JP2003092476A - Electronic component device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify a structure by using a flexible substrate, to improve a sealing property between the substrate and a component cover and to improve reliability. SOLUTION: In the flexible substrate 2 arranged on a base plate 1, a plurality of wiring patterns 5 connected to respective electronic components 9 and a frame-like pattern 6 surrounding a component loading part 2A are embedded. Also, the component cover 10 covering the respective electronic component is provided on a surface side of the substrate 2, and a sealing member 12 mounted on the sealing groove 10B is abutted to the flexible substrate 2 at the position of the frame-like pattern 6. Thus, the structure of the entire device is simplified by using the flexible substrate 2, formation of a level difference on a surface of the flexible substrate 2 at an abutting part of the sealing member 12 due to a thickness of the wiring patterns 5 or the like is suppressed, and the sealing property by the sealing member 12 is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component device suitably used for mounting a sealed structure type electronic circuit or the like on a flexible substrate.

[0002]

2. Description of the Related Art Generally, some electronic component devices are used in a state of being immersed in an oil liquid due to layout restrictions, etc., and such electronic component devices are mounted on a vehicle such as an automobile. A control unit for an automatic transmission is known (for example, Japanese Patent Laid-Open No. 2001-6
8176, etc.).

A control unit according to the prior art of this kind is arranged inside a transmission case together with various sensors and actuators for controlling the shift of an automatic transmission, for example, according to a shift operation of a driver or a driving state of a vehicle. To change the shift range of the automatic transmission.

In this case, the circuit board of the control unit and the like are housed in a metal housing case in a hermetically sealed state.
It is isolated from the lubricating oil that lubricates the inside of the transmission case. Further, the housing case is provided with a plurality of electrode terminals projecting inside and outside the case. These electrode terminals are connected to the circuit board inside the case, and are connected to the sensor and the actuator outside the housing case via lead wires and the like. Further, a sealing means such as a hermetic seal is provided between each electrode terminal and the housing case.

[0005]

By the way, in the above-mentioned prior art, a plurality of electrode terminals are pulled out from a hermetically sealed control unit via a hermetic seal or the like.
These electrode terminals are connected to sensors and actuators by lead wires or the like.

For this reason, it is necessary to attach hermetic seals to the lead-out portions of the individual electrode terminals in the housing case, and moreover, a large number of leads are provided between these electrode terminals and the sensors, actuators, etc. arranged at various places. Since wires and the like have to be connected, there is a problem that the wiring structure and the seal structure of the entire control device including the control unit become complicated, the assembly work is troublesome, and the reliability is lowered.

The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to allow electronic components mounted on a flexible substrate to be housed in a component cover in a sealed state,
An object of the present invention is to provide an electronic component device capable of simplifying a wiring lead-out structure and a seal structure with respect to the outside and improving reliability.

[0008]

In order to solve the above-mentioned problems, the invention of claim 1 is sandwiched between a base member on which an electronic component is mounted and a flexible resin film provided on the base member. A flexible board having a wiring pattern extending from a mounting portion of the electronic component toward the periphery; a component cover attached to the flexible substrate at a position surrounding the mounting portion of the electronic component to cover the electronic component; The seal member is provided at a contact portion with the component cover and seals the inside of the component cover from the outside.

With this configuration, when assembling the electronic component device, the wiring pattern arranged in the flexible substrate and the electronic component can be assembled in a sub-assembled state. By providing the flexible substrate with the component cover and the seal member, the electronic component can be housed in a sealed state between the flexible substrate and the component cover, and the wiring pattern can be easily pulled out from the inside of the component cover. .

According to the second aspect of the present invention, an auxiliary pattern surrounding the mounting portion of the electronic component is provided between the resin films of the flexible substrate, and the wiring pattern is drawn from the inside of the component cover to the outside of the auxiliary pattern. A notch is provided for this purpose, and the seal member is provided along the auxiliary pattern.

With this, an auxiliary pattern formed in, for example, a frame shape and surrounding a mounting portion of the electronic component can be arranged at a portion of the flexible substrate where the seal member is arranged, and the wiring pattern is formed through the notch. It can be pulled out of the auxiliary pattern. Therefore, it is possible to suppress the formation of a step on the surface of the flexible board at the position of the seal member, because only the portion of the flexible board where the wiring pattern is pulled out rises due to the thickness of the wiring pattern or the like.

According to the third aspect of the present invention, the auxiliary pattern is formed together with the wiring pattern by using the same metal material. Thus, when the flexible substrate is manufactured, the wiring pattern can be formed by subjecting the metal film to processing such as pattern formation and etching, and the processing for the auxiliary pattern can be performed at the same time. Therefore, the wiring pattern and the auxiliary pattern can be formed together without increasing the number of steps for manufacturing the flexible substrate.

Further, according to the invention of claim 4, the component cover is provided with the seal groove for mounting the seal member on the contact surface with the flexible substrate. This allows
The seal member mounted in the seal groove of the component cover can be brought into contact with the flexible substrate, and the gap between them can be sealed by the seal member.

According to the invention of claim 5, the wiring pattern is composed of a plurality of wiring patterns, and the interval between the wiring patterns is set to 0.1 to 0.3 mm. Accordingly, for example, in a portion where each wiring pattern is drawn from the inside to the outside of the component cover, it is possible to prevent the gap between these drawn portions from being too wide and to form a step such as a dent on the surface of the flexible substrate. .

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Electronic component devices according to embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

1 to 9 show a first embodiment according to the present invention. In the present embodiment, a control device for an automatic transmission will be described as an example of an electronic component device.

Reference numeral 1 denotes a base plate as a base member formed of, for example, a metal plate, a resin plate, etc., and a flexible substrate 2 and an electronic component 9 which will be described later are mounted on the base plate 1, as shown in FIGS. Has been done. The base plate 1 is attached to a control valve 13 of the automatic transmission together with a shift control component 14 to be described later, and is arranged, for example, in a transmission case of the automatic transmission.

Reference numeral 2 denotes a flexible substrate mounted on the front surface side of the base plate 1. The flexible substrate 2 is composed of a base film 3, a wiring pattern 5, a coverlay film 7 and the like, which will be described later, and the base film 3 and the cover. It is formed integrally by sandwiching a plurality of wiring patterns 5 with the lay film 7.

A portion of the flexible substrate 2 covered with a component cover 10 described later is formed as a component mounting portion 2A on which the electronic component 9 is mounted. Further, the flexible board 2 is provided with a plurality of connecting portions 2B protruding from the outer edge side thereof, and the wiring patterns 5 are exposed on the protruding end sides of the respective connecting portions 2B. Then, each connecting portion 2B is connected to the shift control component 14 in a state of being flexibly deformed as necessary, as indicated by an imaginary line in FIG. 2, for example.

Reference numeral 3 denotes a base film formed of an insulating resin material such as polyimide. The base film 3 is formed as a flexible resin film having a thickness of, for example, about 10 to 100 μm. There is. Then, as shown in FIGS. 5 and 6, the base film 3 is adhered to the base plate 1 with an adhesive 4 at a portion corresponding to the component mounting portion 2A, for example.

Reference numeral 5 denotes a plurality of wiring patterns embedded between the base film 3 of the flexible substrate 2 and the coverlay film 7, and each wiring pattern 5 is formed by plating a metal material such as copper on the base film 3. Alternatively, it is formed by bonding and has a predetermined pattern shape as shown in FIGS.

Here, a part of each wiring pattern 5 is exposed on the surface of the coverlay film 7 in the component mounting portion 2A of the flexible substrate 2, and each electronic component 9 is exposed at this exposed portion (not shown). It is connected. In addition, each wiring pattern 5 extends from the component mounting portion 2A of the flexible substrate 2 toward each connection portion 2B, and an intermediate portion thereof is a linear lead wire portion 5A that is drawn from the inside of the component cover 10 to the outside. ing.

The lead wire portion 5A is shown in FIG.
As shown in, for example, a thickness dimension of about 10 to 50 μm,
It has a width dimension of about 0.5 to 1.5 mm and is separated from each other with a predetermined distance D. In this case, at the position of each lead wire portion 5A, the cover lay film 7 is raised due to the thickness of the lead wire portion 5A and the like, and a step (unevenness) is formed on the surface thereof. Therefore, the distance D between the lead-out wire portions 5A is, for example, 0.1 to 0.3 mm in order to suppress the step difference of the coverlay film 7 at the contact portion of the seal member 12 as shown in FIG. 9 described later. The dimension is preset to about 0.2 mm, preferably about 0.2 mm.

Reference numeral 6 denotes a frame-shaped pattern as an auxiliary pattern embedded between the base film 3 and the coverlay film 7 of the flexible substrate 2. The frame-shaped pattern 6 is, for example, as shown in FIGS. The wiring pattern 5 is made of the same metal material or the like, and has a thickness dimension substantially equal to that of the lead wire portion 5A and a width dimension larger than the seal member 12.

In this case, when the flexible substrate 2 is manufactured, for example, in the process of forming the wiring pattern 5 by subjecting the metal film to patterning, etching, etc., the frame-shaped pattern 6 is also simultaneously processed. Thus, the wiring pattern 5 and the frame-shaped pattern 6 are formed together.

The frame-shaped pattern 6 is formed in a substantially quadrangular frame shape, extends along the contact portion of the seal member 12 that contacts the flexible substrate 2, and the component mounting portion 2A.
It is arranged to surround. Further, the frame-shaped pattern 6 is provided with, for example, three notches 6A, 6B, 6C, and the lead wire portion 5A of each wiring pattern 5 is provided with the flexible substrate 2 via these notches 6A, 6B, 6C. From the component mounting portion 2A to the connecting portion 2B.
In this case, the distance D'between the lead-out wire portion 5A of the wiring pattern 5 and the frame-shaped pattern 6 at the positions of the notches 6A, 6B, 6C is approximately equal to the distance D between the lead-out wire portions 5A. Has been formed.

As a result, the frame-shaped pattern 6 is embedded in a portion of the flexible substrate 2 with which the seal member 12 abuts, in which each wiring pattern 5 is not drawn out, and this portion and the wiring pattern 5 are drawn out. This prevents a step from being formed on the surface of the coverlay film 7.

Reference numeral 7 is a coverlay film which constitutes the surface side of the flexible substrate 2. The coverlay film 7 is
Almost the same as the base film 3, for example, 10 to 50 μm
It is formed of a flexible resin film having a thickness dimension. Then, the coverlay film 7 is adhered to the front surface side of the base film 3, each wiring pattern 5 and the frame-shaped pattern 6 by using the adhesive layer 8, and covers them almost entirely.

Reference numeral 9 is a component mounting portion 2A of the flexible substrate 2.
As shown in FIG. 3, each electronic component 9 includes a semiconductor IC such as a microcomputer, a transistor, a resistor, a capacitor, and the like. Connected to each other. Each electronic component 9 is connected to the shift control component 14 via the wiring pattern 5, and the shift control component 14 is connected to the shift control component 14.
Is used to configure a control unit that controls the shift range of the automatic transmission.

Reference numeral 10 denotes a component cover in which each electronic component 9 is housed in a sealed state between the flexible substrate 2 and the component cover 10. The component cover 10 is formed in a substantially box shape with the lower side in FIG. 2 open. Further, the component cover 10 has a frame-shaped contact surface 10A that comes into contact with the cover lay film 7 at the position where the open end surrounds the component mounting portion 2A of the flexible substrate 2,
A seal groove 10B is formed on the contact surface 10A over the entire circumference. The component cover 10 is fastened to the base plate 1 via the flexible substrate 2 by a plurality of mounting screws 11 and covers each electronic component 9.

Reference numeral 12 is a seal member such as an O-ring mounted in the seal groove 10B of the component cover 10.
2 is formed of an elastic material such as a resin material or rubber into a quadrangular frame shape, and is a hardness standard value such as an O-ring defined by the Japanese Industrial Standard (JIS), for example, a hardness of 60 to 80, preferably a hardness. It has a hardness equivalent to 70. The seal member 12 elastically contacts the seal groove 10B of the component cover 10 and the surface of the cover lay film 7.

In this case, at the portion where the seal member 12 abuts the coverlay film 7, as shown in FIG. 6, the distance D between the lead wire portions 5A and the space between the lead wire portions 5A and the frame-shaped pattern 6 are provided. The steps corresponding to the intervals D'of the cover lay film 7 are formed so that the seal member 12 having the above-mentioned hardness is elastically deformed and abutted on the steps of the cover lay film 7 without any gap. , For example 0.1-0.3m
It is set to a small size of about m, preferably about 0.2 mm.

Thus, the seal member 12 can stably seal between the cover lay film 7 and the component cover 10, and when the automatic transmission control device is arranged in the transmission case, the component cover 10 is lubricated. It is configured to reliably prevent oil from entering.

On the other hand, in FIG. 2, reference numeral 13 is a control valve to which the base plate 1 and the like are attached. Inside the control valve 13, a hydraulic circuit (not shown) for switching the shift range of the automatic transmission is provided. There is.
Reference numeral 14 denotes a plurality of gear shift control parts (only one is shown) attached to the control valve 13, and each gear shift control component 14 is, for example, various sensors for detecting oil temperature, oil pressure, etc. in the control valve 13. And an actuator for switching the hydraulic circuit.

The control device for the automatic transmission according to the present embodiment has the above-mentioned structure, and its operation will be described below.

First, when the automatic transmission is in operation, the control unit consisting of the electronic components 9 detects the shift operation of the driver and the operating state of the vehicle. Then, the control unit detects the oil temperature, oil pressure, etc. in the control valve 13 using various sensors of the gear shift control component 14, and switches the hydraulic circuit using the actuator to shift gears of the automatic transmission. Controls range switching.

At the time of assembling the control device, first, each electronic component 9 is mounted on the component mounting portion 2A of the flexible substrate 2 and these are bonded onto the base plate 1. And
The component cover 10 is attached to the component mounting portion 2A of the flexible substrate 2.
Etc. are attached, the shift control parts 14 are connected to the respective connection parts 2B, and these parts are arranged in the transmission case in a state of being assembled to the control valve 13.

In this case, when the component cover 10 is attached to the flexible substrate 2, as shown in FIG. 7, steps are formed on the surface of the cover lay film 7 due to the respective wiring patterns 5 and the like, so that the component cover 10 is attached to the side of the component cover 10. It is necessary to elastically deform the formed seal member 12 and bring it into contact with the step of the cover lay film 7 without a gap.

Therefore, in order to explain the relationship between the arrangement of the wiring patterns 5 and the stepped state of the coverlay film 7, FIG. 8 shows a comparative example in which the frame-shaped pattern 6 is omitted from the present embodiment. I will refer to it. In the flexible substrate 100 of this comparative example, the lead wire portions 102A of the respective wiring patterns 102 are arranged on the base film 101 at a constant interval d, and the cover lay film 104 is adhered to the surface side of the lead wire portions 102A via the adhesive layer 103. It is what

In this comparative example, the relationship between the distance d between the lead-out wire portions 102A measured by experiments and the step state of the coverlay film 104 is shown in FIG. In FIG. 9, the horizontal axis indicates the distance from the position P in FIG. 8 to the right, and the vertical axis indicates the unevenness of each part of the coverlay film 104 with the surface position of the coverlay film 104 at the position P as a reference. It is a representation.

As can be seen from FIG. 9, each lead wire portion 1
When the distance d between 02A is 0.1 to 0.3 mm,
The size of the step formed on the surface of the coverlay film 104 can be suppressed within an allowable range A of the step that can be sealed by the seal member 12 having a hardness of 60 to 80, for example. The allowable range A of the step is a dimensional range of the step in which the seal member 12 is elastically deformed and can be brought into contact with the step without a gap, and is based on experimental data or the like in consideration of required airtightness. Is set appropriately.

For example, an O-ring having a hardness of 70 has a surface roughness of about 12.5 μm. Using this O-ring, for example, each lead wire portion 102 is formed.
When the distance d between A is 0.5 mm, the size of the step exceeds the allowable range A of the seal member 12, and thus there is a possibility that the step cannot follow the step even if the seal member 12 elastically deforms. Further, the allowable range A is provided between the portion (position P) where the leader line portion 102A is not formed and the portion where it is formed.
Because a large step that exceeds
As shown in FIG. 8, the seal member 12 and the coverlay film 1
A gap 105 is easily formed between the gap 105 and the gap 04.

On the other hand, in the present embodiment, the frame-shaped pattern 6 extending along the abutting portion of the seal member 12 is arranged in the flexible substrate 2, and the lead-out line portions 5A of the respective wiring patterns 5 are arranged between the lead-out line portions 5A. The distance D and the distance D ′ between the lead wire portion 5A and the frame-shaped pattern 6 are, for example, 0.1 to 0.3 mm.
The size is set to about 0.2 mm, preferably about 0.2 mm.

As a result, the frame-shaped pattern 6 can prevent only the position of each lead wire portion 5A from rising at the portion of the flexible substrate 2 with which the seal member 12 abuts. It is possible to prevent D ′ and the like from spreading too much and forming a depression or the like on the surface of the flexible substrate 2.

Therefore, the step of the cover lay film 7 can be kept small at the contact portion of the seal member 12, and the seal member 12 can be brought into contact with the surface of the cover lay film 7 over the entire circumference without any gap. The seal member 1 is provided between the flexible substrate 2 and the component cover 10.
2 makes it possible to stably seal and improve the sealing performance, and at the same time, each electronic component 9 in the component cover 10
Etc. can be reliably protected against external oil liquid, and reliability can be improved.

Since the flexible substrate 2 is used,
At the time of assembling the control device, the plurality of wiring patterns 5 and each electronic component 9 can be assembled in a sub-assembly state, and these electronic components 9 can be housed in the component cover 10 in a hermetically sealed state. And the flexible substrate 2
By this, the lead wire portion 5A of each wiring pattern 5 can be easily drawn out from the inside of the component cover 10, the drawing structure and the seal structure can be simplified, and the wiring pattern 5 is connected to each gear shift control component 14. By doing so, the assembling work can be performed efficiently.

Moreover, when the flexible substrate 2 is formed, for example, the wiring pattern 5 and the frame-shaped pattern 6 are formed on the metal film or the like arranged on the base film 3.
Etching and the like can be performed simultaneously. Therefore,
Each wiring pattern 5 and the frame-shaped pattern 6 can be efficiently formed together without newly adding a process or the like for forming the frame-shaped pattern 6, and the frame-shaped pattern 6 can be suppressed while suppressing the cost increase of the flexible substrate 2. Can be easily added.

Next, FIG. 10 shows a second embodiment according to the present invention, and the feature of this embodiment is that a part of the auxiliary pattern is used as a wiring pattern. In this embodiment, the same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

Reference numeral 21 denotes a flexible substrate mounted on the base plate 1. The flexible substrate 21 has a base film 22, a plurality of wiring patterns 23 and 24, a frame-shaped pattern 25, as in the first embodiment. Adhesive layer,
And a coverlay film (both not shown). The lead wire portions 23A and 24A of the wiring patterns 23 and 24 are drawn out from the component mounting portion 21A of the flexible substrate 21 through the notches of the frame-shaped pattern 25.

However, of the wiring patterns 23 and 24, for example, two wiring patterns 24 have lead lines 24A.
Are connected to each other by an intermediate portion 25A of the frame pattern 25.

Thus, in this embodiment having such a configuration, it is possible to obtain substantially the same operational effects as those of the first embodiment. And, particularly in this embodiment,
The wiring pattern 24 is formed in the middle portion 25A of the frame-shaped pattern 25.
Since it is used as a part of, the degree of freedom in design can be increased.

Next, FIG. 11 shows a third embodiment according to the present invention, which is characterized in that a part of the auxiliary pattern is used as a wiring pattern for grounding.
In this embodiment, the same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

Reference numeral 31 is a flexible board mounted on the base plate 1. The flexible board 31 includes a base film 32, a plurality of wiring patterns 33, and a frame-shaped pattern 3.
4 and an adhesive layer and a coverlay film (none of which are shown), and the lead wire portion 33A of each wiring pattern 33 is a component mounting portion 31 of the flexible substrate 31.
It is drawn out from A through the notch of the frame-shaped pattern 34.

However, on the base film 32, a plurality of grounding wiring patterns 35 connected to each electronic component 9 inside the frame-shaped pattern 34, and grounded to the ground side outside the frame-shaped pattern 34. The other wiring pattern 36 for grounding is provided, and these wiring patterns 35, 36 are connected to each other by the intermediate portion 34A of the frame-shaped pattern 34.

Thus, in this embodiment having such a configuration, it is possible to obtain substantially the same operational effects as those of the first embodiment. And, particularly in this embodiment,
Since the intermediate portion 34A of the frame-shaped pattern 34 is used as a part of the ground wiring patterns 35 and 36, the wiring structure on the ground side can be simplified and the degree of freedom in design can be increased.

In each of the above-mentioned embodiments, the component mounting portions 2A, 21A, 31 of the flexible boards 2, 21, 31 are arranged.
Although each electronic component 9 is directly mounted on A, the present invention is not limited to this. For example, each electronic component 9 is mounted on an insulating substrate or the like, and the insulating substrate is attached to a component mounting portion of a flexible substrate to perform wiring. It may be configured to be connected to a pattern.

Further, in the embodiment, the notches 6A, 6B, 6C, etc. are provided on two sides of the rectangular frame-shaped pattern 6, 25, 34 having four sides, and the wiring pattern is formed from these notches. 5, 23, 24, 33, etc. are drawn out, but in the present invention, the position and the number of notches provided in the auxiliary pattern are not limited to those in the embodiment, and for example, the auxiliary pattern having a rectangular frame shape. It is also possible to provide a notch on each of the four sides and draw out the wiring pattern through these four notches.

Further, in the embodiments, the control device for the automatic transmission is described as an example of the electronic component device, but the present invention is not limited to this, and the flexible structure is provided on the flexible flexible substrate. Needless to say, the present invention can be applied to various electronic component devices configured to mount the electronic circuit and the like.

[0059]

As described above in detail, according to the invention of claim 1, the component cover is attached to a part of the flexible substrate provided on the base member, and the seal member is provided between the flexible substrate and the component cover. Since the electronic component device is assembled, the wiring pattern and the electronic component can be efficiently assembled in the sub-assembly state when the electronic component device is assembled, and the electronic component can be housed in the component cover in a sealed state. Further, the wiring pattern can be easily drawn out from the inside of the component cover by the flexible substrate, the drawing structure and the seal structure can be simplified, and the reliability can be improved.

According to the second aspect of the present invention, the flexible substrate is provided with an auxiliary pattern surrounding the mounting portion of the electronic component at the position of the seal member, and the auxiliary pattern has a cutting pattern for drawing out the wiring pattern to the outside. Since the notch is provided, it is possible to prevent the auxiliary pattern from forming a step on the surface of the flexible substrate because only the pulled-out portion of each wiring pattern is raised at the portion of the flexible substrate where the sealing member abuts. Thereby, the seal member can be stably brought into contact with the flexible substrate, and the sealing property between the flexible substrate and the component cover can be improved.

Further, according to the invention of claim 3, since the auxiliary pattern is formed together by using the same metal material as the wiring pattern, the wiring pattern and the auxiliary pattern are formed at the time of manufacturing the flexible substrate. It can be efficiently formed together.

Further, according to the invention of claim 4, since the component cover is provided with the seal groove for mounting the seal member on the contact surface with the flexible substrate, the seal member mounted in the seal groove of the component cover. Can be stably brought into contact with the flexible substrate, and a space between them can be sealed by the seal member.

Further, according to the invention of claim 5, since the interval between the wiring patterns is formed to be 0.1 to 0.3 mm, for example, at the portion where each wiring pattern is drawn from the inside to the outside of the component cover. It is possible to prevent the gap between these drawn-out portions from being too wide and to form a step such as a dent on the surface of the flexible substrate. This allows
The seal member can be stably brought into contact with the flexible substrate, and the sealing property thereof can be improved.

[Brief description of drawings]

FIG. 1 is a front view showing a control device for an automatic transmission according to a first embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of the control device as seen from the direction of arrows II-II in FIG.

FIG. 3 is an enlarged front view showing a component cover and the like in FIG.

FIG. 4 is an enlarged cross-sectional view of the flexible substrate as seen from the direction of arrows IV-IV in FIG.

5 is an enlarged cross-sectional view of a main part of a flexible substrate, a seal member, etc., which shows an enlarged part a in FIG.

6 is an enlarged cross-sectional view of a main part of a flexible substrate, a seal member and the like as viewed from the direction of arrows VI-VI in FIG.

FIG. 7 is an enlarged cross-sectional view of a main part of the state before the flexible substrate and the seal member are brought into contact with each other, as viewed from the same position as in FIG.

FIG. 8 is an enlarged cross-sectional view of essential parts showing a comparative example in which a flexible substrate without a frame-shaped pattern is used for comparison with the first embodiment.

FIG. 9 is a characteristic diagram showing a relationship between an interval between wiring patterns and a step state of a coverlay film.

FIG. 10 is an enlarged cross-sectional view of a control device for an automatic transmission according to a second embodiment of the present invention, viewed from the same position as in FIG.

FIG. 11 is an enlarged cross-sectional view of a control device for an automatic transmission according to a third embodiment of the present invention, viewed from the same position as in FIG.

[Explanation of symbols]

1 Base plate (base member) 2,21,31 Flexible substrate 2A, 21A, 31A component mounting section 2B connection 3,22,32 Base film 4 adhesive 5,23,24,33 Wiring pattern 5A, 23A, 24A, 33A Lead wire 6,25,34 Frame pattern (auxiliary pattern) 6A, 6B, 6C Notch 7 Coverlay film 8 Adhesive layer 9 electronic components 10 Parts cover 10A contact surface 10B seal groove 11 Mounting screw 12 Seal member 13 Control valve 14 Gear change control parts 35, 36 Grounding wiring pattern D, D'interval

Claims (5)

[Claims] 1. A base member on which an electronic component is mounted, and a flexible substrate in which a wiring pattern provided on the base member and sandwiched between flexible resin films extends from a mounting portion of the electronic component toward the periphery. A component cover attached to the flexible substrate at a position surrounding a mounting portion of the electronic component and covering the electronic component; and a component cover provided at a contact portion between the flexible substrate and the component cover to seal the inside of the component cover to the outside. An electronic component device including a sealing member. 2. An auxiliary pattern surrounding a mounting portion of the electronic component is provided between the resin films of the flexible substrate, and the auxiliary pattern has a notch for drawing out the wiring pattern from the inside of the component cover to the outside. The electronic component device according to claim 1, wherein the seal member is provided along the auxiliary pattern. 3. The electronic component device according to claim 2, wherein the auxiliary pattern is formed together with the wiring pattern by using the same metal material. 4. The electronic component device according to claim 1, wherein the component cover is provided with a seal groove for mounting the seal member on a contact surface with the flexible substrate. 5. The wiring pattern is composed of a plurality of wiring patterns, and an interval between the wiring patterns is 0.1 to 10.
The electronic component device according to claim 1, 2, 3, or 4, which is formed to have a thickness of 0.3 mm.