WO2014132292A1 - Suction nozzle and surface mounting device - Google Patents
Suction nozzle and surface mounting device Download PDFInfo
- Publication number
- WO2014132292A1 WO2014132292A1 PCT/JP2013/001248 JP2013001248W WO2014132292A1 WO 2014132292 A1 WO2014132292 A1 WO 2014132292A1 JP 2013001248 W JP2013001248 W JP 2013001248W WO 2014132292 A1 WO2014132292 A1 WO 2014132292A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chamber
- cylinder
- suction
- nozzle
- nozzle body
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
Definitions
- the present invention relates to a suction nozzle and a surface mounting machine, and more particularly to a suction nozzle and a surface mounting machine suitable for sucking small electronic components.
- the surface mounter stops the printed circuit board at a board stop position set on the board transport line, and mounts an electronic component on the printed board stopped at the board stop position.
- the surface mounter includes a head unit.
- the head unit includes, for example, a plurality of suction nozzles. Each suction nozzle is moved by the head unit between a component supply position to which electronic components are supplied and the substrate stop position. At the component supply position, each suction nozzle picks up an electronic component (suction operation), and at the substrate stop position, each suction nozzle mounts the picked-up electronic component on the printed board (mounting operation).
- the suction nozzle disclosed in the publication includes a nozzle body having a component suction surface, an air passage opening in the component suction surface, and a nozzle holder that holds the nozzle body so as to be movable up and down.
- the air passage is set to a negative pressure.
- the electronic component is sucked by the negative pressure of the air passage and is sucked by the component suction surface.
- pressurized air is supplied to the air passage.
- the electronic component adsorbed on the component adsorption surface is pressed onto the printed circuit board by pressurized air. After this pressing operation, the suction nozzle moves away from the mounted electronic component (separation operation).
- the mounting process of electronic components on a printed circuit board has been diversified, and for example, there is an application example in which mounting is performed on a relatively low adhesive surface such as a flux application surface or a surface having no adhesiveness (ordinary solder paste) Is highly sticky).
- a relatively low adhesive surface such as a flux application surface or a surface having no adhesiveness (ordinary solder paste) Is highly sticky.
- the separation operation may be performed while the electronic component pressed against the printed circuit board is attached to the component suction surface of the suction nozzle (so-called “take-away operation”).
- This “take-away operation” is caused by the negative pressure between the suction surface and the electronic component for a moment or when the nozzle is quickly raised, or the component is shifted due to a sudden inflow of air to the boundary surface. It is thought that there is a possibility. Further, even if the take-out operation is not reached, there is a possibility that the electronic component once mounted may be displaced or fall off due to the above-described electrostatic or vacuum attracting force. In addition, the above-mentioned problem becomes more prominent as the nozzle separating operation is quickened.
- the present invention has been made in view of the above-described problems, and an object of the present invention is to provide a suction nozzle and a surface mount capable of reliably performing an operation of separating an electronic component.
- the present invention provides an adsorption operation for sucking and picking up an electronic component at a negative pressure, a mounting operation for mounting the electronic component picked up by supplying pressurized air on the printed circuit board,
- a suction nozzle that performs a separation operation for separating from an electronic component mounted on the printed circuit board after a mounting operation, a nozzle body provided with a component suction surface that sucks the electronic component, and an air passage that opens to the component suction surface; Provided in the nozzle body and retracted into the nozzle body when the air passage is under negative pressure during the suction operation, while the nozzle body is separated from the mounted electronic component during the separation operation
- the suction nozzle is provided with a pressing member protruding from the component suction surface.
- the electronic component in the suction operation, the electronic component can be picked up and picked up on the component suction surface as in the case of the conventional suction nozzle, and in the mounting operation, the sucked electronic component is mounted on the printed circuit board. Can do.
- the suction nozzle performs a separation operation after the mounting operation, the pressing element protrudes from the component suction surface of the nozzle body.
- the electronic component mounted on the printed circuit board is pressed to the printed circuit board side by the pressing element.
- the nozzle body With this pressing operation, the nozzle body can be separated from the electronic component. Therefore, the mounted electronic component does not move with the operation of the nozzle body.
- the suction nozzle is slidably disposed in the air passage of the nozzle body, and the air passage is viewed in the supply direction of the pressurized air, and the first chamber on the upstream side and the second chamber on the downstream side.
- the cylinder further includes a chamber partitioned into a chamber, and the pressing element is integrally formed at an end portion of the cylinder, and the cylinder is formed with a communication path that communicates the first chamber with the second chamber.
- the communication passage is configured such that when the air passage is set to a negative pressure during the adsorption operation, the presser is retracted into the nozzle body, while the nozzle body is mounted after the separation operation.
- restriction that generates a differential pressure between the first chamber and the second chamber so that the pressing element protrudes from the component suction surface when the electronic component is separated from the electronic component.
- the cylinder moves in a direction in which the presser retracts into the nozzle body due to the differential pressure between the first chamber and the second chamber.
- pressurized air is supplied to the air passage during the mounting operation, the presser is pressurized in a direction protruding from the component suction surface of the nozzle body due to the differential pressure between the first chamber and the second chamber.
- the communication path forms a bypass communicating the second chamber and the atmosphere on the second chamber side with respect to the restriction, and the nozzle body is at least connected to the first chamber.
- the nozzle body When pressurized air is supplied, it has a bypass passage communicating with the bypass.
- the differential pressure between the first chamber and the second chamber can be generated using atmospheric pressure. Therefore, the control of the differential pressure is facilitated and the operation reliability of the suction nozzle is increased.
- the air in the second chamber is released from the bypass through the bypass passage to the atmosphere even when the cylinder is lowered. Increases the internal pressure. Therefore, since the so-called air damper effect due to the air in the second chamber can be suppressed, it is possible to prevent the force that pushes down the cylinder from being hindered by the internal pressure of the second chamber.
- the suction nozzle further includes a side cylinder integrally connected to the cylinder, wherein the nozzle body forms a side communication path that communicates the first chamber with the atmosphere. Is slidably mounted in the side communication path and divides the side communication path into the first chamber side and the atmosphere side.
- a differential pressure is generated between the first chamber and the second chamber, and the chamber side of the side communication passage also has a negative pressure. Therefore, buoyancy is generated in the side cylinder.
- the side cylinder is integrally connected with the cylinder which has a presser integrally.
- the pressing element receives a force in the direction of retreating into the nozzle body more reliably.
- pressurized air is supplied to the air passage, differential pressure is generated between the first chamber and the second chamber, and pressurized air is also supplied to the chamber side of the side communication passage. Therefore, the side cylinder is pressed together with the cylinder in a direction in which the presser protrudes from the component suction surface of the nozzle body. Therefore, the pressing element can receive the force in a direction in which the pressing element protrudes more reliably from the nozzle body.
- the suction nozzle further includes a pin for connecting the cylinder and the side cylinder, and the nozzle body has a recess for defining a stroke of the pin outside the air passage.
- the cylinder and the side cylinder can be connected by the pin, and the required operation can be realized.
- the stroke of the pin is formed in the nozzle body outside the air passage, even if foreign matter is mixed in the air passage, the foreign matter does not adhere to the pin. For this reason, the stability and reliability of the operation of the cylinder or the side cylinder can be improved, and the frequency of maintenance work such as cleaning the air passage can be reduced.
- Another aspect of the present invention is a surface mounter for mounting an electronic component on a printed board, wherein the suction nozzle is provided.
- the nozzle body can be separated from the electronic component with the pressing operation of the pressing element.
- the electronic component separating operation can be reliably performed.
- FIG. 1 is a schematic plan view showing a schematic configuration of a surface mounter according to a first embodiment of the present invention. It is an external view of the suction nozzle employ
- FIG. 3 is a schematic exploded sectional view of the suction nozzle of FIG. 2. FIG. 3 is a schematic exploded sectional view of the suction nozzle of FIG. 2.
- the surface mounter according to the first embodiment includes a base 11 having a substantially rectangular shape in plan view.
- a mounting area as a work area for mounting electronic components, a standby area set on the upstream side of the mounting area, and an exit area set on the downstream side of the mounting area are linear. Is set in series.
- a horizontal direction in which each area is arranged is assumed to be an X-axis direction
- a horizontal direction orthogonal to the X-axis direction is a Y-axis direction
- a vertical direction is a Z-axis direction.
- the substrate transport device 2 is disposed along the X-axis direction of the base 11, and the printed circuit board W is transported from the ⁇ X direction on the upstream side to the + X direction on the downstream side.
- the substrate transport apparatus 2 includes a conveyor, a transport motor, and an encoder.
- the conveyor is driven by a transport motor and transports the printed circuit board W from the upstream side to the downstream side.
- the encoder detects the operation state of the transport motor and outputs it to the control unit.
- the control unit can stop the printed circuit board W at an arbitrary position by controlling the transport motor based on the output of the encoder.
- component supply units 13 are provided on both sides of the board transfer device 2, respectively.
- Each component supply unit 13 includes a plurality of tape feeders 14.
- Each tape feeder 14 supplies a predetermined electronic component.
- the head unit 15 includes a head main body 16, a plurality of nozzle units 17 connected to the head main body 16, a component camera 18 attached to the head main body 16, and a suction nozzle provided for each nozzle unit 17. 20 (see FIG. 2 and subsequent figures), and an air pressure adjuster (not shown) capable of adjusting the air pressure for each nozzle unit 17.
- the head unit 15 is configured to be movable in the X-axis direction and the Y-axis direction by a known transport mechanism.
- Each of the plurality of nozzle units 17 is configured to be able to move up and down in the Z-axis direction and rotate around the Z-axis.
- Such a surface mounter 1 performs a carry-in operation, a fixing operation, a suction operation, a mounting operation, a separation operation, and a carry-out operation.
- the carry-in operation is an operation for carrying the printed circuit board W into the entrance area from an external or continuous printing device or the like.
- the fixing operation is an operation of fixing the printed circuit board W carried into the entrance area to the mounting position in the mounting area after carrying it into the mounting area.
- the suction operation is an operation of sucking the electronic component provided at the component supply position of the component supply unit 13 by the suction nozzle 20 of the corresponding nozzle unit 17.
- the sucked electronic component C is transported above the printed circuit board W fixed at the mounting position, and the suction nozzle 20 is lowered to mount the electronic component C at a predetermined position on the printed circuit board W. It is.
- the separation operation is preferably an operation in which the supply of pressurized air is stopped, and then the suction nozzle 20 is lifted and separated from the mounted electronic component C.
- the carry-out operation is an operation in which the printed circuit board W on which the electronic component is mounted is transported to the exit area, and then is carried out to the downstream side of another mounting machine, an inspection device, a reflow furnace or the like that is externally or continuously provided. is there.
- the suction nozzle 20 includes a nozzle body 21.
- the nozzle body 21 is a metal member that integrally includes an engaging convex portion 22, a sleeve portion 23, a bulging portion 24, and a suction portion 25.
- the nozzle body 21 has an air passage 30 that communicates with the engaging convex portion 22, the sleeve portion 23, the bulging portion 24, and the suction portion 25 along the axis of the nozzle body 21. Is formed.
- the engaging convex portion 22 is a mounting portion provided on one end side of the nozzle body 21.
- the engaging convex portion 22 has long sides 22a parallel to each other.
- the nozzle main body 21 has the engaging projection 22 held by the nozzle unit 17.
- the nozzle body 21 hangs down from the engagement convex portion 22 to the sleeve portion 23, the bulging portion 24, and the suction portion 25.
- the top and bottom of the nozzle body 21 will be described with reference to the posture when the nozzle body 21 is mounted on the nozzle unit 17 along the vertical direction.
- the direction parallel to the long side 22a is assumed to be the front-rear direction.
- the sleeve portion 23 is a cylindrical body that extends downward from the central portion of the lower surface of the engaging convex portion 22.
- the bulging portion 24 is a cylindrical member that is provided below the sleeve portion 23 and bulges radially outward from the sleeve portion 23.
- the bulging part 24 is formed in a substantially circular shape.
- grooves 24a that serve as both positioning and rotation prevention are formed at appropriate positions in the circumferential direction of the bulging portion 24 (two locations in the illustrated example). The positioning member of the nozzle unit 17 is engaged with the groove 24a.
- the adsorbing part 25 has a rectangular parallelepiped appearance that hangs down from the center of the bulging part 24.
- the bottom portion 25a of the suction portion 25 has three rows of grooves 25b in the front and rear and three rows on the left and right.
- the groove 25b has a rectangular frame-like portion 25c formed at the outer edge at the bottom portion 25a.
- channel 25b forms the projection part 25d scattered at four corners inside the frame-shaped part 25c.
- the bottom surfaces of the frame-like portion 25c and the protruding portion 25d constitute a component suction surface that comes into contact with the electronic component.
- an air inlet / outlet 26 is opened.
- an air passage 30 communicating with the air inlet / outlet 26 is formed in the nozzle body 21 through the center of the engaging convex portion 22, the sleeve portion 23, and the bulging portion 24. Yes. That is, the air passage 30 is open to the component adsorption surface via the air inlet / outlet 26.
- the air passage 30 includes a step portion 30a at the lower portion.
- the step portion 30a is an annular portion that is concentric with the upper end side and is formed with a smaller diameter than the upper end side.
- the air inlet / outlet 26 is open at the center of the bottom of the stepped portion 30a.
- a cylinder 40 is slidably provided in the air passage 30.
- the cylinder 40 is divided into a first chamber 31 on the upstream side of the air passage 30 and a second chamber on the downstream side.
- the first chamber 31 on the upstream side is connected to the above-described unillustrated air pressure adjuster. Therefore, the inside of the first chamber 31 becomes negative pressure or pressurized air is supplied by the air pressure adjuster.
- the second chamber 32 is a part including a step 30a on the lower end side. As described above, the step portion 30 a that is a part of the second chamber communicates with the air inlet / outlet port 26. Therefore, when the second chamber 32 is under a negative pressure, the electronic component C can be sucked.
- the electronic component C With this suction force, the electronic component C is separated from the frame-like portion 25c constituting the component suction surface and the bottom surface of the protruding portion 25d. Adhere and hold.
- the electronic component C held on the bottom surface of the frame-shaped portion 25c and the protruding portion 25d constituting the component suction surface is the frame-shaped portion 25c and the protruding portion 25d. And pressed to the opposite side.
- the cylinder 40 includes a large-diameter portion 40a, a small-diameter portion 40b, and a rod 50 in this order from the top.
- the large diameter portion 40 a is a portion that is in sliding contact with the air passage 30.
- the small diameter part 40b is a part of a circular cross section that is formed integrally and concentrically with the lower part of the large diameter part 40a. Further, the small diameter portion 40 b is set to be slightly smaller in diameter than the step portion 30 a of the air passage 30, while being set to be larger in diameter than the air inlet / outlet 26.
- the rod 50 is a shaft member having a predetermined length, and is formed concentrically with the small diameter portion 40b.
- the cylinder 40 slides up and down within a stroke ST (see FIGS. 7 to 9) set in advance as will be described later.
- a stroke ST see FIGS. 7 to 9 set in advance as will be described later.
- the cylinder 40 including the rod 50, floats above the air inlet / outlet 26, and the air inlet / outlet 26 communicates with the second chamber 32 (see FIG. 7).
- the small diameter portion 40b of the cylinder 40 is seated on the step portion 30a of the air passage 30 (see FIG. 9).
- the specifications of each part are set so that a slight gap is formed between the step part 30a of the air passage 30 and the lower surface of the large diameter part 40a. Therefore, even if the cylinder 40 moves to the bottom dead center, the second chamber 32 maintains a slight volume. Further, at the bottom dead center, the rod 50 penetrates the air inlet / outlet 26 and protrudes to the lower surface (see FIG. 9).
- the rod 50 retreats into the nozzle body 21 when the air passage 30 is at a negative pressure, and functions as a pressing member that protrudes from the component suction surface during the separation operation.
- the rod 50 is an example of the presser of the present invention.
- a communication path 41 is formed in the cylinder 40 to communicate the first chamber 31 and the second chamber 32.
- the communication path 41 includes a throttle 42, a bypass 43, and a vertical path 44.
- the aperture 42 opens toward the first chamber 31 and communicates the bypass 43 and the first chamber 31.
- the throttle 42 is sufficiently small with respect to the air inlet / outlet 26.
- the second chamber 32 is set to be sufficiently large so as to have a negative pressure.
- the bypass 43 is a hole penetrating along the diameter direction along the left and right of the cylinder 40 at the time of assembly.
- the bypass 43 is for connecting the communication passage 41 and the atmosphere when supplying pressurized air to the air passage 30.
- a pair of passages 27 are formed in the bulging portion 24 of the nozzle body 21 as shown in FIG.
- the passages 27 face each other on the diameter along the left and right sides of the bulging portion 24, extend vertically outside the sleeve portion 23 of the bulging portion 24, and communicate with the atmosphere at the upper end. Further, each passage 27 and the air passage 30 communicate with each other through a lateral passage 28.
- the lateral path 28 is formed at a position where the bypass 40 communicates with the left and right when the cylinder 40 moves to the bottom dead center.
- the specifications of each part are set so that the lateral path 28 and the bypass 43 do not communicate with each other.
- the longitudinal path 44 extends in parallel with the central axis of the cylinder 40 and communicates the bypass 43 and the second chamber 32. In the illustrated example, two longitudinal paths 44 are formed. Each longitudinal path 44 is opposed to each other along the diameter direction of the bypass 43.
- a side communication path 60 is formed in the bulging portion 24.
- the side communication passage 60 extends in front of the adsorption portion 25 in parallel with the air passage 30 in the radial direction of the bulging portion 24.
- the upper end side of the side communication path 60 communicates with the first chamber 31. Further, the lower end side of the side communication passage 60 communicates with the atmosphere in front of the adsorption portion 25.
- a side cylinder 70 is provided in the side communication path 60.
- the side cylinder 70 partitions the side communication path 60 into the first chamber 31 side and the atmosphere side.
- the side cylinder 70 is formed with a through hole 71 that penetrates in the diameter direction of the side cylinder 70.
- the through hole 71 is for allowing the connecting pin 72 to pass therethrough.
- the connecting pin 72 passes through the through hole 71 of the side cylinder 70 through a slit 73 formed in the front surface of the bulging portion 24.
- a bottomed hole 45 is formed in the front portion of the cylinder 40.
- the rear end portion of the connecting pin 72 is fitted into the hole 45 and is fixed to the cylinder 40. Further, the cylinder 40 and the side cylinder 70 are integrally connected by the connecting pin 72.
- the slit 73 is a long hole extending vertically.
- the upper and lower ends of the slit 73 define the top dead center and the bottom dead center of the cylinder 40, respectively.
- the width dimension of the slit 73 is set to a length suitable for the side portion of the connecting pin 72 to be in sliding contact.
- the slit 73 is an example of a recess that defines the stroke ST of the connecting pin 72.
- the processing hole generated at the time of processing such as forming the passage 27 and the lateral path 28 in the nozzle main body 21, is appropriately closed by a plug 29.
- the printed circuit board W to be mounted is conveyed from the outside by the conveyor of the circuit board conveying device 2 through the entrance area, the printed circuit board W is mounted by a substrate fixing mechanism (not shown). Fixed to the mounting position in the area (fixing operation).
- the head unit 15 moves toward the component supply unit 13 that supplies the electronic component C to be mounted, and the nozzle unit corresponding to the electronic component provided at the component supply position of the component supply unit 13. Adsorption is performed by the 17 adsorption nozzles 20 (adsorption operation).
- the sucked electronic component C is transported above the printed circuit board W fixed at the mounting position, and the suction nozzle 20 is lowered to mount the electronic component C at a predetermined position on the printed circuit board W (mounting operation).
- the air pressure adjuster stops the supply of pressurized air after the electronic component C is mounted.
- the suction nozzle 20 is then levitated and the operation of separating the nozzle unit 17 that has supplied the electronic component C is performed.
- both the cylinder 40 and the side cylinder 70 are maintained at the top dead center, so that the rod 50 retracts upward from the air inlet / outlet 26 and opens the air inlet / outlet 26. Therefore, since the second chamber 32 communicates with the air inlet / outlet 26 and is maintained in a state close to the atmosphere, the state of the internal pressure P1 ⁇ the internal pressure P2 is also maintained for the differential pressure. Further, the bypass 43 of the cylinder 40 and the lateral path 28 of the nozzle body 21 are blocked.
- the internal pressure P1 of the first chamber 31 becomes higher than the internal pressure P2 of the second chamber 32, and the cylinder 40 and the side cylinder 70 are pushed down by the differential pressure.
- the cylinders 40 and 60 are gradually lowered, and finally the rod 50 enters the air inlet / outlet 26 and comes into contact with the upper surface of the electronic component C (see timing t5 in FIG. 6).
- the bypass 43 of the communication passage 41 and the lateral path 28 of the nozzle body 21 are generally communicated (see FIG. 8).
- the second chamber 32 is also compressed as the cylinder 40 is lowered, but the internal pressure of the second chamber 32 is maintained at atmospheric pressure because the bypass 43 and the lateral path 28 are in general communication. Therefore, it is possible to suppress the lowering of the cylinder 40 from being inhibited by the internal pressure P2 of the second chamber 32.
- the second embodiment is different from the first embodiment in that the side communication path 60 and the side cylinder 70 are omitted. Further, the lateral path 28 formed in the second embodiment is different from the first embodiment in that it is configured to always communicate with the second chamber 32.
- the lateral path 28 in the second embodiment has an opening width that is small enough to suppress an increase in negative pressure (a decrease in suction force) during the suction operation.
- the first chamber 31 has air. Suction is performed, and the internal pressure P1 becomes lower than the atmospheric pressure.
- the second chamber 32 communicates with the first chamber 31 via the communication passage 41, air suction is suppressed by the throttle 42 of the communication passage 41, so that the second chamber 32 passes through the lateral passage 28 and the passage 27.
- the internal pressure P2 is maintained relatively close to the atmospheric pressure. Therefore, the internal pressure P1 of the first chamber 31 becomes lower than the internal pressure P2 of the second chamber 32, and the cylinder 40 is lifted upward by the differential pressure.
- the cylinder 40 is maintained at the top dead center, so that the rod 50 retreats upward from the air inlet / outlet 26 and opens the air inlet / outlet 26. Therefore, since the second chamber 32 communicates with the air inlet / outlet 26 and is maintained in a state close to the atmosphere, the state of the internal pressure P1 ⁇ the internal pressure P2 is also maintained for the differential pressure.
- the cylinder 40 gradually descends, and finally the rod 50 enters the air inlet / outlet 26 and comes into contact with the upper surface of the electronic component C (see timing t5 in FIG. 6).
- the second chamber 32 is always open to the atmosphere by the lateral path 28 and the passage 27. Therefore, even if the second chamber 32 is compressed as the cylinder 40 is lowered, the internal pressure of the second chamber 32 is maintained at atmospheric pressure. Therefore, it is possible to suppress the lowering of the cylinder 40 from being inhibited by the internal pressure P2 of the second chamber 32.
- the electronic component C can be sucked and picked up on the component suction surface as in the case of the conventional suction nozzle 20, and at the time of the mounting operation.
- the sucked electronic component C can be mounted on the printed circuit board W.
- the suction nozzle 20 performs a separation operation after the mounting operation, the rod 50 protrudes from the component suction surface of the nozzle body 21.
- the electronic component C mounted on the printed circuit board W is pressed to the printed circuit board W side by the rod 50.
- the nozzle body 21 can be separated from the electronic component C. Therefore, the mounted electronic component C does not move with the operation of the nozzle body 21.
- the rod 50 is integrally formed at the end of the cylinder 40.
- the cylinder 40 is formed with a communication passage 41 that communicates the first chamber 31 and the second chamber 32.
- the communication passage 41 is an air passage.
- the rod 50 is retracted into the nozzle main body 21 when the pressure 30 is negative, while the rod 50 protrudes from the component suction surface during the detaching operation, between the first chamber 31 and the second chamber 32.
- a throttle 42 for generating a differential pressure.
- the cylinder 40 causes the rod 50 to retract into the nozzle body 21 due to the differential pressure between the first chamber 31 and the second chamber 32, that is, Move upward. Further, when pressurized air is supplied to the air passage 30, the rod 50 is pressurized in a direction protruding from the component suction surface of the nozzle body 21 due to the differential pressure between the first chamber 31 and the second chamber 32.
- the communication path 41 forms the bypass 43 that communicates the second chamber 32 and the atmosphere on the second chamber 32 side with respect to the throttle 42, and the nozzle body 21 includes at least the first main body 21.
- a bypass passage (passage 27, lateral passage 28) communicating with the bypass 43 is provided.
- the differential pressure between the first chamber 31 and the second chamber 32 can be generated using atmospheric pressure. Therefore, the control of the differential pressure is facilitated and the operation reliability of the suction nozzle 20 is increased.
- the air in the second chamber 32 passes from the bypass 43 to the bypass passage (passage 27, lateral passage 28) even if the piston descends. Since the second chamber 32 is released into the atmosphere, an increase in internal pressure is suppressed. Therefore, since the air damper effect by the air of the second chamber 32 can be suppressed, it is possible to prevent the force that pushes down the piston from being hindered by the internal pressure of the second chamber 32.
- the bypass passage is disconnected from the bypass 43 when the first chamber is at a negative pressure. Therefore, a larger suction force can be exerted when the electronic component C is sucked.
- the side cylinder 70 further connected integrally with the cylinder 40 is further provided, and the nozzle main body 21 forms the side communication path 60 which connects the 1st chamber 31 and air
- the side cylinder 70 is slidably mounted in the side communication path 60 and divides the side communication path 60 into a chamber side and an atmosphere side. Therefore, in the present embodiment, when the air passage 30 is set to a negative pressure, a differential pressure is generated between the first chamber 31 and the second chamber 32, and the chamber side of the side communication passage 60 is also set to a negative pressure. . Therefore, buoyancy is generated in the side cylinder 70. Further, the side cylinder 70 is integrally connected to the cylinder 40 having the rod 50 integrally.
- the rod 50 receives the force in the direction of retreating into the nozzle body 21 more reliably.
- pressurized air is supplied to the air passage 30
- a differential pressure is generated between the first chamber 31 and the second chamber 32, and pressurized air is also supplied to the chamber side of the side communication passage 60. Therefore, the side cylinder 70 is pressurized in a direction in which the rod 50 together with the cylinder 40 protrudes from the component suction surface of the nozzle body 21. Therefore, the rod 50 can receive force in a direction in which the rod 50 protrudes from the nozzle body 21 more reliably.
- the pin which connects the cylinder 40 and the side cylinder 70 is further provided, and the nozzle main body 21 has the slit 73 as a recessed part which prescribes
- the cylinder 40 and the side cylinder 70 can be connected by a pin to realize a required operation.
- the pin stroke ST is formed in the nozzle body 21 outside the air passage 30, even if foreign matter enters the air passage 30, the foreign matter does not adhere to the pin.
- the recess is not limited to the slit 73 and may be a bottomed groove.
- the separation operation when the separation operation is performed after the mounting operation, the separation operation is performed after the supply of pressurized air is stopped. Therefore, in each embodiment, when the suction nozzle is separated from the electronic component, the pressurized air does not leak to the surroundings, and the pressurized air does not adversely affect the surrounding electronic components or the surface of the printed board.
- the separation operation may be executed while the supply of pressurized air is continued.
- the present invention can be suitably applied to equipment for automatically mounting electronic components on a printed circuit board.
- it is suitable for application to various printed circuit board manufacturing processes, such as mounting electronic components on a relatively low-adhesion surface such as a flux application surface, or a surface having no adhesiveness.
Abstract
Description
まず、第1実施形態について、説明する。第1実施形態に係る表面実装機は、平面視略矩形の基台11を備えている。基台11には、電子部品を実装するための作業エリアとしての実装エリアと、この実装エリアの上流側に設定される待機エリアと、実装エリアの下流側に設定される出口エリアとが直線状に直列に設定されている。以下の説明では、各エリアが配列されている水平方向を仮にX軸方向とし、このX軸方向と直交する水平方向をY軸方向とし、鉛直方向をZ軸方向とする。本実施形態では、基台11のX軸方向に沿って基板搬送装置2が配設され、プリント基板Wは上流側となる-X方向から下流側となる+X方向に搬送される。 (First embodiment)
First, the first embodiment will be described. The surface mounter according to the first embodiment includes a base 11 having a substantially rectangular shape in plan view. On the
次に、第2実施形態について説明する。 (Second Embodiment)
Next, a second embodiment will be described.
The present invention can be suitably applied to equipment for automatically mounting electronic components on a printed circuit board. In particular, it is suitable for application to various printed circuit board manufacturing processes, such as mounting electronic components on a relatively low-adhesion surface such as a flux application surface, or a surface having no adhesiveness.
Claims (6)
- 電子部品を負圧で吸引してピックアップする吸着動作と、加圧空気を供給することによりピックアップした電子部品をプリント基板に実装する実装動作と、前記実装動作後に、前記プリント基板に装着した電子部品から離れる切り離し動作とを実行する吸着ノズルにおいて、
電子部品を吸着する部品吸着面、及び前記部品吸着面に開口する空気通路を備えたノズル本体と、
前記ノズル本体に設けられ、前記吸着動作の際に空気通路が負圧にされているときには前記ノズル本体内に退避する一方、前記切り離し動作の際に前記ノズル本体が実装後の電子部品から離れたときには前記部品吸着面から突出する押圧子と
を備えていることを特徴とする吸着ノズル。 Adsorption operation for sucking and picking up electronic components with negative pressure, mounting operation for mounting electronic components picked up by supplying pressurized air on a printed circuit board, and electronic components mounted on the printed circuit board after the mounting operation In the suction nozzle that performs the separation operation away from the
A nozzle body provided with a component adsorption surface for adsorbing electronic components, and an air passage opening in the component adsorption surface;
Provided in the nozzle body and retracted into the nozzle body when the air passage is under negative pressure during the suction operation, while the nozzle body is separated from the mounted electronic component during the separation operation A suction nozzle characterized by comprising: a pressing member protruding from the component suction surface. - 請求項1記載の吸着ノズルにおいて、
前記ノズル本体の前記空気通路内に摺動可能に配置され、前記空気通路を、前記加圧空気の供給方向でみて、上流側の第1チェンバと下流側の第2チェンバとに区画するシリンダをさらに備え、
前記押圧子は、前記シリンダの端部に一体形成されており、
前記シリンダには、前記第1チェンバと前記第2チェンバとを連通する連通路が形成されており、
前記連通路は、前記吸着動作の際に空気通路が負圧にされているときには前記押圧子が前記ノズル本体内に退避する一方、前記切り離し動作の際に前記ノズル本体が実装後の電子部品から離れたときには前記押圧子が前記部品吸着面から突出するように、前記第1チェンバと前記第2チェンバとの間に差圧を生成する絞りを有するものである
ことを特徴とする吸着ノズル。 The suction nozzle according to claim 1,
A cylinder that is slidably disposed in the air passage of the nozzle body, and that divides the air passage into a first chamber on the upstream side and a second chamber on the downstream side when viewed in the direction in which the pressurized air is supplied. In addition,
The pressing element is integrally formed at the end of the cylinder,
The cylinder is formed with a communication passage communicating the first chamber and the second chamber,
The communication passage is configured such that when the air passage is set to a negative pressure during the adsorption operation, the pressing element is retracted into the nozzle body, while the nozzle body is removed from the electronic component after being mounted during the separation operation. A suction nozzle comprising a throttle that generates a differential pressure between the first chamber and the second chamber so that the pressing element protrudes from the component suction surface when separated. - 請求項2記載の吸着ノズルにおいて、
前記連通路は、前記絞りよりも前記第2チェンバ側で当該第2チェンバと大気とを連通するバイパスを形成しており、
前記ノズル本体は、少なくとも前記第1チェンバに加圧空気が供給されている場合に、前記バイパスと連通するバイパス用通路を有している
ことを特徴とする吸着ノズル。 The suction nozzle according to claim 2.
The communication path forms a bypass that communicates the second chamber and the atmosphere on the second chamber side of the throttle,
The suction nozzle, wherein the nozzle body has a bypass passage communicating with the bypass when at least pressurized air is supplied to the first chamber. - 請求項2または3に記載の吸着ノズルにおいて、
前記シリンダと一体的に連結されるサイドシリンダをさらに備え、
前記ノズル本体は、前記第1チェンバと大気とを連通するサイド連通路を形成するものであり、
前記サイドシリンダは、前記サイド連通路内に摺動可能に装着されて、前記サイド連通路を前記第1チェンバ側と大気側とに区画するものである
ことを特徴とする吸着ノズル。 The suction nozzle according to claim 2 or 3,
A side cylinder integrally connected to the cylinder;
The nozzle body forms a side communication path that communicates the first chamber with the atmosphere,
The suction nozzle, wherein the side cylinder is slidably mounted in the side communication path, and divides the side communication path into a first chamber side and an atmosphere side. - 請求項4記載の吸着ノズルにおいて、
前記シリンダと前記サイドシリンダとを連結するピンをさらに備え、
前記ノズル本体は、前記ピンのストロークを規定する凹部を前記空気通路の外側に有するものである
ことを特徴とする吸着ノズル。 The suction nozzle according to claim 4,
A pin that connects the cylinder and the side cylinder;
The nozzle main body has a recess that defines the stroke of the pin on the outside of the air passage. - プリント基板に電子部品を実装する表面実装機において、
請求項1から5の何れか1項に記載の吸着ノズルを備えている
ことを特徴とする表面実装機。
In surface mounters that mount electronic components on printed circuit boards,
A surface mounting machine comprising the suction nozzle according to any one of claims 1 to 5.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015502573A JP5913731B2 (en) | 2013-02-28 | 2013-02-28 | Suction nozzle and surface mounter |
PCT/JP2013/001248 WO2014132292A1 (en) | 2013-02-28 | 2013-02-28 | Suction nozzle and surface mounting device |
CN201380066615.8A CN105359636B (en) | 2013-02-28 | 2013-02-28 | Suction nozzle and surface mounting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2013/001248 WO2014132292A1 (en) | 2013-02-28 | 2013-02-28 | Suction nozzle and surface mounting device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014132292A1 true WO2014132292A1 (en) | 2014-09-04 |
Family
ID=51427602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/001248 WO2014132292A1 (en) | 2013-02-28 | 2013-02-28 | Suction nozzle and surface mounting device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5913731B2 (en) |
CN (1) | CN105359636B (en) |
WO (1) | WO2014132292A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106794582A (en) * | 2014-10-10 | 2017-05-31 | 富士机械制造株式会社 | Suction nozzle |
JPWO2016132448A1 (en) * | 2015-02-17 | 2017-11-24 | 富士機械製造株式会社 | Suction nozzle |
KR20190050140A (en) * | 2017-11-02 | 2019-05-10 | 한화정밀기계 주식회사 | A nozzle device for component mounter |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2018047413A1 (en) * | 2016-09-08 | 2019-06-24 | シャープ株式会社 | Optical component mounting device and method of manufacturing sensor device |
KR102208102B1 (en) * | 2017-03-07 | 2021-01-27 | 야마하하쓰도키 가부시키가이샤 | Component mounting device and board holding method |
CN109192695A (en) * | 2018-09-11 | 2019-01-11 | 浙江韩宇光电科技有限公司 | The suction nozzle of LED high-speed paster head and the preparation method of suction nozzle |
JP6949893B2 (en) * | 2019-03-07 | 2021-10-13 | Ckd株式会社 | Adsorption buffer |
DE102019127292B4 (en) * | 2019-10-10 | 2023-01-19 | Asm Assembly Systems Gmbh & Co. Kg | Device and method for precise assembly with assembly elements |
DE102019135740B4 (en) * | 2019-12-23 | 2023-04-06 | Asm Assembly Systems Gmbh & Co. Kg | Holding device with elastic spring element and pneumatic channel system; Placement head and placement machine and method for placing component carriers |
CN111642126B (en) * | 2020-05-25 | 2021-04-09 | 深圳市琦轩实创科技有限公司 | A paster equipment for production of electron class product |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6285387U (en) * | 1985-11-18 | 1987-05-30 | ||
JPH07183693A (en) * | 1993-12-24 | 1995-07-21 | Toshiba Corp | Non-standard shape component mounting apparatus |
JPH1199495A (en) * | 1997-09-30 | 1999-04-13 | Ckd Corp | Vacuum chuck and sucking method of work |
JP2000133996A (en) * | 1998-10-27 | 2000-05-12 | Matsushita Electric Ind Co Ltd | Electronic part mounting equipment |
JP2003078294A (en) * | 2001-09-03 | 2003-03-14 | Matsushita Electric Ind Co Ltd | Electronic-component mounting apparatus |
JP2008168382A (en) * | 2007-01-11 | 2008-07-24 | Juki Corp | Component suction nozzle |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4933353B2 (en) * | 2007-05-31 | 2012-05-16 | ヤマハ発動機株式会社 | Suction nozzle and surface mounter |
JP5096898B2 (en) * | 2007-12-12 | 2012-12-12 | ティアック株式会社 | Mechanical valve |
-
2013
- 2013-02-28 JP JP2015502573A patent/JP5913731B2/en active Active
- 2013-02-28 WO PCT/JP2013/001248 patent/WO2014132292A1/en active Application Filing
- 2013-02-28 CN CN201380066615.8A patent/CN105359636B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6285387U (en) * | 1985-11-18 | 1987-05-30 | ||
JPH07183693A (en) * | 1993-12-24 | 1995-07-21 | Toshiba Corp | Non-standard shape component mounting apparatus |
JPH1199495A (en) * | 1997-09-30 | 1999-04-13 | Ckd Corp | Vacuum chuck and sucking method of work |
JP2000133996A (en) * | 1998-10-27 | 2000-05-12 | Matsushita Electric Ind Co Ltd | Electronic part mounting equipment |
JP2003078294A (en) * | 2001-09-03 | 2003-03-14 | Matsushita Electric Ind Co Ltd | Electronic-component mounting apparatus |
JP2008168382A (en) * | 2007-01-11 | 2008-07-24 | Juki Corp | Component suction nozzle |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106794582A (en) * | 2014-10-10 | 2017-05-31 | 富士机械制造株式会社 | Suction nozzle |
CN106794582B (en) * | 2014-10-10 | 2020-01-31 | 株式会社富士 | Suction nozzle |
JPWO2016132448A1 (en) * | 2015-02-17 | 2017-11-24 | 富士機械製造株式会社 | Suction nozzle |
KR20190050140A (en) * | 2017-11-02 | 2019-05-10 | 한화정밀기계 주식회사 | A nozzle device for component mounter |
KR102436661B1 (en) | 2017-11-02 | 2022-08-26 | 한화정밀기계 주식회사 | A nozzle device for component mounter |
Also Published As
Publication number | Publication date |
---|---|
CN105359636B (en) | 2018-04-27 |
JP5913731B2 (en) | 2016-04-27 |
JPWO2014132292A1 (en) | 2017-02-02 |
CN105359636A (en) | 2016-02-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5913731B2 (en) | Suction nozzle and surface mounter | |
JP5494588B2 (en) | Underpinning pin module for electronic component mounting apparatus, substrate underlay device, and substrate underlay method | |
JP5445534B2 (en) | Electronic component mounting apparatus, electronic component mounting method, and layout changing method of receiving pin module | |
JP4756109B1 (en) | Component mounting equipment | |
JPH11220294A (en) | Electronic component transfer equipment, holder replacing method and device therefor | |
JP6027794B2 (en) | Transfer jig | |
JP2007266331A (en) | Electronic component mounter | |
JP2010087062A (en) | Electronic component mounting head and electronic component mounting device using the same | |
US20180243869A1 (en) | Component mounted body manufacturing system and component mounted body manufacturing method | |
WO2014207802A1 (en) | Component mounting machine | |
JP4222741B2 (en) | Component mounting apparatus and component mounting method | |
WO2014049822A1 (en) | Pickup nozzle and component mounting method | |
WO2019116506A1 (en) | Workpiece processing device | |
JP6063214B2 (en) | Holder mounting device | |
JPH01317000A (en) | Electronic component packaging device | |
JP5071601B1 (en) | Positioning device, mounting device, and manufacturing method of substrate device | |
JP5953068B2 (en) | Electronic component placement table and die bonder equipped with the same table | |
JP2017092188A (en) | Mounting head, surface-mounted machine, and detection method for suction state of suction nozzle | |
JP2006147884A (en) | Surface mounter | |
JP3128406B2 (en) | Electronic component automatic mounting device | |
JP5895127B2 (en) | Suction tool and component mounting device | |
KR102062278B1 (en) | Chip mounter | |
JP5895128B2 (en) | Suction tool and component mounting device | |
WO2019026160A1 (en) | Mounting head and component mounting machine | |
WO2017056181A1 (en) | Component chuck device and component mounting device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201380066615.8 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13876289 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2015502573 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 13876289 Country of ref document: EP Kind code of ref document: A1 |