JP2003105057A - Epoxy resin composition and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is excellent in reliability, such as of peeling resistance and bulging properties, during reflow and in mold release characteristics in molding. SOLUTION: This resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an organopolysiloxane, and (D) a filler. The epoxy resin is of a tetramethylbisphenol F type represented by formula (I). The organopolysiloxane is a modified organopolysiloxane prepared by reacting an organopolysiloxane with an epoxy resin or a curing agent.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition which is excellent in reflow reliability, moldability and releasability and is particularly suitable for semiconductor encapsulation.

[0002]

2. Description of the Related Art Conventionally, as a sealing method for electronic circuit parts such as semiconductor devices, phenolic resin, silicone resin, and hermetic seals made of metal or ceramics have been used.
Resin encapsulation with an epoxy resin or the like has been proposed, and a resin used for such encapsulation is generally called an encapsulant resin. Among them, the resin encapsulation with an epoxy resin is most actively used from the viewpoint of the balance of economic efficiency, productivity and physical properties. And the sealing method with epoxy resin is
A method in which a semiconductor element is set in a mold and sealed by a transfer molding method or the like using a composition obtained by adding a curing agent, a filler and the like to an epoxy resin is generally used.

Recently, the mounting of a semiconductor device package on a printed circuit board has been increased in density and automation. Instead of the conventional "insertion mounting method" in which lead pins are inserted into holes in the board, the semiconductor device package is mounted on the surface of the substrate. "Surface mounting method" for soldering solder has become popular. Along with this, the semiconductor device package has changed from the conventional DIP (dual in-line package) to a thin FPP (flat plastic package) suitable for high-density mounting and surface mounting.
Package). Among them, recently
Due to advances in fine processing technology, TSO with a thickness of 2 mm or less
P, TQFP and LQFP are becoming mainstream. Therefore, it becomes more susceptible to external influences such as humidity and temperature, and reliability such as reflow reliability, high temperature reliability, and moisture resistance reliability will become more important in the future. In particular, recently, it has been demanded to improve the reflow reliability in a package having a thickness of 1 mm or less such as TSOP and TQFP.

In surface mounting, solder reflow is usually used for mounting. In this method, a semiconductor device package is placed on a substrate, exposed to a high temperature of 200 ° C. or higher, and the solder previously attached to the substrate is melted to adhere the semiconductor device package to the substrate surface. In such a mounting method, since the entire semiconductor device package is exposed to high temperature, if the hygroscopicity of the sealing resin is high, peeling may occur between the sealing resin and the semiconductor chip, or between the sealing resin and the lead frame, A phenomenon occurs in which moisture absorbed absorbs explosive expansion during solder reflow to generate cracks. In the case of a thin package, the silver paste layer absorbs moisture and peels from the interface with the silicon chip or the lead frame during reflow, and the package bottom is pushed down to swell the package bottom (swelling characteristic), which is a problem. Furthermore, in recent years, lead-free solders that do not contain lead have been used from the viewpoint of environmental protection, but lead-free solders have a high melting point, which increases the reflow temperature, resulting in higher reflow reliability. It has been demanded.

For the purpose of improving reflow resistance, an epoxy resin composition containing a polyether group-containing organopolysiloxane as a stress-reducing agent has been proposed (Japanese Patent Laid-Open No. 11-1999).
-106612 publication). However, although a remarkable effect can be exhibited in lowering the stress, the presence of a polyether group in the molecule lowers the adhesive force when absorbing moisture, and as a result, it was not sufficient to satisfy the reflow property higher than ever. .

Further, a resin composition having a good releasability is required from the viewpoints of continuous moldability / productivity improvement and damage to a package at the time of molding, but in general, releasability is greatly improved. If it is too much, the adhesiveness between the substrate and the resin will be deteriorated and the reflow resistance will be deteriorated. Therefore, there has not been proposed yet one that simultaneously achieves both the reflow resistance and the releasability. Further, there is a demand for a resin composition having further reflow resistance, particularly excellent swelling characteristics in a package having a thickness of 1 mm or less.

[0007]

SUMMARY OF THE INVENTION The object of the present invention has been made in view of the above circumstances, and has excellent reflow reliability at higher reflow temperatures, and releasability during continuous molding. An object of the present invention is to provide an epoxy resin composition having an excellent package appearance and a semiconductor device encapsulated with the epoxy resin composition.

[0008]

The present inventors have arrived at the present invention as a result of extensive studies to achieve the above object.

The present invention mainly has the following configurations. That is, "an epoxy resin composition containing an epoxy resin (A), a curing agent (B), an organopolysiloxane (C), and a filler (D), wherein the epoxy resin (A) has the following chemical formula (I): An epoxy resin composition comprising the represented tetramethylbisphenol F type epoxy resin.

[0010]

[Chemical 4] It is.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below.

The present invention includes, as essential components, an epoxy resin (A), a curing agent (B), and an organopolysiloxane (C).
And a filler (D).

In the present invention, the epoxy resin (A) is tetramethylbisphenol F represented by the chemical formula (I).
A type epoxy resin is contained as an essential component.

[0014]

[Chemical 5]

By incorporating the tetramethylbisphenol F type epoxy resin represented by the chemical formula (I) into the epoxy resin, the swelling property during reflow is improved. Also,
The epoxy resin has an excellent package surface appearance during continuous molding. Furthermore, the effect of lowering the viscosity and improving the moldability can be obtained. The content of the tetramethylbisphenol F type epoxy resin epoxy resin represented by the chemical formula (I) is preferably 10% by weight or more based on the total amount of the epoxy resin (A),
If it is 10% or less, the fluidity does not decrease and 90
%, The adhesiveness of the chip surface will not be reduced.

Depending on the application, an epoxy resin other than the epoxy resin represented by the chemical formula (I) may be used in combination. The other epoxy resin is not particularly limited as long as it is a compound having two or more epoxy groups in one molecule, and includes all monomers, oligomers and polymers. For example, bisphenol F type epoxy resin having no alkyl substituent, cresol novolac type epoxy resin, phenol novolac type epoxy resin, 4,4′-bis (2,3-epoxypropoxy) biphenyl, 4,4′-bis (2,2 3-
Epoxypropoxy) -3,3 ', 5,5'-tetramethylbiphenyl, 4,4'-bis (2,3-epoxypropoxy) -3,3', 5,5'-tetraethylbiphenyl, 4,4 ' -Bis (2,3-epoxypropoxy)
Biphenyl type epoxy resin such as -3,3 ', 5,5'-tetrabutylbiphenyl, phenol aralkyl type epoxy resin, naphthalene type epoxy resin, bisphenol A type epoxy resin, triphenol type epoxy resin,
Examples thereof include dicyclopentadiene skeleton-containing epoxy resin, triphenylmethane type epoxy resin, and halogenated epoxy resin. 2 as other epoxy resin
You may use 1 or more types.

When two or more epoxy resins are used in combination,
Particularly preferred as the other epoxy resin other than the epoxy resin represented by the chemical formula (I) are, for example, 4,4′-bis (2,3-epoxypropoxy) -3,3 ′, 5,5 ′.
-Tetramethylbiphenyl, bisphenol F type epoxy resin having no alkyl substituent, bisphenol A type epoxy resin and the like.

The amount of the epoxy resin (A) compounded is usually 0.5 to 10% by weight, especially 1
~ 6 wt% is preferred.

The curing agent (B) in the present invention is not particularly limited as long as it cures by reacting with the epoxy resin (A), and specific examples thereof include, for example, phenol novolac, cresol novolac and naphthol novolac. Novolak resin, phenol aralkyl resin,
Biphenyl skeleton-containing phenol aralkyl resin, dicyclopentadiene skeleton-containing phenol resin, naphthol aralkyl resin, bisphenol compounds such as bisphenol A, maleic anhydride, phthalic anhydride, pyromellitic anhydride and other acid anhydrides, and metaphenylenediamine,
Examples thereof include aromatic amines such as diaminodiphenylmethane and diaminodiphenylsulfone, which may be used alone or in combination of two or more kinds of curing agents. The melt viscosity of the curing agent (B) is 1 Pa in terms of ICI (150 ° C) viscosity.
s or less, more preferably 0.3 Pa · s or less is particularly preferably used.

Among the curing agents (B), a phenol aralkyl resin is used as a particularly preferable curing agent from the viewpoint of reflow reliability, and a p-xylene type phenol aralkyl resin is more preferable.

When two or more curing agents are used in combination, the content of the curing agent is more preferably 10% by weight or more based on the total amount of the curing agent (B) from the viewpoint of improving the swelling property.
It is more preferably 0% by weight or more.

The content of the curing agent (B) is usually 0.5 to 10% by weight, preferably 1 to 6% by weight, based on the whole epoxy resin composition. Further, the compounding ratio of the epoxy resin (A) and the curing agent (B) is such that the chemical equivalent ratio of the curing agent (B) to the epoxy resin (A) is 0.5-1. 5, especially in the range of 0.7 to 1.3.

Further, in the present invention, the epoxy resin (A)
A curing catalyst may be used to accelerate the curing reaction of the curing agent (B). The curing catalyst is not particularly limited as long as it accelerates the curing reaction, and for example, 2-methylimidazole,
Imidazole compounds such as 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole, triethylamine, benzyldimethylamine, α-methylbenzyl Methylamine, 2- (dimethylaminomethyl) phenol,
Tertiary amine compounds such as 2,4,6-tris (dimethylaminomethyl) phenol, 1,8-diazabicyclo (5,4,0) undecene-7, zirconium tetramethoxide, zirconium tetrapropoxide, tetrakis (acetylacetate) Nato) zirconium, an organometallic compound such as tri (acetylacetonato) aluminum, and triphenylphosphine, tetraphenylphosphonium tetraphenylborate salt, trimethylphosphine, triethylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine, Organic phosphine compounds such as tri (nonylphenyl) phosphine may be mentioned. Among them, organic phosphine compounds are preferable from the viewpoint of reliability and moldability, and triphenylphosphine is particularly preferably used. Two or more kinds of these curing catalysts may be used in combination depending on the use, and the addition amount thereof is preferably in the range of 0.1 to 10 parts by weight with respect to 100 parts by weight of the epoxy resin (A).

Specific examples of the organopolysiloxane (C) in the present invention include BY16-853 (polysiloxane containing amino groups at both ends) and BY16-750 (polysiloxane containing carboxyl groups at both ends) manufactured by Toray Dow Corning Silicone Co., Ltd. Siloxane), BY16-752 (polysiloxane containing phenol groups at both ends), SF-841
8 (side chain carboxyl group-containing polysiloxane), BY1
6-855 (polysiloxane containing epoxy groups at both ends),
Examples thereof include mercapto group-containing organopolysiloxane. The organopolysiloxane (C) is used in an amount of 0.01 to 5% by weight, particularly 0.1 to 2% by weight based on the total amount of the epoxy resin composition.
It is preferably in the range of% by weight.

Although the effect of the present invention can be exhibited even if the organopolysiloxane (C) is added as it is, it is more preferable to use it as the modified organopolysiloxane (c1) by reacting with an epoxy resin, a curing agent and the like. Here, the modified organopolysiloxane (c1) is a reaction product of the organopolysiloxane (C ′) and the epoxy resin (e) or the curing agent (f). When the modified organopolysiloxane (c1) is used as the organopolysiloxane (C), a reaction product obtained by previously reacting the organopolysiloxane (C ′) with the epoxy resin (e) or the curing agent (f) It is preferably added to the resin composition, but a method of producing a reaction product in the resin composition in the step of producing the resin composition is also possible. In this case, the epoxy resin (A) and the curing agent (B) react with the organopolysiloxane (C ′), and the epoxy resin and the curing agent in the case of reacting in advance are distinguished from each other in order to distinguish them from each other. (E) or a curing agent (f).

As a specific example of the organopolysiloxane (C ') as a reaction raw material of the modified organopolysiloxane (c1), a compound containing no polyether group is preferable from the viewpoint of moisture resistance, and Toray Dow Corning BY16-853 (polysiloxane containing both end amino groups), BY16-750 (polysiloxane containing both end carboxyl groups) and BY16-752 manufactured by Silicone Co., Ltd.
(Polysiloxane containing phenol groups at both ends), SF-8
418 (side chain carboxyl group-containing polysiloxane), B
There is no particular limitation as long as it is a compound having a functional group capable of reacting with the epoxy resin and the curing agent, such as Y16-855 (polysiloxane containing both end epoxy groups) and organopolysiloxane containing mercapto group. The number of functional groups of the organopolysiloxane (C ′) is required to be at least one or more in one molecule, but if the number is too large, the reflow property is deteriorated, so 5 or less is preferable. Further, the organopolysiloxane (C ') is preferably one having functional groups at both ends represented by the general formula (III).

[0027]

[Chemical 6]

The molecular weight of the organopolysiloxane (C ') is preferably 130 to 10,000, more preferably 500 to 5,000. When the molecular weight is 10,000 or less, the viscosity of the modified organopolysiloxane (c1) does not become too high, and when it is 130 or more, the effect of the present invention can be sufficiently obtained.

As a concrete example of the epoxy resin (e), a general epoxy resin may be used, and among them, the epoxy resin represented by the general formula (II) is preferable. Examples thereof include bisphenol F type epoxy resin, bisphenol A type epoxy resin, and epoxy derivative of 4,4′-ethylidene bisphenol. Among these, the general formula (II)
Particularly preferred are those having an epoxy equivalent of 150 to 210 and having a liquid form to a softening point of 100 ° C.

[0030]

[Chemical 7]

Specific examples of the curing agent (f) include novolac resins such as phenol novolac, cresol novolac, and naphthol novolac, phenol aralkyl resins, biphenyl skeleton-containing phenol aralkyl resins, dicyclopentadiene skeleton-containing phenol resins, naphthol aralkyl resins, bisphenols. Examples thereof include bisphenol compounds such as A, acid anhydrides such as maleic anhydride, phthalic anhydride, and pyromellitic anhydride, and aromatic amines such as metaphenylenediamine, diaminodiphenylmethane, and diaminodiphenylsulfone.

In the present invention, when the modified organopolysiloxane (c1) is obtained by chemically reacting the organopolysiloxane with the epoxy resin (e) or the curing agent (f) in advance, the mixing ratio of the two is such that the organopolysiloxane (C). ') 1 to 5 equivalents of the epoxy resin (e) or the curing agent (f) are preferable relative to 1 equivalent, and more preferably 1
~ 3 equivalents.

A catalyst for accelerating the reaction can be used in the chemical reaction between the organopolysiloxane (C ') and the epoxy resin (e) or the curing agent (f). The catalyst is not particularly limited, but an imidazole compound, an amino compound or an organic phosphine compound is used. From the viewpoint of reliability, an organic phosphine compound such as triphenylphosphine is particularly preferable. The reaction temperature between the organopolysiloxane (C ′) and the epoxy resin (e) or the curing agent (f) is 7
It is in the range of 0 to 200 ° C, and particularly preferably 100 to 180 ° C.

The modified organopolysiloxane (c1) thus obtained is added in an amount of 0.01 to 5% by weight, particularly 0.1 to 2% by weight, based on the total amount of the epoxy resin composition.
It is preferably in the range of. When the modified organopolysiloxane (c1) is not previously added and then added in the step of producing the resin composition, the organosiloxane is finally adjusted so that the content in the resin composition falls within the above range. Further, the compounding amounts of the epoxy resin (A) and the curing agent (B) are adjusted. Further, it is also possible to use two or more kinds of modified organopolysiloxane (c1) in combination as long as the effect of the present invention is not impaired.

The filler (D) in the present invention is preferably an inorganic filler, specifically, amorphous silica, crystalline silica, calcium carbonate, magnesium carbonate, alumina, magnesia, clay, talc, calcium silicate. ,
Examples include metal oxides such as titanium oxide and antimony oxide, asbestos, glass fibers and glass spheres.
Among them, amorphous silica has a large effect of lowering the coefficient of linear expansion and is effective in lowering stress, and thus is preferably used. As the shape, a crushed shape or a spherical shape is used, and a spherical shape is particularly preferably used from the viewpoint of fluidity.

The amorphous silica referred to here generally means one having a true specific gravity of 2.3 or less. This amorphous silica can be produced by any known method, for example, a method of melting crystalline silica and a method of oxidizing metallic silicon,
A synthesis method from various raw materials such as hydrolysis of alkoxysilane can be used.

Among the amorphous silica, spherical fused silica produced by melting quartz is particularly preferably used, and the spherical fused silica is preferably contained in the total filler (D) in an amount of 85% by weight or more. It is particularly preferable that the content is at least wt%.

The particle size and particle size distribution of the filler (D) are not particularly limited, but the average particle size (meaning median size, the same applies hereinafter) is taken from the viewpoint of fluidity and reduction of burrs during molding. It is preferably in the range of 5 to 30 μm. Further, two or more kinds of fillers having different average particle diameters or particle size distributions can be combined.

In the present invention, a coupling agent such as a silane coupling agent or a titanium coupling agent can be added. More preferably, the filler is treated with these coupling agents prior to blending with the other components. A silane coupling agent is preferably used as the coupling agent, and as the silane coupling agent,
Generally used are those in which a hydrolyzable group such as an alkoxy group, a halogen atom and an amino group, and an organic group are directly bonded to a silicon atom, and a partial hydrolyzed condensate thereof. As the organic group in the silane coupling agent, a hydrocarbon group substituted with a nitrogen atom, an oxygen atom, a halogen atom, a sulfur atom or the like is used. Specific examples of the silane coupling agent include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysisilane, γ- (2,3-epoxycyclohexyl) propyltrimethoxysilane, γ- (N-phenylamino) propyltrimethoxysilane, γ- (N-phenylamino) propylmethyldimethoxysilane, γ-
(N-methylamino) propyltrimethoxysilane, γ
-(N-methylaminopropyl) methyldimethoxysilane, γ- (N-ethylamino) propyltrimethoxysilane, γ- (N-ethylamino) propylmethyldimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ- (N-ethylamino) propylmethyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, γ-mercaptopropyltrimethoxysilane,
γ-mercaptopropylmethyldimethoxysilane, N-β
-(Aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyldimethoxysilane, N-β- (aminoethyl)
-Γ-aminopropyltriethylsilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldiethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldimethoxysilane, γ
-(N, N-dimethylamino) propyltrimethoxysilane and the like can be mentioned. From the viewpoint of fluidity and filling properties, it is preferable to add 0.1 to 2% by weight of the coupling agent to the total amount of the epoxy resin composition.

In the epoxy resin composition of the present invention, when the proportion of the filler is high, the flame retardancy becomes high, and the flame retardancy can be maintained without using the conventionally used flame retardant. However, a bromine compound can be blended for the purpose of further improving the flame retardance, though it is not an essential component. The bromine compound is not particularly limited as long as it is usually added to the epoxy resin composition as a flame retardant. Preferred specific examples of the bromine compound include brominated bisphenol A.
Type epoxy resin, brominated epoxy resin such as brominated phenol novolac type epoxy resin, brominated polycarbonate resin, brominated polystyrene resin, brominated polyphenylene oxide resin, tetrabromobisphenol A, decabromodiphenyl ether and the like. Brominated epoxy resins such as brominated bisphenol A type epoxy resin and brominated phenol novolac type epoxy resin are particularly preferable from the viewpoint of moldability. Similarly, in the epoxy resin composition of the present invention, an antimony compound can be blended although it is not an essential component. This is usually added as a flame retardant aid to the epoxy resin composition for semiconductor encapsulation, and is not particularly limited, and known ones can be used. Specific preferred examples of the antimony compound include:
Examples thereof include antimony trioxide, antimony tetraoxide, and antimony pentoxide.

When these flame retardants and flame retardant aids are added,
From the viewpoint of easy disposal of unnecessary substances generated from the epoxy resin composition and reliability of the semiconductor device, it is preferable that the halogen atom and the antimony atom are each 0.2 wt% or less with respect to the epoxy resin composition.

The epoxy resin composition of the present invention can further optionally contain various additives listed below. Various colorants and pigments such as carbon black and iron oxide, silicone rubber, olefin copolymers, modified nitrile rubber, modified polybutadiene rubber and other elastomers, silicone oil, polyethylene and other thermoplastic resins, fluorine-based, silicone Surfactants such as
Long-chain fatty acids, metal salts of long-chain fatty acids, esters of long-chain fatty acids, amides of long-chain fatty acids, various releasing agents such as paraffin wax, ion trapping agents such as hydrotalcites, cross-linking agents such as organic peroxides Is mentioned.

The epoxy resin composition of the present invention is preferably produced by melt-kneading the above components. For example, it is produced by mixing various raw materials by a known method such as a mixer, and then melt-kneading using a known kneading method such as a Banbury mixer, a kneader, a roll, a single-screw or twin-screw extruder, and a cokneader. The resin temperature during melt kneading is usually in the range of 70 to 150 ° C.

The epoxy resin composition of the present invention is melted by heating and kneading, cooled and pulverized into the shape of a powder, tablet shape obtained by tableting the powder, and tablet which is melted by heating and kneading and cooled and solidified in a mold. And the shape of pellets that are melted by heating and kneading, extruded and further cut.

Then, from these shapes, the semiconductor element is sealed and the semiconductor device is manufactured. The epoxy resin composition of the present invention is applied to, for example, 120 to 250 ° C., preferably 150 to 20 on a member having a semiconductor fixed to a substrate.
At a temperature of 0 ° C., molding is performed by a method such as transfer molding, injection molding, or casting method to manufacture a semiconductor device sealed with a cured product of an epoxy resin composition.
If necessary, additional heat treatment (for example, 150 to 200
C., 2 to 16 hours).

[0046]

EXAMPLES The present invention will be described in detail below with reference to examples, but the present invention is not limited to the examples given here. In addition,% in an Example shows weight%.

[Examples 1 to 7, Comparative Examples 1 to 3] Tables 1 and 2
After dry-blending the components shown in Table 2 with the composition ratio (weight ratio) shown in Table 2, the roll surface temperature was 90 ° C.
After heating and kneading for 5 minutes using the mixing roll of, cooling,
It was crushed to obtain an epoxy resin composition for semiconductor encapsulation. Here, in Table 1, E to I are reaction products of the organopolysiloxane (C ′) and the epoxy resin (e),
J is an unmodified organopolysiloxane.

[0048]

[Table 1]

[0049]

[Table 2]

[0050]

[Chemical 8]

<Evaluation of swelling characteristics (reflow resistance reliability)> About the obtained resin composition, 144 pin TQFP (outer shape: 20 mm × 20 mm × 1.0 mm, frame material:
42 alloy) mold was used to mold a package with a mold temperature of 175 ° C. and a cure time of 1 minute using a low-pressure transfer molding machine. As the evaluation chip, a chip having a chip size of 8 mm × 8 mm × 0.3 mm, on which a simulated element having a surface coated with a silicon nitride film was mounted, was used.

144 pin TQ obtained by the above molding
After 10 packages of FP were post-cured at 180 ° C. for 6 hours, the thickness I (μm) of the central part of the package was measured with a micrometer. 85 ℃ / 6
After humidifying at 0% RH for 24 hours, it was heat-treated in an IR reflow furnace having a maximum temperature of 260 ° C. The temperature profile of the reflow furnace is 60 to 100 in the region of 150 to 200 ° C.
Second, heating rate of 200 to 260 ° C. is 1.5 to 2.5 ° C. /
Seconds, 10-2 in the maximum temperature range of 255-265 ℃
Maintain for 0 seconds and decrease the temperature from 260 to 200 ° C from 1.5 to
It was set to 2.5 ° C./second. Five seconds after the package left the reflow furnace, the thickness II (μm) of the central portion of the package was measured again with the micrometer. Further, (thickness II-thickness I) was calculated for each of 10 packages, and the average value of the 10 packages was defined as "blister" (μm). The swelling is preferably small, and particularly preferably 80 μm or less.

<Continuous Formability (Package Surface Stain) Evaluation> A continuous moldability was evaluated by molding a package in the same manner as above. However, the cure time was 40 seconds. One-shot molding was performed with a melamine resin for mold cleaning, and then two-shot molding was performed with a release recovery material "TR-4" manufactured by Toray Co., Ltd. in order to recover the mold releasability between the mold and the resin. Subsequently, the package appearance after continuous 20-shot molding with the above resin composition was observed, and continuous moldability was evaluated. Visually observe the package surface dirt,
If the dirt area reaches 3% or more of the package surface x, less than 3% 1% or more △: less than 1% ○
Was judged as.

<Evaluation of releasability> Cone truncated cone (upper base diameter: 9 m
m, lower bottom diameter: 10 mm, height: 20 mm), a mold temperature of 175 ° C., cure time of 60 seconds, molding pressure of 7
Mold release at the time of molding at MPa and removal from the mold immediately after molding was measured with a push-pull gauge. The molding was carried out continuously for 10 shots, and the maximum value among the 10 measured values was taken as the mold release load value.

[0055]

[Table 3]

Table 3 shows the evaluation results. As can be seen in Table 3, the modified organopolysiloxane (g
In the case of adding 1) and the unmodified organopolysiloxane, the swelling property, continuous moldability, and releasability can be satisfied at the same time (Examples 1 to 7). Further, when the tetramethylbisphenol F type epoxy resin represented by the chemical formula (I) is not used, the continuous moldability is insufficient (Comparative Example 3). As described above, the epoxy resin composition of the present invention has excellent swelling properties, continuous moldability, and releasability.

[0057]

As described above, according to the present invention, an epoxy resin composition for semiconductor encapsulation which is excellent in peel resistance during reflow, reflow reliability such as swelling characteristics, and releasability during molding, and A semiconductor device sealed with the epoxy resin composition can be obtained.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 23/31 F term (reference) 4J002 CC04Y CD03W CD05W CD06W CD07W CD20X CE00Y CP05X CP10X DE077 DE147 DE237 DJ007 DJ017 DJ037 DJ047 EJ036 EL136 EL146 EN076 EV226 FD017 FD14Y FD146 FD150 GQ05 4J036 AD04 AD08 CD16 DA02 DA05 DB15 DC03 DC05 DC10 DC41 DD04 DD07 FA01 FA05 FB06 FB07 GA04 JA07 4M109 AA01 BA01 CA21 EA03 EB02 EB12 EB19 EC05 EC20 EC20 EC20

Claims (5)

[Claims] 1. An epoxy resin composition containing an epoxy resin (A), a curing agent (B), an organopolysiloxane (C) and a filler (D), wherein the epoxy resin (A) has the following chemical formula (I): ) Tetramethylbisphenol F represented by
An epoxy resin composition comprising a type epoxy resin. [Chemical 1] 2. The epoxy resin composition according to claim 1, wherein the organopolysiloxane (C) is a modified organopolysiloxane which is a reaction product of the organosiloxane and an epoxy resin or a curing agent. 3. A modified organopolysiloxane (c1) which is a reaction product of an organopolysiloxane (C) with an epoxy resin (e) represented by the following general formula (II) or a curing agent (f). ] The epoxy resin composition of Claim 1 characterized by these. [Chemical 2] 4. The epoxy resin composition according to claim 1 or 2, wherein the organopolysiloxane (C) is represented by the following general formula (III). [Chemical 3] 5. A semiconductor device which is encapsulated with the cured product of the epoxy resin composition according to any one of claims 1 to 4.