WO2020189664A1 - Socket and inspection socket - Google Patents

Abstract

Provided are a socket and an inspection socket which can protect an exposed contact pin from damage even in a configuration in which a floating plate is not used. The socket, which electrically connects a first electric component and a second electric component to each other, comprises: an accommodation part that can accommodate the first electric component; a contact pin that is disposed on a bottom portion, in a state in which an upper contact end portion is exposed, such that the first electric component and the second electric component which are vertically separated from each other are electrically connected to each other with a bottom portion of the accommodation part interposed therebetween; and a movable member that has an abutting part which comes into contact with the first electric component to adjust the orientation of the first electric component and is vertically movable between a first position where the abutting part is above the contact end portion and a second position where the abutting part is not above the contact end portion, wherein the movable member vertically extends such that a protrusion end part protruding upward from the bottom portion constitutes the abutting part.

Description

Socket and inspection socket

The present invention relates to a socket and a socket for inspection.

Conventionally, for example, an IC socket is known as a socket for accommodating an electric component such as a so-called IC package in which an integrated circuit (IC) is packaged for electrical connection with the outside. IC sockets are used, for example, to inspect the electrical characteristics of electrical components when they are shipped and inspected.

Japanese Unexamined Patent Publication No. 2017-11188 JP-A-2002-164136

The IC socket is provided with a contact pin at the bottom of the accommodating portion for electrical connection with an electric component. In some IC sockets, the tip of the contact pin is exposed from the bottom to the electric component side (see Patent Document 1). The exposed tip of the contact pin is vulnerable to external forces. Therefore, when the electric component is accommodated in the accommodating portion of the socket, the tip of the contact pin may be damaged by rubbing with the electric component.

On the other hand, there is also an IC socket having a floating plate that prevents damage to the contact pin by accommodating and protecting the tip of the contact pin exposed from the bottom surface in the through hole (see Patent Document 2). The floating plate is mainly composed of an insulating material, and the dielectric constant of such an insulating material may affect the characteristic impedance of the contact pin.

Also, when the signal to be transmitted is a high frequency signal, the length of the contact pin may be shortened in order to match the characteristic impedance. In such a case, when a floating plate is used, it is necessary to make the floating plate thin according to the length of the contact pin. However, there is a certain limit to the thinning of the floating plate, and by extension, there is a limit to the shortening of the contact pin.

That is, a configuration that does not use a floating plate is desired.

An object of the present invention is to provide a socket and an inspection socket that can protect exposed contact pins from damage even in a configuration that does not use a floating plate.

The socket according to the present invention
A socket that electrically connects the first electrical component and the second electrical component.
A housing unit capable of accommodating the first electrical component and
To the bottom portion so as to electrically connect the first electric component and the second electric component separated in the vertical direction with the bottom portion of the accommodating portion interposed therebetween, and with the upper contact end exposed. Contact pins to be placed and
The contact has a contact portion that adjusts the posture of the first electrical component by contacting the first electrical component, and the contact portion is above the position of the contact end portion. A movable member that is movable in the vertical direction between a second position that is not above the position of the end and
With
The movable member extends in the vertical direction so that a protruding end portion protruding upward from the bottom portion constitutes the contact portion.

The inspection socket according to the present invention is
An inspection socket used for inspecting the electrical characteristics of the first electrical component.
It has the above socket.

According to the present invention, the exposed contact pins can be protected from damage even in a configuration that does not use a floating plate.

It is a perspective view which shows the socket which concerns on embodiment of this invention. It is an enlarged view which shows the accommodating part of the socket shown in FIG. 1A enlarged. It is an enlarged view which shows the part of the accommodating part of the socket shown in FIG. 1B enlarged. FIG. 1B is a cross-sectional view taken along the line AA of the accommodating portion of the socket shown in FIG. 1B, and is a cross-sectional view of an electric component. It is sectional drawing which shows the state before mounting an electric component on a movable member in the socket shown in FIG. 2A. FIG. 5 is a cross-sectional view showing a state in which an electric component is placed on a movable member in the socket shown in FIG. 2A. It is an enlarged view which shows the part of the accommodating part of the socket shown in FIG. 2C enlarged. It is a figure which shows the state which pressed the electric component in the socket shown in FIG. 2C. It is a figure which shows the accommodating part of the conventional socket, and is the cross-sectional view which shows an example which a contact pin is damaged. It is an enlarged view which shows the part of the accommodating part of the socket shown in FIG. 3A enlarged. It is a figure which shows the accommodating part of the conventional socket, and is the cross-sectional view which shows another example which a contact pin is damaged. It is an enlarged view which shows the part of the accommodating part of the socket shown in FIG. 4A enlarged. It is sectional drawing which shows an example of the case where the electric component is tilted at the time of accommodating in the accommodating part in the socket shown in FIG. 2A. It is sectional drawing which shows another example of the case where the electric component is tilted when accommodating in the accommodating part in the socket shown in FIG. 2A. It is a figure which shows the movable member in the socket shown in FIG. 2A. It is a figure which shows the movable member which does not have a protrusion. It is a figure which shows another example of the movable member shown in FIG. 6A. It is a figure which shows the accommodating part of the socket which concerns on the modification 1 of the Embodiment of this invention, and is the cross-sectional view which shows the case where the electric component is tilted at the time of accommodating in the accommodating part. It is an enlarged view which shows the part of the accommodating part of the socket shown in FIG. 7A enlarged. FIG. 5 is a cross-sectional view showing a case where an inclined electric component moves on a movable member in the socket shown in FIG. 7A. It is an enlarged view which shows the part of the accommodating part of the socket shown in FIG. 7C enlarged. FIG. 5 is a cross-sectional view showing a state in which an electric component is placed on a movable member in the socket shown in FIG. 7A. It is an enlarged view which shows the part of the accommodating part of the socket shown in FIG. 7E enlarged. FIG. 5 is a cross-sectional view showing still another example of a case where an electric component is tilted when being housed in a housing portion in the socket shown in FIG. 2A. It is an enlarged view which shows the part of the accommodating part of the socket shown in FIG. 8A enlarged. It is a figure which shows the accommodating part of the socket which concerns on the modification 2 of the Embodiment of this invention, and is the cross-sectional view which shows the case where the electric component is tilted at the time of accommodating in the accommodating part. 9 is a cross-sectional view showing a state in which an electric component is placed on a movable member in the socket shown in FIG. 9A.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

In the present embodiment, as an example of the socket, an inspection socket for inspecting the electrical characteristics of an electric component is illustrated. In this inspection, various tests are performed on the electric components to be inspected. For example, it is investigated whether or not the electric component operates properly in the same environment as the actual usage environment of the electric component or in an environment where the load is higher than the actual environment.

The socket according to the present embodiment is an IC socket whose inspection target is an IC package, but the electric component to be inspected by the socket may be an electric component different from the IC package. ICs are electronic circuits and include, for example, transistors, resistors, capacitors and inductors interconnected on a silicon substrate.

Further, the socket according to the present embodiment can be applied to other uses as long as it electrically connects the electric parts housed inside and the electric parts outside. An example of another application is the secure installation of internal and external electrical components. In this application, the socket is soldered onto an external circuit board, followed by the socket of an IC chip (eg, an electronic circuit that includes transistors, resistors, capacitors and inductors interconnected on a silicon substrate). Insert and house inside. As a result, the IC chip can be protected from damage due to heat during soldering. In this case, the socket serves as a place for placing the IC chip and is a component for safe insertion and removal of the IC chip.

FIG. 1A is a perspective view showing the IC socket 20A according to the present embodiment. Further, FIG. 1B is an enlarged view showing the accommodating portion 21 of the IC socket 20A shown in FIG. 1A in an enlarged manner. Further, FIG. 1C is an enlarged view showing a part of the accommodating portion 21 of the socket shown in FIG. 1B in an enlarged manner. 2A is a cross-sectional view taken along the line AA of the accommodating portion 21 of the IC socket 20A shown in FIG. 1B, and is a cross-sectional view of the electric component 10A.

(Configuration of IC socket according to this embodiment)
The IC socket 20A has an accommodating portion 21, contact pins 23a and 23b, and movable members 31 and 33.

(Accommodation)
The accommodating portion 21 can accommodate the electric component 10A. The accommodating portion 21 has a base portion 22 and a frame portion 25. In the present embodiment, the base portion 22 and the frame portion 25 constituting the accommodating portion 21 are separate members, but the base portion 22 and the frame portion 25 may be integrally formed. In short, the accommodating portion 21 may have a configuration capable of accommodating the electric component 10A. The electric component 10A is an example of the first electric component, and is an IC package in the present embodiment.

The base portion 22 is, for example, a flat member having a thickness, and constitutes the bottom portion of the accommodating portion 21. Specifically, the upper surface of the base portion 22 is the bottom surface 21a of the accommodating portion 21. In the present embodiment, the thickness direction of the base 22 is referred to as the vertical direction, and hereinafter, "upper" and "lower" indicate upper and lower in the vertical direction.

The base portion 22 is provided with a plurality of through holes penetrating in the vertical direction, and contact pins 23a and 23b, which will be described later, are inserted through these through holes. The base 22 holds the contact pins 23a and 23b inserted through the through holes so as not to fall off. Since a known technique can be applied to the holding of the contact pins 23a and 23b in the through hole, detailed description thereof will be omitted here.

Further, the base portion 22 is provided with a plurality of recesses 26 having a bottom and opening upward, and movable members 31 and 33, which will be described later, are inserted into these recesses 26.

The frame portion 25 is a frame body that surrounds the central portion and is opened in the vertical direction, and constitutes the outer peripheral portion of the accommodating portion 21. Specifically, the inner peripheral surface of the frame portion 25 becomes the inner wall 21b of the accommodating portion 21. The opening shape of the central portion of the frame is rectangular as an example.

When the IC socket 20A is used, the electric component 10A is housed in the housing section 21, and the housed electrical component 10A and the circuit board 40 attached below the base 22 are electrically connected. The circuit board 40 is an example of a second electric component, and in the present embodiment, it is a circuit board of a test device for performing the various tests described above.

A plurality of guide portions 24 for guiding the electric component 10A to the correct position of the accommodating portion 21 are provided on the inner peripheral side of the frame portion 25, that is, on the inner wall 21b of the accommodating portion 21. Here, two guide portions 24 are provided on each inner wall 21b. Each guide portion 24 is inclined with respect to a positioning surface 24a for positioning the end portion of the electric component 10A in the accommodating portion 21 and the positioning surface 24a to guide the end portion of the electric component 10A to the positioning surface 24a. It has a surface 24b.

In the present embodiment, a plurality of solder balls 11a and 11b are provided on the lower surface of the electric component 10A. The solder ball 11a is a terminal for supplying power to supply power to the electronic circuit in the electric component 10A, and the solder ball 11b is a terminal for signal transmission for transmitting a signal with the electronic circuit. Here, as an example, a solder ball 11a for power supply is arranged inside (center side) of the electric component 10A, and a solder ball 11b for signal transmission is arranged outside the solder ball 11a. Further, here, some solder balls 11a and 11b are illustrated.

In the present embodiment, the BGA (Ball Grid Array) type IC is illustrated as the electrical component 10A, but other types such as the LGA (Land Grid Array) type may be used.

The electric component 10A housed in the accommodating portion 21 and positioned in the accommodating portion 21 by the guide portion 24 is pressed by a pressing member or the like (not shown). By this pressing, the upper and lower tips (an example of the contact end) of the contact pins 23a and 23b, which will be described later, are in pressure contact with the solder balls 11a and 11b and the terminal 41 of the circuit board 40, respectively, thereby ensuring a reliable electrical connection. Is formed.

(Contact pin)
The contact pins 23a and 23b electrically connect the electric component 10A and the circuit board 40. The contact pins 23a and 23b are made of a conductive material. When the IC socket 20A is used, the contact ends above the contact pins 23a and 23b (hereinafter, simply referred to as "upper contact ends") come into contact with the solder balls 11a and 11b (see FIG. 2E and the like). Further, the lower contact ends of the contact pins 23a and 23b (hereinafter, simply referred to as "lower contact ends") come into contact with the terminal 41 of the circuit board 40 (see FIG. 2E and the like).

As shown in FIG. 2A, the contact pins 23a and 23b are provided so as to penetrate the base 22 in the vertical direction, whereby the electrical components 10A and the circuit board that are vertically separated from each other with the base 22 interposed therebetween. 40 is electrically connected. In addition, in FIG. 2A and the like, some contact pins 23a and 23b are shown, and some other contact pins are omitted for simplification.

Examples of the configuration of the contact pins 23a and 23b themselves include a configuration in which the plunger is projected from the upper and lower openings of the tubular body (barrel), respectively, because known techniques can be applied to this configuration. , The detailed description thereof will be omitted.

When a high-frequency signal is transmitted between the electric component 10A and the circuit board 40, the contact pin 23b is configured as a coaxial line and the length of the contact pin 23b is shortened in order to match the characteristic impedance. Is desirable.

The contact pins 23a and 23b are provided corresponding to the configuration of the electrical component 10A to be inspected. In the present embodiment, the contact pins 23a and 23b are provided corresponding to the configuration (number, arrangement, etc.) of the solder balls 11a and 11b of the electric component 10A. Specifically, the contact pins 23a and 23b are the contact pin 23a for power supply provided corresponding to the solder ball 11a for power supply and the signal provided corresponding to the solder ball 11b for signal transmission. Includes a contact pin 23b for transmission. The contact pin 23a for power supply is an example of the first contact pin, and the contact pin 23b for signal transmission is an example of the second contact pin.

In the present embodiment, the arrangement area of the solder balls 11a and the arrangement area of the solder balls 11b are separated in the electric component 10A. Therefore, according to this division, a region R1 in which the contact pin 23a for power supply is arranged and a region R2 in which the contact pin 23b for signal transmission are arranged are formed in the base portion 22 which is the bottom of the accommodating portion 21. Has been done. Specifically, the inside (center side) of the accommodating portion 21 is the region R1 of the contact pin 23a for power supply, and the outside (that is, the outer peripheral side of the accommodating portion 21) is the region R2 of the contact pin 23b for signal transmission. ing.

The tips (upper contact ends) of the contact pins 23a and 23b on the electrical component 10A side are exposed upward from the bottom surface 21a (upper surface of the base 22) of the accommodating portion 21. Further, the tips (lower contacts) of the contact pins 23a and 23b on the circuit board 40 side are exposed downward from the lower surface 22a of the base portion 22.

(Movable member)
The movable members 31 and 33 adjust the posture of the electric component 10A in the accommodating portion 21. The adjustment of the posture of the electric component 10A means that when the electric component 10A inserted into the accommodating portion 21 is tilted with respect to the bottom surface 21a, the tilt is reduced before the electric component 10A comes into contact with the contact pins 23a and 23b. It is preferably parallel to the bottom surface 21a. These movable members 31, 33 are formed of an insulating material.

The movable member 31 is provided in a plurality of recesses 26 formed in the base portion 22 which is the bottom surface 21a of the accommodating portion 21. The movable member 31 is inserted into the recess 26 so as to be movable in the vertical direction. A spring 32 (a urging member) is housed inside the recess 26, and the spring 32 urges the movable member 31 upward. A member different from the spring may be used as the member for applying the upward urging force to the movable member 31, but the coil spring illustrated in the present embodiment (see FIG. 2A and the like) has a simple configuration. It is preferable in that it is possible to give sufficient urging force.

Further, the movable member 31 extends in the vertical direction and protrudes upward from the base portion 22 (bottom surface 21a of the accommodating portion 21). The movable member 31 has an upper surface 31a at the tip (protruding end) of a portion protruding upward from the base 22. The upper surface 31a has a first position P1 (see FIG. 2D described later) above the positions of the upper contact ends of the contact pins 23a and 23b and a second position P2 (described later) not above the positions of the upper contact ends. It is configured to be movable in the vertical direction with and from FIG. 2E). That is, when an external force (specifically, a pressing force by the pressing member via the electric component 10A) is received from above, the spring 32 is compressed, and the upper surface 31a (movable member 31) moves downward. Further, when the external force from above is reduced or eliminated, the compressed spring 32 is restored, so that the upper surface 31a (movable member 31) moves upward. The movable member 31 is formed by abutting the upper surface 31a on the lower surface of the electric component 10A and by applying a reaction force due to the urging force of the spring 32 generated to the pressure from the electric component 10A to the electric component 10A. , Adjust the posture of the electric component 10A in the accommodating portion 21.

That is, the upper surface 31a, which is the tip of the movable member 31, constitutes a contact portion that abuts on the lower surface of the electric component 10A so as to adjust the posture of the electric component 10A.

Here, the first position P1 is a vertical position of the upper surface 31a when the movable member 31 is not pressed from above via the electric component 10A. In this case, since the movable member 31 does not receive an external force from above, the first position P1 of the upper surface 31a is the position farthest from the bottom surface 21a. Assuming that the direction upward from the bottom surface 21a is the height direction, the first position P1 is the position where the top surface 31a is the highest and is higher than the upper contact ends of the contact pins 23a and 23b. When the upper contact ends of the contact pins 23a and 23b are movable in the vertical direction, the first position P1 is higher than the uppermost position of the upper contact ends.

On the other hand, at the second position P2, the accommodated electric component 10A is pressed downward, the movable member 31 is pressed downward, and the solder balls 11a and 11b are in contact with the upper contact ends of the contact pins 23a and 23b ( This is the vertical position of the upper surface 31a when pressure welding is performed. The second position P2 is a position lower than the first position P1 and is at the same height as or lower than the upper contact ends of the contact pins 23a and 23b. When the upper contact ends of the contact pins 23a and 23b are movable in the vertical direction, the second position P2 is above and below the upper contact ends when they come into contact with (press contact) the solder balls 11a and 11b. It is a position at the same height as the directional position or a position lower than that.

With the above configuration, the movable member 31 maintains the upper surface 31a at the first position P1 or a position in the vicinity thereof until the accommodated electric component 10A is pressed downward. As described above, the first position P1 is higher than the position of the upper contact end portion of the contact pins 23a and 23b. Therefore, the movable member 31 supports the electric component 10A so as to form a gap between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b. That is, the upper surface 31a at the first position P1 comes into contact with the electric component 10A, so that the posture of the electric component 10A is adjusted. The adjustment of the posture of the electric component 10A by the upper surface 31a will be described later with reference to FIG. 5A.

Although detailed illustration is omitted, the movable member 33 has the same configuration as the movable member 31 except for the arrangement position. That is, the movable member 33 is provided in a plurality of recesses 26 formed in the base portion 22, and the movable member 33 is inserted into the recesses 26 so as to be movable in the vertical direction. A spring 32 is housed inside the recess 26, and the spring 32 urges the movable member 33 upward. A member different from the spring may be used as the member for applying the upward urging force to the movable member 33, but the coil spring illustrated in the present embodiment has a simple configuration and provides a sufficient urging force. It is preferable in that it can be imparted.

Further, the movable member 33 extends in the vertical direction and protrudes upward from the base 22. The movable member 33 has an upper surface 33a at the tip (protruding end) of a portion protruding upward from the base 22. The upper surface 33a can move in the vertical direction between the first position P1 which is above the position of the upper contact end of the contact pins 23a and 23b and the second position P2 which is not above the position of the upper contact end. It is configured. That is, when an external force (specifically, a pressing force by the pressing member via the electric component 10A) is received from above, the spring 32 is compressed, and the upper surface 33a (movable member 33) moves downward. Further, when the external force from above is reduced or eliminated, the compressed spring 32 is restored, so that the upper surface 33a (movable member 33) moves upward. The movable member 33 is formed by abutting the upper surface 33a on the lower surface of the electric component 10A and by applying a reaction force due to the urging force of the spring 32 generated to the pressure from the electric component 10A to the electric component 10A. , Adjust the posture of the electric component 10A in the accommodating portion 21.

With the above configuration, the movable member 33 also maintains the upper surface 33a at the first position P1 or a position in the vicinity thereof until the accommodated electric component 10A is pressed downward. As described above, the first position P1 is higher than the position of the upper contact end portion of the contact pins 23a and 23b. Therefore, the movable member 33 supports the electric component 10A so as to form a gap between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b. That is, the upper surface 33a at the first position P1 comes into contact with the electric component 10A, so that the posture of the electric component 10A is adjusted. The adjustment of the posture of the electric component 10A by the upper surface 33a will be described later with reference to FIG. 5B.

In the present embodiment, the first position P1 by the upper surface 31a of the movable member 31 and the first position P1 by the upper surface 33a of the movable member 33 are the same position. Further, the second position P2 by the upper surface 31a of the movable member 31 and the second position P2 by the upper surface 33a of the movable member 33 are at the same position.

Further, the movable members 31 are provided at four locations in the region R2 on the bottom surface 21a so as to be along the circumferential direction of the region R2 (see FIGS. 1A to 1C). The four movable members 31 are arranged so that the distances between the movable member 31 and the four corners of the accommodating portion 21 that are closest to the movable member 31 are equal. When considering the characteristic impedance of the contact pin 23b, it is desirable to provide the movable member 31 in the region R1 or in the region R3 between the region R1 and the region R2.

Further, the movable members 33 are provided at eight locations in the region R4 on the bottom surface 21a so as to be along the circumferential direction of the region R4 outside the region R1. In FIGS. 1A to 1C, all the movable members 33 are not shown, but the movable members 33 are provided at two places between the two guide portions 24 of one inner wall 21b, and are provided at a total of eight places. Has been done. The eight movable members 33 are arranged so that the distances between the movable member 33 and the four corners of the accommodating portion 21 that are closest to the movable member 33 are equal.

As described above, on the bottom surface 21a of the accommodating portion 21, the movable member 33 is arranged on the outer peripheral side, the movable member 31 is arranged inside the movable member 33, and the movable members 31 and 33 project upward from different positions. It is arranged to do.

Further, the movable member 31 and the movable member 33 have a cylindrical shape as an example, but are not limited to this, and may be, for example, an elliptical pillar shape or a polygonal pillar shape. Further, the upper surface 31a of the movable member 31 and the upper surface 33a of the movable member 33 have a size capable of supporting the region of the bottom surface where the solder balls 11a and 11b are not formed in the electric component 10A.

The configuration of the IC socket 20A according to the present embodiment has been described above.

Next, the action and effect of the above-described configuration are divided into a case where the electric component 10A is accommodated in the accommodating portion 21 without tilting and a case where the electric component 10A is accommodated in the accommodating portion 21 at an angle, and is appropriately referred to the prior art. I will explain it with a comparative explanation.

(When the electric component 10A is accommodated in the accommodating portion 21 without tilting)
In the IC socket 20A provided with the movable members 31 and 33 having the above-described configuration, the case where the electric component 10A is accommodated in the accommodating portion 21 without tilting will be described with reference to FIGS. 2B to 2E together with FIG. 2A. ..

The electric component 10A is arranged above the accommodating portion 21 of the IC socket 20A and is moved downward from that position (see FIGS. 2A and 2B). At this time, if the positions of the electric components 10A with respect to the accommodating portion 21 are aligned, as shown in FIGS. 2C and 2D, the end portion of the electric components 10A fits inside the positioning surface 24a, and the electric components 10A It is accommodated in the accommodating portion 21 without tilting. At this time, the upper surface 31a of the movable member 31 and the upper surface 33a of the movable member 33 are in the first position P1 due to the urging force of the spring 32, which is higher than the positions of the upper contact ends of the contact pins 23a and 23b. Therefore, the electric component 10A is placed on the upper surface 31a and the upper surface 33a, and the electric component 10A is supported by the upper surface 31a and the upper surface 33a.

In this way, when the electric component 10A is accommodated in the accommodating portion 21 without being tilted, the electric component 10A is supported by the plurality of upper surfaces 31a and 33a, so that the lower surface of the electric component 10A is accommodated on the bottom surface 21a of the accommodating portion 21. Will be supported in parallel with. Further, at this time, the plurality of upper surfaces 31a and 33a maintain a state in which the solder balls 11a and 11b are separated from the upper contact ends of the contact pins 23a and 23b by the urging force of the spring 32. Therefore, as shown in FIGS. 2C and 2D, a gap is formed between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b.

After that, when the electric component 10A is pressed, the plurality of movable members 31 and the movable member 33 move in the pressed direction together with the electric component 10A. At this time, the positions of the solder balls 11a and 11b and the contact pins 23a and 23b are aligned with each other in a direction parallel to the bottom surface 21a of the accommodating portion 21 (hereinafter, referred to as a plane direction for convenience) by the positioning surface 24a. Therefore, the solder balls 11a and 11b come into contact with the contact pins 23a and 23b from the pressing direction assumed in the design (see FIG. 2E).

Then, when the upper surface 31a and the upper surface 33a are lowered to the second position P2 by pressing the electric component 10A, the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b come into contact with each other and electrically. It will be connected.

(When the electric component 10A is tilted and accommodated in the accommodating portion 121)
First, in the conventional IC socket, the case where the electric component 10A is tilted and accommodated in the accommodating portion 121 will be described with reference to FIGS. 3A to 4B. Reference numeral 140 in FIGS. 3A to 4B is a circuit board.

FIG. 3A is a view showing the accommodating portion 121 of the conventional IC socket 120, and is a cross-sectional view showing an example in which the contact pin 123 is damaged, and FIG. 3B is an enlarged view thereof. As shown in FIG. 3A, in the accommodating portion 121 of the IC socket 120, a contact pin 123 is provided on the base portion 122 which is the bottom portion thereof so that the upper contact end portion is exposed. Further, on the inner wall of the accommodating portion 121, a guide portion 124 for guiding the electric component 10A to the correct position of the accommodating portion 121 is provided.

In the IC socket 120 having such a configuration, as shown in FIG. 3A, when the electric component 10A is accommodated in the accommodating portion 121, one end of the electric component 10A gets on the guide portion 124, and the electric component 10A May be tilted.

In this case, the electric component 10A is guided by the guide unit 124 by its own weight and moves in the direction indicated by the arrow. At the time of this movement, as shown in FIG. 3B, when the solder ball 11b of the electric component 10A is on the contact pin 123, the solder ball 11b moves by rubbing the upper contact end of the contact pin 123. become. As a result, the upper contact end of the contact pin 123 and the solder ball 11b are damaged.

Further, FIG. 4A is a view showing the accommodating portion 121 of the conventional IC socket 120, and is a cross-sectional view showing another example in which the contact pin 123 is damaged, and FIG. 4B is an enlarged view thereof. Here, as shown in FIG. 4A, when the electric component 10A is accommodated in the accommodating portion 121, one end of the electric component 10A rides on the guide portion 124, and the electric component 10A is in an inclined state. To do.

In this case as well, the electric component 10A is guided by the guide unit 124 due to its own weight and moves in the direction indicated by the arrow. During this movement, as shown in FIG. 4B, when the solder balls 11b of the electric component 10A are in a state of falling between the contact pins 123, the solder balls 11b are caught on the upper contact end of the contact pins 123 and are moved upward. It will move by rubbing the end of the contact. As a result, the upper contact end of the contact pin 123 and the solder ball 11b are damaged.

As described above, in the conventional IC socket 120, when the electric component 10A is tilted and accommodated in the accommodating portion 121, the upper contact end portion of the contact pin 123 and the solder ball 11b are damaged by the electric component 10A.

Compared to such a conventional IC socket 120, the IC socket 20A of the present embodiment includes a plurality of movable members 31 and 33. When the electric component 10A is accommodated in the accommodating portion 21, if one end of the electric component 10A rides on the guide portion 24 and the electric component 10A is tilted, a part of the electric component 10A can be moved. It is supported by the upper surface 31a of the member 31 and the upper surface 33a of the movable member 33.

Consider a case where the electric component 10A is supported by the upper surface 31a of a part of the movable members 31 when the electric component 10A is tilted. In this case, the end portion of the electric component 10A on the side close to the bottom surface 21a of the accommodating portion 21 and the portion inside the end portion is supported by the upper surface 31a of the movable member 31 on the end portion side. At this time, the upper surface 31a of the movable member 31 is at the first position P1 due to the urging force of the spring 32, which is higher than the positions of the upper contact ends of the contact pins 23a and 23b.

In addition, the movable member 31 is arranged at a position where a gap can be formed between the solder balls 11a and 11b of the tilted electric component 10A and the upper contact ends of the contact pins 23a and 23b. For example, the movable member 31 may be positioned as close as possible to the inner wall 21b of the accommodating portion 21 in the plane direction. By forming the movable member 31 as described above, a gap is formed between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b as shown in FIG. 5A.

Further, consider a case where the electric component 10A is supported by the upper surface 33a of a part of the movable members 33 when the electric component 10A is tilted. In this case, the end portion of the electric component 10A on the side close to the bottom surface 21a of the accommodating portion 21 is supported by the upper surface 33a of the movable member 33 on the end portion side. At this time, the upper surface 33a of the movable member 33 is at the first position P1 due to the urging force of the spring 32, which is higher than the positions of the upper contact ends of the contact pins 23a and 23b. Therefore, as shown in FIG. 5B, a gap is formed between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b.

In this way, the upper surfaces 31a and 33a at the first position P1 come into contact with the electric component 10A, so that the electric component 10A is positioned as parallel as possible to the bottom surface 21a of the accommodating portion 21. Is being adjusted. As a result, a gap is formed between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b.

After that, one end of the electric component 10A is guided by the inclined surface 24b of the guide portion 24, and the electric component 10A moves in the direction indicated by the arrow. As a result, the end portion of the electric component 10A moves to the position of the positioning surface 24a and is supported by the upper surface 31a of the plurality of movable members 31 and the upper surface 33a of the movable member 33 as shown in FIG. 2C. .. Even during this movement, the upper surfaces 31a and 33a maintain a state in which there is a gap between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b.

After this movement, the electric component 10A is supported by the upper surface 31a of the plurality of movable members 31 and the upper surface 33a of the movable member 33, so that the electric component 10A becomes parallel to the bottom surface 21a of the accommodating portion 21. Even in this state, the upper surfaces 31a and 33a maintain a state in which there is a gap between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b. At this time, the positions of the solder balls 11a and 11b and the positions of the contact pins 23a and 23b coincide with each other in the plane direction.

After that, when the electric component 10A is pressed, the plurality of movable members 31 and the movable member 33 move in the pressed direction together with the electric component 10A. At this time, the positions of the solder balls 11a and 11b and the positions of the contact pins 23a and 23b coincide with each other in the plane direction. Therefore, the solder balls 11a and 11b come into contact with the contact pins 23a and 23b from the pressing direction assumed in the design (see FIG. 2E). That is, unlike the conventional case, the solder balls 11a and 11b do not move by rubbing the upper contact ends of the contact pins 23a and 23b. As a result, the upper contact ends of the contact pins 23a and 23b can be protected from the electric component 10A.

Then, when the upper surface 31a and the upper surface 33a are lowered to the second position P2 by pressing the electric component 10A, the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b come into contact with each other and electrically. It will be connected.

As described above, in the present embodiment, the IC socket 20A includes a plurality of movable members 31 and movable members 33 that adjust the posture of the electric component 10A at the time of accommodation. The upper surfaces 31a and 33a of the movable members 31 and 33 have a first position P1 that is above the position of the upper contact end of the contact pins 23a and 23b and a second position P2 that is not above the position of the upper contact end. It is possible to move up and down between. The upper surfaces 31a and 33a of the movable members 31 and 33 come into contact with the electric component 10A to adjust the posture of the electric component 10A.

According to the present embodiment configured in this way, when the electric component 10A is accommodated in the accommodating portion 21, even if the electric component 10A is tilted, the plurality of movable members 31 and the movable member 33 are electrically operated. Adjust the posture of component 10A. As a result, the upper contact ends of the contact pins 23a and 23b exposed upward can be protected from the electric component 10A. As a result, in the IC socket 20A, the lengths of the contact pins 23a and 23b can be shortened by the amount that the above-mentioned floating plate is unnecessary, and the signal quality characteristics can be improved by matching the characteristic impedances. ..

The movable members 31 and 33 may have the configuration shown in FIG. 6C. 6C will be described with reference to FIGS. 6A and 6B.

As shown in FIG. 6A, the movable member 31 has a main body 31b having an upper surface 31a, a collar portion 31c provided below the main body 31b and slidably supported inside the recess 26, and a lower portion of the collar portion 31c. It is provided with a protruding portion 31d (holding portion) that protrudes downward. As described above, the movable member 31 extends in the vertical direction and has an upper surface 31a protruding upward from the base portion 22 (bottom surface 21a of the accommodating portion 21). Further, the protruding portion 31d is press-fitted into the inside of the spring 32 to hold the spring 32. Since the movable member 33 has the same configuration, the illustration and description thereof are omitted here.

FIG. 6B is a diagram showing a movable member 51 including an upper surface 51a, a main body 51b, and a collar portion 51c. That is, it is a configuration in which the protruding portion 31d is removed from the movable member 31. As described above, the movable member 51 does not have the protruding portion 31d shown in FIG. 6A, and the spring 32 is in contact with the lower surface 51d of the movable member 51 to apply an urging force to the movable member 51. ..

On the other hand, in the movable member 31 shown in FIG. 6A, since the spring 32 is press-fitted into the protruding portion 31d, there is no possibility that the spring 32 is sandwiched between the recess 26 and the flange portion 31c, and the movable member 31 is pressed. It can be moved smoothly.

Then, instead of the movable member 31 (movable member 33) shown in FIG. 6A, the movable member 61 shown in FIG. 6C may be used. Further, instead of the movable members 34 and 35 described later, the same configuration as the movable member 61 shown in FIG. 6C may be used.

As shown in FIG. 6C, the movable member 61 includes a main body 61b having an upper surface 61a, a collar portion 61c provided below the main body 61b and slidably supported inside the recess 26, and a lower portion of the collar portion 31c. It is provided with an insertion groove 61d (holding portion) into which the spring 32 is inserted. As described above, the movable member 61 extends in the vertical direction and has an upper surface 61a protruding upward from the base 22 (bottom surface 21a of the accommodating portion 21). Further, the spring 32 is inserted and held inside the insertion groove 61d. That is, the press-fitting work of the spring 32 becomes unnecessary. In the movable member 61, since the spring 32 is inserted into the insertion groove 61d, there is no possibility that the spring 32 is caught in the gap between the recess 26 and the flange portion 61c, and the movable member 61 can be moved smoothly.

[Modification 1]
This modification is different from the above embodiment in that the first position of the upper surface of the movable member on the outer peripheral side is lower than the first position of the upper surface of the inner movable member.

(Structure of Modification 1)
This modification will be described with reference to FIGS. 7A and 7B. Here, FIG. 7A is a view showing the accommodating portion 21 of the IC socket 20B according to the present modification, and is a cross-sectional view showing a case where the electric component 10A is tilted when accommodating in the accommodating portion 21. Further, FIG. 7B is an enlarged view showing a part of the accommodating portion 21 of the IC socket 20B shown in FIG. 7A in an enlarged manner. In the following, the same components as those of the IC socket 20A described above will be designated by the same reference numerals, and duplicate description will be omitted.

In this modification, as shown in FIGS. 7A and 7B, the IC socket 20B includes a plurality of movable members 31 (second movable member) and movable member 34 (first movable member). The movable member 34 is provided in place of the movable member 33 on the outer peripheral side of the IC socket 20A, and the first position P3 by the upper surface 34a of the movable member 34 is the first position P1 by the upper surface 33a of the movable member 33. Are in different positions. The movable member 34 is also formed of an insulating material.

Although detailed illustration is omitted, the movable member 34 has the same configuration as the movable member 33 except for the height. That is, the movable member 34 is provided in a plurality of recesses 26 formed in the base portion 22, and the movable member 34 is inserted into the recesses 26 so as to be movable in the vertical direction. A spring 32 is housed inside the recess 26, and the spring 32 urges the movable member 34 upward. A member different from the spring may be used as the member for applying the upward urging force to the movable member 34, but the coil spring illustrated in the present embodiment has a simple configuration and provides a sufficient urging force. It is preferable in that it can be imparted.

Further, the movable member 34 extends in the vertical direction and protrudes upward from the base 22. The movable member 34 has an upper surface 34a at the tip (protruding end) of a portion protruding upward from the base 22. The upper surface 34a can move in the vertical direction between the first position P3 which is above the position of the upper contact end of the contact pins 23a and 23b and the second position P2 which is not above the position of the upper contact end. It is configured. Although the second position P2 is not shown in FIGS. 7A and 7B, and FIGS. 7C to 7F described later, it has the same meaning as the above-mentioned second position P2. The explanation will be given using P2.

With the above configuration, the movable member 34 also maintains the upper surface 34a at the first position P3 or a position in the vicinity thereof until the accommodated electric component 10A is pressed downward. As described above, the first position P3 is higher than the position of the upper contact end portion of the contact pins 23a and 23b. Therefore, the movable member 34 supports the electric component 10A so as to form a gap between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b. That is, when the upper surface 34a at the first position P3 comes into contact with the electric component 10A, the posture of the electric component 10A is adjusted.

In addition, the first position P3 on the upper surface 34a of the movable member 34 is different from the first position P1 on the upper surface 33a of the movable member 33, and is also different from the first position P1 on the upper surface 31a of the movable member 31. It has become. Specifically, the first position P3 by the upper surface 34a of the movable member 34 is a position lower than the first position P1 by the upper surfaces 31a and 33a of the movable members 31 and 33. That is, the first position P3 of the upper surface 34a of the movable member 34 on the outer peripheral side is lower than the first position P1 of the upper surface 31a of the movable member 31 inside. The second position P2 on the upper surface 31a of the movable member 31 and the second position P2 on the upper surface 34a of the movable member 34 are at the same position.

See FIGS. 7A-7D and 8A and 8B for lowering the first position P3 of the upper surface 34a of the outer peripheral side movable member 34 to be lower than the first position P1 of the upper surface 31a of the inner movable member 31. I will explain. FIG. 8A is a cross-sectional view showing still another example of the case where the electric component 10A is tilted when being accommodated in the accommodating portion 21 in the IC socket 20A shown in FIG. 2A. Further, FIG. 8B is an enlarged view showing a part of the accommodating portion 21 of the IC socket 20A shown in FIG. 8A in an enlarged manner.

When the electric component 10A is accommodated in the accommodating portion 21, one end of the electric component 10A may ride on the guide portion 24 and the electric component 10A may be tilted. In this case, as shown in FIGS. 8A and 8B, the electric component 10A is supported by the upper surface 31a of a part of the movable member 31, and the end portion of the electric component 10A collides with the side surface of the movable member 33 on the outer peripheral side. May be done. In this way, when the end of the electric component 10A collides with the movable member 33 on the outer peripheral side and the side surface, the electric component 10A cannot move in the direction indicated by the arrow, and the end of the electric component 10A is on the positioning surface 24a. You will not be able to move to the position.

In order to deal with such a case, in this modification, the first position P3 of the upper surface 34a of the movable member 34 on the outer peripheral side is made lower than the first position P1 of the upper surface 31a of the inner movable member 31. Therefore, as shown in FIGS. 7A to 7D, even when the electric component 10A is in an inclined state and the electric component 10A is supported by the upper surface 31a of a part of the movable member 31, the end portion of the electric component 10A Can be prevented from colliding with the side surface of the movable member 34 on the outer peripheral side.

The difference between the first position P1 on the upper surface 31a of the movable member 31 and the first position P3 on the upper surface 34a of the movable member 34 depends on the mode of the electric component 10A and the IC socket 20B. For example, it depends on the dimensions of the electric component 10A and its allowable value, the allowable values of the diameters of the solder balls 11a and 11b, the heights of the solder balls 11a and 11b, the heights of the contact pins 23a and 23b protruding from the bottom surface 21a, and the like. .. Therefore, the difference between the first position P1 of the upper surface 31a of the movable member 31 and the first position P3 of the upper surface 34a of the movable member 34 is set in consideration of these.

Further, the movable member 34 has a cylindrical shape as an example, but is not limited to this, and may be, for example, an elliptical pillar shape or a polygonal pillar shape. Further, the upper surface 34a of the movable member 34 has a size capable of supporting a region of the lower surface where the solder balls 11a and 11b are not formed in the electric component 10A.

(When the electric component 10A is accommodated in the accommodating portion 21 without tilting)
A case where the electric component 10A is accommodated in the accommodating portion 21 without being tilted in the IC socket 20B provided with the movable members 31 and 34 having the above-described configuration will be described. In this case, the operation is substantially the same as that of the IC socket 20A described above, so the description will be given with reference to FIGS. 2A, 2B and 2E, and also with reference to FIGS. 7E and 7F described later.

The electric component 10A is arranged above the accommodating portion 21 of the IC socket 20B and is moved downward from that position (see FIGS. 2A and 2B). At this time, if the position of the electric component 10A with respect to the accommodating portion 21 is aligned, the end portion of the electric component 10A fits inside the positioning surface 24a, and the electric component 10A is accommodated in the accommodating portion 21 without tilting. (See FIGS. 7E and 7F). The upper surface 31a of the movable member 31 and the upper surface 34a of the movable member 34 are in the first position P3 due to the urging force of the spring 32, but in this modification, the first position P1 of the upper surface 31a is the upper surface 34a. It is higher than the first position P3. Therefore, the electric component 10A is placed on the upper surface 31a of the plurality of movable members 31, and the electric component 10A is supported by the upper surface 31a (see FIGS. 7E and 7F).

In this way, when the electric component 10A is accommodated in the accommodating portion 21 without being tilted, the upper surface 31a of the plurality of movable members 31 supports the electric component 10A, so that the lower surface of the electric component 10A is the bottom surface of the accommodating portion 21. It will be supported in parallel with 21a. At this time, the upper surface 31a of the movable member 31 is maintained in a state in which the solder balls 11a and 11b are separated from the upper contact ends of the contact pins 23a and 23b by the urging force of the spring 32. Therefore, a gap is formed between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b (see FIGS. 7E and 7F).

After that, when the electric component 10A is pressed, the plurality of movable members 31 move in the pressed direction together with the electric component 10A, and the plurality of movable members 34 also move in the pressed direction together with the electric component 10A. Moving. At this time, the positions of the solder balls 11a and 11b and the contact pins 23a and 23b are aligned in the plane direction by the positioning surface 24a. Therefore, the solder balls 11a and 11b come into contact with the contact pins 23a and 23b from the pressing direction assumed in the design (see FIG. 2E).

Then, when the upper surface 31a and the upper surface 34a are lowered to the second position P2 by pressing the electric component 10A, the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b come into contact with each other and electrically. It will be connected.

(When the electric component 10A is tilted and accommodated in the accommodating portion 21)
The case where the electric component 10A is tilted and accommodated in the accommodating portion 21 will be described with reference to FIGS. 7A to 7F and 2E.

As shown in FIGS. 7A and 7B, the IC socket 20B of this modification includes a plurality of movable members 31 and 34, and the first position P3 by the upper surface 34a of the movable member 34 on the outer peripheral side is the movable member 31. It is lower than the first position P1 by the upper surface 31a. Therefore, when the electric component 10A is accommodated in the accommodating portion 21, if one end of the electric component 10A rides on the guide portion 24 and the electric component 10A is tilted, the electric component 10A is partially used. It is supported by the upper surface 31a of the movable member 31 of the above.

In this case, the end portion of the electric component 10A on the side close to the bottom surface 21a of the accommodating portion 21 and the portion inside the end portion is supported by the upper surface 31a of the movable member 31 on the end portion side. At this time, the upper surface 31a of the movable member 31 is at the first position P1 due to the urging force of the spring 32, which is higher than the positions of the upper contact ends of the contact pins 23a and 23b.

In addition, the movable member 31 is arranged at a position where a gap can be formed between the solder balls 11a and 11b of the tilted electric component 10A and the upper contact ends of the contact pins 23a and 23b. For example, the movable member 31 may be positioned as close as possible to the inner wall 21b of the accommodating portion 21 in the plane direction. By forming the movable member 31 as described above, as shown in FIGS. 7A and 7B, a gap is formed between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b. Become.

After that, one end of the electric component 10A is guided by the inclined surface 24b of the guide portion 24 by its own weight, and moves in the direction indicated by the arrow. As described above, the first position P3 of the upper surface 34a of the movable member 34 on the outer peripheral side is lower than the first position P1 of the upper surface 31a of the movable member 31. Further, the first position P3 of the upper surface 34a of the movable member 34 is lower than the end portion of the electric component 10A when the electric component 10A is in an inclined state. Therefore, when the electric component 10A moves in the direction indicated by the arrow, the end portion of the electric component 10A does not collide with the movable member 34 on the outer peripheral side as shown in FIGS. 7C and 7D. Therefore, the movable member 34 on the outer peripheral side does not hinder the movement of the electric component 10A.

After that, one end of the electric component 10A is further guided by the inclined surface 24b of the guide portion 24 due to its own weight, and further moves in the direction indicated by the arrow. At this time, since the movable member 34 on the outer peripheral side does not hinder the movement of the electric component 10A, the end portion of the electric component 10A moves to the position of the positioning surface 24a, and as shown in FIGS. 7E and 7F, a plurality of movable members 34 are movable. It will be supported by the upper surface 31a of the member 31. Even during this movement, the upper surface 31a maintains a state in which there is a gap between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b.

After this movement, the electric component 10A is supported by the upper surface 31a of the plurality of movable members 31, so that the electric component 10A is parallel to the bottom surface 21a of the accommodating portion 21. Even in this state, the upper surface 31a maintains a state in which there is a gap between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b. At this time, the positions of the solder balls 11a and 11b and the positions of the contact pins 23a and 23b coincide with each other in the plane direction.

After that, when the electric component 10A is pressed, the plurality of movable members 31 and the movable member 34 move together with the electric component 10A in the pressed direction. At this time, the positions of the solder balls 11a and 11b and the positions of the contact pins 23a and 23b coincide with each other in the plane direction. Therefore, the solder balls 11a and 11b come into contact with the contact pins 23a and 23b from the pressing direction assumed in the design (see FIG. 2E). That is, unlike the conventional case, the solder balls 11a and 11b do not move by rubbing the upper contact ends of the contact pins 23a and 23b. As a result, the upper contact ends of the contact pins 23a and 23b can be protected from the electric component 10A.

Then, when the upper surface 31a and the upper surface 34a are lowered to the second position P2 by pressing the electric component 10A, the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b come into contact with each other and electrically. It will be connected.

As described above, in this modified example, the IC socket 20B includes a plurality of movable members 31 and movable members 34 that adjust the posture of the electric component 10A at the time of accommodation. The upper surfaces 31a and 34a of the movable members 31 and 34 have a first position P1 that is above the position of the upper contact end of the contact pins 23a and 23b and a second position P2 that is not above the position of the upper contact end. It is possible to move up and down between. The upper surfaces 31a and 34a of the movable members 31 and 34 come into contact with the electric component 10A to adjust the posture of the electric component 10A.

According to this modified example configured in this way, when the electric component 10A is housed in the accommodating portion 21, even if the electric component 10A is in an inclined state, the plurality of movable members 31 and the movable member 34 are the electric components. Adjust the posture of 10A. As a result, the upper contact ends of the contact pins 23a and 23b exposed upward can be protected from the electric component 10A. As a result, in the IC socket 20B, the lengths of the contact pins 23a and 23b can be shortened by the amount that the above-mentioned floating plate is unnecessary, and the signal quality characteristics can be improved by matching the characteristic impedances. ..

Further, when the electric component 10A is accommodated in the accommodating portion 21, the movable member 34 on the outer peripheral side does not hinder the movement of the electric component 10A. Therefore, when the electric component 10A is accommodated in the accommodating portion 21, it is possible to prevent improper installation of the electric component 10A and deterioration of the positioning accuracy of the electric component 10A.

In the IC socket 20B of this modification, a movable member 34 is provided instead of the movable member 33 on the outer peripheral side of the IC socket 20A, but the movable member 34 may not be provided. That is, the IC socket 20B of this modification may be configured to include only the inner movable member 31 as the movable member. Also in this case, since there is no configuration that hinders the movement of the electric component 10A, the same action and effect as when the movable member 34 is provided can be obtained.

[Modification 2]
In the above embodiment, in the IC socket 20A, the plurality of movable members 31 and 33 support the electric component 10A, and in the above modification 1, in the IC socket 20B, the plurality of movable members 31 and 34 support the electric component 10A. Supports. In this modification, in the IC socket 20C, one movable member 35 supports the electric component 10B.

(Structure of Modification 2)
This modification will be described with reference to FIGS. 9A and 9B. Here, FIG. 9A is a view showing the accommodating portion 21 of the IC socket 20C according to the present modification, and is a cross-sectional view showing a case where the electric component 10B is tilted when accommodating in the accommodating portion. Further, FIG. 9B is a cross-sectional view showing a state in which the electric component 10B is placed in the IC socket 20C shown in FIG. 9A. Here, too, the same components as those of the above-mentioned electric components 10A, IC sockets 20A, and 20B are designated by the same reference numerals, and redundant description will be omitted.

In this modification, the IC socket 20C includes one movable member 35. The movable member 35 is also formed of an insulating material.

The movable member 35 is provided in one recess 27 formed at the center of the bottom surface 21a of the accommodating portion 21 in the base portion 22, and the movable member 35 is inserted into the recess 27 so as to be movable in the vertical direction. .. A spring 36 (a urging member) is housed inside the recess 27, and the spring 36 urges the movable member 35 upward. A member different from the spring may be used as the member for applying the upward urging force to the movable member 35, but the coil spring illustrated in the present embodiment (see FIG. 9A and the like) has a simple configuration. It is preferable in that it is possible to give sufficient urging force.

Further, the movable member 35 extends in the vertical direction and protrudes upward from the base 22. The movable member 35 has an upper surface 35a at the tip (protruding end) of a portion protruding upward from the base 22. The upper surface 35a can move in the vertical direction between the first position P1 which is above the position of the upper contact end of the contact pins 23a and 23b and the second position P2 which is not above the position of the upper contact end. It is configured. Although the first position P1 and the second position P2 are not shown in FIGS. 9A and 9B, they have the same meanings as the first position P1 and the second position P2 described above, and thus the first position will be used thereafter. The explanation will be given using P1 and the second position P2.

With the above configuration, the movable member 35 also maintains the upper surface 35a at the first position P1 or a position in the vicinity thereof until the accommodated electric component 10B is pressed downward. As described above, the first position P1 is higher than the position of the upper contact end portion of the contact pins 23a and 23b. Therefore, the movable member 35 supports the electric component 10B so as to form a gap between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b. That is, when the upper surface 35a at the first position P1 comes into contact with the electric component 10B, the posture of the electric component 10B is adjusted. In the electric component 10B, for example, it is assumed that the solder ball 11a is not formed in the region of the bottom surface supported by the movable member 35.

The movable member 35 has a cylindrical shape as an example, but is not limited to this, and may be, for example, an elliptical column shape or a polygonal column shape. Since the area occupied by the upper surface 35a of the movable member 35 at the bottom of the accommodating portion 21 becomes large, these shapes may be changed to these shapes, such as a circular ring, an elliptical ring, or a polygonal ring, or X. It may have a character shape.

(When the electric component 10B is accommodated in the accommodating portion 21 without tilting)
A case where the electric component 10B is accommodated in the accommodating portion 21 without tilting in the IC socket 20C provided with the movable member 35 having the above-described configuration will be described. In this case as well, the operation is substantially the same as that of the IC socket 20A described above, so the description will be made with reference to FIGS. 2A, 2B and 2E, and also with reference to FIG. 9B.

The electric component 10B is arranged above the accommodating portion 21 of the IC socket 20C and is moved downward from that position (see FIGS. 2A and 2B). At this time, if the position of the electric component 10B with respect to the accommodating portion 21 is aligned, the end portion of the electric component 10B fits inside the positioning surface 24a, and the electric component 10B is accommodated in the accommodating portion 21 without tilting. (See FIG. 9B). At this time, the upper surface 35a of the movable member 35 is at the first position P1 due to the urging force of the spring 36, which is higher than the positions of the upper contact ends of the contact pins 23a and 23b. Therefore, in this modification, the electric component 10B is placed on the upper surface 35a of the movable member 35, and the electric component 10B is supported by the entire surface of the upper surface 35a.

In this way, when the electric component 10B is accommodated in the accommodating portion 21 without tilting, the electric component 10B is supported by the entire upper surface 35a of the movable member 35, so that the lower surface of the electric component 10B is the bottom surface of the accommodating portion 21. It will be supported in parallel with 21a. At this time, the upper surface 35a of the movable member 35 maintains a state in which the solder balls 11a and 11b are separated from the upper contact ends of the contact pins 23a and 23b by the urging force of the spring 36. Therefore, a gap is formed between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b (see FIG. 9B).

After that, when the electric component 10B is pressed, the movable member 35 moves in the pressed direction together with the electric component 10B. At this time, the positions of the solder balls 11a and 11b and the contact pins 23a and 23b are aligned in the plane direction by the positioning surface 24a. Therefore, the solder balls 11a and 11b come into contact with the contact pins 23a and 23b from the pressing direction assumed in the design (see FIG. 2E).

Then, when the upper surface 35a is lowered to the second position P2 by pressing the electric component 10B, the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b are in contact with each other and are electrically connected. It becomes a state.

(When the electric component 10B is tilted and accommodated in the accommodating portion 21)
The case where the electric component 10B is tilted and accommodated in the accommodating portion 21 will be described with reference to FIGS. 9A and 9B.

The IC socket 20C of this modified example includes a movable member 35 as shown in FIGS. 9A and 9B. Therefore, when the electric component 10B is accommodated in the accommodating portion 21, if one end of the electric component 10B rides on the guide portion 24 and the electric component 10B is tilted, the electric component 10B is a movable member. It is supported by the outer edge of the upper surface 35a of the 35.

In this case, the end portion of the electric component 10B on the side close to the bottom surface 21a of the accommodating portion 21 and the portion inside the end portion is supported by the outer edge of the upper surface 35a of the movable member 35 on the end portion side. .. At this time, the upper surface 35a of the movable member 35 is at the first position P1 due to the urging force of the spring 32, which is higher than the positions of the upper contact ends of the contact pins 23a and 23b.

In addition, the movable member 35 is arranged at a position where a gap can be formed between the solder balls 11a and 11b of the tilted electric component 10B and the upper contact ends of the contact pins 23a and 23b. For example, the outer edge of the upper surface 35a of the movable member 35 may be positioned as close as possible to the inner wall 21b of the accommodating portion 21 in the plane direction. By forming the movable member 35 as described above, as shown in FIG. 9A, a gap is formed between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b.

After that, one end of the electric component 10B is guided by the inclined surface 24b of the guide portion 24 by its own weight, and moves in the direction indicated by the arrow. At this time, the end portion of the electric component 10B moves to the position of the positioning surface 24a and is supported by the upper surface 35a of the movable member 35 as shown in FIG. 9B. Even during this movement, the upper surface 35a maintains a state in which there is a gap between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b.

After this movement, the electric component 10B is supported by the entire surface of the upper surface 35a of the movable member 35, so that the electric component 10B is parallel to the bottom surface 21a of the accommodating portion 21. Even in this state, the upper surface 35a maintains a state in which there is a gap between the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b. At this time, the positions of the solder balls 11a and 11b and the positions of the contact pins 23a and 23b coincide with each other in the plane direction.

After that, when the electric component 10B is pressed, the movable member 35 moves in the pressed direction together with the electric component 10B. At this time, the positions of the solder balls 11a and 11b and the positions of the contact pins 23a and 23b coincide with each other in the plane direction. Therefore, the solder balls 11a and 11b come into contact with the contact pins 23a and 23b from the pressing direction assumed in the design (see FIG. 2E). That is, unlike the conventional case, the solder balls 11a and 11b do not move by rubbing the upper contact ends of the contact pins 23a and 23b. As a result, the upper contact ends of the contact pins 23a and 23b can be protected from the electric component 10B.

Then, when the upper surface 35a is lowered to the second position P2 by pressing the electric component 10B, the solder balls 11a and 11b and the upper contact ends of the contact pins 23a and 23b are in contact with each other and are electrically connected. It becomes a state.

As described above, in this modification, the IC socket 20C includes a movable member 35 that adjusts the posture of the electric component 10B at the time of accommodation. The upper surface 35a of the movable member 35 is between the first position P1 which is above the position of the upper contact end of the contact pins 23a and 23b and the second position P2 which is not above the position of the upper contact end. It can move up and down. The upper surface 35a of the movable member 35 comes into contact with the electric component 10A to adjust the posture of the electric component 10A.

According to the present modification configured as described above, when the electric component 10B is accommodated in the accommodating portion 21, the movable member 35 adjusts the posture of the electric component 10B even if the electric component 10B is tilted. .. Thereby, the upper contact ends of the contact pins 23a and 23b exposed upward can be protected from the electric component 10B. As a result, in the IC socket 20C, the lengths of the contact pins 23a and 23b can be shortened by the amount that the above-mentioned floating plate becomes unnecessary, and the signal quality characteristics can be improved by matching the characteristic impedances. ..

Note that the above embodiments are merely examples of implementation of the present invention, and the technical scope of the present invention should not be construed in a limited manner by these. That is, the present invention can be implemented in various forms without departing from its gist or its main features.

This application claims priority under US Patent Provisional Application No. 62 / 819,763 filed March 18, 2019. All the contents described in this application specification and drawings are incorporated herein by reference.

The socket and the inspection socket according to the present invention are suitable for, for example, an IC socket that houses an electric component such as an IC on a circuit board.

10A, 10B Electrical parts 11a, 11b Solder balls 20A, 20B, 20C IC socket 21 Accommodating part 21a Bottom surface 21b Inner wall 22 Base part 22a Bottom surface 23a, 23b Contact pin 24 Guide part 24a Positioning surface 24b Inclined surface 25 Frame part 26, 27 Recession 31 , 33, 34, 35, 51, 61 Movable members 31a, 33a, 34a, 35a, 51a, 61a Top surface 31b, 51b, 61b Main body 31c, 51c, 61c Brim part 31d Protruding part 32, 36 Spring 40, 140 Circuit board 41 Terminal 51d Bottom surface 61d Insertion groove 120 IC socket 121 Accommodating part 122 Base part 123 Contact pin 124 Guide part P1, P3 1st position P2 2nd position R1, R2, R3, R4 area

Claims (10)

1. A socket that electrically connects the first electrical component and the second electrical component.
   A housing unit capable of accommodating the first electrical component and
   To the bottom portion so as to electrically connect the first electric component and the second electric component separated in the vertical direction with the bottom portion of the accommodating portion interposed therebetween, and with the upper contact end exposed. Contact pins to be placed and
   The contact has a contact portion that adjusts the posture of the first electrical component by contacting the first electrical component, and the contact portion is above the position of the contact end portion. A movable member that is movable in the vertical direction between a second position that is not above the position of the end and
   With
   The movable member extends in the vertical direction so that a protruding end portion protruding upward from the bottom portion constitutes the contact portion.
   socket.
2. With a plurality of the movable members
   The first position of the contact portion of the plurality of movable members is the same position in the vertical direction.
   The socket according to claim 1.
3. With a plurality of the movable members
   The plurality of movable members include a first movable member arranged on the outer peripheral side of the accommodating portion and a second movable member arranged inside the first movable member.
   The first position of the contact portion in the first movable member is different from the first position of the contact portion in the second movable member in the vertical direction.
   The socket according to claim 1.
4. The first position of the contact portion in the first movable member is lower than the first position of the contact portion in the second movable member.
   The socket according to claim 3.
5. An urging member for urging the movable member from the second position to the first position is provided.
   The movable member includes a holding portion for holding the urging member.
   The socket according to any one of claims 1 to 4.
6. The holding portion is a protruding portion that is press-fitted into the urging member.
   The socket according to claim 5.
7. The holding portion is an insertion groove into which the urging member is inserted.
   The socket according to claim 5.
8. The contact pin has a first contact pin for power supply and a second contact pin for signal transmission.
   The second contact pin constitutes a coaxial line.
   The socket according to any one of claims 1 to 7.
9. The movable member is arranged between the first contact pin and the second contact pin.
   The socket according to claim 8.
10. An inspection socket used for inspecting the electrical characteristics of the first electrical component.
    The socket according to any one of claims 1 to 9 is provided.
    Inspection socket.

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