JP2003077966A - Inspection device of semiconductor circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To wholly flatten a bottom face height of a division type contact structure in an inspection device of a semiconductor circuit lifted and held in a state that a plurality of the division type contact structures are arranged so as to correspond to each semiconductor circuit on a wafer. SOLUTION: The inspection device having the plurality of the division type contact structures 5 provided with a contact part 10 contactable on the whole electrode pad 3 of each of a plurality of the semiconductor circuits manufactured on a lower face of the wafer 1 on a lower face of a base member 6, lifted and held on the base member 6 in the state that each of the plurality of the contact structures 5 is arranged so as to correspond to each semiconductor circuit and inspecting each semiconductor circuit, is provided with a means for adjusting the bottom face height of the contact structure 5 and wholly flattening each bottom face. Thereby the bottom face height of the contact structure 5 can be wholly flattened to perform a stable wafer burn-in test.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention corresponds to each of the above-mentioned semiconductor circuits in a divided type contact structure having a contact portion capable of contacting all of the electrode pads of each semiconductor circuit manufactured on the upper surface of a wafer. Is held in the state
The present invention relates to an inspection device for inspecting each semiconductor circuit, and more particularly to an inspection device for a semiconductor circuit that adjusts the height of the bottom surface of each contact structure to flatten it as a whole.

[0002]

2. Description of the Related Art In recent years, in a semiconductor integrated circuit manufacturing process, a burn-in test for ensuring the reliability of each semiconductor circuit 2 manufactured on the upper surface of one wafer 1 shown in FIG. A so-called wafer burn-in technique, which is performed collectively for all the semiconductor circuits 2, 2, ... Has been put into practical use. In order to realize such a wafer burn-in technique, all of the electrode pads 3, 3, ... Of tens of thousands or more formed on all the semiconductor circuits 2, 2 ,. There is a need for a semiconductor circuit inspection device having a contact portion that can be brought into contact with each other to ensure reliable electrical connection. As such a semiconductor circuit inspection device, a plurality of split type contact structures capable of contacting all the electrode pads 3 in one semiconductor circuit 2 on the wafer 1 are provided, and the plurality of contact structures are provided. 2. Description of the Related Art Inspection devices for semiconductor circuits arranged in a plane have been developed.

A conventional inspection apparatus for this type of semiconductor circuit is
For example, as shown in FIG. 5A, a contactor 4 that can simultaneously contact the lower surface of the base member 6 with all the electrode pads 3 (see FIG. 4) of each semiconductor circuit 2 manufactured on the upper surface of the wafer 1. Has a plurality of split type contact structures 5, each of which is arranged so as to correspond to each of the semiconductor circuits 2, 2 ,. In this state, the base member 6 is suspended and held in the above state.

[0004]

However, in such a conventional semiconductor circuit inspecting apparatus, the accuracy error of the plurality of stat screws 7 for holding each of the contact structures 5 and the contact structure 5 cannot be prevented. Since it is not possible to absorb the manufacturing error of the thickness of the silicon substrate 8 and the cover 9 which are the component parts, as shown in FIG. 5B, the bottom surfaces of the contactors 4 and 4 located under the contact structures 5 are There was a difference d in height, and there was a site that was not flattened as a whole. Therefore, in the wafer burn-in test, the probe terminal group 10 provided on the bottom surface of the contactor 4 is not properly contacted with all the electrode pads 3 on the wafer 1, and the load applied on the upper surface of the wafer 1 is partially concentrated. There was something to do. Therefore, the electrode pad 3 may be damaged, or the contact between the probe terminal group 10 and the electrode pad 3 may become unstable.

Therefore, the present invention addresses such a problem, and adjusts the heights of the bottom surfaces of the plurality of contact structures to flatten the bottom surfaces of the contact structures as a whole, thereby forming electrodes on the wafer. An object of the present invention is to provide a semiconductor circuit inspection device capable of preventing damage to a pad and stabilizing contact between the electrode pad and a contact portion of a contact structure.

[0006]

In order to achieve the above object, a semiconductor circuit inspecting apparatus according to the present invention is provided with a bottom surface of a base member and all electrode pads of a plurality of semiconductor circuits manufactured on the top surface of a wafer. A plurality of split-type contact structures having contactable contact portions are provided, and the plurality of contact structures are respectively lifted and held on the base member in a state of being arranged so as to correspond to each of the semiconductor circuits. The inspection device for inspecting each semiconductor circuit includes means for adjusting the height of the bottom surface of each contact structure to flatten each bottom surface as a whole.

With this structure, the height of the bottom surface of each contact structure is adjusted by the bottom surface height adjusting means, and each bottom surface is flattened as a whole.

Further, the bottom surface height adjusting means of each of the contact structures includes a lifting holder for the contact structures.
A lifting elastic body sandwiched between the neck portion of the lifting holder and the upper surface of the base member. Thereby, when the tightening of the lifting holder of the contact structure is adjusted, the lifting elastic body sandwiched between the neck of the lifting holder and the upper surface of the base member is deformed, and the bottom surface of each contact structure is deformed. The height of is adjusted.

Further, each of the contact structures is provided with a contact prevention member for preventing contact with the lower surface of the base member at the peripheral edge of the upper surface thereof. Thus, even if the contact surface of each of the contact structures comes into contact with the upper surface of the wafer and moves upward, the contact preventing member prevents the upper surface of the contact structure from contacting the lower surface of the base member.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a side sectional view showing an embodiment of a semiconductor circuit inspection apparatus according to the present invention. This semiconductor circuit inspection apparatus includes a plurality of semiconductor circuits 2, 2 manufactured on the upper surface of one wafer 1 shown in FIG.
An apparatus used when performing a wafer burn-in test for inspecting the reliability of ... At the wafer level. As shown in FIG. 1A, a split type contact structure 5, a base member 6,
It has a stat screw 7 and a bottom surface height adjusting means for each contact structure.

The contact structure 5 is in contact with all the electrode pads 3, 3, ... In one semiconductor circuit 2 manufactured in plural on the upper surface of the wafer 1 shown in FIG. Then, as shown in FIG. 2, it comprises a contactor 4, a silicon substrate 8 and a cover 9.

The contactors 4 are all electrode pads 3, 3, of each semiconductor circuit 2 manufactured in plural on the wafer 1.
(See FIG. 4), which is a thin film having substantially the same size as the shape of each of the semiconductor circuits 2 described above. The probe terminal group 10 (see FIG. 1B) is formed so as to match the arrangement of 3, 3, .... The contactor 4 has a length of about 25 m, for example.
It is a rectangular shape with m and a width of about 50 mm.

As shown in FIG. 2, a silicon substrate 8 is bonded to the upper surface of the contactor 4. The silicon substrate 8 forms a circuit pattern 11 (see FIG. 1A) corresponding to the probe terminal group 10, and the circuit pattern 11 is provided with a connecting portion 12 for transmitting and receiving an inspection signal. The connecting portion 12 is connected to a board connector 18, which will be described later, so that an inspection signal can be transmitted and received.

A cover 9 is bonded to the upper surface of the silicon substrate 8 as shown in FIG. The cover 9
Is a circuit pattern 1 formed on the silicon substrate 8.
It serves as a member for covering and protecting 1, and has four screw holes 13 at four corners of its upper surface, and an opening 14 extending in the lateral direction is formed at a substantially central portion. The position where the opening 14 is formed is at the silicon substrate 8
It corresponds to above the connecting portion 12 provided in the.

The divided contact structure 5 constructed as described above is arranged so as to correspond to each semiconductor circuit 2, 2, ... Formed on a single wafer 1. Here, as shown in FIG. 4, for example, 22 semiconductor circuits 2, 2, ... Are manufactured on the upper surface of one wafer 1, and the contact structure 5 is shown in FIG. So that the guide frame 16 with 22 positioning windows 15
Are positioned so as to correspond to the arrangement of the above-mentioned 22 semiconductor circuits 2 and are arranged in an individually divided state.

The base member 6 has 22 contact structures 5, 5, ... Positioned by the guide frame 16.
Is held by the lower surface thereof, and as shown in FIG. 1A, the screw through hole 17 and the board connector 18 are positioned by the guide frame 16 and each contact structure 5 is positioned.
Is provided at a position corresponding to. The screw through hole 17
Is the one through which the shaft portion 20 of the stat screw 7 penetrates.
Screw holes 13, 1 formed on the upper surface of the cover 9 shown in FIG.
It is provided at a position corresponding to 3, .... Further, as shown in FIG. 1A, the board connector 18 is provided with a connecting portion 1 provided on the silicon substrate 8 of the contact structure 5.
2 for transmitting and receiving inspection signals to and from the circuit pattern 11, and each connection portion 1 of each contact structure 5 described above.
Are arranged at positions corresponding to 2, 12, .... In addition,
.. are connected to the respective board connectors 18, 18, ..., And these signal transmission cables 18 are connected to a tester (not shown). Further, the upper surface of the base member 6 is flattened by polishing.

As shown in FIG. 1A, the stat screw 7 holds each contact structure 5 positioned by the guide frame 16 on the lower surface of the base member 6, and the neck portion 22 thereof. The shaft portion 20 below is formed to have a length capable of penetrating the screw through hole 17 formed in the base member 6, and the tip portion 21 thereof has a screw hole 13 formed in the cover 9 of the contact structure 5. (See FIG. 2) Threads that can be screwed are cut. As a result, each contact structure 5 divided and positioned by the guide frame 16 can be lifted and held on the lower surface of the base member 6 by, for example, four stat screws 7.

It should be noted that, as shown in FIG.
A load absorbing material 32 is provided between the upper surface of the guide frame 16 for positioning the individual contact structures 5, 5, ... And the lower surface of the substrate 6 holding the guide frame 16. The load absorbing material 32 is formed of a heat resistant elastic body such as silicon rubber, and absorbs the contact pressure when the contactor 4 of each contact structure 5 contacts the upper surface of the wafer 1. ing.

Here, in the present invention, as shown in FIG. 1A, between the neck portion 22 of the stat screw 7 and the upper surface of the base member 6, the lifting elastic members 31 are respectively provided.
Is sandwiched between. This lifting elastic body 31 adjusts the height of the bottom surface of the contactor 4 of the contact structure 5 and flattens the bottom surface of each contactor 4 as a whole, and is made of a heat resistant material such as silicon rubber. And is made of a material having a lower elastic modulus than the load absorbing material 32. As a result, when the stat screw 7 is rotated, for example, in the tightening direction, the lifting elastic body 31 is compressed and deformed accordingly. Therefore, when the tightening of the four stat screws 7 is adjusted, The bottom height of the contactor 4 of the contact structure 5 can be adjusted. Therefore, the accuracy error of the stat screw 7 and the manufacturing error of the contact structure 5 can be absorbed, and as shown in FIG. 1B, the bottom surface height of the contactor 4 of each contact structure 5 is flat as a whole. Can be converted. The number of stat screws 7 for lifting and holding one contact structure 5 is not limited to four, and any number may be used as long as the height of the bottom surface of the contact structure 5 can be adjusted, for example, two or three. Good. The stat screw 7 and the lifting elastic body 31 constitute bottom surface height adjusting means of each contact structure.

Further, since the lifting elastic body 31 is formed of a material having a lower elastic modulus than the load absorbing material 32 as described above, each contact structure in which the bottom surface height is flattened as a whole. When the load absorbing material 32 is compressed and deformed when the body 5 contacts the upper surface of the wafer 1, the lifting elastic body 31 deforms to return to its original shape. As a result, the contact structure 5 moves smoothly, and good contact between the electrode pad 3 and the probe terminal group 10 can be obtained.

Further, as shown in FIG. 2, a contact prevention member 33 is provided on the peripheral edge of the upper surface of the contact structure 5. The contact prevention member 33 serves as a member for preventing the upper surface of the contact structure 5, that is, the upper surface of the cover 9, from coming into contact with the lower surface of the base member 6, and is, for example, a peripheral edge of the upper surface of the cover 9. The load absorbing material 31 is formed thinner than the load absorbing material 31. As a result, even if the contactor 4 serving as the contact surface of the contact structure 5 contacts the upper surface of the wafer 1 and the contact structure 5 moves upward, the contact prevention member 33 causes the upper surface of the contact structure 5 to move. Does not contact the lower surface of the base member 6. The contact prevention member 3
The shape of 3 is not limited to the shape surrounding the peripheral edge of the upper surface of the cover 9, and may be, for example, an intermittent shape attached only in the vertical direction.

The contact prevention member 33 is formed so that its thickness is thinner than that of the load absorbing material 32. This ensures a contact stroke when the contact structure 5 moves upward.

Next, the use of the semiconductor circuit inspecting device thus configured will be described. Here, it is assumed that a so-called pre-process has already been performed on the upper surface of the wafer and that, for example, 22 semiconductor circuits 2, 2, ... Are manufactured as shown in FIG. A wafer burn-in test is performed on the top. First, the height of all contactors 4 of each contact structure 5, 5, ... Of the semiconductor circuit inspection apparatus shown in FIG. 1A is adjusted by the bottom height adjusting means (7, 31) of each contact structure. Adjusted to flatten each bottom as a whole. At this time, the error is flattened to about ± several μm.

Next, the wafer 1 is set on a measuring stage of a tester (not shown) and the tester is operated. Then, as shown in FIG. 1B, the probe terminal group 10 formed on the lower surface of all the flattened contactors 4 and all the electrode pads 3 formed on the wafer 1 are collectively brought into contact with each other. To do. Then, the reliability test of each semiconductor circuit 2 is performed while heating the entire wafer 1. At this time, contact stability between the probe terminal group 10 and the electrode pad 3 is always ensured. Therefore, a stable wafer burn-in test can be performed.

[0025]

Since the present invention is constructed as described above,
According to the invention of claim 1, a plurality of split-type contact structures are provided on the lower surface of the base member, each of which has a contact portion capable of contacting all electrode pads of each semiconductor circuit manufactured on the upper surface of the wafer. In each of the contact structures, each of the plurality of contact structures is suspended and held by the base member in a state of being arranged so as to correspond to each of the semiconductor circuits, and inspects each of the semiconductor circuits. By providing means for adjusting the height of the bottom surface of the body to flatten each bottom surface as a whole, the height of the bottom surface of each contact structure can be adjusted by the bottom surface height adjusting means, The bottom surface of each can be flattened as a whole. This makes it possible to absorb the manufacturing error of the contact structure and to bring the contact portion of the contact structure into contact with the electrode pads on the wafer at once. Therefore, a stable wafer burn-in test can be performed.

According to a second aspect of the present invention, the bottom surface height adjusting means of each of the contact structures includes a lifting holder of the contact structure, a neck portion of the lifting holder, and an upper surface of a base member. By adjusting the tightening of the lifting holder of the contact structure, the lifting elastic body is sandwiched between the neck of the lifting holder and the upper surface of the base member. The lifted elastic body is deformed, and the height of the bottom surface of each contact structure can be adjusted. Therefore, each bottom surface can be flattened as a whole.

According to the invention of claim 3, each of the contact structures is provided with a contact prevention member for preventing contact with the lower surface of the base member at the peripheral edge of the upper surface thereof. Even if the contact surface of each of the contact structures comes in contact with the upper surface of the wafer and moves upward, the contact preventing member can prevent contact between the upper surface of the contact structure and the lower surface of the base member. Further, it is possible to secure the contact stroke when the contact structure moves upward.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of a semiconductor circuit inspection apparatus according to the present invention, FIG. 1 (a) is an overall view showing a structure in which a split-type contact structure is suspended and held on a lower surface of a base member; b) is an enlarged view showing a state where the bottom surface of the contact structure is in contact with the upper surface of the wafer.

FIG. 2 is a perspective view showing a structure of the split-type contact structure.

FIG. 3 is a perspective view showing a state in which the split type contact structure is positioned and arranged so as to correspond to the arrangement of each semiconductor circuit on a wafer.

FIG. 4 is a plan view showing a wafer on which a plurality of semiconductor circuits are manufactured.

5A and 5B are side cross-sectional views showing a conventional semiconductor circuit inspection device, FIG. 5A is an overall view showing a structure in which a split-type contact structure is suspended and held on a lower surface of a base member, and FIG. It is an enlarged view showing the state where the bottom of a structure contacts the upper surface of a wafer.

[Explanation of symbols] 4 ... Contactor 5 ... Contact structure 6 ... Base member 7 ... Stat screw 8 ... Silicon substrate 9 ... Cover 10 ... Probe terminal 11 ... Circuit pattern 12 ... Connection part 13 ... Screw hole 14 ... Opening 15 ... Positioning window 16 ... Guide frame 17 ... Screw through hole 18 ... Board connector 19 ... Signal transmission cable 20 ... Shaft 21 ... Tip 22 ... neck 31 ... Elastic body for lifting 32 ... Load absorbing material 33 ... Contact prevention member

Continued front page    (72) Inventor Akio Hasebe             5-20-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Stock             Ceremony Company within Hitachi Semiconductor Group F-term (reference) 2G003 AA10 AC01 AG03 AH05                 2G011 AA01 AB08 AC14 AE03                 2G014 AA01 AA14 AB59 AC10                 2G132 AA01 AB03 AF02 AL03                 4M106 AA01 BA01 CA70 DD04 DD06                       DD09 DD13

Claims (3)

[Claims] 1. A plurality of split-type contact structures, each of which has a contact portion capable of contacting all electrode pads of a plurality of semiconductor circuits manufactured on the upper surface of a wafer, on the lower surface of a base member. In the inspection device for inspecting each of the semiconductor circuits, which is suspended and held by the base member in a state where each of the contact structures is arranged so as to correspond to each of the semiconductor circuits, the height of the bottom surface of each of the contact structures is increased. An apparatus for inspecting a semiconductor circuit, comprising means for adjusting a height to flatten each bottom surface as a whole. 2. The bottom height adjusting means of each of the contact structures is a lifting holder of the contact structure, and a lifting elastic body sandwiched between a neck of the lifting holder and an upper surface of a base member. 2. The semiconductor circuit inspection apparatus according to claim 1, further comprising: 3. The semiconductor circuit inspection apparatus according to claim 1, wherein each of the contact structures is provided with a contact prevention member for preventing contact with the lower surface of the base member on the peripheral edge of the upper surface thereof.