JP2003094191A - Laser beam machining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machining device containing fewer optical components within its YAG laser head, preventing any part from damage, and also reducing energy loss. SOLUTION: The laser beam machinig device lases a first wavelength laser beam on a machining object 7 to process it, provided with a first laser branching means 301 branching the first wavelength laser beam and a wavelength conversion means 401 converting the wavelength of one laser beam branched by the first laser branching means into at least one of wavelengths among 1/2, 1/3, 1/4, 1/5 or 1/6. Additionally those laser beams lased on the machining object are the ones with their wavelengths to be 1/2, 1/3, 1/4, 1/5 or 1/6 generated from the wavelength conversion means or the other first wavelength laser beam branched by the first laser branching means and the laser beam with 1/2, 1/3, 1/4, 1/5 or 1/6 wavelength generated from the wavelength conversion means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for performing various kinds of processing such as marking, punching, cutting and welding by irradiating a work with laser light.

[0002]

2. Description of the Related Art Conventionally, as a technique for converging laser beams having a plurality of wavelengths and irradiating a workpiece for processing, there is a structure shown in FIG. 12 (Japanese Patent Laid-Open No. 06-106378). 12
FIG. 7 is an explanatory diagram showing a configuration of a conventional laser processing device.
In the figure, 1 is a YAG laser power source, 2 is a YAG laser head, 4 is a second harmonic generator, and 7 is a workpiece.
The YAG laser power supply 1 drives the laser oscillation element in the YAG laser head 2. The laser light having a wavelength of 1064 nm emitted from the YAG laser head 2 is a second harmonic generator (S) including a nonlinear optical crystal which is a wavelength conversion means.
HG) 4, and the laser light wavelength-converted to the second harmonic 532 nm, which is a half wavelength, and the unconverted laser light (1064 nm) are emitted from this. Each laser beam emitted from the SHG 4 is dichroic mirror 8.
By 0, the laser light having the wavelength of 532 nm is transmitted and the laser light having the wavelength of 1064 nm is reflected so that the optical path is separated. Wavelength 532n passed through dichroic mirror 80
The laser light of m is transmitted through the variable optical attenuator 180 provided in the variable optical attenuator rotation mechanism 17 to the dichroic mirror 8.
After all 1 is transmitted, the dichroic mirror 82 is further totally transmitted and is incident on the slit 19. The laser light flux converted into a desired size by the slit 19 is imaged on the workpiece 7 by the imaging lens 61 and the objective lens 62, and the workpiece 7 is processed by this. On the other hand, the wavelength 1 reflected by the dichroic mirror 80
The 064 nm laser beam is totally reflected by the mirror 51 and travels to the mirror 52 via the variable attenuator 181 provided in the variable optical attenuator rotation mechanism 17. The laser light is totally reflected by the mirror 52, totally reflected by the dichroic mirror 81, and then enters the slit 19. Thereafter, the wavelength 53
An image is formed on the workpiece 7 through the same path as the 2 nm laser light, and the workpiece is processed. The variable attenuator 18
For example, circular ones are used as 0 and 181, and are configured to be rotatable. Specifically, the variable attenuators 180, 1
Reference numeral 81 indicates, for example, two polarizing plates or a combination of a polarizing plate and a phase plate (however, either one is fixed), or the transmittance changes continuously so as to continuously change depending on the rotation angle. It is composed of an ND filter and the like. The variable optical attenuator rotating mechanism 17 includes a mechanism (not shown) that causes the variable optical attenuators 180 and 181 to rotate constantly by, for example, a motor, and the variable attenuators 180 and 18.
A sensor 130 for detecting the 0% transmission position of 1 is provided. This sensor 130 is, for example, a limit switch,
It is composed of a transmission type, a reflection type, a capacitance type sensor and the like. The sensor 130 is connected to a variable optical attenuator controller 27. When one laser wavelength is selected, the controller 27 sets the transmittance of the laser light of the other wavelength to 0%, and the laser of a single wavelength is used. It is also possible to control the variable light attenuation rotation mechanism 17 so that only the workpiece 7 is irradiated. If one of the variable optical attenuators is not in the position where the transmittance is 0% due to some trouble, an interlock signal 28 is output to the YAG laser power source 1 and laser processing by mixing a plurality of wavelengths is performed depending on the case. To prevent. Also,
The light emitted from the light source 25 enters the dichroic mirror 82 via a filter 26 that blocks laser light having wavelengths of 1064 nm and 532 nm. Light from the light source 25 is emitted from the dichroic mirror 82.
The light is totally reflected at and enters the slit 19. Then, the light emitted from the slit 19 is imaged on the workpiece 7 in the same manner as the laser light, and is used to confirm the processing range at the time of laser processing. With the above-described structure, it is possible to process a workpiece with two types of laser wavelengths.
As described above, the conventional laser processing apparatus has a wavelength of 1064n.
The m laser is converted into the laser light having the wavelength of 1064 nm and the laser light having the wavelength converted by the wavelength converting means, and then the laser light having the wavelength of 1064 nm and the laser light having the wavelength conversion are branched by the dichroic mirror, and the laser beams having the respective branched wavelengths are branched. A variable optical attenuator that combines light with two polarizing plates or a polarizing plate and a phase plate (however, either one is fixed),
Alternatively, the laser power is adjusted by a variable optical attenuator including an ND filter whose transmittance changes continuously.

[0003]

However, since the first laser beam (having a wavelength of 1064 nm) is wavelength-converted by the wavelength converting means and the laser power of each wavelength is controlled, the procedure is as described above. It is essential to use such a variable optical attenuator, and there is a problem that the phase plate or the ND filter, which is an optical component forming the variable optical attenuator, absorbs the energy of the laser light to generate heat and damage it. When the plane of the polarizing plate, the phase plate, or the ND filter and the incident direction of 1064 nm are at right angles, the reflected light of the YAG laser light is Y.
The optical components in the YAG laser head may be damaged by returning to the inside of the AG laser head. As a countermeasure against this, the surface of the polarizing plate or the phase plate or the ND filter and 1064 nm
It is possible to make it not perpendicular to the incident direction of, but in this case,
The reflected light of the YAG laser light had to be absorbed at a certain place, a laser absorber was installed, and it was necessary to cool the laser absorber during processing. Furthermore, the total power of the laser light is determined by the difference in the transmittance of the polarizing plate, the phase plate or the ND filter, and the reflected light from the polarizing plate, the phase plate or the ND filter does not contribute to the processing.
There was a problem of large energy loss. Therefore,
The present invention provides a laser processing device that does not generate heat in the laser processing device, does not damage optical components inside the YAG laser head, does not require a laser absorber that absorbs the reflected light of the YAG laser light, and has low energy loss. The purpose is to do.

[0004]

In order to solve the above-mentioned problems, the invention of claim 1 has a laser oscillator for emitting a laser beam and a condensing optical system for condensing the laser beam. In a laser processing apparatus for irradiating a workpiece with light and processing it, a laser branching unit for branching the laser beam and a wavelength conversion unit for converting the wavelength of the laser beam are provided, and the wavelength is provided in the subsequent stage of the laser branching unit. This is a configuration in which conversion means is arranged. According to this means, since the laser branching means is used instead of the variable attenuator, the arrangement of the variable attenuator becomes unnecessary, and heat generation from the optical components constituting the variable attenuator is eliminated. The invention of claim 2 has a laser oscillator that emits laser light of a first wavelength, and a condensing optical system that condenses the first wavelength laser light, and the first wavelength laser light is a workpiece. In a laser processing apparatus for irradiating and processing a laser beam onto a first laser beam, the first laser beam splitting unit splits the first wavelength laser beam, and the wavelength of one laser beam split by the first laser beam splitting unit is 1/2, 1 / 3, 1/4, 1/5 or 1
A wavelength conversion means for converting at least one of the / 6 wavelengths, and the laser light with which the workpiece is irradiated is emitted from the wavelength conversion means 1/2, 1/3,
1/4, 1/5 or 1/6 wavelength laser light, or the other first wavelength laser light branched by the first laser branching means, and 1/2, 1 / emitted from the wavelength converting means.
The laser light has a wavelength of 3, 1/4, 1/5, or 1/6. By this means, since the laser branching means is used instead of the variable attenuator, the arrangement of the variable attenuator is unnecessary, heat generation from the optical parts constituting the variable attenuator is eliminated, and the energy loss of the laser is reduced, and the laser head is reduced. It becomes a laser processing device that does not damage the inside,
In addition, the laser does not need a laser absorber.
Further, the laser processing apparatus uses a laser beam having a short wavelength such as ½ wavelength.

Further, in the invention of claim 3, the other first wavelength laser light branched by the first laser branching means and the 1/2, 1/3, 1/4, 1/5 or 1 / 6 wavelength laser light is superimposed on the same optical axis, or 1/2,
The laser light of at least two wavelengths among the laser light of 1/3, 1/4, 1/5 or 1/6 wavelength is superposed on the same optical axis. By this means, since the laser branching means is used in place of the variable attenuator, the arrangement of the variable attenuator is unnecessary, heat generation from the optical components constituting this is eliminated, and the energy loss of the laser is further reduced,
The laser processing apparatus does not damage the inside of the laser head, and in addition, it does not require a laser absorber. Further, since the lasers of a plurality of wavelengths are on the same optical axis, the allowable value of the distance (working distance) between the condenser lens and the work piece becomes large, which facilitates the setting of the laser processing device and the work piece. .

Further, in the invention of claim 4, the laser light converted into the 1/2 wavelength is branched by the second laser branching means, and the 1/3, 1/4, 1/5 or 1/6 is obtained. It has a wavelength conversion means for converting the wavelength into a wavelength. By this means, since the laser branching means is used instead of the variable attenuator, the arrangement of the variable attenuator is unnecessary, heat generation from the optical parts constituting the variable attenuator is eliminated, and the energy loss of the laser is reduced, and the laser head is reduced. It becomes a laser processing device that does not damage the inside, and also a laser that does not require a laser absorber. Further, as described later, the number of nonlinear optical crystals used can be reduced, which leads to cost reduction of the laser processing apparatus.

Further, in the invention of claim 5, the laser light wavelength-converted into the 1/3 wavelength is branched by the third laser branching means and converted into 1/4, 1/5 or 1/6 wavelength. It has a wavelength converting means for By this means
Since the laser branching means is used instead of the variable attenuator, there is no need to arrange the variable attenuator, the heat generated from the optical parts that compose the variable attenuator is eliminated, the energy loss of the laser is reduced, and the inside of the laser head is not damaged. It becomes a laser processing device that does not give a laser, and in addition, it becomes a laser that does not require a laser absorber. Further, as described later, the number of nonlinear optical crystals used can be reduced, which leads to cost reduction of the laser processing apparatus.

Further, the invention of claim 6 is a wavelength conversion means for branching the laser light wavelength-converted to the 1/4 wavelength by a fourth laser branching means to convert it to 1/5 or 1/6 wavelength. With. The invention of claim 7 is
It has a wavelength conversion means for branching the laser light wavelength-converted to the ⅕ wavelength by a fifth laser branching means and converting it to a ⅙ wavelength.

According to this means, since the laser branching means is used instead of the variable attenuator, the arrangement of the variable attenuator becomes unnecessary, and the heat generation from the optical parts constituting the variable attenuator is eliminated,
Furthermore, the energy loss of the laser is reduced, and the laser processing apparatus does not damage the inside of the laser head, and the laser does not require a laser absorber. Further, as described later, the number of nonlinear optical crystals used can be reduced, which leads to cost reduction of the laser processing apparatus.

The invention of claim 8 is the first, second,
The laser splitting means 3, 4 or 5 comprises a beam splitter. By this means, since the laser branching means is used instead of the variable attenuator, the arrangement of the variable attenuator is unnecessary, heat generation from the optical parts constituting the variable attenuator is eliminated, and the energy loss of the laser is reduced, and the laser head is reduced. It becomes a laser processing device that does not damage the inside, and also a laser that does not require a laser absorber. Further, as will be described later, since it has a plurality of beam splitters, it becomes possible to control the power ratio between the laser light of the first wavelength and the laser light of other wavelengths, and it becomes possible to perform laser processing with a wavelength distribution suitable for the workpiece. .

According to a tenth aspect of the present invention, the power of the laser light with which the object to be processed is irradiated is the first, half,
It has a wavelength dispersion laser power measuring means for detecting every 1/3, 1/4, 1/5 or 1/6 wavelength.
Further, the invention of claim 11 is the first, 1/2, 1/3, 1/4, 1 from the wavelength dispersion laser power measuring means.
At least one of the output signals corresponding to the laser light of / 5 or 1/6 wavelength is sent to the beam splitter selecting means of the first, second or third laser branching means, and the first, 1/2, 1 / 3, 1/4, 1/5 or 1 /
It is provided with a controller for controlling the power of 6-wavelength laser light. Further, in the invention of claim 12, the controller controls the powers of the laser beams simultaneously and independently for each wavelength.
By this means, since the laser branching means is used instead of the variable attenuator, the arrangement of the variable attenuator is unnecessary, heat generation from the optical parts constituting the variable attenuator is eliminated, and the energy loss of the laser is reduced, and the laser head is reduced. It becomes a laser processing device that does not damage the inside, and also a laser that does not require a laser absorber. In addition, since the wavelength of the laser beam being processed can be monitored and the laser power can be controlled for each wavelength, high-quality laser processing becomes possible.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 shows a first embodiment of the present invention. FIG. 1 is a schematic diagram of a laser processing apparatus showing a first embodiment. In the figure, 301 is a first laser branching unit, 401 is a first wavelength converting unit, and 601 and 602 are condenser lenses. The same reference numerals indicate the same parts, and the reference numerals described in the section of the conventional example are omitted. YAG
The laser power supply 1 supplies power to a lamp or a semiconductor laser (not shown) that excites a YAG rod inside a YAG laser head 2 having a laser oscillator. YA
The wavelength 106 which is the first wavelength emitted from the G laser head 2
The laser light of 4 nm (hereinafter, the first wavelength is the fundamental wave laser of the YAG laser head 2) is split into the transmitted light and the reflected light by the first laser splitting means 301 which is a beam splitter. The laser beam that has passed through and passed straight passes through the condenser lens 601 and is condensed on the surface of the workpiece 7 with its beam diameter being the minimum. On the other hand, the laser light deflected by the reflection by the first laser branching means 301 is totally reflected by the total reflection mirror 5, and KTP (KTiOPO ₄ )
Is incident on the first wavelength conversion means 401. The laser light having a wavelength of 1064 nm that has entered the first wavelength conversion unit 401 is converted into a laser having a wavelength of 532 nm, which is a half wavelength, and is condensed by the condensing lens 602.
The laser beam of nm is focused on the surface of the workpiece 7 and is irradiated. According to this embodiment, since the polarizing plate, the phase plate, or the ND filter is not used as in the conventional case, these optical components do not absorb the energy of the laser. Therefore, the workpiece can be irradiated with the laser light from the YAG laser head with very little loss. Further, unlike the prior art, an optical attenuator is not used, and laser splitting by a beam splitter, that is, only transmission and reflection of laser light is performed, so heat is generated from an optical component such as a polarizing plate or a phase plate or an ND filter. Since it can be remarkably reduced, there is no damage to the optical components as in the prior art. Further, since there is no reflected light from the polarizing plate, the phase plate or the ND filter, the optical components inside the YAG laser head will not be damaged. Although the YAG laser is used as the laser in this embodiment, a YVO ₄ laser, a YLF laser, or a fiber laser may be used. Also, YAG laser,
The excitation element contained in the YVO ₄ laser, the YLF laser and the fiber laser can be Yb or Er in addition to Nd.
It is not limited. The first wavelength conversion means is a nonlinear optical crystal such as BBO (BaB ₂ O ₄ ) or LBO (LiB).
₃ O ₅ ) is also possible, and the crystal is not particularly limited.

(Second Embodiment) FIG. 2 shows a second embodiment of the present invention. FIG. 2 is a schematic view of a laser processing apparatus showing the second embodiment. In the present embodiment, the second branching means and the second wavelength converting means are added to those of the first embodiment. In the figure, 302 is a second branching unit, 402 is a second wavelength converting unit, 502 is a total reflection mirror, and 603 is a condenser lens. The path that reaches the surface of the workpiece 7 via the first wavelength converting means 401 after being reflected by the first laser branching means 301 is the same as in the first embodiment. The laser light having a wavelength of 1064 nm that has passed through the first laser branching means 301 and travels straight is further branched into the transmitted light and the reflected light by the second laser branching means 302 including a beam splitter. Second laser branching means 30
The laser light that has passed through 2 and travels straight is condensed by the condenser lens 601 and is condensed and irradiated onto the surface of the workpiece 7. The laser light reflected and deflected by the second branching means 302 is
Total reflection by the total reflection mirror 502, LBO and BB
Second wavelength conversion means 4 consisting of two nonlinear optical crystals of O
Incident on 02. The laser light incident on the wavelength conversion means 402 has a wavelength of 355 nm, which is a 1/3 wavelength of 1064 nm.
The laser beam is converted into a laser beam, is condensed by the condenser lens 6, and is irradiated onto the surface of the workpiece 7. According to the present embodiment, since no optical component such as a polarizing plate or a phase plate or an ND filter that absorbs the energy of the laser light is used as in the prior art, the laser light from the YAG laser head is processed with extremely little loss. Can illuminate objects. Further, unlike the prior art, an optical attenuator is not used, and only laser splitting by a beam splitter, that is, transmission and reflection of laser light is performed, so that optical components such as polarizing plates or phase plates or ND filters are absorbed. Without damaging the optical components by the laser light. Further, unlike the conventional case, since the reflected light from the polarizing plate or the phase plate or the ND filter is not used, the optical components inside the YAG laser head are not damaged. In addition, the laser processing apparatus of the present invention,
Infrared wavelength 1064 nm, visible light wavelength 53
Wavelength 355 in 2nm (1/2 wavelength) and ultraviolet region
Since processing can be performed with laser light having three wavelengths of nm (1/3 wavelength), processing by thermal action and chemical action by ultraviolet rays is also possible. By thus emitting lasers having a plurality of wavelengths, the laser processing apparatus of the present invention has a wavelength of 10
It is effective for processing glass, ceramics, etc., which were difficult to process with a laser processing device with a single wavelength of 64 nm. Further, a third laser branching means is provided between the second laser branching means 302 and the lens 601, a wavelength of 1064 nm is branched and totally reflected by a total reflection mirror, and third wavelength converting means composed of LBO and CLBO. Through the wavelength of 1064
It is also possible to convert the wavelength of the laser of nm to the wavelength of 266 nm which is a quarter wavelength. This gives a wavelength of 1064n
The laser processing device emits m, 532 nm, 355 nm and 266 nm. The laser light having the wavelength of 266 nm is generated by the laser branching means including the beam splitter and the third wavelength converting means, like the laser light having the other wavelengths. Therefore, the workpiece can be irradiated with the laser light from the YAG laser head with very little loss. In the present embodiment, the LB is used as the second wavelength conversion means.
Although O and BBO are used, LBO and LBO, KTP and BBO, or KTP and LBO may be used. Also, 532 corresponding to 1/2, 1/3 and 1/4 wavelengths,
It has been shown that lasers with wavelengths of 355 and 266 nm emit, but the fourth and fifth beamsplitters also consist of beam splitters.
It is also obvious that the laser branching means, and the fourth and fifth wavelength converting means made of a suitable nonlinear optical crystal can be added, and the same effect as that of the above-described embodiment can be obtained.

(Third Embodiment) FIG. 3 shows a third embodiment of the present invention. FIG. 3 is a schematic diagram of a laser processing apparatus showing a third embodiment. In the figure, 8 is a specific wavelength reflecting mirror. Wavelength 1 emitted from YAG laser head 2
The 064 nm laser light is split into transmitted light and reflected light by the first laser splitting means 301 which is a beam splitter. The laser light that has passed through and goes straight has a wavelength of 106
Transmittance for 4nm light and wavelength 532nm
After passing through the specific wavelength reflecting mirror 8 having a reflectivity for the light of 1, the light is condensed by the condenser lens 6 and is condensed on the surface of the workpiece 7. On the other hand, the laser light of wavelength 1064 nm reflected and deflected by the first laser branching means 301 is
The light is totally reflected by the total reflection mirror 503 and is incident on the first wavelength conversion means 401 made of the nonlinear optical crystal KTP.
The laser light incident on the first wavelength conversion means 401 is 10
It is converted into a laser having a wavelength of 532 nm, which is a half wavelength of 64 nm, is totally reflected by a total reflection mirror 504, is then reflected and deflected by a specific wavelength reflection mirror 8, and is processed along with the laser light of wavelength 1064 nm on the same optical axis. 7 surface is irradiated. According to this embodiment, the following effects are obtained as in the first and second embodiments. That is, the laser beam from the YAG laser head can be applied to the work piece with very little energy loss, and the heat generated from the optical components such as the polarizing plate, the phase plate or the ND filter can be significantly reduced, and the optical components are not damaged. . Further, since the laser light having the wavelength of 1064 nm and the laser light having the wavelength of 532 nm are on the same optical axis, the working distance between the condenser lens 6 and the workpiece 7 is smaller than that of the laser of the embodiment shown in FIG. This also has the effect of increasing the allowable distance. In the laser processing apparatus shown in FIG. 1, the optimum positional relationship is a point where a laser having a wavelength of 1064 nm and a laser having a wavelength of 532 nm intersect, and particularly when the distance between the lens 601 and the workpiece 7 changes, a laser beam having a wavelength of 532 nm is emitted. Since the laser light having the wavelength of 1064 nm and the laser light having the wavelength of 1064 nm are applied to different points on the surface of the workpiece 7, there is no allowable working distance range. However, in the present embodiment, even if the distance between the lens and the workpiece is changed to some extent, the laser light having the wavelength of 1064 nm and the wavelength 532 are emitted.
The laser beam of nm does not irradiate at different points on the surface of the workpiece 7. That is, the present embodiment has an effect that the allowable distance between the lens and the workpiece 7 is widened, and the setting of the laser processing apparatus is facilitated.

(Fourth Embodiment) FIG. 4 shows a fourth embodiment of the present invention. FIG. 4 is a schematic diagram of a laser processing apparatus showing a fourth embodiment. In this embodiment, the second branching means and the second wavelength converting means are added to those of the third embodiment. In the figure, 302 is the second branching means, 4
Reference numeral 02 is a second wavelength converting means, reference numerals 505 and 506 are total reflection mirrors, and reference numerals 801 and 802 are specific wavelength reflection mirrors. Y
The laser light having a wavelength of 1064 nm emitted from the AG laser head 2 is split into a transmitted light and a reflected light by the first laser splitting means 301 including a beam splitter. First
The path of the laser beam that is reflected by the laser branching means 301, passes through the specific wavelength reflecting mirror 801 through the first wavelength converting means 401, and is condensed by the condenser lens 6 is the third embodiment. It is the same as the form. On the other hand, the laser light which has passed through the first laser branching means 301 and has gone straight is split into transmitted light and reflected light by the second laser branching means 302 which is a beam splitter. Second laser branching means 302
The laser beam having a wavelength of 1064 nm that has passed through the laser beam is transparent to the light having a wavelength of 1064 nm and has a wavelength of 53 nm.
Specific wavelength reflecting mirror 8 that is reflective for 2 nm light
01 through the specific wavelength reflecting mirror 802, which is transparent to the light having the wavelengths of 1064 nm and 532 nm and reflective to the light having the wavelength of 355 nm,
It is condensed by the condenser lens 6 and is irradiated onto the workpiece 7. On the other hand, the laser light having a wavelength of 1064 nm which is reflected and deflected by the second laser branching means 302 is totally reflected by the total reflection mirror 505 and is incident on the second wavelength converting means 402 composed of LBO and BBO. By the second wavelength converting means 402, the laser light having a wavelength of 1064 nm is
The wavelength is converted to a laser beam having a wavelength of 355 nm, which is a 1/3 wavelength. The wavelength-converted laser light having a wavelength of 355 nm is totally reflected by the specific wavelength reflection mirror 802, and the condenser lens 6
And is irradiated to the workpiece 7. As described above, the workpiece 7 is irradiated with laser light having three wavelengths of 1064, 532, and 355 nm. In addition,
In the present embodiment, LBO and B are used as the second wavelength conversion means.
BO was used, but LBO and LBO, KTP and BB
O, or KTP and LBO may be used. According to this embodiment, the following effects are obtained as in the first to third embodiments. That is, the laser beam from the YAG laser head can be applied to the work piece with very little energy loss, and the heat generated from the optical components such as the polarizing plate, the phase plate or the ND filter can be significantly reduced, and the optical components are not damaged. . Further, therefore, the optical components inside the YAG laser head are not damaged. Furthermore, a wavelength of 1064 nm in the infrared region and a wavelength of 3 in the ultraviolet region
Since it can be processed with a laser beam having a wavelength of 55 nm, it can be processed by a thermal action as well as by a chemical action by ultraviolet rays. By emitting lasers of a plurality of wavelengths in this way, it is effective for processing ceramics and the like, which were difficult to process by a laser processing device having a single wavelength of 1064 nm. Further, as compared with the laser processing apparatus shown in the embodiment as shown in FIG. 2, since laser lights of three wavelengths (wavelengths 1064, 532, and 355 nm) are on the same optical axis, FIG.
Similar to the embodiment shown in, the working distance permissible distance between the lens 6 and the workpiece 7 is widened, and the setting of the laser processing apparatus is facilitated.

(Fifth Embodiment) FIG. 5 shows a fifth embodiment of the present invention. FIG. 5 is a schematic diagram of a laser processing apparatus showing a fifth embodiment. In this embodiment, a third branching means and a third wavelength converting means are added to those of the fourth embodiment. In the drawing, 303 is a third laser branching unit, 403 is a third wavelength converting unit, 803 is a specific wavelength reflecting mirror, and 507 and 508 are wavelengths 106, respectively.
It is a total reflection mirror that totally reflects 4 and 266 nm. The third laser splitting means 303 is composed of a beam splitter and splits the laser light having a wavelength of 1064 nm into transmitted light and reflected light. In addition, the third wavelength conversion means 40
3 is composed of two nonlinear optical crystals of LBO and CLBO (CsLiB ₆ O ₁₀ ). The laser light having a wavelength of 1064 nm branched by the third laser branching means is wavelength-converted by the third wavelength converting means 403 into a laser light having a wavelength of 266 nm which is a quarter wavelength. Wavelength converted wavelength 266n
The laser light of m transmits a light of wavelength 1064 nm and has a wavelength of 2
It is totally reflected by a specific wavelength reflection mirror 803 having a characteristic of reflecting light of 66 nm, transmitted through the condenser lens 6, and irradiated onto the surface of the workpiece 7. Therefore, it becomes a laser processing apparatus that irradiates the surface of the workpiece with laser light having wavelengths of 1064, 532, 355 and 266 nm. Furthermore, the third laser branching means 303 and the specific wavelength reflecting mirror 801
A fourth laser branching means, a specific wavelength reflection mirror that newly reflects light of a wavelength of 215 nm between the specific wavelength reflection mirrors 801 and 803, and a wavelength of 1064 nm.
By providing a fourth wavelength conversion means for converting the wavelength of the laser light of, the wavelength of 1064, 532, 355, 266 nm
And a laser processing device having five wavelengths of 215 nm. In addition, if a new non-linear optical crystal is discovered, by using this as a fifth wavelength conversion means, a fifth laser branching means and a specific wavelength reflection mirror that reflects light of a wavelength of 177 nm are provided, 1064, 532,
The laser processing device emits laser light having six wavelengths of 355, 266, 215 and 177 nm. That is,
Depending on the nonlinear optical crystal of the wavelength conversion means, laser light of 532 nm, which is 1/2 wavelength of 1064 nm, laser light of 355 nm, which is 1/3 wavelength, and 266n, which is 1/4 wavelength,
The laser processing device emits m laser light, ⅕ wavelength 215 nm laser light, and ⅙ wavelength 177 nm laser light. Further, the laser processing apparatus of the present invention has wavelengths 1064, 532, 355, 266, 2
The laser processing apparatus is not limited to emitting all wavelengths of 15 and 177 nm, and a laser processing apparatus in which a laser beam of any wavelength is selected from these six wavelengths is also possible. According to this embodiment, the following effects are obtained as in the first to fourth embodiments. That is, the laser beam from the YAG laser head can be applied to the work piece with very little energy loss, and the heat generated from the optical components such as the polarizing plate, the phase plate or the ND filter can be significantly reduced, and the optical components are not damaged. . Further, it is possible to perform processing by thermal action as well as processing by chemical action by ultraviolet rays without damaging the optical components inside the YAG laser head. Further, since the laser beams of all wavelengths are on the same optical axis, the allowable distance of the working distance between the lens 6 and the workpiece 7 is widened as in the embodiment shown in FIG. Setting is extremely easy.

(Sixth Embodiment) FIG. 6 shows a sixth embodiment of the present invention. FIG. 6 is a schematic diagram of a laser processing apparatus showing a sixth embodiment. In the figure, 405 is a fourth wavelength converting means. The laser light having a wavelength of 1064 nm emitted from the YAG laser head 2 is split into a transmitted light and a reflected light by the first laser splitting means 301 which is a beam splitter. The laser light having a wavelength of 1064 nm that has passed through the first laser branching means 301 and traveled straight forward has a wavelength of 532 n.
Specific wavelength transmission mirror 801 that reflects the wavelength of m, wavelength 3
A specific wavelength transmission mirror 802 that reflects a wavelength of 55 nm,
Specific wavelength transmission mirror 8 that reflects a wavelength of 266 nm
After passing through 03, the light is condensed by the condenser lens 6 and is irradiated onto the workpiece 7. On the other hand, the laser light having a wavelength of 1064 nm which is reflected and deflected by the first laser branching means 301 is totally reflected by the total reflection mirror 503, and then at a half wavelength by the first wavelength converting means 401 composed of the nonlinear optical crystal KTP. The wavelength is converted into a laser beam having a certain wavelength of 532 nm, and the laser beam is incident on the second laser branching means 304. The laser light having a wavelength of 532 nm is branched by the second laser branching means 304 into transmitted light and reflected light. The laser light having a wavelength of 532 nm that has been transmitted by the second laser branching means 304 and has proceeded straight is a total reflection mirror 5.
10 is totally reflected, is further reflected by a specific wavelength reflection mirror, is transmitted through the specific wavelength reflection mirrors 802 and 803, is condensed by the condenser lens 6, and is irradiated onto the workpiece 7. On the other hand, the laser beam having a wavelength of 532 nm reflected by the second laser branching means 304 is branched by the third laser branching means 305 into transmitted light and reflected light. Third
532n reflected by the laser branching means 305 of
The laser beam of m is the third wavelength conversion means 4 composed of LBO.
In step 04, the wavelength is converted into laser light having a wavelength of 355 nm, which is 1/3 wavelength. The laser light having a wavelength of 355 nm is totally reflected by the total reflection mirror 511 by the third wavelength conversion unit 404, further reflected by the specific wavelength reflection mirror 802, transmitted through the specific wavelength reflection mirror 803, and collected by the condenser lens 6. The light is emitted and is irradiated on the workpiece 7. On the other hand, the laser beam having a wavelength of 532 nm that has passed through the third laser branching unit and travels straight is totally reflected by the total reflection mirror 512, and the fourth wavelength conversion unit 405 made of CLBO has a wavelength of ¼ wavelength 26.
The wavelength is converted to 6 nm. The laser light having a wavelength of 266 nm converted by the fourth wavelength conversion means 405 is totally reflected by the total reflection mirror 513, further reflected by the specific wavelength reflection mirror 803, condensed by the condenser lens 6, and processed. 7 is irradiated. According to the present embodiment, the laser light having the wavelengths of 355 nm and 266 nm is not converted from the laser light having the wavelength of 1064 nm, but the laser light having the wavelength of 532 nm is once converted to the wavelength of 355 n.
Since m and 266 nm are converted, it is not necessary to use KTP which is a nonlinear optical crystal in the third and fourth wavelength conversion means. In the laser processing apparatus shown in FIGS. 4 and 5, two nonlinear optical crystals are used as the third and fourth wavelength conversion means. This is because the third and fourth wavelength converting means 106
This is because the wavelength of the laser light of 4 nm was once converted to 532 nm by the first stage non-linear optical crystal and then changed to 355 nm or 266 nm by the second stage non-linear optical crystal. In the present embodiment, the number of crystals to be used is small because the crystals for ½ wavelength are shared, and the cost can be reduced. Further, as in the first to sixth embodiments, the heat generated from the optical components can be remarkably reduced, so that the optical components are not damaged and the optical components inside the YAG laser head are not damaged. In addition, it is possible to perform processing by thermal action and chemical action by ultraviolet rays. Further, since the laser beams of all wavelengths are on the same optical axis, the allowable distance between the lens 6 and the workpiece 7 is widened, and the setting of the laser processing apparatus is extremely easy.

(Seventh Embodiment) FIG. 7 shows a seventh embodiment of the present invention. FIG. 7 is a schematic diagram of a laser processing apparatus showing a seventh embodiment. In the figure, 406 is a fifth wavelength converting means. The laser light with a wavelength of 1064 nm is the first
The laser splitting means 301 splits the light into transmitted light and reflected light. The laser light having a wavelength of 1064 nm that has passed through and travels straight is a specific wavelength reflection mirror 801 that reflects light of a wavelength 532 nm, a specific wavelength reflection mirror 802 that reflects light of a wavelength 355 nm, a specific wavelength reflection mirror 803 that reflects light of a wavelength 266 nm, The light is transmitted through a specific wavelength reflection mirror 804 that reflects light with a wavelength of 215 nm and a specific wavelength reflection mirror 805 that reflects light with a wavelength of 177 nm, is condensed by the condenser lens 6, and is irradiated onto the workpiece 7. . The laser light having a wavelength of 1064 nm reflected and deflected by the first laser branching means 301 is totally reflected by the total reflection mirror 503, and then is ½ wavelength by the first wavelength converting means 401 composed of the nonlinear optical crystal KTP. The wavelength is converted to laser light of 532 nm. The laser light converted into the wavelength of 532 nm is processed by the second laser branching means 304.
It is split into transmitted light and reflected light. Second laser branching means 3
The laser beam that has passed through 04 and has been converted to a wavelength of 532 nm that has gone straight is totally reflected by the total reflection mirror 510, further reflected by the specific wavelength reflection mirror 801, and transmitted through the specific wavelength reflection mirrors 802, 803, 804, and 805. The light is condensed by the condenser lens 6 and is irradiated onto the workpiece 7. On the other hand, the laser light with a wavelength of 532 nm reflected and deflected by the second laser branching means 302 is reflected by the total reflection mirror 5.
Second wavelength converting means 4 made of LBO and totally reflected at 14
It is incident on 04, is converted into a wavelength of 355 nm which is 1/3 wavelength, and is branched into transmitted light and reflected light by the third laser branching means 306. The laser light having a wavelength of 355 nm that has passed through and travels straight is totally reflected by the total reflection mirror 515, reflected by the specific wavelength reflection mirror 802, and further reflected by the specific wavelength reflection mirror 803.
After passing through 804 and 805, the light is condensed by the condenser lens 6,
The surface of the workpiece 7 is irradiated. On the other hand, the laser beam having a wavelength of 355 nm that is reflected and deflected by the third laser branching unit is totally reflected by the total reflection mirror 516, enters the third wavelength conversion unit 405, and has a wavelength of 266 nm that is a quarter wavelength. Is converted into laser light. Wavelength converted wavelength 266nm
The laser light is incident on the fourth laser wavelength splitting means 307, and is split into transmitted light and reflected light. The laser light having a wavelength of 266 nm that has passed through the laser wavelength branching means 307 and traveled straight is
Total reflection by the total reflection mirror 517, and the specific wavelength reflection mirror 8
03, the light is further transmitted through the specific wavelength reflection mirrors 804 and 805, is condensed by the condenser lens 6, and is processed.
The surface is illuminated. On the other hand, the fourth laser branching means 3
The laser light having a wavelength of 266 nm reflected and deflected by 07 is totally reflected by the total reflection mirror 518, and the fourth wavelength conversion means 40
At 6, the wavelength is converted into a laser beam having a wavelength of 215 nm, which is a 1/5 wavelength. The wavelength-converted laser light having a wavelength of 215 nm is branched by the fifth laser branching means 308 into transmitted light and reflected light. The laser light having a wavelength of 215 nm that has passed through the fifth laser branching means 308 and travels straight is a total reflection mirror 51.
9, total reflection is performed at 9, a specific wavelength reflection mirror 804 is reflected, and further, a specific wavelength reflection mirror 805 is passed through and the condenser lens 6
The light is focused by the laser beam and is irradiated onto the surface of the workpiece 7.
On the other hand, the laser light having a wavelength of 215 nm that is reflected and deflected by the fifth laser branching means 308 is totally reflected by the total reflection mirror 520, and laser light having a wavelength of 177 nm, which is 1/6 wavelength by the fifth wavelength converting means 407. Is converted to. Total reflection is performed by the wavelength-converted total reflection mirror 521 having a wavelength of 177 nm,
Further, the light is reflected by the specific wavelength reflection mirror 805, enters the condenser lens 6, is condensed by the condenser lens 6, and is irradiated on the surface of the workpiece 7. According to this embodiment, the number of crystals used can be small. Further, as in the above-described embodiment, the heat generated from the optical component can be remarkably reduced, so that it is not damaged. Further, similar to the above-mentioned embodiment, without damaging the optical components inside the YAG laser head, it is possible to perform processing by thermal action as well as chemical action by short-wavelength ultraviolet light. Further, since the laser beams of all wavelengths are on the same optical axis, the lens 6 and the workpiece 7
The allowable distance between and becomes wider, and the setting of the laser processing apparatus becomes extremely easy.

(Eighth Embodiment) In the laser branching means used in the seventh embodiment, since the ratio of transmission and reflection to incident light depends on the transmittance and reflectance of the beam splitter, the laser beam of each wavelength is It was difficult to adjust the power independently. In the present embodiment, the laser processing apparatus controls the laser power ratio of each wavelength. The eighth embodiment of the present invention is shown in FIG. FIG. 8 is a schematic view showing a laser branching means of the laser processing apparatus. In the figure, the laser branching means 9 is composed of a plurality of beam splitters 91 to 98, and the respective beam splitters have different transmittance / reflectance ratios stepwise. Reference numeral 10 denotes a beam splitter selecting means, which is composed of an actuator that is linearly movable. The actuator includes a mover 10a and a stator 10
b, and the mover 10a includes beam splitters 91-91.
98 is fixed and movable in the direction of the double-ended arrow.
Further, the laser light incident on the wavelength conversion means is split into a reflected light and a transmitted light by a certain beam splitter, and the stator 10a is linearly moved by a command from a host controller (not shown), and an arbitrary beam splitter. The laser light can be incident on. Since each beam splitter has a different transmissivity / reflectance ratio as described above, the laser power ratio can be controlled at a desired ratio according to the transmissivity / reflectance ratio of the beam splitter. By applying this laser branching means to the laser processing apparatus of the above-described embodiment, it is possible to obtain a laser processing apparatus capable of varying the laser power ratio of each wavelength. Further, it is possible to change the laser power ratio and the absolute value of the laser power by using the beam splitter changing means and the means for controlling the output of the YAG laser which emits the 1064 nm laser. Although eight beam splitters are used in the present embodiment, it is possible to delicately control the laser power by increasing the number of beam splitters used. Further, each beam splitter only transmits and reflects the laser light of each wavelength, and the absorption of the laser light is extremely small, so that the heat generated from the optical component can be significantly reduced and is not damaged. Further, unlike the prior art, since there is no reflected light from the polarizing plate, the phase plate or the ND filter, the optical components inside the YAG laser head are not damaged.

(Ninth Embodiment) FIG. 9 shows a ninth embodiment of the present invention. FIG. 9 is a schematic view of a laser processing apparatus showing the ninth embodiment. In the figure, 11 is a pseudo transmission plate, 12 is a spectroscope, 13a and 13b are photosensors, 1
Reference numeral 4 is a signal processing device, 15 is a display device, 16 is a controller, and 20 is a beam splitter selecting means. The laser light from the YAG laser 1 is beam splitter selection means 2
0 is split into reflected light and transmitted light by a first wavelength splitting means 301a composed of a plurality of beam splitters 9 each having a wavelength of 0, and the transmitted light is reflected by a specific wavelength reflection mirror 801 and a pseudo transmission plate 1.
1 and the condenser lens 6 to irradiate the workpiece 7. On the other hand, the laser light branched by the first laser branching means enters the first wavelength converting means, is converted to a wavelength of 1064 nm to 532 nm, is reflected by the total reflection mirror 5 and the specific wavelength reflection mirror 801, and is a pseudo transmission plate. 11
And the workpiece 7 is irradiated through the condenser lens 6. The pseudo transmission plate 11 is almost transparent to light, but reflects a very small amount of light. This reflected light is transmitted to the spectroscope 12
And 1064 nm and 532 n by the wavelength dispersion laser power measuring means including the photosensors 13a and 13b and the signal processing device 14 of the detected laser power of each wavelength.
The laser power is detected by being separated into m and further arranged at a predetermined position. The result of the detected laser power of each wavelength is displayed on the display device 15. The laser power signal of each wavelength is sent to the controller 16. The controller 16 which receives the laser power signal of each wavelength moves the beam splitter selecting means 20 so as to have a predetermined laser power, and controls the laser power of each wavelength to have a desired value. According to this embodiment, the laser power can be strictly controlled, and high-quality laser processing can be performed.

(Tenth Embodiment) FIG. 10 shows a tenth embodiment of the present invention. FIG. 10 is a schematic view of a laser processing apparatus showing the tenth embodiment. In this embodiment, a second laser branching means is added to the device of the ninth embodiment. In the figure, 302 is a second laser branching means, 1
3b is a photo sensor. Laser light having a wavelength of 1064 nm emitted from the YAG laser head 2 is branched by the first laser branching means 301 into transmitted light and reflected light.
The wavelength 10 transmitted through the first laser branching means 301 and traveling straight
The 64 nm laser light passes through a specific wavelength transmission mirror 801 that reflects a wavelength of 532 nm and a specific wavelength transmission mirror 803 that reflects a wavelength of 266 nm, passes through the pseudo transmission plate 11, and is collected by the condenser lens 6. The work 7 is illuminated and irradiated. On the other hand, the laser light having a wavelength of 1064 nm which is reflected and deflected by the first laser branching means 301 is totally reflected by the total reflection mirror 503, and then at a half wavelength by the first wavelength converting means 401 composed of the nonlinear optical crystal KTP. The wavelength is converted into a laser beam having a certain wavelength of 532 nm, and the laser beam is incident on the second laser branching unit 302. The laser light having a wavelength of 532 nm is branched by the second laser branching means 302 into transmitted light and reflected light. The laser light having a wavelength of 532 nm that has passed through the second laser branching means 302 and travels straight is totally reflected by the total reflection mirror 510, and further the specific wavelength reflection mirror 80.
The light is reflected by No. 1, is transmitted through the specific wavelength reflection mirror 803 and the pseudo transmission plate 11, is condensed by the condenser lens 6, and is irradiated onto the workpiece 7. On the other hand, the laser beam having a wavelength of 532 nm that is reflected and deflected by the second laser branching unit 302 is totally reflected by the total reflection mirror 522, and has a wavelength of 266 nm that is a quarter wavelength by the second wavelength converting unit 408 composed of CLBO. The wavelength is converted to a laser. The wavelength-converted laser light with a wavelength of 266 nm is a total reflection mirror 523.
The light is totally reflected at a wavelength of nm, is reflected by the specific wavelength reflection mirror 803, passes through the pseudo transmission plate 11, is condensed by the condenser lens 6, and is irradiated onto the surface of the workpiece 7. The first and second laser branching means 301 and 302 are respectively composed of a plurality of beam splitters having different transmittance / reflectance, and the beam splitter selecting means 20 and 21 shown in FIG.
And the power ratio of the lasers branched by the laser branching means 301 and 302 can be controlled. Further, the pseudo transmission plate 11 is almost transparent to light, but reflects a very small amount of light. The reflected light is reflected by the wavelength dispersion laser power measuring means including the spectroscope 12, the photosensors 13a and 13b, and the signal processing device 14 for the detected laser power of each wavelength.
The laser power is detected by being separated into 2 nm and further arranged at a predetermined position. The result of the detected laser power of each wavelength is displayed on the display device 15. The laser power signal of each wavelength is sent to the controller 16. The controller 16 which receives the laser power signal of each wavelength moves the beam splitter selecting means 20 so as to have a predetermined laser power, and controls the laser power of each wavelength to have a desired value. According to this embodiment, the laser power can be strictly controlled, and high-quality laser processing can be performed.
Further, it is possible to provide a laser processing apparatus which can irradiate the workpiece 7 with a laser energy with a low loss and in which optical components are less damaged.

(Eleventh Embodiment) FIG. 11 shows an eleventh embodiment of the present invention. FIG. 11 is a schematic view of a laser processing apparatus showing the eleventh embodiment. This embodiment is the seventh
In the apparatus of the above embodiment, each laser splitting means is a plurality of beam splitters, and the beam splitter selecting means 2
2, 23 and 24 are provided, and wavelengths 1064, 532, 3 are provided.
A laser processing apparatus can be provided by providing the controller 16 for controlling the laser powers of 55, 266, 215 and 177 nm. According to this embodiment, the first
The laser power can be strictly controlled in the same manner as in the 0th embodiment, and high-quality laser processing can be performed. The first
The irradiation laser light to be applied to the workpiece used in each of the embodiments to the eleventh embodiment is shown only for the example in which all the laser light emitted from the laser oscillator is used, but the present invention is not limited to this and the laser branching means Only the laser light emitted from one side may be used.

[0023]

As described above, according to the present invention, since the wavelength converting means is arranged after the laser branching means, the need for the variable optical attenuator is eliminated, and the optical parts constituting the variable optical attenuator are damaged. Disappears. Also, the first laser branching means for branching the first wavelength laser light and the wavelengths of the laser light branched by the first laser branching means are 1/2, 1 /
Heat is generated in the laser processing device by irradiating the workpiece with the wavelength conversion means for converting into at least one wavelength of 3, 1/4, 1/5, or 1/6 wavelength to form a laser processing device. There is no damage to the optical components in the YAG laser head, there is no need for a laser absorber that absorbs the reflected light of the YAG laser light, and there is little loss of energy that contributes to processing. . Further, since each laser branching means is provided with a plurality of beam splitters and a beam splitter means, there is an effect that the laser processing apparatus can control laser power of a plurality of wavelengths for each wavelength. Furthermore, the laser power of the laser processing apparatus can be strictly controlled, and high-quality laser processing can be performed.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a laser processing apparatus showing a first embodiment of the present invention.

FIG. 2 is a schematic diagram of a laser processing apparatus showing a second embodiment of the present invention.

FIG. 3 is a schematic diagram of a laser processing apparatus showing a third embodiment of the present invention.

FIG. 4 is a schematic diagram of a laser processing apparatus showing a fourth embodiment of the present invention.

FIG. 5 is a schematic diagram of a laser processing apparatus showing a fifth embodiment of the present invention.

FIG. 6 is a schematic diagram of a laser processing apparatus showing a sixth embodiment of the present invention.

FIG. 7 is a schematic diagram of a laser processing apparatus showing a seventh embodiment of the present invention.

FIG. 8 is a schematic diagram of a beam splitter selecting means showing an eighth embodiment of the present invention.

FIG. 9 is a schematic diagram of a laser processing apparatus showing a ninth embodiment of the present invention.

FIG. 10 is a schematic diagram of a laser processing apparatus showing a tenth embodiment of the present invention.

FIG. 11 is a schematic diagram of a laser processing apparatus showing an eleventh embodiment of the present invention.

FIG. 12 is a schematic diagram showing a conventional laser processing apparatus.

[Explanation of symbols]

1 YAG laser power source 2 YAG laser head 301 First laser branching means 302 Second laser branching means 303, 305, 306 Third laser branching means 307 Fourth laser branching means 308 Fifth laser branching means 401 First Wavelength conversion means 402, 404, 408 wavelength conversion means 403 third wavelength conversion means 405 fourth wavelength conversion means 406 fifth wavelength conversion means 407 sixth wavelength conversion means 5 to 523 total reflection mirror 603 condenser lens 7 Workpieces 8, 801, 802, 803, 804, 805 Specific wavelength reflecting mirrors 91-98 Beam splitter 10 Actuator 10a Mover 10b Stator 11 Pseudo-transmissive plate 12 Spectroscope 13, 13a, 13b, 13c Photosensor 14 Signal Processor 15 Display 16 Controller 20-24 Beam splitter -Option means

Claims (12)

[Claims] 1. A laser processing apparatus which has a laser oscillator that emits laser light and a condensing optical system that condenses the laser light, and irradiates the laser light onto a workpiece to perform processing. A laser processing apparatus comprising: a laser branching unit for branching the laser beam and a wavelength conversion unit for converting the wavelength of the laser beam, wherein the wavelength conversion unit is arranged at a stage subsequent to the laser branching unit. 2. A laser oscillator that emits laser light of a first wavelength and a condensing optical system that condenses the first wavelength laser light, and irradiates the workpiece with the first wavelength laser light. In a laser processing apparatus for processing, a first laser branching unit for branching the first wavelength laser beam and one of the laser beams branched by the first laser branching unit have wavelengths of 1/2, 1/3, 1 / 4, ⅕ or ⅙ wavelength, and a wavelength conversion means for converting the wavelength to at least one wavelength, and the laser light with which the workpiece is irradiated is emitted from the wavelength conversion means. Two, one
/ 3, 1/4, 1/5 or 1/6 wavelength laser light, or the other first wavelength laser light branched by the first laser branching means, and 1/2 emitted from the wavelength converting means,
A laser processing apparatus which is a laser beam having a wavelength of 1/3, 1/4, 1/5 or 1/6. 3. The other first wavelength laser beam split by the first laser splitting means and the 1/2, 1/3, 1 /
Laser beam of 4, 1/5 or 1/6 wavelength is superimposed on the same optical axis, or the above 1/2, 1/3, 1/4, 1/5
Alternatively, the laser processing apparatus according to claim 2, wherein the laser light having at least two wavelengths among the laser light having a 1/6 wavelength is superimposed on the same optical axis to irradiate the workpiece. 4. The laser light converted into the ½ wavelength is branched by a second laser branching means, and the ⅓, ¼,
The laser processing apparatus according to claim 2 or 3, further comprising a wavelength conversion means for converting the wavelength into 1/5 or 1/6 wavelength. 5. The third laser branching means branches the laser light wavelength-converted into the 1/3 wavelength into 1/4 and 1 /
The laser processing apparatus according to claim 2, further comprising a wavelength conversion unit that converts the wavelength into 5 or 1/6 wavelength. 6. The wavelength conversion means for converting the laser light wavelength-converted to the ¼ wavelength into a ⅕ or ⅙ wavelength by a fourth laser branching means.
6. The laser processing apparatus according to any one of 1 to 5. 7. The wavelength conversion means for converting the laser light wavelength-converted to the ⅕ wavelength into a ⅙ wavelength by a fifth laser branching means. The laser processing apparatus according to the item. 8. The first, second, third, fourth or fifth laser branching means comprises a beam splitter.
7. The laser processing apparatus according to any one of 1 to 7. 9. The first, second, third, fourth or fifth laser beam splitting means each comprises a plurality of beam splitters, and the first, 1/2, 1/3, 1/4 or 1 /
9. A beam splitter selecting means capable of selecting the beam splitter for splitting the laser beam of No. 5 according to claim 2.
The laser processing apparatus according to any one of 1. 10. The power of the laser light with which the object to be processed is irradiated is the first, 1/2, 1/3, 1/4, 1/5.
Alternatively, the laser processing apparatus according to any one of claims 2 to 9, further comprising wavelength dispersion laser power measuring means for detecting each 1/6 wavelength. 11. At least one of the output signals corresponding to the laser light of the first, 1/2, 1/3, 1/4, 1/5 or 1/6 wavelength from the wavelength dispersion laser power measuring means. To the beam splitter selection means of the first, second or third laser branching means, and the first, first
11. The laser processing apparatus according to claim 10, further comprising a controller for controlling the power of laser light having a wavelength of / 2, 1/3, 1/4, 1/5, or 1/6. 12. The laser processing apparatus according to claim 11, wherein the controller controls the power of the laser light simultaneously and independently for each wavelength.