JP2003101183A5 - - Google Patents

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Publication number
JP2003101183A5
JP2003101183A5 JP2001286831A JP2001286831A JP2003101183A5 JP 2003101183 A5 JP2003101183 A5 JP 2003101183A5 JP 2001286831 A JP2001286831 A JP 2001286831A JP 2001286831 A JP2001286831 A JP 2001286831A JP 2003101183 A5 JP2003101183 A5 JP 2003101183A5
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JP
Japan
Prior art keywords
weight
parts
resin composition
inorganic filler
range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001286831A
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English (en)
Japanese (ja)
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JP2003101183A (ja
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Publication date
Application filed filed Critical
Priority to JP2001286831A priority Critical patent/JP2003101183A/ja
Priority claimed from JP2001286831A external-priority patent/JP2003101183A/ja
Publication of JP2003101183A publication Critical patent/JP2003101183A/ja
Publication of JP2003101183A5 publication Critical patent/JP2003101183A5/ja
Pending legal-status Critical Current

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JP2001286831A 2001-09-20 2001-09-20 回路基板と電力変換モジュールおよびその製造方法 Pending JP2003101183A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001286831A JP2003101183A (ja) 2001-09-20 2001-09-20 回路基板と電力変換モジュールおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001286831A JP2003101183A (ja) 2001-09-20 2001-09-20 回路基板と電力変換モジュールおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2003101183A JP2003101183A (ja) 2003-04-04
JP2003101183A5 true JP2003101183A5 (enExample) 2005-03-17

Family

ID=19109738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001286831A Pending JP2003101183A (ja) 2001-09-20 2001-09-20 回路基板と電力変換モジュールおよびその製造方法

Country Status (1)

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JP (1) JP2003101183A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4570505B2 (ja) * 2005-02-23 2010-10-27 古河電気工業株式会社 鉛フリー半田付け基板及びその製造方法
JP2008028376A (ja) * 2006-06-20 2008-02-07 Sanyo Electric Co Ltd 回路基板、半導体モジュールおよび回路基板の製造方法
JP4992342B2 (ja) * 2006-08-23 2012-08-08 三菱電機株式会社 プリント配線板の製造方法
JP2009231498A (ja) * 2008-03-21 2009-10-08 Furukawa Electric Co Ltd:The 金属コア多層プリント配線板
JP5929220B2 (ja) * 2011-01-26 2016-06-01 住友ベークライト株式会社 プリント配線板およびプリント配線板の製造方法
KR20150049515A (ko) * 2013-10-30 2015-05-08 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
KR101797576B1 (ko) * 2017-02-12 2017-12-12 주식회사 써키트 플렉스 시트타입 전도성 폴리머의 홀가공 기술을 이용한 무선안테나용 회로기판의 제조방법 및 그에 의해 제조된 무선안테나용 회로기판, 무선안테나모듈 및 전기전자기기
JPWO2022239687A1 (enExample) * 2021-05-10 2022-11-17

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