JP2003094445A - Manufacturing method for fine structure, manufacturing method for device equipped with the fine structure, fine structure by the manufacturing method, device for manufacturing the fine structure, and device for manufacturing device equipped with the fine structure - Google Patents

Manufacturing method for fine structure, manufacturing method for device equipped with the fine structure, fine structure by the manufacturing method, device for manufacturing the fine structure, and device for manufacturing device equipped with the fine structure

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JP2003094445A
JP2003094445A JP2001287390A JP2001287390A JP2003094445A JP 2003094445 A JP2003094445 A JP 2003094445A JP 2001287390 A JP2001287390 A JP 2001287390A JP 2001287390 A JP2001287390 A JP 2001287390A JP 2003094445 A JP2003094445 A JP 2003094445A
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substrate
mother stamper
resin
step
manufacturing
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JP3978706B2 (en
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Eiichi Fujii
Kimio Nagasaka
永一 藤井
公夫 長坂
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Seiko Epson Corp
セイコーエプソン株式会社
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Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a fine structure wherein a device to manufacture the fine structure does not need to be made larger, and the transfer of a fine pattern can be performed at a high precision.
SOLUTION: For this manufacturing method for the fine structure, fine patterns on the surface of a mother stamper are transferred in order. Such a manufacturing method for the fine structure includes (1) to (7) processes. In the process (1), the mother stamper is fixed at a specified location for a substrate. In the process (2), a resin is fed in a space between the mother stamper and the substrate. In the process (3), the mother stamper is pressed to the resin under a vacuumized state. In the process (4), the resin is hardened. In the process (5), the mother stamper is separated from the hardened resin. In the process (6), the mother stamper or the substrate is moved so that a relative location between the mother stamper and the substrate may be changed. In the process (7), after the process (6), the processes (2) to (6) are repeated by a specified number of times.
COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は、回折格子等の光学素子、反射板又は半透過反射型の液晶表示器等の分野に利用される、基板上に微細なパターンを有する微細構造体の製造方法に係り、より詳細には、スタンパーの表面にある微細パターンを大型基板へ転写させることによる微細構造体の製造方法、該微細構造体を備えた装置の製造方法、該製造方法による微細構造体、該微細構造体製造用装置並びに該微細構造体を備えた装置製造用装置に関する。 BACKGROUND OF THE INVENTION [0001] [Technical Field of the Invention The present invention relates to an optical element such as a diffraction grating, is used in the field of liquid crystal display or the like of the reflector or semi-transmissive reflective type, on a substrate It relates to a method of manufacturing a microstructure having a fine pattern, and more particularly to a method for manufacturing a microstructure according thereby transferring a fine pattern on the surface of the stamper to the large substrate, the apparatus having a fine pore structure production method, the fine structure according to the production method, an apparatus for device fabrication having a fine pore structure manufacturing apparatus and the fine structure. 【0002】 【従来の技術】従来から、微細構造体である光ディスク等の樹脂板の製造方法としては、射出成形法や2P法(photo polymerization)等が公知である。 2. Description of the Related Art Conventionally, as a method for producing a resin plate such as an optical disc is a microstructure, an injection molding method or a 2P method (photo Polymerization) or the like are known. 射出成形法は、溶融した樹脂を高圧力で、樹脂板のスタンパが配置された金型内に注入して、この樹脂を硬化させることにより、スタンパの表面にある微細パターンが転写された微細構造体を得るものである。 Injection molding, a molten resin at a high pressure, is injected into a mold stamper is placed in the resin plate by curing the resin, microstructure fine pattern on the surface of the stamper has been transferred it is to obtain a body. 【0003】一方、2P法は、光学的特性の良いプラスチック平板を準備し、当該平板とスタンパとの間に光硬化樹脂を充填し、前記プラスチック平板側から光を当てて、前記光硬化樹脂を硬化させることにより、スタンパの表面にある微細パターンが転写された微細構造体を得るものである。 On the other hand, 2P method prepares a good plastic flat of optical properties, filled with a photocurable resin between the flat plate and the stamper, and light is applied from the plastic flat side, the photocurable resin by curing, thereby obtaining a microstructure in which fine patterns on the surface of the stamper has been transferred. 【0004】しかしながら、前述した射出成形法及び2 However, injection molding and 2 described above
P法を利用して、大面積の微細構造体を製造するには装置の大型化が必要であるが、その大型化は大変困難である。 Using the P method, to manufacture a fine structure with a large area is required size of the device, its size is very difficult. 【0005】特開平7−153124号には、スタンパを移動させて多面付けスタンパを作成する方法が開示されている。 [0005] JP-7-153124, a method of creating a multi with stamper by moving the stamper is disclosed. しかし、微細パターンの転写の場合には樹脂ムラが問題となり、また、樹脂中に存在する空気により微細パターンの転写に悪影響を及ぼすおそれがある。 However, in the case of the transfer of a fine pattern becomes a resin unevenness problem, also, it can adversely affect transfer of a fine pattern by the air present in the resin. さらに、上記文献での多面付けにおけるスタンパは一方向にしか移動できない問題もある。 Furthermore, there is also a problem that the stamper can only move in one direction in the multi with the above literature. 【0006】 【発明が解決しようとする課題】本発明は、かかる事情に鑑み、微細構造体を製造するための装置を大型化する必要性がなく、高精度で微細パターンの転写を可能にする、微細構造体の製造方法を提供することを目的とする。 [0006] [SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, there is no need to increase the size of the apparatus for manufacturing a fine structure, to allow for transfer of a fine pattern with high precision , and an object thereof is to provide a method of manufacturing a microstructure. 【0007】 【課題を解決するための手段】上記目的は、マザースタンパの表面にある微細パターンを順次転写させることによる微細構造体の製造方法であって、(1)基板に対して前記マザースタンパを所定の位置に固定する工程と、 [0007] SUMMARY OF THE INVENTION The above object is achieved by a method for manufacturing a microstructure according thereby sequentially transferring a fine pattern on the surface of the mother stamper, (1) the mother stamper to the substrate and fixing to a predetermined position,
(2)前記マザースタンパと前記基板との間に樹脂を供給する工程と、(3)真空中にて前記マザースタンパを前記樹脂に押圧する工程と、(4)前記樹脂を硬化させる工程と、(5)前記マザースタンパを前記硬化樹脂から離脱させる工程と、(6)前記マザースタンパと前記基板との相対位置を変更させるように、前記マザースタンパ若しくは前記基板を移動させる工程と、(7)前記工程(6)の後、工程(2)〜工程(6)を所定の回数繰り返す工程と、を含むことを特徴とする微細構造体の製造方法により達成される。 (2) a step of supplying the resin between the mother stamper and the substrate, a step of pressing the mother stamper to the resin at (3) in a vacuum, and curing (4) the resin, (5) a step of separating the mother stamper from the cured resin, and (6) as to change the relative position between the mother stamper and the substrate, the step of moving the mother stamper or the substrate, (7) wherein after the step (6) is achieved by the method for producing a fine structure which comprises the steps of: step (2) to step (6) are repeated a predetermined number of times, the. 【0008】また、上記目的は、マザースタンパの表面にある微細パターンを順次転写させることによる微細構造体を備えた装置の製造方法であって、前記微細構造体は、(1)基板に対して前記マザースタンパを所定の位置に固定する工程と、(2)前記マザースタンパと前記基板との間に樹脂を供給する工程と、(3)真空中にて前記マザースタンパを前記樹脂に押圧する工程と、 Further, the above object is achieved by a method for manufacturing a device having a fine structure due be sequentially transferring a fine pattern on the surface of the mother stamper, the fine structure, with respect to (1) a substrate and fixing the mother stamper to a predetermined position, (2) the mother stamper and the step of supplying a resin between the substrate, the step of pressing the mother stamper to the resin at (3) in vacuum When,
(4)前記樹脂を硬化させる工程と、(5)前記マザースタンパを前記硬化樹脂から離脱させる工程と、(6) (4) and curing the resin, a step of separating from said curing resin (5) the mother stamper, (6)
前記マザースタンパと前記基板との相対位置を変更させるように、前記マザースタンパ若しくは前記基板を移動させる工程と、(7)前記工程(6)の後、工程(2) So as to change the relative position between the substrate and the mother stamper, a step of moving the mother stamper or the substrate, after (7) the step (6), Step (2)
〜工程(6)を所定の回数繰り返す工程と、を含む方法により製造され、(8)前記微細構造体を前記装置に組み込む工程と、を含む微細構造体を備えた装置の製造方法により達成される。 A step of repeating - step (6) a predetermined number of times, is manufactured by a process comprising, are achieved by a method for manufacturing a device having a fine structure comprising the steps of incorporating into the device the microstructure (8) that. 【0009】本発明の好ましい態様では、前記製造方法において、前記硬化樹脂よりも柔軟性のあるクッション材を介して、前記基板及び前記マザースタンパの各位置が固定されることを特徴とする。 [0009] In a preferred embodiment of the present invention, in the manufacturing method, through a cushioning material having flexibility than the cured resin, the position of the substrate and the mother stamper is characterized in that it is fixed. 【0010】本発明の好ましい態様では、前記製造方法において、前記工程(2)において、インクジェット法により所定の位置に前記樹脂を供給することを特徴とする。 [0010] In a preferred embodiment of the present invention, the manufacturing method, in the step (2), and supplying the resin to a predetermined position by an inkjet method. 【0011】本発明の好ましい態様では、前記製造方法において、前記樹脂は光硬化性樹脂又は熱硬化性樹脂であることを特徴とする。 [0011] In a preferred embodiment of the present invention, in the manufacturing method, the resin is characterized in that it is a photocurable resin or a thermosetting resin. 【0012】また、上記目的は、マザースタンパの表面にある微細パターンを、熱可塑性樹脂からなる基板へ順次転写させることによる微細構造体の製造方法であって、(1)前記基板に対して前記マザースタンパを所定の位置に固定する工程と、(2)前記基板を加熱圧着するように、真空中にて前記マザースタンパを前記基板へ押圧する工程と、(3)前記マザースタンパを前記基板から離脱させる工程と、(4)前記マザースタンパと前記基板との相対位置を変更させるように、前記マザースタンパ若しくは前記基板を移動させる工程と、(5)前記工程(4)の後、工程(2)〜工程(4)を所定の回数繰り返す工程と、を含むことを特徴とする微細構造体の製造方法により達成される。 [0012] The above-described object is a fine pattern on the surface of the mother stamper, method for manufacturing a microstructure according to be sequentially transferred to a substrate made of a thermoplastic resin, the relative (1) the substrate and fixing the mother stamper to a predetermined position, (2) to heat bonding the substrate, a step of pressing the mother stamper to the substrate in a vacuum, from the substrate (3) the mother stamper a step of separating, (4) so ​​as to change the relative position between the mother stamper and the substrate, and the step of moving the mother stamper or the substrate, after (5) the step (4), step (2 ) and - step (4) is repeated a predetermined number of times step is accomplished by the production method of the fine structure which comprises a. 【0013】また、上記目的は、マザースタンパの表面にある微細パターンを、熱可塑性樹脂からなる基板へ順次転写させることによる微細構造体を備えた装置の製造方法であって、前記微細構造体は、(1)前記基板に対して前記マザースタンパを所定の位置に固定する工程と、(2)前記基板を加熱圧着するように、真空中にて前記マザースタンパを前記基板へ押圧する工程と、 [0013] The above-described object is a fine pattern on the surface of the mother stamper, method for manufacturing a device having a fine structure due be sequentially transferred to a substrate made of a thermoplastic resin, the fine structure , and fixing the mother stamper to a predetermined position with respect to (1) the substrate, a step of pressing the mother stamper to the substrate (2) said to thermocompression bonding of the substrate, in a vacuum,
(3)前記マザースタンパを前記基板から離脱させる工程と、(4)前記マザースタンパと前記基板との相対位置を変更させるように、前記マザースタンパ若しくは前記基板を移動させる工程とを含み、(5)前記工程(4)の後、工程(2)〜工程(4)を所定の回数繰り返す工程と、を含む方法により製造され、(6)前記微細構造体を前記装置に組み込む工程と、含むことを特徴とする微細構造体を備えた装置の製造方法により達成される。 (3) a step of separating the mother stamper from the substrate, (4) so ​​as to change the relative position between the mother stamper and the substrate, and a step of moving the mother stamper or the substrate, (5 ) after the step (4), and step (2) are repeated - step (4) a predetermined number of times step, is prepared by a process comprising, (6) a step of incorporating the microstructure in the device, to include It is achieved by the method for manufacturing a device having a fine structure characterized. 【0014】本発明の好ましい態様では、前記製造方法において、前記硬化樹脂よりも柔軟性のあるクッション材を介して、前記基板及び前記マザースタンパの各位置が固定されることを特徴とする。 [0014] In a preferred embodiment of the present invention, in the manufacturing method, through a cushioning material having flexibility than the cured resin, the position of the substrate and the mother stamper is characterized in that it is fixed. 【0015】本発明の好ましい態様では、前記製造方法において、前記基板の裏打ち材として緩衝材を用いることを特徴とする。 [0015] In a preferred embodiment of the present invention, the manufacturing method is characterized by using the buffer material as a backing material of the substrate. 【0016】また、上記目的は、前記製造方法により製造される微細構造体により達成される。 Further, the above object is achieved by a fine structure manufactured by the manufacturing method. 【0017】また、上記目的は、微細パターンを転写させるための微細構造体製造用装置であって、基板を載置させるステージと、第一及び第二のブロックと、表面に前記微細パターンを有するマザースタンパーを配設させ、前記第一及び第二のブロックに沿って前記ステージに対して上下に可動するチャンバーと、から構成され、 Further, the above object is achieved by a fine structure manufacturing apparatus for transferring a fine pattern having a stage for mounting the substrate, and the first and second blocks, the fine pattern on the surface mother stamper is disposed, a chamber for moving up and down relative to the stage along the first and second blocks are composed of,
前記ステージとの相対位置が変更可能であるヘッドと、 The head relative position of the stage can be changed,
前記基板上に供給される樹脂を硬化させて、該樹脂に前記微細パターンを転写させる際に、前記ヘッド内を真空にさせる真空ポンプと、を具備することを特徴とする装置により達成される。 Curing the resin supplied to the substrate, when to transfer the fine pattern to the resin is achieved by a device characterized by comprising a vacuum pump for the vacuum, the inside the head. 【0018】また、上記目的は、微細パターンを転写させるための、微細構造体を備えた装置製造用装置であって、基板を載置させるステージと、第一及び第二のブロックと、表面に前記微細パターンを有するマザースタンパーを配設させ、前記第一及び第二のブロックに沿って前記ステージに対して上下に可動するチャンバーと、から構成され、前記ステージとの相対位置が変更可能であるヘッドと、前記基板上に供給される樹脂を硬化させて、該樹脂に前記微細パターンを転写させる際に、前記ヘッド内を真空にさせる真空ポンプと、前記微細構造体を前記装置に組み込むための組み込み手段と、を具備することを特徴とする装置により達成される。 Further, the object is for transferring a fine pattern, a device manufacturing apparatus having a microstructure, a stage for mounting the substrate, and the first and second blocks, on the surface is disposed a mother stamper having the fine pattern, a chamber for moving up and down relative to the stage along the first and second blocks are composed of, is changeable relative position of the stage and the head, to cure the resin to be supplied to the substrate, when to transfer the fine pattern to the resin, and a vacuum pump for the in the head to a vacuum, for incorporating the microstructure to said device It is achieved by a device characterized by comprising a built-in means. 【0019】本発明の好ましい態様では、前記装置において、前記ヘッドは、前記第一及び第二のブロックに固着され、前記ステージ上の基板と接するクッション材をさらに備え、前記クッション材は硬化した樹脂よりも柔軟性があることを特徴とする。 [0019] In a preferred embodiment of the present invention, in the apparatus, the head is fixed to the first and second blocks, further comprising a cushioning material in contact with the substrate on the stage, the cushion material has been cured resin characterized in that there is flexibility than. 【0020】本発明の好ましい態様では、前記装置において、前記真空ポンプは、前記ヘッド内を真空にすることを特徴とする。 [0020] In a preferred embodiment of the present invention, in the apparatus, the vacuum pump is characterized in that the inside of the head to the vacuum. 【0021】本発明の好ましい態様では、前記装置は樹脂を供給する供給手段をさらに具備することを特徴とする。 [0021] In a preferred embodiment of the present invention, the apparatus is characterized by further comprising supplying means for supplying a resin. 【0022】本発明の好ましい態様では、前記装置において、前記供給手段はインクジェット法に利用されるノズルであることを特徴とする。 [0022] In a preferred embodiment of the present invention, in the apparatus, characterized in that said supplying means is a nozzle which is utilized in an ink jet method. 【0023】本発明の好ましい態様では、前記装置は、 [0023] In a preferred embodiment of the present invention, the device,
チャンバーを加熱する加熱手段をさらに具備することを特徴とする。 And further comprising a heating means for heating the chamber. 【0024】本発明の好ましい態様では、前記装置は、 [0024] In a preferred embodiment of the present invention, the device,
前記ヘッドと一体となって移動し、前記樹脂を硬化させるための紫外線照射手段をさらに具備することを特徴とする。 The head and move together, and further comprising a UV irradiation means for curing the resin. 【0025】なお、本発明で用いる微細パターンのサイズは、サブミクロンの領域であり、オーダとしては、約0.1μmである。 [0025] The size of the fine pattern used in the present invention is a region of the sub-micron, as the order is about 0.1 [mu] m. また、本発明で用いる微細構造体とは、前記微細パターンを有する構造体のことをいう。 Further, the fine structure used in the present invention refers to a structure having the fine pattern. 【0026】 【発明の実施の形態】本発明の実施の形態を詳細に説明するが、本発明は、以下の実施態様に限定されるものではない。 [0026] illustrating the embodiment of the embodiment of the present invention in detail, but the present invention is not limited to the following embodiments. 【0027】まず、金属金型であるマザースタンパの製造方法を説明する。 Firstly, a method of manufacturing a mother stamper is a metal mold. 図1は、本発明に利用されるマザースタンパの製造工程を示す断面図である。 Figure 1 is a cross-sectional view showing the mother stamper manufacturing process utilized in the present invention. 【0028】薬液にて再生されたガラス原盤10を研磨洗浄した後で、図1(a)に示すように、ガラス原盤上にフォトレジスト膜20を塗布する。 [0028] The glass master 10 reproduced by chemical after abrasive cleaning, as shown in FIG. 1 (a), a photoresist film 20 on the glass master. このフォトレジスト膜20上に記録信号に応じたレーザ光にて照射する。 Irradiated by the laser beam corresponding to the recording signal on the photoresist film 20.
図1(b)に示す現像工程にて、露光部を除去し、微細な凹凸を有するパターンを形成する。 In the developing step shown in FIG. 1 (b), to remove the exposed portions to form a pattern having fine irregularities. 図1(c)に示すように、このフォトレジストの微細パターンに導電膜3 As shown in FIG. 1 (c), the conductive film 3 to the fine pattern of the photoresist
0を付ける。 Put a 0. この導電膜はスパッタリング及び蒸着、無電解めっき法にて形成される。 The conductive film sputtering and evaporation, are formed by electroless plating. 一般には、導電膜はA In general, the conductive film A
g、Niが使用される。 g, Ni is used. その後、当該導電膜を電極として、Ni電鋳を行い所定の厚さにし(図1(d)を参照)、ガラス原盤から剥離すると、表面に微細パターンを有するマザースタンパ40が得られる(図1 Then, (see to FIG. 1 (d)) of the conductive film as an electrode, and a predetermined thickness is performed Ni electroforming, when peeled from the glass master, mother stamper 40 having a fine pattern on its surface is obtained (Fig. 1
(e))。 (E)). 図1(e)には、半球上の微細パターンを示すが、本発明にて転写できる微細パターンはこれに限定されるものではない。 In FIG. 1 (e) shows a fine pattern on the hemisphere, a fine pattern can be transferred in the present invention is not limited thereto. 【0029】図2は、本発明による微細構造体の製造方法の一の態様を説明する図である。 FIG. 2 is a diagram illustrating an embodiment of a method for manufacturing a microstructure according to the present invention. 後述する本発明による微細構造体製造用の装置100を構成するヘッド20 Head 20 constituting the apparatus 100 for fine structure produced according to the present invention described later
0に、前述のように製造したマザースタンパ40(図2 0, the mother stamper 40 (FIG. 2 prepared as described above
には図示せず)を所定の位置に配設させる。 To disposed not shown) in place. なお、図2 It should be noted that FIG. 2
は前記装置100の正面図である。 Is a front view of the device 100. 大型基板310を前記装置のステージ300に載置させ、マザースタンパ4 The large substrate 310 is mounted on the stage 300 of the apparatus, the mother stamper 4
0が有する微細パターンを転写したい前記大型基板の領域の位置決めを行い、例えば、前記ヘッドを図2の実線で囲まれた領域へ移動する。 0 performs positioning of regions of the large substrate to be transferring a fine pattern having, for example, moves to the head surrounded by the solid line in FIG. 2 regions. あるいは、前記ヘッドを固定したままの状態で、大型基板が載置されたステージ3 Alternatively, in a state of fixing the said head, stage 3 large substrate is placed
00を移動させることも可能である。 It is also possible to move the 00. 図2に示すように、大型基板310を固定するステージ300に対して、マザースタンパ400を配設させるヘッド200の大きさは小さくてよい。 As shown in FIG. 2, with respect to the stage 300 for fixing the large substrate 310, the size of the head 200 which is disposed the mother stamper 400 may be small. 【0030】図2の実線に示す領域にて、マザースタンパの微細パターンの転写後、ヘッド200又はステージ300を移動させて、次に転写させたい領域へ移動することができる。 [0030] in the area indicated by the solid line in FIG. 2, it is possible after the transfer of the mother stamper fine pattern, by moving the head 200 or the stage 300, then moves to the area desired to be transferred. 例えば、図3に示すように、領域、 For example, as shown in FIG. 3, region,
、の順(X軸方向)や、領域、、の順(Y軸方向)に、ヘッド200又はステージ300を移動させて、マザースタンパ40の微細パターンを順次転写させることができる。 , And forward (X-axis direction) of the order of region ,, (Y-axis direction) to move the head 200 or the stage 300, can sequentially transferring a fine pattern of the mother stamper 40. かかるヘッド200又はステージ30 Such a head 200 or stage 30
0の移動を順次繰り返すことにより、大型基板にマザースタンパ40の微細パターンの転写が実現される。 By sequentially repeating the moving of 0, transfer of a fine pattern of the mother stamper 40 is implemented on a large substrate. なお、前記ヘッドはX、Y、Z(図3の紙面に対して垂直方向)軸方向に移動可能であり、前記ステージはX及びY軸方向に移動可能である。 Incidentally, the head X, Y, Z is movable in the axial direction (direction perpendicular to the paper surface of FIG. 3), the stage is movable in X and Y-axis directions. 【0031】本発明に利用される基板310の材料としては、特に限定されないが、後述するように紫外線を用いて樹脂を硬化させる場合には、紫外線等を通過させるガラス製や透明な樹脂であることが望ましい。 [0031] As the material of the substrate 310 to be utilized in the present invention is not particularly limited, when the resin is cured using ultraviolet radiation as described below is a glass or a transparent resin that passes ultraviolet rays it is desirable. 【0032】図4及び図5は、本発明による微細構造体の製造方法の第一の態様を説明する図である。 [0032] Figures 4 and 5 are diagrams for explaining a first embodiment of the production method of fine structures according to the present invention. 本発明による微細構造体製造用装置100を用いて、マザースタンパ40が有する微細パターンを転写させる。 Using a fine structure manufacturing apparatus 100 according to the present invention, thereby transferring a fine pattern having the mother stamper 40. 図4に示す微細構造体製造装置100は、ヘッド200とステージ300とから構成される。 Microstructure manufacturing apparatus 100 shown in FIG. 4 is composed of the head 200 and the stage 300.. なお、図4及び図5では、 In FIG. 4 and FIG. 5,
説明を簡潔にするために一つのヘッドを例示するが、パターンの転写効率を向上させるためには、複数のヘッドを用いてもよい。 Description illustrates one head for simplicity. However, in order to improve the transfer efficiency of the pattern may be a plurality of heads. 【0033】前記ステージ300には基板310を設置させることができる。 [0033] it is possible to install the substrate 310 on the stage 300. 前記ヘッド200は第一のブロック210及び第二のブロック220と、チャンバー23 The head 200 includes a first block 210 and second block 220, the chamber 23
0とを有し、前記チャンバー230には、前述のように製造されたマクタースタンパ40が配設され、前記第一のブロック210及び第二のブロック220を介して、 Has 0 and, in the chamber 230, macro terpolymers stamper 40 manufactured as described above is disposed, via the first block 210 and second block 220,
基板310に対して上下に可動する。 Movable up and down relative to the substrate 310. また、第一のブロック210には樹脂400を供給するための手段250 Furthermore, it means 250 for the first block 210 to supply resin 400
を具有し、第二のブロック220は、基板310及びマザースタンパ40により画成される空間と連通した管を有し、真空ポンプ260の作用により該管を介して前記空間を真空にさせる。 And androgynous a second block 220 has a tube communicates with the space defined by the substrate 310 and the mother stamper 40, thereby to vacuum the space through the tube by the action of the vacuum pump 260. なお、前記第一のブロック210 Incidentally, the first block 210
が前記管を有し、一方、前記第二のブロック220が前記手段250を有する構造でもよい。 There have the tube, whereas the second block 220 may have a structure having the unit 250. 【0034】また、前記第一のブロック210及び第二のブロック220は、基板310と接するクッション材240を備える。 Further, the first block 210 and second block 220 is provided with a cushion member 240 which is in contact with the substrate 310. マザースタンパ40の有する微細パターンを転写させたい領域は、前記クッション材240により囲まれ、前述したヘッド内の真空を可能にする。 Area desired to be transferring a fine pattern having a mother stamper 40 is surrounded by the cushion member 240, to allow the vacuum in the head as described above. その他のクッション材240の働きについては、後述する。 For the work of the other cushion material 240, it will be described later. 【0035】本発明による微細構造体の製造方法は、前記チャンバー230に配設されたマザースタンパ40が基板310に対して、図4に示すように、所定の位置に固定される。 The method for manufacturing a microstructure according to the present invention, the mother stamper 40, which is disposed in the chamber 230 to the substrate 310, as shown in FIG. 4, is fixed to a predetermined position. 次いで、前記マザースタンパ40と前記基板310との間に、被硬化樹脂400を供給する。 Then, between the substrate 310 and the mother stamper 40, supplying a curable resin 400. 供給方法としては、ブロックに設けられた樹脂供給手段25 As the supply method, a resin supply means 25 provided in the block
0を介して、一定量の樹脂をムラなく供給するインクジェット法が好ましい。 Through 0, an inkjet method is preferable to supply a quantity of resin evenly. インクジェット法により樹脂を供給する場合には、前記手段250はノズルであることが好ましい。 When supplying the resin by an ink jet method, it is preferable that the means 250 is the nozzle. 【0036】次に、ヘッド200に備えられている真空ポンプ260によりヘッド内部を真空にする。 Next, a vacuum inside the head by a vacuum pump 260 provided in the head 200. その際に、樹脂400中に存在する空気等の脱気や脱泡が可能となる。 At that time, it is possible to degas and defoaming such as air present in the resin 400. 真空状態に保ちながら、供給された樹脂400 While maintaining the vacuum state, the supplied resin 400
を前記マザースタンパ40により押圧し、樹脂を硬化させる。 Pressed by the mother stamper 40, the resin is cured. 硬化させる方法としては、熱硬化又は光硬化があるが、使用する樹脂の性質に左右される。 As a method of curing, there is a thermosetting or light curing, depends on the nature of the resin used. よって、本発明にて供給される樹脂としては、光硬化性樹脂又は熱硬化性樹脂が好ましい。 Therefore, the resin is supplied in the present invention, a photocurable resin or a thermosetting resin is preferable. 【0037】光硬化性樹脂を利用する場合、前記基板3 [0037] When using a photocurable resin, the substrate 3
10は紫外線を透過させる材質であることが好ましい。 It is preferred that 10 is a material that transmits ultraviolet rays.
つまり、前記基板310を介して紫外線照射手段500 That, ultraviolet light irradiation means 500 via the substrate 310
からの紫外線により樹脂400が硬化される(図5を参照)。 Resin 400 is cured by UV light from (see Figure 5). 紫外線照射手段500はヘッド200と一体となって移動し、ヘッド200が被転写領域に移動した場合に、当該領域にて光硬化製樹脂を硬化させることができる。 Ultraviolet light irradiation means 500 is moved together with the head 200, when the head 200 is moved to the transfer area, it is possible to cure the photocurable resin in the region. 紫外線照射手段500の具体例としては、水銀灯などが挙げられる。 Specific examples of the ultraviolet light irradiation means 500, like a mercury lamp. 【0038】また、熱硬化性樹脂を利用する場合には、 [0038] In the case of using a thermosetting resin,
スタンパを加熱させる手段、例えばヒータ等により、スタンパを介して熱を樹脂に伝播させ、樹脂を硬化させる。 It means for heating the stamper, for example, by a heater or the like, heat is propagated to the resin through a stamper, the resin is cured. 【0039】しかる後、前記マザースタンパ40を硬化樹脂から離脱させ、硬化樹脂が基板310上に形成される。 [0039] Thereafter, the mother stamper 40 is detached from the cured resin, the cured resin is formed on the substrate 310. 図3にて説明したように、マザースタンパ40又は前記基板310の相対位置を変更させるように、ヘッド200又はステージ300を移動させ、次に転写させたい基板の領域へ、前述と同様な方法により転写させる。 As described with reference to FIG. 3, as to change the relative positions of the mother stamper 40 or the substrate 310 moves the head 200 or the stage 300, then the area of ​​the substrate desired to be transferred, by a similar to the above method to transfer.
これを繰り返すことにより、大型基板へ所望の微細パターンが形成され得る。 By repeating this, a large substrate a desired fine pattern can be formed. 【0040】前記したクッション材240は、マザースタンパの有する微細パターンを転写させたい領域を囲み、一回の転写部分を限定し、供給された樹脂の拡散を防止する働きがある。 The cushion material 240 described above surrounds the region intended to be transferring a fine pattern having a mother stamper, limiting the transfer portion once, there is a function of preventing diffusion of the supplied resin. さらに、クッション材240は、 In addition, the cushion material 240,
微細パターンが転写された硬化樹脂よりも柔軟性を有する必要がある。 It should have a flexibility than the fine pattern is transferred cured resin. 図4では、前記クッション材240は基板に直接接しているが、図5の左側のクッション材24 In FIG. 4, the cushion material 240 is in direct contact with the substrate, the left side of FIG. 5 of the cushion member 24
0では、そのクッション材240は先に硬化した樹脂3 In 0, resin 3 that the cushion material 240 is cured earlier
20上に載置されている。 It has been placed on the 20. この場合、前記クッション材が硬化樹脂320に対して縮む必要がある。 In this case, the cushion material is required to shrink to the cured resin 320. つまり、硬化樹脂320よりも柔軟性を有しなければ、クッション材240と硬化樹脂320との間に隙間が生じ、マザースタンパ40により樹脂400を押圧する際に真空を保持できなくなり、前述したように、樹脂中に存在する空気等に起因した樹脂ムラが発生するおそれがある。 That is, if you have no flexibility than the cured resin 320, a gap between the cushioning material 240 and the cured resin 320, will not be able to hold a vacuum when pressing the resin 400 by the mother stamper 40, as described above , there is a possibility that resin unevenness caused by the air or the like existing in the resin may occur. 【0041】前記した本発明による製造方法によれば、 [0041] According to the manufacturing method according to the present invention described above,
図6に示すような転写された微細パターンを有する微細構造体が得られる。 Microstructure is obtained having the transferred fine pattern as shown in FIG. さらに、ヘッド200又はステージ300を移動させて、得られた微細パターンの隣りにおいて同様に微細パターンを転写すれば、図7に示すような転写パターンが得られる。 Furthermore, by moving the head 200 or the stage 300, if the transfer similarly fine pattern in neighboring resulting fine pattern is transferred pattern as shown in FIG. 7 is obtained. かかる転写を順次行えば、 If sequentially carried out such a transfer,
大型基板にマザースタンパが有する転写パターンを、広範囲に同一の転写パターンを形成されることが可能となる。 The transfer pattern mother stamper has a large substrate, extensively and it is possible to be formed by the same transfer pattern. 【0042】以上の繰り返しで、図8に示すように、大面積の大型基板全体に微細構造体を得ることができる。 [0042] In the above repeating, as shown in FIG. 8, may be large entire substrate having a large area obtain a fine structure. 【0043】次に、本発明による別の実施態様を説明する。 [0043] Next, another embodiment according to the present invention. 【0044】図9は、本発明による微細構造体の製造方法の第二の態様を説明する図である。 [0044] Figure 9 is a diagram for explaining the second embodiment of the production method of fine structures according to the present invention. 図4及び図5に示した方法とは異なり、樹脂400を使用する代わりに、 Unlike the method shown in FIGS. 4 and 5, instead of using the resin 400,
基板310が熱可塑性樹脂から構成されることを特徴とする。 Wherein the substrate 310 is composed of a thermoplastic resin. 【0045】ステージ300には熱可塑性樹脂からなる大型基板を配置する。 [0045] Stage 300 is placing a large substrate consisting of a thermoplastic resin. 基板として利用され得る具体的な例としては、ポリカーボネート、ポリスチレン、アクリル樹脂等が挙げられる。 Specific examples which may be utilized as the substrate, polycarbonate, polystyrene, and acrylic resins. 前記基板の厚みは特に限定されないが、100μm〜200μmのフィルムの場合には、フィルム単体での使用も可能である。 The thickness of the substrate is not particularly limited, in the case of a film of 100μm~200μm the use of the film itself is also possible. 基板として、 As the substrate,
フィルム形態の熱可塑性樹脂を利用する場合には、後述する加熱圧着の際に、未転写部分の熱変形を防止するために、基板の下に裏打ち材として、例えば、シリコーンゴムのような緩衝材を設けることができる。 When using a thermoplastic resin film forms, at the time of thermocompression bonding to be described later, in order to prevent thermal deformation of the non-transferred portion, as a lining material under the substrate, for example, cushioning material such as silicone rubber it can be provided. 【0046】第二の態様による具体的な製造方法は、前記した第一の態様と同じように、マザースタンパ40 The specific manufacturing method according to the second aspect, like the first embodiment described above, the mother stamper 40
を、チャンバー230を介してヘッド200に固定する。 And fixed to the head 200 through the chamber 230. ヘッド200を移動させて、転写させたい位置を決定する。 The head 200 is moved, it determines the position desired to be transferred. あるいは、ステージ300の移動により転写位置を決定することもできる。 Alternatively, it is also possible to determine the transfer position by the movement of the stage 300. 第二の態様では、後述する理由から、チャンバー230には、ヒータなどの加熱手段を具有する。 In a second aspect, the reason described below, the chamber 230, to androgynous heating means such as a heater. ヘッド200のチャンバー230を加熱させ、マザースタンパ40が所望の温度へ上昇させる。 The chamber 230 of the head 200 is heated, the mother stamper 40 raises to a desired temperature.
加熱する温度は、使用する基板の軟化温度以上、融点以下であることが望ましい。 The heating temperature is above the softening temperature of the substrate to be used, it is desirable that the melting point or less. 例えば、ポリカーボネートを使用する場合には、マザースタンパ40の温度を130 For example, when using polycarbonate, the temperature of the mother stamper 40 130
〜260℃に加熱する。 Heated to ~260 ℃. 【0047】また、予め基板自体を加熱しておいてもよい。 Further, it may be heated in advance substrate itself. ただし、その場合の温度は基板の軟化温度以下に設定するが、できるだけ高温であることが望ましい。 However, although the temperature in this case is set equal to or less than the softening temperature of the substrate is desirably as high as possible. 【0048】マザースタンパ40の温度が安定した後、 [0048] After the temperature of the mother stamper 40 is stabilized,
ヘッド200のチャンバー230のみを下降させて、マザースタンパ40を熱可塑性樹脂基板に押圧する。 Only the chamber 230 of the head 200 is lowered to press the mother stamper 40 to the thermoplastic resin substrate. この際にマザースタンパ40により加熱圧着させ、マザースタンパ40を剥離すると、図10に示す転写パターンが形成される。 This time was heat-pressed by the mother stamper 40, when peeling off the mother stamper 40, the transfer pattern shown in FIG. 10 is formed. 圧着時間は加熱温度に影響されるので、適切な時間を設定することが望ましい。 Since bonding time is affected by the heating temperature, it is desirable to set the appropriate time. 【0049】ヘッド200のブロック210、220にはクッション材240を備え、ヘッド200が、既にパターンが形成された位置に載置される場合には、第一の態様にて説明したのと同じ理由により、熱可塑性樹脂から構成される基板よりも柔軟性がなければならない。 [0049] provided with a cushioning material 240 to block 210, 220 of the head 200, when the head 200 is placed on the already pattern is formed position is the same reason as described in the first embodiment Accordingly, there must be more flexible than the substrate composed of a thermoplastic resin. また、本発明の第二の態様による製造方法において、前記クッション材240は、基板である熱可塑性樹脂の未転写部分への熱の伝播を防ぎ、基板の変形を防止する機能も有する。 In the method according to the second aspect of the present invention, the cushion member 240 is to prevent heat from propagating untransferred portion of the thermoplastic resin is a substrate also has a function of preventing the deformation of the substrate. 【0050】図10及び図11は、本発明による製造方法の第二の態様により形成される転写パターンの概略断面図を示す。 [0050] FIGS. 10 and 11 show a schematic cross-sectional view of a transfer pattern formed by the second embodiment of the method according to the invention. マザースタンパ40を有するヘッド200 Head 200 having a mother stamper 40
を移動、若しくは基板310である熱可塑性樹脂が固定されているステージ300を順次移動させることにより、大型基板の広範囲に同一パターンが転写され、大型基板に微細構造体を形成することが可能となる。 Movement, or by a thermoplastic resin is sequentially moving the stage 300 which is fixed a substrate 310, extensively same pattern of large substrate is transferred, it is possible to form a fine structure on a large substrate . 【0051】前述した本発明による第一及び第二の態様の製造方法により製造された大型基板の微細構造体をマスタースタンパとして用いて、以下に説明するように大型金型を製造することができる。 [0051] Using the microstructure of the large substrate manufactured by the manufacturing method of the first and second aspects of the present invention described above as a master stamper, it is possible to produce a large mold as described below . 【0052】本発明の製造方法の第一の態様により得られた微細パターンを有する大型基板表面を、図12 [0052] The large substrate surface having obtained fine patterns by the first embodiment of the production method of the present invention, FIG. 12
(b)工程に示すように、導体化処理を施し、ニッケル電鋳し(図12(c))、大型基板から剥離することにより、図12(d)に示す大型金属金型を製造することができる。 (B) as shown in step, subjected to a conductive treatment, nickel electroforming (FIG. 12 (c)), by peeling from the large substrate, to produce a large metal mold shown in FIG. 12 (d) can. 【0053】上述したような微細構造体の製造方法は、 The method of manufacturing a micro structure as described above,
種々の微細構造体を備える部材、表示装置をはじめとする電子装置等の装置の製造において適用可能である。 Member comprising a variety of microstructures can be applied in the manufacture of devices such as an electronic device including the display device. 例えば、反射型又は半透過反射型液晶表示装置の反射体における凹凸構造等の微細構造の形成に適用するなど、微細構造体を備えた液晶装置、有機EL装置、これらを含む表示装置、その他光学素子を含む装置等の電子装置の製造に適用することができる。 For example, reflective or the like is applied to the formation of the microstructure, such as a concavo-convex structure in the reflector of the transflective liquid crystal display device, liquid crystal device, an organic EL device having a fine structure, a display device including these, other optical it can be applied to the manufacture of electronic devices of the apparatus or the like including a device. 【0054】例えば、前述の製造方法により製造された微細構造体を、組み込み手段により液晶表示装置に組み込む工程により、反射型又は半透過反射型液晶表示装置が製造される。 [0054] For example, a fine structure produced by the production method described above, the step of incorporating the liquid crystal display device by incorporation unit, reflective or transflective liquid crystal display device is manufactured. 【0055】 【発明の効果】請求項1、3乃至6、8、9に記載の製造方法によれば、微細パターンを有するマザースタンパから大型基板前面に繋ぎ目のない連続パターンの微細構造体の形成が実現できる。 [0055] [Effect of the Invention of claim 1, 3 to 6, 8 and 9 according to the production method, the mother stamper without continuous pattern of joints on large substrate front surface of the microstructure having a fine pattern formation can be realized. また、その基板をもとに、金属金型も製造可能である。 Further, the substrate on the basis of metal mold can also be produced. 【0056】請求項2、7に記載の製造方法によれば、 [0056] According to the manufacturing method according to claim 2 and 7,
微細パターンを有するマザースタンパから大型基板前面に繋ぎ目のない連続パターンの微細構造体を備えた装置の製造が実現される。 Manufacture of the device having a fine structure with no continuous patterns joints on large substrate front from the mother stamper having a fine pattern is realized. 【0057】また、請求項3及び8に記載の本発明の製造方法によれば、柔軟性のあるクッション材を介してヘッドと基板とが接することにより、一回の微細パターンの転写する範囲を限定させることができ、樹脂を硬化させる場合には、樹脂自体の拡散を防止することができる。 [0057] Further, according to the manufacturing method of the present invention described in claim 3 and 8, by the head and the substrate are in contact via a cushion material having flexibility, the range of transfer of a single fine pattern it can be limited, in the case of curing the resin, it is possible to prevent diffusion of the resin itself. また、基板に熱可塑性樹脂を用いた場合には、未転写部分の変形を最小限に抑制し、保護することができる。 In the case of using a thermoplastic resin in the substrate, it is possible to suppress the deformation of the untransferred portion to a minimum, be protected. さらに、パターンを転写する際の真空を確実にし、 Furthermore, to ensure a vacuum when transferring a pattern,
樹脂の脱泡を可能とし、もって微細パターンの転写が実現される。 To enable the degassing of the resin, transfer of a fine pattern is realized with. 【0058】請求項4に記載の製造方法によれば、インクジェット法により樹脂をムラなく均一に供給することができ、もって微細パターンの転写を可能とする。 [0058] According to the manufacturing method according to claim 4, by an ink jet method can be uniformly supplied without the resin unevenness, has been to enable transfer of a fine pattern. 【0059】請求項9に記載の製造方法によれば、熱可塑性樹脂の未転写部分の変形を防止することができる。 [0059] According to the manufacturing method according to claim 9, it is possible to prevent deformation of the untransferred portion of the thermoplastic resin. 【0060】請求項11乃至18に記載の装置によれば、微細パターンを有するマザースタンパから大型基板前面に繋ぎ目のない連続パターンの微細構造体と、当該微細構造体を有する装置を製造するための装置が提供される。 [0060] wherein the apparatus according to according to claim 11 or 18, the microstructure of the no continuity patterns joints on large substrate front from the mother stamper having a fine pattern, for the manufacture of a device having the microstructures apparatus is provided for.

【図面の簡単な説明】 【図1】 本発明に利用されるマザースタンパーの製造工程の断面図である。 It is a cross-sectional view of BRIEF DESCRIPTION OF THE DRAWINGS [Figure 1] mother stamper manufacturing process utilized in the present invention. 【図2】 本発明による微細構造体の製造方法の第一の態様を説明する図である。 2 is a diagram illustrating a first embodiment of the production method of fine structures according to the present invention. 【図3】 本発明による微細構造体の製造方法による微細パターンの転写順序の例を説明する図である。 Is a diagram illustrating an example of a transfer sequence of a fine pattern by the manufacturing method of the microstructure according to the present invention; FIG. 【図4】 本発明の実施態様による微細構造体の製造方法を説明する図である。 4 is a diagram for explaining a method of manufacturing the microstructure according to embodiments of the present invention. 【図5】 本発明の実施態様による微細構造体の製造方法を説明する図である。 5 is a diagram for explaining a method of manufacturing the microstructure according to embodiments of the present invention. 【図6】 本発明の製造方法により転写された樹脂の微細パターンの概略断面図である。 6 is a schematic cross-sectional view of a fine pattern of the transferred resin by the production method of the present invention. 【図7】 本発明の製造方法により、順次転写された微細パターンの概略断面図である。 The production method of [7] The present invention is a schematic sectional view of a sequentially transferred micropattern. 【図8】 本発明の製造方法により製造された大面積基板の転写パターンの概略図である。 8 is a schematic view of a transfer pattern of a large area substrate manufactured by the manufacturing method of the present invention. 【図9】 本発明による微細構造体の製造方法の第二の態様を説明する図である。 9 is a diagram illustrating a second embodiment of the production method of fine structures according to the present invention. 【図10】 本発明による製造方法の第二の態様により形成される転写パターンの概略断面図を示す。 Figure 10 shows a schematic cross-sectional view of a transfer pattern formed by the second embodiment of the method according to the invention. 【図11】 本発明による製造方法の第二の態様により形成される転写パターンの概略断面図を示す。 11 shows a schematic cross-sectional view of a transfer pattern formed by the second embodiment of the method according to the invention. 【図12】 本発明による製造方法により製造された微細構造体を有する大型基板をマスタースタンパとして用いて、大型金属金型の製造工程の断面図である。 [12] using a large substrate having a fine structure produced by the method according to the invention as a master stamper is a cross-sectional view of a large metal mold manufacturing process. 【符号の説明】 10 ガラス原盤20 フォトレジスト膜30 導電膜40 マザースタンパ100 微細構造体製造用装置200 ヘッド210 第一のブロック220 第二のブロック230 チャンバー240 クッション材250 樹脂供給手段260 真空ポンプ300 ステージ310 基板320 微細パターンを有する、先に硬化した樹脂400 樹脂500 紫外線照射手段 [Description of reference numerals] 10 glass master disk 20 photoresist film 30 conductive 40 mother stamper 100 microstructure first block 220 manufacturing equipment 200 head 210 second block 230 the chamber 240 a cushion material 250 resin supply means 260 vacuum pump 300 having a stage 310 substrate 320 fine patterns, resin and cured above 400 resin 500 ultraviolet light irradiation means

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Claims (1)

  1. 【特許請求の範囲】 【請求項1】 マザースタンパの表面にある微細パターンを順次転写させることによる微細構造体の製造方法であって、 (1) 基板に対して前記マザースタンパを所定の位置に固定する工程と、 (2) 前記マザースタンパと前記基板との間に樹脂を供給する工程と、 (3) 真空中にて前記マザースタンパを前記樹脂に押圧する工程と、 (4) 前記樹脂を硬化させる工程と、 (5) 前記マザースタンパを前記硬化樹脂から離脱させる工程と、 (6) 前記マザースタンパと前記基板との相対位置を変更させるように、前記マザースタンパ若しくは前記基板を移動させる工程と、 (7) 前記工程(6)の後、工程(2)〜工程(6) A manufacturing method of Claims 1] microstructure due be sequentially transferring a fine pattern on the surface of the mother stamper, the mother stamper to a predetermined position with respect to (1) a substrate and fixing, a process of supplying the resin between the substrate and (2) the mother stamper, a step of pressing the mother stamper to the resin at (3) in vacuum, (4) the resin and curing, (5) a step of separating the mother stamper from the cured resin, (6) so to change the relative position between the mother stamper and the substrate, the step of moving the mother stamper or the substrate If, (7) after the step (6), step (2) to step (6)
    を所定の回数繰り返す工程と、を含むことを特徴とする微細構造体の製造方法。 Method for manufacturing a microstructure, wherein a comprises a predetermined number of times to repeat steps a. 【請求項2】 マザースタンパの表面にある微細パターンを順次転写させることによる微細構造体を備えた装置の製造方法であって、 前記微細構造体は、 (1) 基板に対して前記マザースタンパを所定の位置に固定する工程と、 (2) 前記マザースタンパと前記基板との間に樹脂を供給する工程と、 (3) 真空中にて前記マザースタンパを前記樹脂に押圧する工程と、 (4) 前記樹脂を硬化させる工程と、 (5) 前記マザースタンパを前記硬化樹脂から離脱させる工程と、 (6) 前記マザースタンパと前記基板との相対位置を変更させるように、前記マザースタンパ若しくは前記基板を移動させる工程と、 (7) 前記工程(6)の後、工程(2)〜工程(6) 2. A method for manufacturing a device having a fine structure due be sequentially transferring a fine pattern on the surface of the mother stamper, the fine structure, the mother stamper against (1) the substrate and fixing in position, and supplying the resin between the substrate and (2) the mother stamper, a step of pressing the mother stamper to the resin at (3) in a vacuum, (4 ) and curing the resin, (5) a step of separating the mother stamper from the cured resin, so as to change the relative position between the substrate and (6) the mother stamper, the mother stamper or the substrate a step of moving, (7) after the step (6), step (2) to step (6)
    を所定の回数繰り返す工程と、を含む方法により製造され、 (8) 前記微細構造体を前記装置に組み込む工程と、 A predetermined number of times to repeat steps, are prepared by a process comprising the steps of incorporating into the device the microstructure (8),
    を含む微細構造体を備えた装置の製造方法。 Method for manufacturing a device including a microstructure containing. 【請求項3】 前記硬化樹脂よりも柔軟性のあるクッション材を介して、前記基板及び前記マザースタンパの各位置が固定されることを特徴とする請求項1又は2に記載の製造方法。 3. A through the cushion material having flexibility than the cured resin, said substrate and a manufacturing method according to claim 1 or 2 each position of the mother stamper is characterized in that it is fixed. 【請求項4】 前記工程(2)において、インクジェット法により所定の位置に前記樹脂を供給することを特徴とする請求項1又は2に記載の製造方法。 4. A wherein step (2) A process according to claim 1 or 2, characterized in that supplying the resin to a predetermined position by an inkjet method. 【請求項5】 前記樹脂は光硬化性樹脂又は熱硬化性樹脂であることを特徴とする請求項1又は2に記載の製造方法。 Wherein said resin production method of claim 1 or 2, characterized in that a photocurable resin or a thermosetting resin. 【請求項6】 マザースタンパの表面にある微細パターンを、熱可塑性樹脂からなる基板へ順次転写させることによる微細構造体の製造方法であって、 (1) 前記基板に対して前記マザースタンパを所定の位置に固定する工程と、 (2) 前記基板を加熱圧着するように、真空中にて前記マザースタンパを前記基板へ押圧する工程と、 (3) 前記マザースタンパを前記基板から離脱させる工程と、 (4) 前記マザースタンパと前記基板との相対位置を変更させるように、前記マザースタンパ若しくは前記基板を移動させる工程と、 (5) 前記工程(4)の後、工程(2)〜工程(4) 6. The fine pattern on the surface of the mother stamper, method for manufacturing a microstructure according to be sequentially transferred to a substrate made of a thermoplastic resin, predetermined the mother stamper against (1) the substrate and fixing the position of, (2) to heat bonding the substrate, a step of pressing the mother stamper to the substrate in a vacuum, a step of separating the (3) the mother stamper from the substrate , (4) the so as to change the relative positions of the mother stamper and the substrate, and the step of moving the mother stamper or the substrate, (5) after said step (4), step (2) to step ( 4)
    を所定の回数繰り返す工程と、を含むことを特徴とする微細構造体の製造方法。 Method for manufacturing a microstructure, wherein a comprises a predetermined number of times to repeat steps a. 【請求項7】 マザースタンパの表面にある微細パターンを、熱可塑性樹脂からなる基板へ順次転写させることによる微細構造体を備えた装置の製造方法であって、前記微細構造体は、 (1) 前記基板に対して前記マザースタンパを所定の位置に固定する工程と、 (2) 前記基板を加熱圧着するように、真空中にて前記マザースタンパを前記基板へ押圧する工程と、 (3) 前記マザースタンパを前記基板から離脱させる工程と、 (4) 前記マザースタンパと前記基板との相対位置を変更させるように、前記マザースタンパ若しくは前記基板を移動させる工程と、 (5) 前記工程(4)の後、工程(2)〜工程(4) 7. A fine pattern on the surface of the mother stamper, method for manufacturing a device having a fine structure due be sequentially transferred to a substrate made of a thermoplastic resin, the fine structure (1) and fixing the mother stamper to the substrate at a predetermined position, a step of pressing the mother stamper to the substrate (2) said to thermocompression bonding of the substrate, in a vacuum, (3) the a step of separating the mother stamper from the substrate, (4) the so as to change the relative positions of the mother stamper and the substrate, and the step of moving the mother stamper or the substrate, (5) the step (4) after the step (2) to step (4)
    を所定の回数繰り返す工程と、を含む方法により製造され、 (6) 前記微細構造体を前記装置に組み込む工程と、 A predetermined number of times to repeat steps, are prepared by a process comprising the steps of incorporating into the device (6) the microstructure,
    含むことを特徴とする微細構造体を備えた装置の製造方法。 Method for manufacturing a device having a microstructure which comprises. 【請求項8】 前記硬化樹脂よりも柔軟性のあるクッション材を介して、前記基板及び前記マザースタンパの各位置が固定されることを特徴とする請求項6又は7に記載の製造方法。 8. via a cushion material having flexibility than the cured resin, the manufacturing method according to claim 6 or 7 each position of the substrate and the mother stamper is characterized in that it is fixed. 【請求項9】 前記基板の裏打ち材として緩衝材を用いることを特徴とする請求項6又は7に記載の製造方法。 9. The method according to claim 6 or 7, characterized by using the buffer material as a backing material of the substrate. 【請求項10】 請求項1乃至9のうち何れか一項に記載された製造方法により製造されることを特徴とする微細構造体。 10. A microstructure, characterized in that it is manufactured by the manufacturing method according to any one of claims 1 to 9. 【請求項11】 微細パターンを転写させるための微細構造体製造用装置であって、 基板を載置させるステージと、 第一及び第二のブロックと、表面に前記微細パターンを有するマザースタンパーを配設させ、前記第一及び第二のブロックに沿って前記ステージに対して上下に可動するチャンバーと、から構成され、前記ステージとの相対位置が変更可能であるヘッドと、 前記基板上に供給される樹脂を硬化させて、該樹脂に前記微細パターンを転写させる際に、前記ヘッド内を真空にさせる真空ポンプと、を具備することを特徴とする装置。 11. A microstructure manufacturing apparatus for transferring a fine pattern, distribution and stage for mounting the substrate, and the first and second blocks, the mother stamper having the fine pattern on the surface is set, a chamber for moving up and down relative to the stage along the first and second blocks are composed of a head relative position of the stage can be changed, it is supplied onto the substrate that the resin is cured, and when to transfer the fine pattern to the resin, characterized by comprising a vacuum pump for the vacuum in the head unit. 【請求項12】 微細パターンを転写させるための、微細構造体を備えた装置製造用装置であって、 基板を載置させるステージと、 第一及び第二のブロックと、表面に前記微細パターンを有するマザースタンパーを配設させ、前記第一及び第二のブロックに沿って前記ステージに対して上下に可動するチャンバーと、から構成され、前記ステージとの相対位置が変更可能であるヘッドと、 前記基板上に供給される樹脂を硬化させて、該樹脂に前記微細パターンを転写させる際に、前記ヘッド内を真空にさせる真空ポンプと、 前記微細構造体を前記装置に組み込むための組み込み手段と、を具備することを特徴とする装置。 12. for transferring a fine pattern, a device manufacturing apparatus having a microstructure, a stage for mounting the substrate, and the first and second blocks, the fine pattern on the surface is disposed a mother stamper having a chamber that moves up and down relative to the stage along the first and second blocks are composed of a head relative position of the stage can be changed, the curing the resin to be supplied onto the substrate, when to transfer the fine pattern to the resin, and a vacuum pump for the in the head to a vacuum, and built means for incorporating the microstructure to said device, apparatus characterized by comprising a. 【請求項13】 前記ヘッドは、前記第一及び第二のブロックに固着され、前記ステージ上の基板と接するクッション材をさらに備え、前記クッション材は硬化した樹脂よりも柔軟性があることを特徴とする請求項11又は12に記載の装置。 Wherein said head, said fixed to the first and second blocks, characterized by further comprising a cushioning material in contact with the substrate on the stage, the cushion material which is flexible than hardened resin the apparatus of claim 11 or 12,. 【請求項14】 前記真空ポンプは、前記ヘッド内を真空にすることを特徴とする請求項11又は12に記載の装置。 14. The vacuum pump apparatus according to claim 11 or 12, characterized in that the inside of the head to the vacuum. 【請求項15】 前記装置は樹脂を供給する供給手段をさらに具備することを特徴とする請求項11又は12に記載の装置。 15. The apparatus of claim 11 or 12 wherein the apparatus is characterized by further comprising supplying means for supplying a resin. 【請求項16】 前記供給手段はインクジェット法に利用されるノズルであることを特徴とする請求項15に記載の装置。 16. The supply means according to claim 15, characterized in that a nozzle to be used for ink-jet method. 【請求項17】 前記装置は、チャンバーを加熱する加熱手段をさらに具備することを特徴とする請求項11又は12に記載の装置。 17. The apparatus according to claim 11 or 12, further comprising a heating means for heating the chamber. 【請求項18】 前記装置は、前記ヘッドと一体となって移動し、前記樹脂を硬化させるための紫外線照射手段をさらに具備することを特徴とする請求項11又は12 18. The apparatus moves the turned head and integral, claim 11 and further comprising a UV irradiation means for curing the resin or 12
    に記載の装置。 The apparatus according to.
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