Surface treatment agent.
り基板の表面処理方法。5. A surface treatment method for a copper-clad substrate using the surface treatment agent according to claim 1.
ッキ基板の表面処理方法。6. A method for treating a copper-plated substrate using the surface treating agent according to claim 1.
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|---|---|---|---|
| JP2000397353A JP2002194573A (en) | 2000-12-27 | 2000-12-27 | Surface treatment agent for copper and copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000397353A JP2002194573A (en) | 2000-12-27 | 2000-12-27 | Surface treatment agent for copper and copper alloy |
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|---|---|
| JP2002194573A true JP2002194573A (en) | 2002-07-10 |
Family
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Cited By (5)
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|---|---|---|---|---|
| JP2004003020A (en) * | 2000-12-27 | 2004-01-08 | Ebara Udylite Kk | Micro-etching agent for copper and copper alloy and method for micro-roughening copper or copper alloy by using the agent |
| JP2009105286A (en) * | 2007-10-24 | 2009-05-14 | Mitsui Mining & Smelting Co Ltd | Surface-processed copper foil |
| KR101084815B1 (en) * | 2007-04-02 | 2011-11-21 | 멧쿠 가부시키가이샤 | Method for manufacturing substrate, and surface treating agent for copper used in the same |
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-
2000
- 2000-12-27 JP JP2000397353A patent/JP2002194573A/en not_active Withdrawn
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|---|---|---|---|---|
| JP2004003020A (en) * | 2000-12-27 | 2004-01-08 | Ebara Udylite Kk | Micro-etching agent for copper and copper alloy and method for micro-roughening copper or copper alloy by using the agent |
| KR101084815B1 (en) * | 2007-04-02 | 2011-11-21 | 멧쿠 가부시키가이샤 | Method for manufacturing substrate, and surface treating agent for copper used in the same |
| TWI396774B (en) * | 2007-04-02 | 2013-05-21 | Mec Co Ltd | A substrate manufacturing method and a copper surface treatment agent used therefor |
| JP2009105286A (en) * | 2007-10-24 | 2009-05-14 | Mitsui Mining & Smelting Co Ltd | Surface-processed copper foil |
| WO2019098168A1 (en) * | 2017-11-14 | 2019-05-23 | 大日本印刷株式会社 | Metal plate for producing vapor deposition masks, inspection method for metal plates, production method for metal plates, vapor deposition mask, vapor deposition mask device, and production method for vapor deposition masks |
| JPWO2019098168A1 (en) * | 2017-11-14 | 2019-11-14 | 大日本印刷株式会社 | Metal plate for manufacturing vapor deposition mask, metal plate inspection method, metal plate production method, vapor deposition mask, vapor deposition mask device, and vapor deposition mask production method |
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| JP2020190033A (en) * | 2017-11-14 | 2020-11-26 | 大日本印刷株式会社 | Metal plate for manufacturing vapor deposition mask, method for inspecting metal plate, method for manufacturing metal plate, vapor deposition mask, vapor deposition mask device and method for manufacturing vapor deposition mask |
| US11237481B2 (en) | 2017-11-14 | 2022-02-01 | Dai Nippon Printing Co., Ltd. | Metal plate for manufacturing deposition mask and manufacturing method for metal plate, and deposition mask and manufacturing method for deposition mask |
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| CN110158071B (en) * | 2019-06-26 | 2021-11-23 | 匡云叶 | Surface treatment liquid for copper and surface treatment method |
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