JP2003077604A - Socket for electric component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stabilize the size of a guide part for positioning in holding an electric component on a mounting part. SOLUTION: A socket for the electric component comprises a socket body 1 that has the mounting part 5 for supporting the electric component 4 on its upper surface and has the guide parts 7' for regulating and positioning a plurality of positions on the outer surfaces of the electric component 4 placed on the mounting part 5, a contact pin contactably disposed at a connecting terminal of the electric component 4 mounted on the mounting part 5, and a holding member for holding the electric component 4 on the mounting part 5 in a fixing state and contacting and keeping the connecting terminal with the contact pin. Each guide part 7' of the socket body 1 is formed in a projecting shape capable of abutting on the outer surface of the electric component 4 in point contact. Thus, the guide parts 7' contact the electric component 4, so that positioning parts do not largely change and the sizes of the guide parts 7' for positioning in holding the electric component 4 on the mounting part 5 is stabilized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric component socket for detachably holding an electric component such as an IC package and connecting it to another electric circuit device. More specifically, the electric component is held on a mounting portion. The present invention relates to a socket for electric parts that stabilizes the guide size of a guide portion for positioning at the time.

[0002]

2. Description of the Related Art Conventional sockets for electric parts of this type are
Similar to that shown in FIG. 1, a mounting portion for mounting an electric component is formed on the upper surface, and a guide portion for regulating and positioning a plurality of positions on the outer side surface of the electric component mounted on the mounting portion is provided. The socket body 1 formed, the contact pin 2 provided so as to be capable of contacting the connection terminal of the electric component mounted on the mounting portion, and the electric component mounted on the mounting portion are held in a fixed state. The holding member 3 for maintaining the connection terminal in contact with the contact pin 2 is provided. The electric component is an IC package or the like, and such an electric component socket is usually called an IC socket.

The guide portion of the socket body 1 positions the IC package mounted on the mounting portion on the upper surface of the socket body 1 so that, for example, a pin-shaped connection terminal contacts the contact pin 2. 7 and 8 for example.
Was configured as shown in. That is, the mounting portion 5 formed on the upper surface of the socket body 1 is provided with the positioning pieces 6 that are substantially L-shaped in a plan view at the positions corresponding to the four corners of the IC package 4. A guide portion 7 is formed on the inner side surface of the.

The specific shape of the positioning piece 6 is shown in FIG.
As shown in FIG. 3, a substantially L-shaped member is erected in a plan view in the vicinity of the four corners of the socket body 1, and a guide portion that projects in a planar shape with a predetermined width on the inner side surface of the substantially L-shaped member. 7 is formed, and a guide surface 8 inclined from the outer side to the inner side is formed in an upper portion continuous with the guide portion 7. The guide surface 8 guides the IC package 4 toward the center when the IC package 4 is dropped into the placing portion 5. The guide portion 7 can contact the outer surface of the IC package 4 and positions the IC package 4. The spacing between the guide portions 7, 7 facing each other of the positioning pieces 6 standing on the four corners is set to be slightly larger than the length and width of the IC package 4, and a predetermined tolerance is set. .

[0005]

However, in such a conventional socket for electric parts, the guide portion 7 of the positioning piece 6 of the socket body 1 is formed in a flat shape with a predetermined width. As shown in FIG. 7, when positioning the IC package 4, the guide portion 7 is in surface contact with the outer surface of the IC package 4 for positioning. In this case, there is no problem when the shape of the guide portion 7 is not deformed and is properly projected, but since the positioning piece 6 is a molded product, the positioning piece 6 is deformed, falls, or is affected by surface roughness. There were times when it appeared.

For example, in the plan view shown in FIG. 9A, the guide portion 7 may be deformed inward as shown by a broken line. In this case, the position of contact with the outer surface of the IC package 4 located inside thereof changes, and the guide portion 7 having a predetermined width comes into contact only with the outermost width side, and the initially set guide dimension changes. It was something to do. Also,
In the state of the front view shown in FIG. 9B, the guide portion 7 may tilt inward as shown by a broken line. In this case, the interval at which the IC packages 4 dropped inside of them pass is changed to the uppermost end of the guide portion 7, and the initially set guide dimension is changed. Further, when the surface of the guide portion 7 has surface roughness, the most protruding portion of the surface roughness regulates the guide dimension, and the guide dimension initially set changes as in the above. there were.

When the guide dimension of the guide portion 7 is changed as described above and the guide dimension is narrower than the initially set guide dimension, the IC package 4 is not placed on the placing portion 5, and the electric component is not mounted. Can no longer be held in the socket. Further, when the guide dimension becomes larger than the initially set guide dimension, the IC package 4 cannot be properly positioned by the mounting portion 5, and the connection terminal of the IC package 4 must be properly brought into contact with the contact pin. Can not be. Particularly, in the recent IC package 4, the pitch of the connection terminals such as leads, pins and balls is narrowed due to the high integration of the device, and the tolerance of the guide dimension is set to be small. The influence of the change in the guide size due to the guide portion 7 was large.

Therefore, the present invention addresses such a problem, and provides a socket for electric parts, which stabilizes the guide size of the guide part for positioning when holding the electric part on the mounting part. To aim.

[0009]

In order to achieve the above object, the socket for electric parts according to the present invention has a mounting portion on which an electric component is mounted and which is mounted on the mounting portion. A socket body formed with a guide portion for regulating and positioning a plurality of outer surfaces of the electric component, a contact pin provided so as to be capable of contacting a connection terminal of the electric component placed on the placing portion, A holding member for holding an electric component mounted on a mounting portion in a fixed state and holding a connection terminal thereof in contact with the contact pin, in a socket for an electric component, wherein the guide portion of the socket body is an electric component. It is formed in a protruding shape that can be brought into point contact with the outer surface of the.

With this structure, the guide portion of the socket body is formed in a protruding shape so that it can be brought into point contact with the outer surface of the electric component. As a result, the portion for contacting and positioning the electric component does not largely change, and the contact is made for point-contacting at almost the same portion. Therefore, the guide size of the guide portion for positioning when holding the electric component on the mounting portion is stabilized.

Further, the guide portion of the socket body is formed at a position corresponding to a plurality of corners of the electric component mounted on the mounting portion. As a result, the electric parts are reliably positioned by the mounting portion by the plurality of guide portions.

Further, the projecting shape of the guide portion of the socket body is formed in a columnar shape having a semicircular cross section. As a result, the semi-circular columnar guide portion can come into point contact with the outer surface of the electric component.

Furthermore, the projecting shape of the guide portion of the socket body is formed in a columnar shape having a triangular cross-section. As a result, the prismatic guide portion protruding in a triangular shape can be brought into point contact with the outer surface of the electric component.

The projecting shape of the guide portion of the socket body is formed such that the columnar projecting portion has a smaller amount of upward projection than that of downward projection. As a result, even if the guide part may fall inward, the upper part guides the electric part to the mounting part without impeding the dropping of the electric part, and the lower end of the projecting guide part. Position correctly.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a front view of an electric component socket according to an embodiment of the present invention in a half-cross section, and FIG. 2 is a schematic view showing a state in which an electric component is mounted on a mounting portion of the socket body. . This socket for electric parts holds an electric part such as an IC package in a detachable manner, and is connected to another electric circuit device (test device) in a burn-in test, an electrical continuity test or the like for removing an initial defect of the IC package or the like. As shown in FIG. 1, it comprises a socket body 1, a contact pin 2, and a holding member 3.

The IC package as the electric component is
A rectangular package body enclosing a device is provided with connection terminals. Depending on the shape of the package body and the type of connection terminal, lead type, PGA (Pin Grid Array)
Type and BGA (Ball Grid Array) type. In the following description, a BG in which a large number of ball-shaped connection terminals are arranged in a matrix on the lower surface of a rectangular package body and protruded
An A-type IC package will be described as an example.

The socket body 1 is for mounting and positioning an IC package, and as shown in FIG. 2, a mounting portion 5 for mounting the IC package 4 is formed on the upper surface thereof. As an example of a specific structure, as shown in FIG.
The concave portion 10 is formed on the inner side of the upper surface of the socket body 1,
A floating plate 11 is stretched above the recessed portion 10, and the projection 1 formed in the recessed portion 10 is formed.
A spring 13 is mounted between the floating plate 11 and the floating plate 11, and the spring 13 constantly presses the floating plate 11 upward. And
The upper surface of the floating plate 11 is used as the mounting portion 5. In addition, the ball-shaped connection terminals 20 of the IC package 4 are provided in the plane of the floating plate 11.
Introducing holes 14, 14, ... (See FIG. 4) for receiving the connection terminals 20 are formed at positions corresponding to (see FIG. 4). Further, the structure of the mounting portion 5 is not limited to the above-mentioned floating type, and may be a fixed type.

Positioning pieces 6, 6, ... Are provided on the mounting portion 5 of the socket body 1. This positioning piece 6
Is to form a guide portion that regulates and positions a plurality of positions on the outer side surface of the IC package 4 placed on the placing portion 5. As shown in FIG. 2, a plurality of corner portions of the IC package 4 are formed. For example, a substantially L-shaped member in plan view is provided at positions corresponding to the four corners, and a guide portion 7'is formed on the inner side surface of the substantially L-shaped member.

The specific shape of the positioning piece 6 is shown in FIG.
As shown in FIG. 2, a substantially L-shaped member is erected in a plan view in the vicinity of the four corners of the socket body 1, and a guide portion 7'protruding on the inner side surface of the substantially L-shaped member is formed. A guide surface 8 which is inclined from the outside to the inside is formed in an upper portion continuous with the guide portion 7 '. The guide surface 8 is
When the IC package 4 is dropped into the mounting portion 5, the IC package 4 is guided to the center side. The guide portion 7'can be brought into contact with the outer surface of the IC package 4 to position the IC package 4.

Inside the socket body 1, as shown in FIG. 1, contact pins 2, 2, ... Are provided. The contact pin 2 is for contacting and electrically connecting to the connection terminal of the IC package 4 mounted on the mounting portion 5, and is made of a thin metal plate having good conductivity and elasticity. , A take-out terminal portion 2a on the base side, a fixing portion 2b to the socket body 1, an intermediate bent portion 2c partially bent in the lateral direction to effectively draw out contact elasticity, and the IC package on the tip side. And a contact main body portion 2d that contacts the connection terminal 4 of FIG. Then, the fixing portion 2b is planted in the member in the concave portion 10, and the contact main body portion 2d on the tip end side of each contact pin 2, 2, ... Is introduced into the introducing holes 14, 14 ,. It is positioned to match.

A holding member 3 is attached to the socket body 1. The holding member 3 holds the IC package 4 mounted on the mounting portion 5 in a fixed state and maintains its connection terminal in contact with the contact pin 2.
It is provided so that it can be opened and closed on the side of one side. In FIG. 1, for example, a pivot pin 15 is attached to the right side portion, and the cover-shaped holding member 3 is configured with the pivot pin 15 as a rotation center.
Is attached so that it can be opened and closed. A helical spring 16 is wound around the pivot pin 15, and both ends of the helical spring 16 are brought into contact with the right side portion of the socket body 1 and the lower surface of the holding member 3 so that elastic force The holding member 3 is always biased in the opening direction.

On the other hand, another pivot pin 17 is attached to the left side portion of the socket body 1, and a locking lever 18 is rotatably provided around the pivot pin 17. Then, the locking lever 18 is constantly urged in the upright direction by the elastic force of the other coiled spring 19 wound around the pivot pin 17, and is locked on the other end side of the holding member 3 to be closed. It is designed to be kept in a state.

Here, in the present invention, FIG. 2 and FIG.
As shown in FIG.
It is formed in a projecting shape that can be brought into point contact with the outer surface of the C package 4. That is, in FIG. 3, the guide portion 7'protruding on the inner side surface of the positioning piece 6 is formed in a columnar shape having a semicircular cross section, that is, a columnar shape. As a result, in the case of the conventional example shown in FIG.
The surface of the guide portion 7 ′ is positioned in contact with the outer surface of the guide member. However, in the case of the present invention, as shown in FIG.
As a result, the outer surface of the IC package 4 is point-contacted and positioned.

At this time, since the guide portion 7'is positioned at the most projecting portion with respect to the outer surface of the IC package 4, the portion to be positioned in contact with the IC package 4 does not change greatly, and is always kept. Almost the same portion is point-contacted for positioning. Therefore,
Even if the positioning piece 6 is deformed, collapsed, or has surface roughness, the portion for contacting and positioning the IC package 4 is hardly changed. Therefore, the positioning piece 6 is deformed or collapsed. Can be removed or reduced.

As shown in FIG. 2, the distance between the guide portions 7'and 7'of the positioning pieces 6 and 6 facing left and right or front and rear with respect to the length L of the bottom surface portion of the IC package 4. And the size (L + Δ
L). Also, although not shown, in the direction orthogonal to the length L, the distance between the guide portions 7'and 7'with respect to the width W of the bottom surface portion of the IC package 4 is set to be slightly larger than that. The size is (W + ΔW).
In this case, the dimension between the guide portions 7'and 7 '(L + ΔL)
And the clearances ΔL and ΔW of the dimension (W + ΔW) are the tolerances of the guide dimension.

Next, the use of the socket for electric parts constructed as described above will be described with reference to FIG. First, in FIG. 1, the lead-out terminal portions 2a of the contact pins 2 projecting to the lower surface side of the socket body 1 are inserted into the connection holes of the printed wiring board and soldered in advance, so that a plurality of printed wiring boards are formed on the printed wiring board. Provide sockets for electrical parts.

In this state, first, in FIG. 1, the retaining lever 3 of the socket body 1 is moved to the open position against the elastic force of the coil spring 19, so that the holding member 3 is elastically moved by the coil spring 16. And the holding member 3 is maintained in the released state. Next, the IC package 4 is held and conveyed, for example, by an automatic machine, above the socket for electric parts in which the holding member 3 is released as described above.
As shown in (a), it is dropped into the mounting portion 5 of the socket body 1 as indicated by arrow A. In this case, the IC package 4 just needs to be properly placed at a predetermined position of the placing portion 5, but the position may be slightly shifted to the left or right. In this state, the ball-shaped connection terminals 20, 20, ... That protrude to the lower surface side of the IC package 4 do not match the introduction holes 14, 14 ,.

At this time, as shown in FIG. 4B, the positioning piece 6 is moved according to the dropping of the IC package 4.
The both side ends of the IC package 4 are guided so as to slide inward by the inwardly inclined surface of the guide surface 8 formed on the upper side of the. When the IC package 4 further descends, the IC package 4 is guided toward the center by the guide of the guide surface 8 as shown in FIG. 4C.

Immediately before the IC package 4 is further lowered and placed on the placing portion 5, as shown in FIG. 4D, a cylindrical guide formed on the lower side of the positioning piece 6 is formed. The outer surface of the IC package 4 comes into contact with the portion 7 ', and the IC package 4 is automatically positioned. In this state, ΔL shown in FIG.
Positioned within the tolerance of (and ΔW) guide dimensions,
The ball-shaped connection terminals 20, 20, ... Of the IC package 4
Are correctly inserted into the introduction holes 14, 14, ... Of the socket body 1. As a result, the ball-shaped connection terminals 20, 20, ...
2, ... is surely contacted.

Next, in FIG. 1, the holding member 3 is pressed against the elastic force of the spiral spring 16 to cover the upper surface side of the IC package 4, and the other end side of the holding member 3 is covered with the spiral spring 19. The holding member 3 is closed by locking the locking lever 18 with an elastic force. As a result, the setting of the IC package 4 in the socket for electric parts is completed, and thereafter, the burn-in test, the electrical continuity test, etc. are performed on the IC package 4.

FIG. 5 is an explanatory view showing another embodiment of the projecting shape of the guide portion of the socket body 1. In this embodiment, the columnar protruding portion is formed in a shape in which the upper protruding amount is smaller than the lower protruding amount. That is, as shown in Fig. 5B, the guide portion 7 "is formed in a tapered shape (conical shape) in which the upper portion is thinner than the lower portion in a side view. In this case, the tapered portion is formed. The lower end of the guide portion 7 ″ serves as a regular guide portion for positioning the IC package 4. By doing this, FIG.
As in the conventional example described with reference to FIG. 3, even if the guide portion 7 ″ is tilted inward, the upper portion does not hinder the IC package 4 from being dropped because of its tapered shape (conical shape). The part can be positioned correctly.

FIG. 6 is an explanatory view showing still another embodiment of the projecting shape of the guide portion of the socket body 1. In this embodiment, the cross-sectional shape of the guide portion is formed in a columnar shape protruding in a triangular shape. That is, the guide portion 7c having a triangular prism shape
It was formed in. In this case, the apex portion of the triangle can be brought into contact with the outer surface of the IC package 4 by point contact, and the positioning can be performed correctly as in the guide portion 7'shown in FIG. Although illustration is omitted, similarly to FIG. 5, the columnar protruding portion may be formed in a shape in which the upper protruding amount is smaller than the lower protruding amount. That is, it may be formed in a triangular pyramid shape. In this case, similarly to the case shown in FIG. 5, even if the triangular pyramid-shaped guide portion 7c is tilted inward, the triangular pyramid shape causes the upper portion to be IC-shaped.
The positioning can be correctly performed at the lower end portion without hindering the dropping of the package 4.

In the above description, the IC package 4 as an electric component is a BGA type IC package, but the present invention is not limited to this, and a lead type IC package, a PGA type IC package, or the like may be used. The same applies to sockets for electric parts that are detachably held. In these cases, the shape and structure of the contact pin 2 and the holding member 3 are changed to those corresponding to the respective IC packages, but the shape and structure of the guide portions 7 ', 7 ", 7c of the positioning piece 6 are changed. It can be applied in exactly the same way.

[0034]

Since the present invention is constructed as described above,
According to the first aspect of the present invention, the guide portion of the socket body is formed in a projecting shape so that it can be brought into point contact with the outer surface of the electric component. As a result, it is possible to perform point-contact positioning in almost the same portion without significantly changing the portion in contact with the electric component for positioning. That is,
Even if the member on which the guide portion is formed is deformed, falls, or has surface roughness, the portion for contacting and positioning the electric component is almost unchanged, so that the member is deformed, It is possible to eliminate or reduce the influence of the occurrence of falling and the surface roughness. Therefore, it is possible to stabilize the guide size of the guide portion for positioning when holding the electric component on the mounting portion. Therefore, the electric component can be surely connected to the electric component socket, and the burn-in test, the electrical continuity test, and the like can be correctly performed.

According to the second aspect of the invention, the guide portion of the socket body is formed at a position corresponding to a plurality of corners of the electric component mounted on the mounting portion,
The electrical parts can be reliably positioned on the mounting part by the plurality of guide parts. Therefore, the electrical component can be reliably connected to the electrical component socket, and the burn-in test, the electrical continuity test, and the like can be correctly performed.

Further, according to the third aspect of the present invention, since the projecting shape of the guide portion of the socket body is formed in the shape of a column having a semicircular projecting cross section, the projecting shape of the column is a semicylindrical projecting column. The guide portion can make contact with the outer surface of the electric component by point contact.

Further, according to the invention of claim 4, the projecting shape of the guide portion of the socket body is formed in the shape of a prism having a triangular cross-section, and thus the shape of a prism having a triangular shape is formed. The guide portion can be brought into point contact with the outer surface of the electric component.

According to the fifth aspect of the invention, the projecting shape of the guide portion of the socket body is formed such that the columnar projecting portion has a smaller amount of upward projection than that of downward projection. As a result, even if the guide part may fall inward, the upper part does not hinder the dropping of the electric part and guides the electric part to the mounting part to guide the protruding part. It can be correctly positioned at the lower end of the.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of an electric component socket according to the present invention in a half-sectioned state.

FIG. 2 is a schematic view showing a state in which an electric component is placed on a placing portion of the socket body.

FIG. 3 is a perspective view showing a shape of a guide portion of the socket body.

FIG. 4 is an explanatory diagram showing a state in which an electric component is placed and positioned on a placing portion of the socket body.

FIG. 5 is an explanatory view showing another embodiment of the projecting shape of the guide portion of the socket body.

FIG. 6 is an explanatory view showing still another embodiment of the protruding shape of the guide portion of the socket body.

FIG. 7 is a schematic view showing a state in which an electrical component is placed on a placement portion of a socket body in a conventional socket for electrical components.

FIG. 8 is a perspective view showing a shape of a guide portion of the conventional socket body.

FIG. 9 is an explanatory view showing a state where a member is deformed or collapsed in the guide portion of the socket body of the conventional example.

[Explanation of symbols]

1 ... Socket body 2 ... Contact pin 3 ... Holding member 4 ... IC package 5 ... Placement part 6 ... Positioning piece 7 ', 7 ", 7c ... Guide section 8 ... Guide surface 14 ... Introduction hole 20 ... Ball-shaped connection terminal

Claims (5)

[Claims] 1. A mounting portion for mounting an electric component is formed on an upper surface thereof, and a guide portion for regulating and positioning a plurality of locations on an outer side surface of the electric component mounted on the mounting portion is formed. The socket body, the contact pin provided so as to be able to contact the connection terminal of the electric component mounted on the mounting portion, and the electric component mounted on the mounting portion are held in a fixed state, and the connection terminal is A holding member for maintaining contact with the contact pin,
In the socket for electrical parts, the socket for electrical parts is characterized in that the guide portion of the socket body is formed in a projecting shape capable of abutting pointwise contact with the outer surface of the electrical part. 2. The socket for an electric component according to claim 1, wherein the guide portion of the socket body is formed at a position corresponding to a plurality of corners of the electric component mounted on the mounting portion. . 3. The projecting shape of the guide portion of the socket body is
The socket for electric parts according to claim 1 or 2, wherein the sectional shape is formed in a columnar shape protruding in a semicircular shape. 4. The projecting shape of the guide portion of the socket body is
The socket for electric parts according to claim 1 or 2, wherein the sectional shape is formed in a columnar shape protruding in a triangular shape. 5. The projecting shape of the guide portion of the socket body is
The socket for electrical parts according to claim 3 or 4, wherein the columnar projecting portion is formed in a shape such that an upward projecting amount is smaller than a downward projecting amount.