JP2003078294A - Electronic-component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus by which the mounting efficiency of an electronic component onto a circuit board is enhanced, by a method wherein a plurality of kinds of electronic components including the electronic component incapable of being sucked and held by a conventional suction nozzle can be held by a single holding mechanism, without using a holding mechanism exclusively used for each electronic component. SOLUTION: A mounting head part 12 is provided with a holding mechanism 14 for relative movement. The holding mechanism 14 is provided with an adhesion body 15 which holds an electronic component 16 by adhesive force. At a component feed part 13, the adhesive body 15 is pressed to the electronic component 16 to hold it by adhesion.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, and more particularly, to an electronic component supplied from a component supply unit, which is pressed against an adhesive body, and is adhered and held by the adhesive force of the adhesive body to be mounted on a circuit board. The present invention relates to a holding mechanism mounted at a predetermined position.

[0002]

2. Description of the Related Art Referring to FIG. 8, a conventional electronic component mounting apparatus 70 includes a substrate transfer section 72 for loading and unloading a circuit board 71, and a large number of electronic components 7 on a tape wound in a reel.
3 is mounted and stored in the component supply unit 74 and the holding mechanism 7.
Some of them include a mounting head portion 5 mounted so as to be relatively movable, and an XY robot 79 for moving the mounting head portion 76 in the XY directions along the Y-axis arm 77 and the X-axis arm 78.

Referring to FIGS. 8 and 9, the holding mechanism 75 is provided with a suction nozzle 80 having a suction air passage 80a formed therein. One end of the suction air flow path 80a has a holding mechanism 7.
5 is opened on the front end face 80b in the displacement direction, and the other end is connected to the suction air source.

The operation of the electronic component mounting apparatus 70 will be described below. First, the board transport unit 72 carries the circuit board 71 into a predetermined mounting position. Then, the XY robot 79
However, the mounting head unit 76 is moved to the component supply unit 74, the suction nozzle 80 is lowered, and the front end face 80b is moved to the electronic component 73.
Abut. After sucking and holding the electronic component 73 on the front end face 80b by suction air supplied from the suction air source,
The suction nozzle 80 is raised to its original height.

The XY robot 79 moves the suction nozzle 80 holding the electronic component 73 to a mounting position on the circuit board 71 on which the electronic component 73 is to be mounted, and then lowers the suction nozzle 80 to move the electronic component. 73 to the circuit board 71
It is mounted by abutting on.

[0006]

In the above-described conventional electronic component mounting apparatus 70, since the electronic component 73 is sucked and held on the front end face 80b of the suction nozzle 80 by the suction air, the gap between the electronic component 73 and the front end face 80b is held. If there is even a slight gap, the suction air will leak, and the suction force will weaken, and a sufficient holding force will not be obtained.

That is, in the electronic parts 73A and 73B having an uneven top surface as shown in FIG. 10 and the electronic parts 73C and 73D having a hole in the center of a connector or the like, the suction air leaks and is sucked. The inside of the suction air flow path 80a of the nozzle 80 cannot be maintained at a negative pressure. Therefore, it is difficult to suck and hold such an electronic component 73 by the suction nozzle 80. That is, there is a problem that the electronic component 73 applicable to the conventional electronic component mounting apparatus 70 is limited to the electronic component 73 having a suction surface suitable for suction.

Further, for the suction nozzle 80, a dedicated suction nozzle must be designed and manufactured in accordance with the shape of the electronic component 73 to be suction-held for the above reason, and it takes a long time to prepare the nozzle. However, there is a drawback that requires a great deal of cost.

Further, every time the electronic component 73 to be suction-held is changed, it is required to stop the operation of the electronic-component mounting apparatus 70 and replace it with a dedicated suction nozzle 80 designed optimally. There is a drawback that productivity is significantly hindered.

The present invention makes it possible to hold various kinds of electronic parts by a single holding mechanism regardless of the shape of the electronic parts, and to reduce the cost and improve the productivity. It is intended to provide a mounting device.

[0011]

The above object of the present invention can be achieved by the following constitutions. The holding mechanism includes: a mounting head unit that is movable along a predetermined direction; and a holding mechanism that is provided so as to be movable relative to the mounting head unit and that holds an electronic component supplied with an electronic component from a component supply unit. In an electronic component mounting apparatus that mounts the electronic component held by the electronic component at a predetermined position on a circuit board, the holding mechanism presses the electronic component in the component supply unit to hold the electronic component by an adhesive force. An electronic component mounting apparatus comprising a body arranged.

The holding mechanism reduces the adhesive force between the adhesive body and the electronic component when the electronic component is mounted at a predetermined position on the circuit board, and the cream solder is applied on the circuit substrate. 2. The electronic component mounting apparatus according to claim 1, further comprising a peeling mechanism that reduces the adhesive force between the electronic component and the circuit board to separate the electronic component from the adhesive body.

The electronic component mounting apparatus according to the above or the above, wherein the adhesive body is detachably attached to the holding mechanism and is replaceable.

The holding mechanism includes a nozzle portion in which an air flow path, a cylinder chamber communicating with the air flow path, and an adhesive body chamber having one end opening to a front end face in the displacement direction of the holding mechanism are formed; A piston that protrudes into the body chamber and is loosely fitted into the cylinder chamber and is movable in the displacement direction of the holding mechanism; and a piston that is disposed in the cylinder chamber and urges the piston in a direction to protrude into the adhesive body chamber. The electronic component mounting apparatus as described in the above item, further comprising: a biasing member and the adhesive body fixed to the one end of the piston so as to be retractable from the adhesive body chamber.

The holding mechanism includes a nozzle portion in which an air flow path, a cylinder chamber communicating with the air flow path, and an adhesive body chamber whose one end opens to a front end face in the displacement direction of the holding mechanism are formed, and one end of the adhesive mechanism. A piston that protrudes into the body chamber and is loosely fitted in the cylinder chamber and is movable in the displacement direction of the holding mechanism; and a biasing member that is disposed in the cylinder chamber and that biases the piston in a direction to pull the piston from the adhesive body chamber. The electronic component mounting apparatus as described above or any one of the preceding claims, further comprising a member and the adhesive body made of an elastic body disposed in the adhesive body chamber so as to cover the opening of the adhesive body chamber.

The holding mechanism includes a nozzle portion in which an air passage and a cylinder chamber communicating with the air passage are formed, and one end of the nozzle portion protrudes toward a front end face of the holding mechanism in the displacement direction of the holding mechanism and is free to move into the cylinder chamber. A piston fitted and movable in the displacement direction of the holding mechanism, an urging member arranged in the cylinder chamber for urging the piston in the direction of retracting, and a hole capable of projecting and retracting the one end of the piston. And the pressure-sensitive adhesive body fixed to the front end surface of the nozzle portion.

The holding mechanism includes an air flow passage, a cylinder chamber communicating with the air flow passage, and a nozzle portion having a suction air flow passage communicating with an annular groove formed on a front end face in the displacement direction of the holding mechanism. , A piston whose one end projects from the front end surface of the nozzle portion and is loosely fitted in the cylinder chamber so as to be movable in the displacement direction of the holding mechanism; and a piston disposed in the cylinder chamber and biased in a direction to pull in the piston. And a pressure-sensitive adhesive body that is provided with a hole that allows the one end of the piston to be retracted and retracted, and that is adhered to the front end surface of the nozzle portion by suction from the suction air flow path. The electronic component mounting apparatus as described above.

After the pressure-sensitive adhesive body is pressed against the measurement surface to adhere to the measurement surface, the pressure-sensitive adhesive body is moved in a direction away from the measurement surface to measure the strength of the pressure-sensitive adhesive force of the pressure-sensitive adhesive body. When the strength of the adhesive force is measured by pressing the adhesive force measuring device and the adhesive body to the adhesive force measuring device at a predetermined timing, and when the strength of the adhesive force becomes weaker than the predetermined strength. The electronic component mounting apparatus according to any one of items 1 to 5, further comprising: a control device that issues a warning that calls for replacement of the adhesive body.

The adhesive force measuring device is movable in a predetermined direction and has a moving member provided with the measurement surface at one end along the predetermined direction, and the moving member always has a predetermined force in one direction along the displacement direction. The pressure-sensitive adhesive body, the pressure-sensitive adhesive body including a biasing member that biases the moving member, and a detection device that detects the movement when the moving member moves a predetermined distance against the biasing force of the biasing member and transmits a detection signal. After pressing and adhering to the measurement surface, by moving the adhesive in a direction away from the measurement surface, the moving member adhered by the adhesive force resists the urging force of the urging member. The electronic component mounting apparatus according to claim 1, wherein the detection signal is transmitted from the detection apparatus when the apparatus has moved by a predetermined distance.

[0020]

In the electronic component mounting apparatus described above, the board transfer section carries the circuit board into a predetermined mounting position. Then
The XY robot moves the mounting head unit to the component supply unit and positions the adhesive body arranged in the holding mechanism directly above the electronic component to be adhesively held. The holding mechanism is lowered to bring the adhesive body into contact with the electronic component, and by the adhesive force of the adhesive body,
After the electronic component is adhesively held, the holding mechanism is raised to the original height.

The XY robot moves the holding mechanism, which holds the electronic component by adhesive, to the mounting position on the circuit board where the electronic component is to be mounted, and then lowers the holding mechanism to bring the electronic component into contact with the circuit board. Let's implement.

The electronic component supplied from the component supply unit is adhesively held by the adhesive body by pressing the adhesive body arranged in the holding mechanism against the electronic component. Even an electronic component having a shape that cannot be sucked and held by a suction nozzle such as an electronic component having a hole formed in the hole can be held regardless of the shape of the electronic component.

Further, from this, even if the kind of the supplied electronic component is changed, the holding mechanism is not replaced,
Different types of electronic components can be adhesively held by using the same adhesive to carry out the mounting work continuously, and the operation efficiency of the electronic component mounting apparatus can be improved and the productivity can be enhanced.

In the electronic component mounting apparatus, the holding mechanism reduces the adhesive force between the adhesive body and the electronic component,
A peeling mechanism for separating the electronic component from the adhesive body is provided.

Therefore, when the electronic component is mounted at a predetermined position on the circuit board, the peeling mechanism is operated to generate the adhesive force between the adhesive body and the electronic component, and the electronic component and the circuit by the cream solder applied on the circuit board. The adhesive force between the boards can be made smaller to separate the electronic component from the adhesive body, and the electronic component can be reliably mounted at the mounting position on the circuit board.

In the above-mentioned electronic component mounting apparatus, since the adhesive body can be freely attached to and detached from the holding mechanism, the adhesive body can be easily replaced, and the adhesive force of the adhesive body is reduced by long-term use. At this time, it is possible to maintain high efficiency without changing the adhesive efficiency in a short time and lowering work efficiency.

In the above-mentioned electronic component mounting apparatus, the holding mechanism has a piston movably fitted in a cylinder chamber provided in the nozzle portion, and the piston is urged by the urging member in a direction to project into the adhesive body chamber. Has been done. An adhesive is fixed to one end of the piston, and the piston is moved so that the piston can move in and out of the adhesive chamber.

In the component supply unit, when the adhesive body is pressed and adhered to the electronic component, the adhesive body is pressed by the urging force of the urging member to the electronic component in a state where the adhesive body is projected from the adhesive body chamber. Make it sticky. When mounting the electronic component on the circuit board, suction air is supplied to the cylinder chamber through the air flow path, and the piston is pulled toward the air flow path side against the biasing force of the biasing member. As a result, the adhesive body fixed to the piston is drawn into the adhesive body chamber to separate the electronic component from the adhesive body.

As described above, by simply supplying or stopping the suction air supplied to the cylinder chamber, the adhesion or separation of the electronic components can be easily and reliably controlled.

In the electronic component mounting apparatus, the holding mechanism is arranged so that the adhesive body made of an elastic body covers the opening of the adhesive body chamber. Further, a piston is movably fitted in a cylinder chamber provided in the nozzle portion, and the piston is pushed in the direction in which it is projected toward the adhesive body chamber side to press the adhesive body to expand it outward. It has become so.

Therefore, when the pressure-sensitive adhesive body is pressed and adhered to the electronic component in the component supply unit, a large force for lowering the holding mechanism is exerted on the electronic component, regardless of the urging force of the urging member. It is possible to adhere to relatively large and heavy electronic components without fail.

When mounting the electronic component on the circuit board, compressed air is supplied to the cylinder chamber through the air flow path to cause the piston to project against the urging force of the urging member. Along with this, the adhesive expands to the outside of the adhesive chamber, only the part pressed by the piston adheres to the electronic parts, and the other parts are separated from the electronic parts to reduce the adhesive area. The adhesive strength with is reduced.

In the above-mentioned electronic component mounting apparatus, the holding mechanism fixes an adhesive body having a hole capable of projecting and retracting one end of the piston to the front end face of the nozzle portion, and moves it from the hole to the cylinder chamber. Put one end of the loosely fitted piston in and out. As a result, when the electronic component is mounted on the circuit board, one end of the piston is projected from the hole of the adhesive body to directly press the electronic component, and it is reliably separated from the adhesive body.

In the above electronic component mounting apparatus, the holding mechanism forms an annular groove in the front end surface of the nozzle portion, the annular groove communicating with the suction air flow path, and the suction air is supplied to the annular groove to attach the suction air to the front end surface of the nozzle portion. Adsorb and fix the adhesive. Therefore, in order to replace the adhesive, the adhesive can be easily removed from the front end face of the nozzle by stopping the suction air supplied to the annular groove, and a new adhesive can be applied to the front end of the nozzle. By supplying the suction air to the annular groove in contact with each other, the adhesive body can be replaced very easily, and the maintenance of the adhesive body can be performed in a short time.

In the above-mentioned electronic component mounting apparatus, an adhesive force measuring device is provided, and the adhesive force is measured at a predetermined timing. When the adhesive force becomes weaker than the predetermined strength, the adhesive force is measured. By issuing a warning that calls for the replacement of the body, it is possible to completely prevent the adhesive holding error of the electronic component due to the decrease of the adhesive strength. Further, by doing so, a highly reliable circuit board can be manufactured with no mounting leakage on the circuit board.

The timing of measuring the adhesive force can be set freely according to the time when the mounting on a predetermined number of circuit boards is completed, the time when a predetermined number of electronic components are mounted, or the type of adhesive body. it can.

In the above-mentioned electronic component mounting apparatus, the adhesive force measuring apparatus has a moving surface which is provided with a measuring surface at one end and is movable in a predetermined direction, and is moved by a biasing member in one direction along the displacement direction of the moving member. Energize with a predetermined force. When measuring the adhesive force, after pressing the adhesive body to the measurement surface to make it adhere, the moving member that is adhered by the adhesive force becomes the urging force of the urging member by moving the adhesive body in the direction away from the measurement surface. When it moves by a predetermined distance against this, a detection signal is transmitted from the detection device to notify that the adhesive force is sufficient.

Further, the pass / fail level of the adhesive force differs depending on the shape and weight of the electronic parts. Larger or heavier electronic parts are required to have stronger adhesive force, and smaller or lighter electronic parts are relatively weak. Adhesive strength is sufficient. To change the pass / fail level of adhesive strength, simply change the installation position of the detection device.
It can be changed easily. That is, when a strong adhesive force is required, the detection device detects so that the moving distance of the moving member until detection by the detection device becomes long, and when relatively weak adhesive force is sufficient. The position of the detection device is set so that the moving distance of the moving member up to.

[0039]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below with reference to the illustrated embodiments. FIG. 1 is a perspective view showing an entire electronic component mounting apparatus 10, in which an XY robot 11 is mounted on a mounting head unit 1.
2 is moved to the component supply unit 13, the holding mechanism 14 is lowered to press the adhesive body 15 against the electronic component 16,
Is adhered to and held by the adhesive body 15. Next, the XY robot 11 moves the holding mechanism 14 to the mounting position on the circuit board 17 on which the electronic component 16 is to be mounted, and the electronic component 16
Are brought into contact with the circuit board 17 to be mounted.

FIG. 2 is a cross-sectional view showing a main part of the holding mechanism 14 according to the first embodiment of the present invention. FIG. 2A shows a state in which the electronic component 16 is adhered to the adhesive body 15, and FIG. FIG. 6 is a cross-sectional view showing a state in which the electronic component 16 is separated from the adhesive body 15. The holding mechanism 14 includes a nozzle portion 18 and a piston 1.
9, a biasing member 20, and an adhesive body 15.

The nozzle portion 18 is provided with an air flow passage 18a and a cylinder chamber 18b which communicates with the air flow passage 18a, and further has an adhesive body chamber 18d which is opened to a front end face 18c in the displacement direction of the holding mechanism 14. .

The piston 19 holds the adhesive body 15 by the holding mechanism 1
For moving along the displacement direction of 4,
It is loosely fitted in the cylinder chamber 18b so as to be movable. One end
9a projects into the adhesive body chamber 18d, and the adhesive body 15 is fixed to the tip.

The urging member 20 is for urging the piston 19 in the direction in which it is projected into the adhesive chamber 18d, is disposed between the upper end 18e of the cylinder chamber 18b and the piston 19, and is always The piston 19 is urged downward in FIG.

The adhesive body 15 is for sticking and holding the electronic component 16, and is, for example, a rubber sheet coated with an adhesive such as double-sided tape, and is slightly smaller than the inner diameter of the adhesive body chamber 18d. It has a small size, is fixed to one end 19a of the piston 19, and is projected and retracted in the adhesive body chamber 18d as the piston 19 moves. As the adhesive body 15, for example, a gel pack (trade name) of Intel Corporation can be used.

The operation of this embodiment will be described. In FIG. 1, the XY robot 11 moves the mounting head unit 12 to the component supply unit 13, and lowers the holding mechanism 14 to move the adhesive body 1.
5 is pressed against the electronic component 16 to attach the electronic component 16 to the adhesive body 15
Stick to and hold. Then, the XY robot 11 holds the holding mechanism 14 on the circuit board 1 on which the electronic component 16 is to be mounted.
7 to the mounting position to mount the electronic component 16 on the circuit board 1
It is mounted by abutting on 7.

The holding mechanism 14 according to the first embodiment of the present invention.
2A, the urging force of the urging member 20 acts on the adhesive body 15 via the piston 19 to cause the adhesive body 15 to protrude from the adhesive body chamber 18d. In this state, in the component supply unit 13, the holding mechanism 14 is lowered to move the adhesive 1
When 5 is pressed against the electronic component 16, the electronic component 16 is adhesively held by the adhesive body 15 by the adhesive force. Here, the force for pressing the adhesive body 15 against the electronic component 16 is the magnitude of the urging force of the urging member 20, and since it is always pressed with a constant force, the electronic component 16 can be stably adhered. .

When mounting the electronic component 16 on the circuit board 17, the holding mechanism 14 for adhesively holding the electronic component 16 is lowered in FIG.
When the suction air is supplied to the cylinder chamber 18b through the air flow path 18a after being brought into contact with the piston 7, the piston 19 moves upward in the drawing while compressing the biasing member 20. Along with this, the adhesive body 15 also rises and is drawn into the adhesive body chamber 18d, so that the electronic component 16 is separated from the adhesive body 15 and is reliably mounted on the circuit board 17.

FIG. 3 is a sectional view showing an essential part of the holding mechanism 21 according to the second embodiment of the present invention, in which (a) shows a state in which the electronic component 16 is adhered to the adhesive 22 and (b). FIG. 6 is a cross-sectional view showing a state where the electronic component 16 is separated from the adhesive body 22. The holding mechanism 21 includes a nozzle portion 23 and a piston 2
4, the biasing member 25, and the adhesive body 22.

Like the nozzle portion 18 in the first embodiment of the present invention, the nozzle portion 23 is provided with an air passage 23a and a cylinder chamber 23b communicating with the air passage 23a, and further communicates with the cylinder chamber 23b. The adhesive chamber 23d is formed so as to open at the front end face 23c in the displacement direction of the holding mechanism 21. At the front end of the adhesive body chamber 23d, the cross-sectional shape is the adhesive body chamber 2
An elastic body 26 such as rubber formed in the same shape as 3d is fixed.

The piston 24 is for pressing the adhesive 22 to inflate it outward (downward in FIG. 3) in the adhesive chamber 23d, and is movably fitted in the cylinder chamber 23b. The one end 24a projects into the adhesive body chamber 23d and is fixed to the upper surface 22a of the adhesive body 22. The length of the piston 24 is set to be the same as the distance from the upper end portion 23e of the cylinder chamber 23b to the upper surface 22a of the adhesive body 22 in the flat plate state.

The urging member 25 is for urging the piston 24 in the direction of pulling it from the adhesive body chamber 23d, and is arranged between the lower end 23f of the cylinder chamber 23b and the piston 24. Is urged upward in FIG.

The adhesive 22 is for holding the electronic component 16 by adhering it, and is made of an elastic body such as a rubber sheet coated with an adhesive such as an adhesive. It is fixed to the outer peripheral portion of the elastic body 26 so as to cover the opening of 23d. The piston 24 is the upper surface 2 of the adhesive body 22.
When 2a is pressed from above, the adhesive body 22 moves into the adhesive body chamber 23.
d It is configured to bulge outward (downward in FIG. 3).

The holding mechanism 21 according to the second embodiment of the present invention.
In the component supply unit 13 attaches the electronic component 16 to the adhesive body 2
3A, the urging force of the urging member 25 is applied to the piston 24 in FIG.
4 is located at the upper end in the figure. At this time, the nozzle portion 23,
The piston 24 and the adhesive body 22 are in contact with each other.
Therefore, the forces from above in the figure act substantially as a unit. In addition, the adhesive body 22 has an adhesive body chamber 23d.
Covers the opening of the plate.

When the holding mechanism 21 is lowered and the adhesive 22 is pressed against the electronic component 16, the electronic component 16 is adhesively held by the adhesive 22. The force for pressing the adhesive body 22 against the electronic component 16 is determined by the force for lowering the holding mechanism 21 regardless of the urging force of the urging member 25. Therefore, the holding mechanism 2 can be adjusted according to the size and weight of the electronic component 16.
It is possible to adjust the force for lowering 1 so that an optimum amount of force can be applied to the adhesive holding of the electronic component 16.

When mounting the electronic component 16 on the circuit board 17, the holding mechanism 21 for adhesively holding the electronic component 16 is lowered in FIG.
7, the holding mechanism 21 is slowly raised while supplying compressed air to the cylinder chamber 23b through the air flow path 23a.

The piston 24 moves downward in the drawing while being pressed by the compressed air to compress the urging member 25 and moves to the adhesive body 2.
2 is continuously pressed against the electronic component 16. On the other hand, since the nozzle portion 23 rises, the adhesive body 22 fixed to the outer peripheral portion of the elastic body 26 also tries to rise, and the outer periphery of the adhesive body 22 begins to be separated from the electronic component 16. The separation gradually progresses toward the center, and the adhesive 22 expands outward from the adhesive chamber 23d, and the contact area between the adhesive 22 and the electronic component 16 decreases. Eventually the piston 24
Only the portion pressed by is stuck to the electronic component 16.

When the contact area between the adhesive 22 and the electronic component 16 is significantly smaller than the contact area between the circuit board 17 and the electronic component 16, the adhesive force applied to the circuit board 17 is greater than the adhesive force of the adhesive 22. The adhesive force between the circuit board 17 and the electronic component 16 due to the cream solder increases. Further holding mechanism 2
When 1 is raised, the electronic component 16 remains on the circuit board 17 due to the difference in adhesive force and is mounted.

In order to increase the difference in adhesive force and ensure the attachment to the circuit board 17, the piston 24
It is effective to reduce the pressing area of the piston 24, and it is desirable to minimize the area of the one end 24a of the piston 24 within a range that does not damage the adhesive body 22.

The adhesive body 22 is made of an elastic body 26 such as rubber.
Since it is fixed to the adhesive body chamber 23d through the electronic component 16, the electronic component 16 having a different shape such as the adhesive surface of the electronic component 16 being slightly inclined
Even in the case of 6, the elastic body 26, and further the adhesive body 22 made of an elastic material is deformed and responds, and the electronic component 16 can be securely adhered and held.

FIG. 4 is a sectional view showing a main part of a holding mechanism 31 according to the third embodiment of the present invention. FIG. 4A shows a state in which the electronic component 16 is adhered to the adhesive body 32, and FIG. FIG. 6 is a cross-sectional view showing a state in which the electronic component 16 is separated from the adhesive body 32.

The holding mechanism 31 includes a nozzle portion 33, a piston 34, a biasing member 35, and an adhesive body 32. The nozzle part 33 includes an air flow path 33a and the air flow path 33a.
A cylinder chamber 33b communicating with a is provided, and a tip portion 33c provided continuously to the cylinder chamber 33b has a large diameter, and a through hole 33d for allowing the piston 34 to project and retract is opened.

The piston 34 is for pressing the electronic component 16 by projecting and retracting the tip end portion 34a from the nozzle portion 33, and is loosely fitted in the cylinder chamber 33b so that when the piston 34 is most retracted, The length is set so that the tip portion 34a is substantially flush with the adhesive body 32.

The urging member 35 is for urging the piston 34 in the direction in which it is pulled in, and is a cylinder chamber 33b.
It is arranged between the lower end portion 33e and the piston 34, and always urges the piston 34 upward in FIG.

The adhesive body 32 is for holding the electronic component 16 by adhering it, and is made of a substance having an adhesive force on both sides, such as a double-sided tape, and is provided on the lower surface of the tip portion 33c of the nozzle portion 33. It is strongly adhesively fixed. A hole 32a is provided at the center of the adhesive body 32, and the tip portion 34a of the piston 34 can be projected and retracted through the hole 32a.

A holding mechanism 31 which is a third embodiment of the present invention.
In the component supply unit 13 attaches the electronic component 16 to the adhesive body 3
4 (a), the urging force of the urging member 35 is applied to the piston 34 to cause the piston 3 to move.
4 is located at the upper end in the figure. At this time, since the tip end portion 34a of the piston 34 is at least flush with the adhesive body 32 or retracted from the adhesive body 32, the tip end portion 34a does not become an obstacle when the holding mechanism 31 is lowered,
The adhesive body 32 can be pressed by the electronic component 16 to hold the electronic component 16 in an adhesive manner.

The force for pressing the adhesive member 32 against the electronic component 16 is independent of the urging force of the urging member 35, and the holding mechanism 31.
Is determined by the force that lowers. Therefore, the force for lowering the holding mechanism 31 can be adjusted according to the size, weight, and the like of the electronic component 16, and an optimal amount of force for holding the electronic component 16 with adhesive can be applied to the electronic component 16.

When mounting the electronic component 16 on the circuit board 17, the holding mechanism 31 for adhesively holding the electronic component 16 is lowered in FIG.
7, the compressed air is supplied to the cylinder chamber 33b through the air passage 33a to move the piston 34 downward in the figure. The tip portion 34a of the piston 34 has an adhesive body 3
The electronic component 16 is pressed by protruding from the second hole 32a. By elevating the holding mechanism 31, the electronic component 16 is surely mounted separately from the adhesive body 32.

FIG. 5 is a sectional view showing a main part of a holding mechanism 41 according to the fourth embodiment of the present invention. The holding mechanism 41 is
The nozzle portion 43, the piston 34, the biasing member 35, and the adhesive body 42 are provided.

The nozzle portion 43 is provided with an air passage 43a and a cylinder chamber 43b communicating with the air passage 43a, just like the nozzle portion 33 of the third embodiment of the present invention, and is continuous with the cylinder chamber 43b. The tip portion 43c provided as a large diameter has a large diameter, and a through hole 43d for allowing the piston 34 to project and retract.
Is open. Furthermore, on the front end face of the tip portion 43c,
An annular groove 43f is provided, and a suction air passage 43g communicating with the annular groove 43f is provided in parallel with the air passage 43a.

The adhesive body 42 is for sticking and holding the electronic component 16, and is one in which an adhesive such as an adhesive is applied to one surface such as a rubber sheet, and the non-adhesive surface is the tip. The suction air flow path 43 is brought into contact with the front end surface of the portion 43c.
Suction air is supplied from g to hold the adhesive body 42 by suction. Further, in the center of the adhesive body 42, similarly to the adhesive body 32 of the third embodiment of the present invention, a hole 42a for allowing the tip portion 34a of the piston 34 to project and retract is provided. Regarding the other parts, the holding mechanism 31 of the third embodiment of the present invention
The same parts are designated by the same reference numerals and the description thereof will be omitted.

A holding mechanism 41 according to a fourth embodiment of the present invention.
In FIG. 5, the adhesive body 42 is the suction air flow path 43g.
Is sucked and held by supplying suction air to the annular groove 43f. Adhesive holding of the electronic component 16 on the adhesive body 42 and mounting on the circuit board 17 are performed in exactly the same manner as the holding mechanism 31 according to the third embodiment of the present invention. Adhesive body 4
When the adhesive strength of No. 2 becomes weaker, the adhesive body 42 needs to be replaced. However, when the adhesive body 42 is replaced, the suction of the adhesive body 42 is released when the suction air supplied to the annular groove 43f is stopped. Then, the adhesive body 42 separates from the nozzle portion 43.
After the new adhesive body 42 is brought into contact with the nozzle portion 43, when suction air is supplied again from the suction air flow passage 43g to the annular groove 43f, the new adhesive body 42 is adsorbed and held by the nozzle portion 43, and the adhesive body 42 is very easily formed. Can be replaced.

FIG. 6 is a sectional view showing an essential part of an adhesive force measuring device 51 according to a fifth embodiment of the present invention, showing an example of combination with the holding mechanism 14 of the first embodiment of the present invention. (A)
3B is a cross-sectional view showing a state in which the adhesive body 15 is pressed and adhered to the adhesive force measuring device 51 in order to measure the adhesive force of the adhesive body 15, and FIG. FIG. The adhesive force measuring device 51 includes a moving member 52,
A biasing member 53 and a detection device 54 are provided.

The moving member 52 adheres the adhesive body 15,
A large diameter portion 52 provided at one end for moving the adhesive body 15 together to measure the adhesive force of the adhesive body 15.
It is a rod-shaped member in which a small diameter portion 52b is formed continuously with a, and a flat measurement surface 52c is provided at the other end of the small diameter portion 52b. A flat plate-shaped detection flag 52d is formed to project laterally from the large diameter portion 52a. The guide member 55 is provided with a cylinder chamber 55a, and the large diameter portion 52a of the moving member 52 is loosely fitted in the cylinder chamber 55a so as to be vertically movable in FIG.

The urging member 53 is for urging the moving member 52 in one direction along the displacement direction, and includes the small diameter portion 5
2b is a coil spring, which is loosely fitted and arranged between the large diameter portion 52a and the upper end of the cylinder chamber 55a, and urges the moving member 52 downward in FIG. 6 with a predetermined force. . When the moving member 52 moves in a direction of compressing the biasing member 53, a force proportional to the moving distance is applied to the moving member 52.

The detecting device 54 is for detecting that the moving member 52 has moved by a predetermined distance. For example, the light emitting element and the light receiving element are arranged to face each other, and the light generated from the light emitting element is detected. It is configured as an optical sensor that emits a detection signal when received by the light receiving element. Detector 5
4 is disposed on the side of the guide member 55, and when the moving member 52 moves and the detection flag 52d enters between the light emitting element and the light receiving element to block the light from the light emitting element, this is detected. Is configured to.

To measure the adhesive force of the adhesive body 15 using the adhesive force measuring device 51 of the fifth embodiment of the present invention,
In FIG. 6A, the XY robot 11 moves the holding mechanism 14 above the adhesive force measuring device 51 at a predetermined timing, and then lowers the holding mechanism 14 to move the adhesive body 15 to the measurement surface 52c in a predetermined manner. Press with force to stick.

Next, referring to FIG. 6B, the holding mechanism 1
4, that is, when the adhesive body 15 is moved upward in the figure, the moving member 52 adhered to the adhesive body 15 on the measurement surface 52c also moves upward against the urging force of the urging member 53.

Along with the movement of the moving member 52, the biasing member 53 exerts a downward force in the drawing, which is proportional to the moving distance, on the moving member 52 and tries to separate the measuring surface 52c from the adhesive body 15. . When the adhesive force of the adhesive body 15 is stronger than a predetermined strength, the adhesive body 15 does not separate from the measurement surface 52c, the moving member 52 moves upward, and the detection flag 52d eventually reaches the position of the detection device 54. The light that reaches the light receiving element and enters between the light emitting element and the light receiving element and is emitted from the light emitting element toward the light receiving element is blocked.

When the adhesive force of the adhesive body 15 is weaker than a predetermined strength, the measuring surface 52c is separated from the adhesive body 15 and the biasing member 53 is removed before the detection flag 52d reaches the position of the detection device 54. It returns to the original position by the action.

Therefore, by setting the urging force of the urging member 53 when the detection flag 52d reaches the position of the detecting device 54 to a predetermined strength, the adhesive force of the adhesive body 15 has a predetermined strength. It is possible to know whether or not there is not a predetermined strength, and it is possible to issue a warning that calls for the necessity of replacement or maintenance of the adhesive body 15.

The strength of the adhesive force required for the adhesive body 15 is
It depends on the size and weight of the electronic component 16 to be adhesively held, and it is necessary to set the optimum strength according to the electronic component 16 to be handled. The strength of the adhesive force of the adhesive force measuring device 51 can be easily set by simply adjusting the position of the detecting device 54. That is, when the detection device 54 is moved upward in the figure, the strength of the adhesive force can be set strong, and when the detection device 54 is moved downward in the figure, the strength of the adhesive force is set weak. You can

The procedure for measuring the adhesive strength will be described with reference to the flowchart of FIG. First, the mounting head unit 12 is moved to the component supply unit 13, the electronic component 16 is adhered to and held by the adhesive body 15, and then moved to the mounting position on the circuit board 17, so that the electronic component 16 contacts the circuit board 17. It is mounted in contact (S1). It is determined whether or not mounting on the circuit board 17 is completed (S2), and if NO, the above-described mounting operation is repeatedly executed.

When the mounting on the circuit board 17 is completed, the holding mechanism 14 is moved above the adhesive force measuring device 51 to measure the adhesive force (S3). When the adhesive strength is stronger than the predetermined strength, the mounting operation is repeatedly executed again without replacing the adhesive body 15 (S1, S2). If the adhesive strength is weaker than the predetermined strength, a warning that the adhesive strength has decreased is issued (S4), and the operation of the electronic component mounting apparatus 10 is stopped (S5). In this case, the adhesive body 15 is replaced and then the electronic component mounting apparatus 10 is restarted.

The timing of measuring the adhesive force may be carried out when the mounting of a predetermined number of circuit boards 17 is completed, or may be carried out when the predetermined number of electronic components 16 are mounted. Can be configured to do so.

In the present invention, it has been explained that the adhesive body is exchangeably arranged and is replaced when the adhesive strength is lowered. However, the present invention is not limited to this, and the adhesive may be attached at a predetermined timing. It may be applied. Further, the adhesive force measuring device has been described as one that measures the adhesive force by the urging force of the urging member, but is not limited to this, for example, by adhering an adhesive body such as a pressure sensor or a load cell. It is also possible to electrically amplify and detect the mechanical micro strain when pulled up.

[0086]

As described above, according to the invention of claim 1,
Since the electronic component is adhesively held by the adhesive body by pressing the adhesive body against the electronic component, the conventional suction nozzle such as the electronic component having unevenness on the upper surface or the electronic component having a hole in the center is used. Even an electronic component having a shape that cannot be suction-held can be held regardless of the shape of the electronic component. Further, even if the type of electronic components supplied is changed, it is possible to continue the mounting work using the same adhesive body without exchanging the holding mechanism, improving the operation efficiency of the electronic component mounting apparatus. Productivity can be improved.

According to the second aspect of the invention, the holding mechanism is provided with a peeling mechanism for reducing the adhesive force between the adhesive body and the electronic component to separate the electronic component from the adhesive body.
Therefore, when the electronic component is mounted at a predetermined position on the circuit board, the peeling mechanism is operated to exert the adhesive force between the adhesive body and the electronic component between the electronic component and the circuit board by the cream solder applied on the circuit board. The electronic component can be forcibly detached from the adhesive by making the adhesive force smaller than the adhesive force, and the electronic component can be reliably mounted at the mounting position on the circuit board.

Further, according to the invention of claim 3, since the adhesive body is detachably attached to the holding mechanism, the adhesive body can be easily replaced if necessary, and the adhesive body can be adhered after a long time of use. When the adhesive strength of the body decreases, without changing the adhesive body in a short time and reducing the work efficiency of mounting work,
High efficiency can be maintained.

Further, according to the invention of claim 4, in the holding mechanism, the piston is movably loosely fitted in the cylinder chamber provided in the nozzle portion, and the piston is projected in the adhesive chamber by the biasing member. It is configured such that it is biased and an adhesive body is fixed to one end of the piston so that it can be retracted from the adhesive body chamber.

In the component supply section, when the adhesive body is pressed and adhered to the electronic component, the adhesive body is pushed by the urging force of the urging member so as to be pushed out from the adhesive body chamber so as to surely press the electronic component. Make it sticky. When mounting the electronic component on the circuit board, suction air is supplied to the cylinder chamber through the air flow path, and the piston is pulled toward the air flow path side against the biasing force of the biasing member. As a result, the adhesive body fixed to the piston is drawn into the adhesive body chamber to separate the electronic component from the adhesive body. Therefore, the suction air supplied to the cylinder chamber is
Adhesion or separation of electronic components can be controlled easily and reliably by simply supplying or stopping.

According to the fifth aspect of the invention, the holding mechanism is arranged so that the adhesive body made of an elastic body covers the opening of the adhesive body chamber. Further, a piston is movably fitted in a cylinder chamber provided in the nozzle portion, and the piston is actuated in a direction so as to project toward the adhesive body chamber side, thereby pressing the adhesive body to the outside of the adhesive body chamber. It is designed to inflate.

Therefore, when the pressure-sensitive adhesive body is pressed and adhered to the electronic component in the component supply unit, a large force for lowering the holding mechanism is applied to the electronic component to exert a strong force regardless of the urging force of the urging member. It is possible to adhere to relatively large and heavy electronic components without fail.

Further, when mounting the electronic component on the circuit board, compressed air is supplied to the cylinder chamber through the air flow path so that the piston is projected against the urging force of the urging member.
Along with this, the adhesive expands to the outside of the adhesive room, and only the part pressed by the piston adheres to the electronic parts, and the other parts peel off from the electronic parts, reducing the adhesive area, It is possible to mount the electronic component on the circuit board by reducing the adhesive force with the.

Further, according to the invention of claim 6, an adhesive body provided with a hole capable of projecting and retracting one end of the piston is fixed to the front end face of the nozzle portion, and is moved from the hole to the cylinder chamber so as to be movable. Put one end of the piston that fits in and out. Thus, when the electronic component is mounted on the circuit board, one end of the piston is projected from the hole of the adhesive body to directly press the electronic component, and the electronic component can be reliably separated from the adhesive body and mounted on the circuit board. .

According to the invention of claim 7, an annular groove communicating with the suction air flow path is formed on the front end surface of the nozzle portion, and suction air is supplied to the annular groove to adhere to the front end surface of the nozzle portion. Fix the body by adsorption. Therefore, to replace the adhesive body,
The suction air supplied to the annular groove is stopped to release the sticking and fixing of the adhesive body, and the adhesive body is removed from the front end surface. Next, a new adhesive body can be brought into contact with the front end face of the nozzle section and the suction air can be supplied to adsorb and fix the adhesive body. It can be carried out.

Further, according to the invention of claim 8, the adhesive strength measuring device is provided, and the strength of the adhesive strength is measured at a predetermined timing, and the strength of the adhesive strength becomes weaker than the predetermined strength. At this time, by issuing a warning that calls for replacement of the adhesive body,
Completely prevent adhesive retention mistakes of electronic parts due to reduced adhesive strength. Further, this makes it possible to manufacture a highly reliable circuit board with no mounting leakage on the circuit board.
In addition, the timing of measuring the adhesive force can be freely set according to the time when the mounting on the predetermined number of circuit boards is completed, the time when the predetermined number of electronic components are mounted, or the type of the adhesive.

Further, according to the invention of claim 9, in the adhesive force measuring device, a moving member having a measurement surface at one end and movable in a predetermined direction is moved in one direction along the displacement direction by the urging member. Energize with a predetermined force. When measuring the adhesive force, the adhesive is pressed against the measurement surface to make it adhere, and then the adhesive is moved in a direction away from the measurement surface, and the moving member adhered by the adhesive force resists the urging force of the urging member. When moving by a predetermined distance, a detection signal is transmitted from the detection device to notify that the adhesive strength is sufficient, and highly reliable measurement can be performed with an extremely simple mechanism.

The acceptance / rejection level of the adhesive force varies depending on the shape and weight of the electronic component. Larger or heavier electronic components are required to have stronger adhesive force, and smaller or lighter electronic components are relatively weak. Adhesive strength is sufficient. The acceptance level of the adhesive force can be easily changed by changing the installation position of the detection device. That is, when a strong adhesive force is required, the detecting device is adjusted so that the moving distance of the moving member becomes long, and when relatively weak adhesive force is sufficient, the moving distance of the moving member becomes short. By setting, it can be set easily in a short time.

[Brief description of drawings]

1 to 7 relate to an embodiment of the present invention, and FIG. 1 is a perspective view showing an entire electronic component mounting apparatus.

FIG. 2 is a sectional view of a holding mechanism of the first embodiment.

FIG. 3 is a sectional view of a holding mechanism according to a second embodiment.

FIG. 4 is a sectional view of a holding mechanism according to a third embodiment.

FIG. 5 is a sectional view of a holding mechanism according to a fourth embodiment.

FIG. 6 is a cross-sectional view of an adhesive force measuring device.

FIG. 7 is a flowchart showing a control procedure of the electronic component mounting apparatus.

8 to 10 relate to a conventional example, and FIG. 8 is a perspective view showing an entire electronic component mounting apparatus.

FIG. 9 is a sectional view of a suction nozzle.

FIG. 10 is a perspective view of an electronic component.

[Explanation of symbols]

10 Electronic component mounting equipment 12 Mounting head 13 Parts supply department 14 Holding mechanism 15 Adhesive 16 electronic components 17 circuit board 18 nozzle 18a Air flow path 18b Cylinder chamber 18d Adhesive chamber 19 pistons 19a One end of piston 20 biasing member 21 Holding mechanism 22 Adhesive 23 Nozzle part 23a Air flow path 23b Cylinder chamber 23d Adhesive chamber 24 pistons 24a One end of piston 25 Biasing member 31 holding mechanism 32 Adhesive 32a hole 33 Nozzle part 33a Air flow path 33b Cylinder chamber 34 Piston 34a One end of piston 35 biasing member 41 holding mechanism 42 Adhesive 42a hole 43 Nozzle part 43a Air flow path 43b Cylinder chamber 43f annular groove 43g suction air flow path 51 Adhesive force measuring device 52 Moving member 52c Measuring surface 53 biasing member 54 detector

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Satoshi Uchiyama             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Kazuo Kido             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 3C007 AS08 DS01 FS00 FT10 FU00                       GU06 NS17                 5E313 AA01 AA11 CC02 CC05 CC07                       EE02 EE03 EE24 FG05

Claims (9)

[Claims] 1. A mounting head part that is movable along a predetermined direction, and a holding mechanism that is provided so as to be movable relative to the mounting head part and that is supplied with an electronic component from a component supply part and holds the electronic component. In the electronic component mounting apparatus, wherein the electronic component held by the holding mechanism is mounted at a predetermined position on a circuit board, the holding mechanism presses the electronic component in the component supply unit to adhere the electronic component. An electronic component mounting apparatus comprising a pressure sensitive adhesive body arranged by force. 2. The holding mechanism is applied on the circuit board while reducing the adhesive force between the adhesive body and the electronic component when the electronic component is mounted at a predetermined position on the circuit board. 2. A peeling mechanism for removing the electronic component from the adhesive body by making the adhesive force of the cream solder smaller than the adhesive force between the electronic component and the circuit board.
Electronic component mounting apparatus described. 3. The electronic component mounting apparatus according to claim 1, wherein the adhesive body is detachably attached to the holding mechanism and is replaceable. 4. The nozzle mechanism, wherein the holding mechanism includes an air flow passage, a cylinder chamber communicating with the air flow passage, and an adhesive body chamber having one end opening at a front end face in the displacement direction of the holding mechanism.
A piston whose one end projects into the adhesive chamber and is loosely fitted in the cylinder chamber so as to be movable in the displacement direction of the holding mechanism; and a piston which is disposed in the cylinder chamber and projects the piston into the adhesive chamber. The electronic component mounting apparatus according to claim 2 or 3, further comprising: a biasing member that biases the pressure-sensitive adhesive, and the pressure-sensitive adhesive body fixed to the one end of the piston so as to be retractable from the pressure-sensitive adhesive body chamber. 5. The holding mechanism includes a nozzle portion in which an air flow path, a cylinder chamber communicating with the air flow path, and an adhesive body chamber having one end opened to a front end face in the displacement direction of the holding mechanism are formed.
A piston whose one end projects into the adhesive chamber and is loosely fitted into the cylinder chamber so as to be movable in the displacement direction of the holding mechanism; and a piston which is disposed in the cylinder chamber and which pulls the piston from the adhesive chamber. The urging member for urging, and the pressure-sensitive adhesive body made of an elastic body arranged in the pressure-sensitive adhesive body chamber so as to cover the opening of the pressure-sensitive adhesive body chamber. Electronic component mounting equipment. 6. The holding mechanism includes a nozzle portion in which an air passage and a cylinder chamber communicating with the air passage are formed, and one end of the holding portion protrudes toward a front end face of the nozzle portion in the displacement direction of the holding mechanism. A piston that is loosely fitted in the holding mechanism so as to be movable in the displacement direction of the holding mechanism; a biasing member that is disposed in the cylinder chamber and that biases the piston in the direction in which the piston is retracted; The electronic component mounting apparatus according to claim 2 or 3, further comprising: a pressure-sensitive adhesive body that is provided with a hole that is provided and that is fixed to the front end surface of the nozzle portion. 7. The nozzle in which the holding mechanism is provided with an air flow path, a cylinder chamber communicating with the air flow path, and a suction air flow path communicating with an annular groove formed in a front end face in the displacement direction of the holding mechanism. A piston, one end of which protrudes from the front end surface of the nozzle portion and which is loosely fitted in the cylinder chamber and movable in the displacement direction of the holding mechanism; An urging member for urging and a hole for allowing the one end of the piston to be projected and retracted are provided, and the front end face of the nozzle portion is adsorbed by suction from the suction air flow path. The electronic component mounting apparatus according to claim 2 or 3, characterized in that: 8. The pressure-sensitive adhesive body is pressed against a measurement surface to be adhered to the measurement surface, and then the pressure-sensitive adhesive body is moved in a direction away from the measurement surface to increase the strength of the pressure-sensitive adhesive force of the pressure-sensitive adhesive body. Adhesive force measuring device to measure, while measuring the strength of the adhesive force by pressing the adhesive body to the adhesive force measuring device at a predetermined timing, the strength of the adhesive force is weaker than a predetermined strength The electronic component mounting apparatus according to any one of claims 1 to 7, further comprising a control device that issues a warning that calls for replacement of the adhesive body. 9. The adhesive force measuring device comprises a moving member that is movable in a predetermined direction and has the measurement surface at one end along the predetermined direction; and the moving member is always fixed in one direction along the displacement direction. An urging member that urges by a force of, and a detection device that detects the movement when the moving member moves a predetermined distance against the urging force of the urging member and transmits a detection signal, After the pressure-sensitive adhesive body is pressed against the measurement surface to make it adhere, by moving the pressure-sensitive adhesive body in a direction away from the measurement surface, the moving member adhered by the pressure-sensitive adhesive force causes the urging force of the urging member. 9. The electronic component mounting apparatus according to claim 8, wherein the detection signal is transmitted from the detection device when the electronic device has moved a predetermined distance against the above.