JP2003094445A - Manufacturing method for fine structure, manufacturing method for device equipped with the fine structure, fine structure by the manufacturing method, device for manufacturing the fine structure, and device for manufacturing device equipped with the fine structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a fine structure wherein a device to manufacture the fine structure does not need to be made larger, and the transfer of a fine pattern can be performed at a high precision. SOLUTION: For this manufacturing method for the fine structure, fine patterns on the surface of a mother stamper are transferred in order. Such a manufacturing method for the fine structure includes (1) to (7) processes. In the process (1), the mother stamper is fixed at a specified location for a substrate. In the process (2), a resin is fed in a space between the mother stamper and the substrate. In the process (3), the mother stamper is pressed to the resin under a vacuumized state. In the process (4), the resin is hardened. In the process (5), the mother stamper is separated from the hardened resin. In the process (6), the mother stamper or the substrate is moved so that a relative location between the mother stamper and the substrate may be changed. In the process (7), after the process (6), the processes (2) to (6) are repeated by a specified number of times.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the production of a fine structure having a fine pattern on a substrate, which is used in the fields of optical elements such as diffraction gratings, reflectors or transflective liquid crystal displays. More specifically, the present invention relates to a method, a method for producing a fine structure by transferring a fine pattern on a surface of a stamper to a large substrate, a method for producing a device provided with the fine structure, and a fine structure by the production method. The present invention relates to an apparatus for manufacturing the fine structure and an apparatus for manufacturing an apparatus including the fine structure.

[0002]

2. Description of the Related Art Conventionally, injection molding, 2P (photo polymerization) and the like have been known as methods for producing resin plates such as optical discs, which are fine structures. In the injection molding method, a molten resin is injected under high pressure into a mold in which a stamper of a resin plate is placed, and the resin is cured, so that a fine structure on which the fine pattern on the stamper surface is transferred. It is to get the body.

On the other hand, in the 2P method, a plastic flat plate having good optical characteristics is prepared, a photocurable resin is filled between the flat plate and the stamper, and light is applied from the plastic flat plate side to cure the photocurable resin. By curing, a fine structure on which the fine pattern on the surface of the stamper has been transferred is obtained.

However, the above-mentioned injection molding method and 2
In order to manufacture a large-area fine structure using the P method, it is necessary to upsize the device, but it is very difficult to upsize it.

Japanese Patent Laid-Open No. 7-153124 discloses a method of moving a stamper to form a multi-faced stamper. However, in the case of transferring a fine pattern, resin unevenness becomes a problem, and the air present in the resin may adversely affect the transfer of the fine pattern. Further, there is a problem that the stamper in the multi-faced mounting described in the above document can move only in one direction.

[0006]

SUMMARY OF THE INVENTION In view of such circumstances, the present invention makes it possible to transfer a fine pattern with high accuracy without the need to upsize the apparatus for manufacturing the fine structure. It is an object to provide a method for manufacturing a body.

[0007]

The above object is a method of manufacturing a fine structure by sequentially transferring a fine pattern on the surface of a mother stamper, which comprises (1) a predetermined mother stamper for a substrate. Fixing in position,
(2) supplying resin between the mother stamper and the substrate; (3) pressing the mother stamper against the resin in a vacuum; and (4) curing the resin. (5) removing the mother stamper from the cured resin; (6) moving the mother stamper or the substrate so as to change the relative position of the mother stamper and the substrate; and (7) After the step (6), the step (2) to the step (6) are repeated a predetermined number of times, and the method is achieved by a method for producing a fine structure.

Further, the above object is a method of manufacturing an apparatus having a fine structure by sequentially transferring a fine pattern on the surface of a mother stamper, wherein the fine structure is (1) with respect to a substrate. Fixing the mother stamper at a predetermined position; (2) supplying resin between the mother stamper and the substrate; and (3) pressing the mother stamper against the resin in a vacuum. When,
(4) curing the resin, (5) releasing the mother stamper from the cured resin, and (6)
A step of moving the mother stamper or the substrate so as to change the relative position of the mother stamper and the substrate; and (7) a step (2) after the step (6).
To a step of repeating the step (6) a predetermined number of times, and (8) incorporating the fine structure into the apparatus, and a method of manufacturing an apparatus having a fine structure. It

In a preferred aspect of the present invention, the manufacturing method is characterized in that the respective positions of the substrate and the mother stamper are fixed via a cushioning material which is more flexible than the cured resin.

In a preferred aspect of the present invention, in the manufacturing method, in the step (2), the resin is supplied to a predetermined position by an inkjet method.

In a preferred aspect of the present invention, in the manufacturing method, the resin is a photocurable resin or a thermosetting resin.

Further, the above object is a method for producing a fine structure by sequentially transferring a fine pattern on the surface of a mother stamper to a substrate made of a thermoplastic resin, which is (1) A step of fixing the mother stamper at a predetermined position; (2) a step of pressing the mother stamper against the substrate in a vacuum so that the substrate is thermocompression bonded; and (3) a step of pressing the mother stamper from the substrate. And (4) moving the mother stamper or the substrate so as to change the relative position between the mother stamper and the substrate, and (5) after the step (4), the step (2) ) To step (4) are repeated a predetermined number of times, and a method for manufacturing a fine structure is achieved.

Further, the above object is a method for manufacturing an apparatus having a fine structure by sequentially transferring a fine pattern on the surface of a mother stamper to a substrate made of a thermoplastic resin, wherein the fine structure is (1) fixing the mother stamper to a predetermined position with respect to the substrate, and (2) pressing the mother stamper against the substrate in vacuum so that the substrate is thermocompression bonded.
(3) removing the mother stamper from the substrate, and (4) moving the mother stamper or the substrate so as to change the relative position between the mother stamper and the substrate. And (6) after the step (4), repeating the steps (2) to (4) a predetermined number of times, and (6) incorporating the fine structure into the device. This is achieved by a method of manufacturing a device having a microstructure characterized by:

In a preferred aspect of the present invention, the manufacturing method is characterized in that the respective positions of the substrate and the mother stamper are fixed via a cushioning material which is more flexible than the cured resin.

In a preferred aspect of the present invention, in the manufacturing method, a cushioning material is used as a backing material for the substrate.

The above object is also achieved by the microstructure manufactured by the above manufacturing method.

Further, the above object is an apparatus for producing a fine structure for transferring a fine pattern, which has a stage on which a substrate is placed, first and second blocks, and the fine pattern on the surface. A chamber provided with a mother stamper and movable up and down with respect to the stage along the first and second blocks,
A head whose relative position to the stage is changeable,
A vacuum pump that cures the resin supplied onto the substrate and evacuates the inside of the head when the fine pattern is transferred to the resin.

Further, the above-mentioned object is an apparatus for manufacturing a device having a fine structure for transferring a fine pattern, the stage on which a substrate is placed, the first and second blocks, and the surface. A mother stamper having the fine pattern is arranged, and the chamber is movable up and down with respect to the stage along the first and second blocks, and the relative position to the stage can be changed. A head, a vacuum pump for curing the resin supplied onto the substrate to make the inside of the head a vacuum when the fine pattern is transferred to the resin, and a fine structure for incorporating the fine structure in the apparatus. And an embedding means.

In a preferred aspect of the present invention, in the apparatus, the head further comprises a cushion material fixed to the first and second blocks and in contact with the substrate on the stage, and the cushion material is a cured resin. It is characterized by being more flexible.

In a preferred aspect of the present invention, in the apparatus, the vacuum pump evacuates the inside of the head.

In a preferred aspect of the present invention, the apparatus is characterized by further comprising a supply means for supplying a resin.

In a preferred aspect of the present invention, in the above apparatus, the supply means is a nozzle used in an ink jet method.

In a preferred embodiment of the invention said device is
It is characterized by further comprising heating means for heating the chamber.

In a preferred embodiment of the invention said device is
It is characterized by further comprising ultraviolet irradiation means for moving integrally with the head to cure the resin.

The size of the fine pattern used in the present invention is in the submicron region, and is on the order of about 0.1 μm. The fine structure used in the present invention means a structure having the fine pattern.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION The embodiments of the present invention will be described in detail, but the present invention is not limited to the following embodiments.

First, a method of manufacturing a mother stamper, which is a metal mold, will be described. FIG. 1 is a sectional view showing a manufacturing process of a mother stamper used in the present invention.

After the glass master disk 10 regenerated with a chemical solution is polished and washed, as shown in FIG. 1A, a photoresist film 20 is applied onto the glass master disk. The photoresist film 20 is irradiated with laser light according to a recording signal.
In the developing step shown in FIG. 1B, the exposed portion is removed and a pattern having fine irregularities is formed. As shown in FIG. 1C, the conductive film 3 is formed on the fine pattern of the photoresist.
0 is attached. This conductive film is formed by sputtering, vapor deposition, and electroless plating. Generally, the conductive film is A
g, Ni are used. Then, using the conductive film as an electrode, Ni electroforming is performed to a predetermined thickness (see FIG. 1D), and when peeled from the glass master, a mother stamper 40 having a fine pattern on its surface is obtained (FIG. 1).
(E)). FIG. 1E shows a fine pattern on a hemisphere, but the fine pattern that can be transferred in the present invention is not limited to this.

FIG. 2 is a diagram for explaining one embodiment of the method for manufacturing a fine structure according to the present invention. A head 20 constituting an apparatus 100 for manufacturing a microstructure according to the present invention described later.
0 to the mother stamper 40 (see FIG. 2) manufactured as described above.
(Not shown) is arranged at a predetermined position. Note that FIG.
FIG. 3 is a front view of the device 100. The large substrate 310 is placed on the stage 300 of the apparatus, and the mother stamper 4
The area of the large-sized substrate to which the fine pattern of 0 is to be transferred is positioned, and the head is moved to the area surrounded by the solid line in FIG. 2, for example. Alternatively, with the head fixed, a stage 3 on which a large substrate is placed
It is also possible to move 00. As shown in FIG. 2, the size of the head 200 for disposing the mother stamper 400 may be smaller than that of the stage 300 for fixing the large substrate 310.

After the fine pattern of the mother stamper is transferred in the area indicated by the solid line in FIG. 2, the head 200 or the stage 300 can be moved to move to the area to be transferred next. For example, as shown in FIG.
The head 200 or the stage 300 can be moved in this order (X-axis direction) or in the area (Y-axis direction) to sequentially transfer the fine pattern of the mother stamper 40. Such head 200 or stage 30
By sequentially repeating the movement of 0, the fine pattern of the mother stamper 40 is transferred to the large substrate. The head is movable in the X, Y, and Z (vertical direction with respect to the paper surface of FIG. 3) axial directions, and the stage is movable in the X and Y axial directions.

The material of the substrate 310 used in the present invention is not particularly limited, but when the resin is cured using ultraviolet rays, as will be described later, it is a glass or transparent resin that transmits ultraviolet rays and the like. Is desirable.

FIGS. 4 and 5 are views for explaining the first embodiment of the method for producing a fine structure according to the present invention. The fine pattern of the mother stamper 40 is transferred using the apparatus 100 for producing a fine structure according to the present invention. The microstructure manufacturing apparatus 100 shown in FIG. 4 includes a head 200 and a stage 300. In addition, in FIG. 4 and FIG.
Although one head is illustrated for simplification of description, a plurality of heads may be used to improve the pattern transfer efficiency.

A substrate 310 may be installed on the stage 300. The head 200 includes a first block 210, a second block 220, and a chamber 23.
0, and the maker stamper 40 manufactured as described above is disposed in the chamber 230, and through the first block 210 and the second block 220,
It can move up and down with respect to the substrate 310. Also, means 250 for supplying the resin 400 to the first block 210.
The second block 220 has a tube communicating with the space defined by the substrate 310 and the mother stamper 40, and the vacuum pump 260 operates to evacuate the space through the tube. The first block 210
May have the tube while the second block 220 has the means 250.

In addition, the first block 210 and the second block 220 are provided with a cushion material 240 which is in contact with the substrate 310. The area of the mother stamper 40 to which the fine pattern is to be transferred is surrounded by the cushion material 240, which enables the vacuum in the head described above. Other functions of the cushion member 240 will be described later.

In the method of manufacturing a fine structure according to the present invention, the mother stamper 40 arranged in the chamber 230 is fixed to the substrate 310 at a predetermined position as shown in FIG. Next, the curable resin 400 is supplied between the mother stamper 40 and the substrate 310. As a supply method, a resin supply means 25 provided in the block
An ink jet method in which a constant amount of resin is uniformly supplied via 0 is preferable. When the resin is supplied by the inkjet method, the means 250 is preferably a nozzle.

Next, the inside of the head is evacuated by the vacuum pump 260 provided in the head 200. At that time, it is possible to deaerate or deaerate the air present in the resin 400. The supplied resin 400 while maintaining a vacuum
Is pressed by the mother stamper 40 to cure the resin. The curing method may be heat curing or light curing, but it depends on the properties of the resin used. Therefore, the resin supplied in the present invention is preferably a photocurable resin or a thermosetting resin.

When a photocurable resin is used, the substrate 3
It is preferable that 10 is a material that transmits ultraviolet rays.
That is, the ultraviolet irradiation means 500 is provided through the substrate 310.
The resin 400 is hardened by the ultraviolet rays from (see FIG. 5). The ultraviolet irradiation means 500 moves integrally with the head 200, and when the head 200 moves to the transferred area, the photo-curing resin can be cured in the area. A specific example of the ultraviolet irradiation means 500 is a mercury lamp.

When a thermosetting resin is used,
Heat is transmitted to the resin through the stamper by means of heating the stamper, for example, a heater, and the resin is cured.

Thereafter, the mother stamper 40 is separated from the hardened resin, and the hardened resin is formed on the substrate 310. As described with reference to FIG. 3, the head 200 or the stage 300 is moved so as to change the relative position of the mother stamper 40 or the substrate 310, and is moved to the region of the substrate to be transferred next by the same method as described above. Transfer.
By repeating this, a desired fine pattern can be formed on the large-sized substrate.

The above-mentioned cushion material 240 has a function of surrounding a region of the mother stamper where a fine pattern is to be transferred, limiting a transfer portion for one time, and preventing the supplied resin from diffusing. Further, the cushion material 240 is
It needs to be more flexible than the cured resin on which the fine pattern is transferred. Although the cushion member 240 is in direct contact with the substrate in FIG. 4, the cushion member 24 on the left side of FIG.
At 0, the cushion material 240 is the resin 3 that was previously cured.
20 is mounted. In this case, the cushion material needs to shrink with respect to the cured resin 320. That is, if the resin is not more flexible than the cured resin 320, a gap is created between the cushion material 240 and the cured resin 320, and the vacuum cannot be maintained when the resin 400 is pressed by the mother stamper 40. In addition, resin unevenness may occur due to air or the like present in the resin.

According to the above-mentioned manufacturing method of the present invention,
A fine structure having a transferred fine pattern as shown in FIG. 6 is obtained. Further, by moving the head 200 or the stage 300 and similarly transferring the fine pattern next to the obtained fine pattern, a transfer pattern as shown in FIG. 7 is obtained. If such transfer is performed sequentially,
The transfer pattern of the mother stamper can be formed on a large substrate over a wide range.

By repeating the above, as shown in FIG. 8, a fine structure can be obtained over the entire large substrate having a large area.

Next, another embodiment according to the present invention will be described.

FIG. 9 is a diagram for explaining the second embodiment of the method for producing a fine structure according to the present invention. Unlike the method shown in FIGS. 4 and 5, instead of using the resin 400,
The substrate 310 is characterized by being made of a thermoplastic resin.

A large substrate made of a thermoplastic resin is placed on the stage 300. Specific examples that can be used as the substrate include polycarbonate, polystyrene, acrylic resin and the like. The thickness of the substrate is not particularly limited, but in the case of a film of 100 μm to 200 μm, it is possible to use the film alone. As a substrate
When a thermoplastic resin in the form of a film is used, in order to prevent thermal deformation of the untransferred portion at the time of thermocompression bonding, which will be described later, as a backing material under the substrate, for example, a cushioning material such as silicone rubber. Can be provided.

The concrete manufacturing method according to the second embodiment is similar to that of the first embodiment described above.
Are fixed to the head 200 via the chamber 230. The head 200 is moved to determine the position to be transferred. Alternatively, the transfer position can be determined by moving the stage 300. In the second aspect, the chamber 230 has a heating means such as a heater for the reason described below. The chamber 230 of the head 200 is heated and the mother stamper 40 is heated to a desired temperature.
The heating temperature is preferably higher than or equal to the softening temperature of the substrate used and lower than or equal to the melting point. For example, when using polycarbonate, the temperature of the mother stamper 40 is set to 130
Heat to ~ 260 ° C.

The substrate itself may be heated in advance. However, the temperature in that case is set to be equal to or lower than the softening temperature of the substrate, but it is desirable to be as high as possible.

After the temperature of the mother stamper 40 is stabilized,
Only the chamber 230 of the head 200 is lowered to press the mother stamper 40 against the thermoplastic resin substrate. At this time, the mother stamper 40 is heated and pressure-bonded, and the mother stamper 40 is peeled off, whereby the transfer pattern shown in FIG. 10 is formed. Since the pressure bonding time is affected by the heating temperature, it is desirable to set an appropriate time.

When the blocks 210 and 220 of the head 200 are provided with the cushion material 240 and the head 200 is placed at the position where the pattern is already formed, the same reason as described in the first mode is given. Therefore, it must be more flexible than a substrate composed of a thermoplastic resin. Further, in the manufacturing method according to the second aspect of the present invention, the cushion material 240 also has a function of preventing heat from propagating to an untransferred portion of the thermoplastic resin which is the substrate and preventing deformation of the substrate.

10 and 11 are schematic sectional views of a transfer pattern formed by the second embodiment of the manufacturing method according to the present invention. Head 200 having mother stamper 40
Or the stage 300 on which the thermoplastic resin, which is the substrate 310, is sequentially moved, the same pattern is transferred to a wide area of the large substrate, and a fine structure can be formed on the large substrate. .

By using the microstructure of the large-sized substrate manufactured by the above-described manufacturing method of the first and second aspects of the present invention as a master stamper, a large-sized mold can be manufactured as described below. .

A large-sized substrate surface having a fine pattern obtained by the first embodiment of the manufacturing method of the present invention is shown in FIG.
As shown in the step (b), a large metal mold shown in FIG. 12 (d) is manufactured by conducting a conductor treatment, electroforming nickel (FIG. 12 (c)), and peeling the nickel from the large substrate. You can

The method for manufacturing a fine structure as described above is
It can be applied to the manufacture of devices such as electronic devices such as members including various fine structures and display devices. For example, the invention is applied to the formation of a fine structure such as a concavo-convex structure in a reflector of a reflection type or semi-transmissive reflection type liquid crystal display device. It can be applied to the manufacture of electronic devices such as devices including elements.

For example, a reflection type or semi-transmissive reflection type liquid crystal display device is manufactured by the step of incorporating the fine structure manufactured by the above-described manufacturing method into the liquid crystal display device by the assembling means.

[0055]

According to the manufacturing method of claims 1, 3 to 6, 8 and 9, it is possible to form a continuous pattern fine structure from a mother stamper having a fine pattern on the front surface of a large substrate. it can. Also, a metal mold can be manufactured based on the substrate.

According to the manufacturing method of claims 2 and 7,
It is possible to manufacture a device including a seamless pattern of a fine structure from a mother stamper having a fine pattern to a front surface of a large substrate.

Further, according to the manufacturing method of the present invention as set forth in claims 3 and 8, the head and the substrate are in contact with each other through the cushioning material having flexibility, so that a range in which a fine pattern is transferred once is set. When the resin is cured, diffusion of the resin itself can be prevented. Further, when a thermoplastic resin is used for the substrate, it is possible to suppress the deformation of the untransferred portion to a minimum and protect it. Furthermore, ensure the vacuum when transferring the pattern,
The resin can be degassed, and thus a fine pattern can be transferred.

According to the manufacturing method of the fourth aspect, the resin can be evenly and uniformly supplied by the ink jet method, and thus the fine pattern can be transferred.

According to the manufacturing method of the ninth aspect, the deformation of the untransferred portion of the thermoplastic resin can be prevented.

According to the apparatus described in claims 11 to 18, in order to manufacture a fine structure having a continuous pattern from a mother stamper having a fine pattern to a front surface of a large substrate and a device having the fine structure. Apparatus is provided.

[Brief description of drawings]

FIG. 1 is a sectional view of a manufacturing process of a mother stamper used in the present invention.

FIG. 2 is a diagram illustrating a first aspect of a method for manufacturing a fine structure according to the present invention.

FIG. 3 is a diagram illustrating an example of a transfer order of fine patterns by the method for manufacturing a fine structure according to the present invention.

FIG. 4 is a diagram illustrating a method of manufacturing a fine structure according to an embodiment of the present invention.

FIG. 5 is a diagram illustrating a method of manufacturing a fine structure according to an embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view of a fine pattern of resin transferred by the manufacturing method of the present invention.

FIG. 7 is a schematic cross-sectional view of fine patterns sequentially transferred by the manufacturing method of the present invention.

FIG. 8 is a schematic view of a transfer pattern of a large area substrate manufactured by the manufacturing method of the present invention.

FIG. 9 is a diagram illustrating a second aspect of the method for producing a fine structure according to the present invention.

FIG. 10 is a schematic cross-sectional view of a transfer pattern formed by the second embodiment of the manufacturing method according to the present invention.

FIG. 11 is a schematic cross-sectional view of a transfer pattern formed by the second aspect of the manufacturing method according to the present invention.

FIG. 12 is a cross-sectional view of a manufacturing process of a large metal mold using a large substrate having a fine structure manufactured by the manufacturing method according to the present invention as a master stamper.

[Explanation of symbols]

10 glass master 20 Photoresist film 30 conductive film 40 Mother Stamper 100 Microstructure manufacturing equipment 200 heads 210 First Block 220 Second Block 230 chamber 240 cushion material 250 Resin supply means 260 vacuum pump 300 stages 310 substrate 320 Pre-cured resin with fine pattern 400 resin 500 UV irradiation means

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 4F204 AG05 AH73 EA03 EA04 EB02                       EK01 EK09 EK10                 4F209 AG05 AH73 PA02 PB02 PC05                       PN03 PN06 PN07 PW41

Claims (18)

[Claims] 1. A method of manufacturing a fine structure by sequentially transferring a fine pattern on the surface of a mother stamper, comprising: (1) fixing the mother stamper to a substrate at a predetermined position; 2) supplying resin between the mother stamper and the substrate; (3) pressing the mother stamper against the resin in a vacuum; (4) curing the resin; 5) A step of separating the mother stamper from the cured resin; (6) A step of moving the mother stamper or the substrate so as to change a relative position between the mother stamper and the substrate; After step (6), steps (2) to (6)
And a step of repeating the step a predetermined number of times, the method for manufacturing a fine structure. 2. A method of manufacturing an apparatus having a fine structure by sequentially transferring a fine pattern on the surface of a mother stamper, wherein the fine structure comprises (1) a substrate having the mother stamper. (2) supplying resin between the mother stamper and the substrate; and (3) pressing the mother stamper against the resin in a vacuum; ) Step of curing the resin, (5) Step of releasing the mother stamper from the cured resin, (6) The mother stamper or the substrate so as to change the relative position between the mother stamper and the substrate. And (7) after the step (6), steps (2) to (6)
Is repeated a predetermined number of times, and (8) a step of incorporating the microstructure in the device,
A method of manufacturing a device having a microstructure including :. 3. The manufacturing method according to claim 1, wherein the respective positions of the substrate and the mother stamper are fixed via a cushion material that is more flexible than the cured resin. 4. The manufacturing method according to claim 1, wherein in the step (2), the resin is supplied to a predetermined position by an inkjet method. 5. The manufacturing method according to claim 1, wherein the resin is a photocurable resin or a thermosetting resin. 6. A method of manufacturing a fine structure by sequentially transferring a fine pattern on the surface of a mother stamper to a substrate made of a thermoplastic resin, comprising: (1) providing the mother stamper on the substrate in a predetermined manner. And (2) pressing the mother stamper against the substrate in a vacuum so that the substrate is thermocompression bonded, and (3) separating the mother stamper from the substrate. (4) a step of moving the mother stamper or the substrate so as to change the relative position of the mother stamper and the substrate, (5) after the step (4), the steps (2) to () 4)
And a step of repeating the step a predetermined number of times, the method for manufacturing a fine structure. 7. A method for manufacturing an apparatus having a fine structure by sequentially transferring a fine pattern on the surface of a mother stamper to a substrate made of a thermoplastic resin, wherein the fine structure comprises (1) Fixing the mother stamper at a predetermined position with respect to the substrate; (2) pressing the mother stamper against the substrate in vacuum so that the substrate is thermocompression bonded; (3) (4) moving the mother stamper or the substrate so as to change the relative position between the mother stamper and the substrate; (5) the process (4) After, steps (2) to (4)
Is repeated a predetermined number of times, and (6) a step of incorporating the microstructure in the device,
A method of manufacturing a device having a fine structure, comprising: 8. The manufacturing method according to claim 6, wherein the respective positions of the substrate and the mother stamper are fixed through a cushion material that is more flexible than the cured resin. 9. The manufacturing method according to claim 6, wherein a cushioning material is used as a backing material for the substrate. 10. A microstructure manufactured by the manufacturing method according to any one of claims 1 to 9. 11. An apparatus for producing a fine structure for transferring a fine pattern, comprising: a stage on which a substrate is placed; first and second blocks; and a mother stamper having the fine pattern on its surface. A head that is provided and configured to move up and down with respect to the stage along the first and second blocks, and the relative position of the stage is changeable; and the head is supplied onto the substrate. And a vacuum pump that evacuates the inside of the head when the resin is cured and the fine pattern is transferred to the resin. 12. A device manufacturing apparatus comprising a fine structure for transferring a fine pattern, comprising a stage on which a substrate is mounted, first and second blocks, and the fine pattern on the surface. A head having a mother stamper disposed therein, and a chamber movable up and down with respect to the stage along the first and second blocks, the relative position of which is changeable; A vacuum pump that cures the resin supplied onto the substrate to make the inside of the head a vacuum when the fine pattern is transferred to the resin, and an assembling means for incorporating the fine structure into the apparatus, An apparatus comprising: 13. The head further comprises a cushion material fixed to the first and second blocks and in contact with the substrate on the stage, wherein the cushion material is more flexible than a cured resin. The device according to claim 11 or 12. 14. The apparatus according to claim 11, wherein the vacuum pump creates a vacuum inside the head. 15. The apparatus according to claim 11, wherein the apparatus further comprises a supply means for supplying resin. 16. The apparatus according to claim 15, wherein the supply unit is a nozzle used in an inkjet method. 17. The apparatus according to claim 11, wherein the apparatus further comprises heating means for heating the chamber. 18. The apparatus according to claim 11, further comprising ultraviolet irradiation means for moving integrally with the head to cure the resin.
The device according to.